Display panel, display module and panel circuit board

Abstract

The utility model provides a display panel, a display module and a panel circuit board, the display panel comprises a display substrate, the display substrate comprises a display area and a peripheral area, and the peripheral area comprises a bending area connected with the display area and a binding area connected with the bending area; the driving chip is arranged in the binding area; the panel circuit board is electrically connected with the driving chip, and the binding area is bent in the direction away from the light emitting side of the display panel through the bending area, so that the panel circuit board is located on the side, away from the light emitting side, of the display panel; wherein the driving chip is connected to the first surface of the peripheral area in a binding mode, the area, surrounding the periphery of the driving chip, of the first surface is a first area, and at least the first area is provided with a chip protection piece. According to the display panel, the display module and the panel circuit board provided by the invention, the reliability of the display module can be improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel, a display module, and a panel circuit board. Background Art

[0002] LCD (Liquid Crystal Display) and OLED (Organic Light-Emitting Diode) display products use side binding technology to bind the driver chip (Integrated Circuit, IC) to the FPC (Flexible Printed Circuit) or PCB (Printed Circuit Board) in the binding area of ​​the display panel. However, during the assembly process of the display module, there are problems such as interference and collision between the driver chip and other components, which leads to module reliability issues. Utility Model Content

[0003] The embodiments of the present disclosure provide a display panel, a display module and a panel circuit board, which can improve the reliability of the display module.

[0004] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0005] In a first aspect, an embodiment of the present disclosure provides a display panel, including:

[0006] A display substrate, comprising a display area and a peripheral area, wherein the peripheral area comprises a bending area connected to the display area and a binding area connected to the bending area;

[0007] A driving chip is disposed in the binding area; and

[0008] A panel circuit board is electrically connected to the driving chip, and the binding area is bent through the bending area toward a direction away from the light emitting side of the display panel, so that the panel circuit board is located on a side of the display panel away from the light emitting side; wherein,

[0009] The driving chip is bound and connected to the first surface of the peripheral area. The area on the first surface surrounding the periphery of the driving chip is the first area. A chip protection component is provided at least in the first area.

[0010] Exemplarily, the chip protection component includes:

[0011] a first chip protection glue, wherein the first chip protection glue at least covers a surface of the driver chip facing away from the first surface and the first area; and / or,

[0012] A second chip protective adhesive is provided with a groove area on the second chip protective adhesive, and the driving chip is accommodated in the groove area, so that the second chip protective adhesive surrounds the driving chip, and the second chip protective adhesive only covers the first area.

[0013] Exemplarily, the bonding surface of at least one of the first chip protection glue and the second chip protection glue used to bond to the first surface includes a first bonding area and a second bonding area, the first bonding area is bonded to the panel circuit board, and the second bonding area is bonded to the side surface of the driving chip facing away from the first surface and the first area.

[0014] Exemplarily, the peeling force between the first adhesive area and the panel circuit board is greater than or equal to the peeling force between the second adhesive area and the driving chip.

[0015] Exemplarily, the peeling force between the first adhesive area and the panel circuit board is greater than or equal to 1000 gf / inch; and the peeling force between the second adhesive area and the driver chip is greater than or equal to 600 gf / inch.

[0016] Exemplarily, a main body material of at least one of the first chip protection adhesive and the second chip protection adhesive includes a heat dissipation material.

[0017] Exemplarily, at least one of the first chip protection adhesive and the second chip protection adhesive includes a first film layer and at least one second film layer, the first film layer is an insulating tape, and the second film layer is stacked on a side of the insulating tape away from the first surface.

[0018] Exemplarily, the at least one second film layer includes a conductive film layer, and the conductive film layer is configured as a ground layer or an anti-signal interference layer heat dissipation film; or,

[0019] The at least one second film layer includes a heat dissipation layer and a conductive film layer stacked on a side of the heat dissipation layer away from the first film layer, and the conductive film layer is configured as a ground layer or an anti-signal interference layer.

[0020] Exemplarily, in a direction perpendicular to the first surface, the second chip protection glue has a first height, the driving chip has a second height, and the first height is greater than or equal to the second height.

[0021] Exemplarily, the height difference between the first height and the second height is greater than or equal to 0.3 mm.

[0022] Exemplarily, the driving chip includes a first side and a second side opposite to each other in a direction from the display area to the binding area, and a third side and a fourth side located between the first side and the second side, wherein the first side is closer to the display area than the second side; wherein the second chip protection glue is at least arranged on the first side.

[0023] Exemplarily, the second chip protection glue is distributed on four sides of the driver chip to fully surround the driver chip; or, the second chip protection glue is distributed on at least one of the third side and the fourth side, and the first side to half surround the driver chip.

[0024] Exemplarily, there is a gap between the groove sidewall of the groove area and the driving chip.

[0025] Exemplarily, the gap is greater than or equal to 0.5 mm.

[0026] Exemplarily, the panel circuit board includes a circuit board body; the chip protection component also includes a release film, which is used to be adhered to the circuit board body and can be peeled off from the circuit board body, and the release film includes: a first film area set corresponding to the circuit board body, and a second film area set corresponding to the first area, wherein the second chip protection glue is attached to the second film area, and the second film area and the second chip protection glue have at least partially overlapped and matched shapes in their orthographic projection patterns on the first surface.

[0027] Exemplarily, the peeling force between the first film area and the circuit board body is less than or equal to the peeling force between the second film area and the second chip protection adhesive.

[0028] Exemplarily, in the second chip protection glue, the dimensions of the groove area in the first direction and the second direction are greater than a threshold; wherein, the first direction is the direction from the binding area to the display area, the second direction is parallel to the first surface and perpendicular to the first direction, and the threshold is the corresponding dimensions of the binding pressure head in the first direction and the second direction during the binding process of the driver chip and the panel circuit board.

[0029] Exemplarily, the panel circuit board may include a circuit board body, on which exposed conductive points are provided; the chip protection component also includes a circuit board covering layer covering the circuit board body, and the circuit board covering layer is configured as a conductive layer, specifically, the circuit board covering layer can serve as a grounding film layer or an anti-signal interference film layer; the circuit board covering layer is connected to at least one of the first chip protection glue and the second chip protection glue and serves as an integral component.

[0030] In a second aspect, an embodiment of the present disclosure further provides a panel circuit board, which includes a circuit board body and a chip protection component disposed on the circuit board body, wherein the chip protection component is configured to be pasted on a first area of ​​the display panel.

[0031] In a third aspect, the present disclosure also provides a display module, including:

[0032] A display panel as described above;

[0033] The protection cover plate is arranged on the light emitting side of the display panel.

[0034] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0035] In the display panel, display module and panel circuit board provided by the embodiments of the present disclosure, the display panel includes a display substrate, a driver chip and a panel circuit board, the peripheral area of ​​the display substrate includes a bending area connected to the display area and a binding area connected to the bending area, wherein the driver chip is bound to the binding area, and the panel circuit board is electrically connected to the driver chip, the binding area is bent toward the direction away from the light-emitting side of the display panel through the bending area, so that the panel circuit board is located on the side of the display panel away from the light-emitting side, the driver chip is bound and connected to the first surface of the peripheral area, the area surrounding the periphery of the driver chip on the first surface is the first area, and a chip protection member is provided at least in the first area. In this way, by providing the chip protection member at least in the first area, the chip protection member can surround the driver chip to protect the driver chip, so that when the driver chip and other components interfere or collide during the assembly process, the driver chip can be protected to improve the module reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A front view showing the appearance of a display module provided by some embodiments of the present disclosure when a chip protection member is not provided and the bending area is not bent;

[0037] Figure 2 A schematic diagram showing the structure of a display module provided by some embodiments of the present disclosure when a chip protection member is not provided and a bending area is not bent;

[0038] Figure 3 A schematic diagram showing a structure in which a chip protection member is provided in a display module provided in some embodiments of the present disclosure and the bending area is not bent;

[0039] Figure 4 express Figure 3 One of the schematic diagrams of the local structure of the middle binding region;

[0040] Figure 5 express Figure 3 Schematic diagram of the local structure of the middle binding area (part 2);

[0041] Figure 6 A schematic diagram showing a connection structure between a first chip protection adhesive and a panel circuit board;

[0042] Figure 7 A second schematic diagram showing the connection structure between the first chip protection adhesive and the panel circuit board;

[0043] Figure 8 One of the schematic diagrams showing the film layer stacking structure of the first chip protection glue in some embodiments of the present disclosure;

[0044] Fig. 9 A second schematic diagram showing the film layer stacking structure of the first chip protection glue in some embodiments of the present disclosure;

[0045] Fig.10 A front view showing the appearance of a display module provided by some embodiments of the present disclosure when a chip protection member is provided and the bending area is not bent;

[0046] Fig.11 express Fig.10 Side view of

[0047] Fig.12 express Fig.11 A magnified view of the structure of the middle E region;

[0048] Fig.13 A schematic diagram showing the structure of a panel circuit board in some embodiments of the present disclosure when the first chip protection glue is not connected;

[0049] Fig.14 A schematic diagram showing the structure of a panel circuit board connected to a first chip protection adhesive in some embodiments of the present disclosure;

[0050] Fig.15 A schematic diagram showing the structure of the first chip protection glue;

[0051] Fig.16 A second schematic diagram showing the structure of the first chip protection glue;

[0052] Fig.17 A third schematic diagram showing the structure of the first chip protection glue;

[0053] Fig.18 A fourth structural diagram showing a first chip protection adhesive;

[0054] Fig.19 A fifth structural diagram showing a first chip protection adhesive;

[0055] Fig. 20A rear view of a display module provided in some embodiments of the present disclosure is shown;

[0056] Fig.21 express Fig. 20 Side view of

[0057] Fig. 22 express Fig.21 Middle F is an enlarged view of the local structure;

[0058] Fig.23 A front view showing a display module provided by some other embodiments of the present disclosure provided with a chip protection member and in a state where the bending area is not bent;

[0059] Fig.24 One of the structural schematic diagrams of the second chip protection glue in some embodiments of the present disclosure is shown;

[0060] Fig.25 A second schematic diagram showing the structure of the second chip protection glue in some embodiments of the present disclosure;

[0061] Fig.26 A third structural schematic diagram showing the second chip protection glue in some embodiments of the present disclosure;

[0062] Fig. 27 A fourth structural schematic diagram showing the second chip protection adhesive in some embodiments of the present disclosure;

[0063] Fig.28 A fifth structural diagram showing a second chip protection adhesive in some embodiments of the present disclosure;

[0064] Fig.29 A sixth structural diagram showing a second chip protection adhesive in some embodiments of the present disclosure;

[0065] Fig.30 A seventh structural diagram showing a second chip protection adhesive in some embodiments of the present disclosure;

[0066] Fig.31 An eighth structural schematic diagram showing a second chip protection adhesive in some embodiments of the present disclosure;

[0067] Fig.32 A ninth structural diagram showing a second chip protection adhesive in some embodiments of the present disclosure;

[0068] Fig.33 A tenth schematic diagram showing the structure of the second chip protection glue in some embodiments of the present disclosure;

[0069] Fig.34 A schematic diagram showing the connection structure between a chip protection component and a panel circuit board in some embodiments of the present disclosure;

[0070] Fig.35A schematic diagram showing the structure of a display module in some other embodiments of the present disclosure;

[0071] Fig.36 A schematic diagram showing the connection structure between the release film and the second chip protection adhesive in some embodiments of the present disclosure. DETAILED DESCRIPTION

[0072] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0073] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0074] Before describing in detail the display panel, display module, and panel circuit board provided by the embodiments of the present disclosure, the following description is made of the related technologies:

[0075] In the related art, LCD (Liquid Crystal Display) and OLED (Organic Light-Emitting Diode) display products use side binding technology. Specifically, in the binding area of ​​the display panel, the driver chip (Integrated Circuit, IC) is bound and connected with the FPC (Flexible Printed Circuit) or PCB (Printed Circuit Board). However, during the assembly process of the display module, there are problems such as interference and collision between the driver chip and other components, which leads to reliability problems.

[0076] The applicant of the present disclosure has found through research that in some display products, such as folding display products, especially small-sized folding display products, in order to increase the battery capacity and improve the standby time, it is necessary to provide more space for the battery compartment. The panel circuit board in the display panel will be stacked on the back of the display panel. In order to increase the layout space of the battery compartment, the driver chip needs to be as close to the edge of the protective cover as possible, which results in the driver chip and the protective cover being too close. In the process of assembling the display module, the protection cover and the driver chip are prone to interference, collision and other reliability problems.

[0077] In order to avoid interference and collision between the protective cover and the driver chip, if the distance between the driver chip and the display area is increased, the battery compartment space design requirements cannot be met.

[0078] Based on this, the embodiments of the present disclosure provide a display panel, a display module and a panel circuit board, which can improve the above problems and enhance the reliability of the module.

[0079] like Figures 1 to 7 As shown, the display panel 10 provided in the embodiment of the present disclosure includes a display substrate 100, a driver chip 200 and a panel circuit board 300. The display substrate 100 includes a display area AA and a peripheral area D, wherein the peripheral area D includes a bending area D1 connected to the display area AA, and a binding area D2 connected to the bending area D1; the driver chip 200 is arranged in the binding area D2; the panel circuit board 300 is electrically connected to the driver chip 200, and the binding area D2 is bent toward the direction away from the light emitting side of the display panel 10 through the bending area D1, so that the panel circuit board 300 is located on the side of the display panel 10 away from the light emitting side; the driver chip 200 is bound and connected to the first surface DA of the peripheral area D, and the area surrounding the periphery of the driver chip 200 on the first surface DA is the first area DA1, and a chip protection component 400 is provided at least in the first area DA1.

[0080] In the above scheme, by setting the chip protection component 400 in at least the first area DA1, the chip protection component 400 can surround the driver chip 200 to protect the driver chip 200, so that when the driver chip 200 interferes with or collides with other components during the assembly process, the driver chip 200 can be protected to improve the module reliability.

[0081] In some exemplary embodiments of the present disclosure, Figures 1 to 7 , Figures 10 to 22 As shown, the chip protection member 400 may include: a first chip protection glue 410, the first chip protection glue 410 at least covers the side surface of the driver chip 200 away from the first surface DA and the first area DA1. In this way, during the display module assembly process, when the driver chip 200 interferes with or collides with the protective cover plate, the first chip protection glue 410 completely wraps the driver chip 200, which can play a buffering role to protect the driver chip 200 and avoid reliability problems.

[0082] Since the driver chip 200 protrudes from the first surface DA, it is easy for the first chip protection glue 410 to be unevenly attached or wrinkled. Figures 15 to 19 As shown, in some embodiments, the first chip protection glue 410 may be provided with an anti-wrinkle structure 413 at a predetermined area P.

[0083] In some exemplary embodiments, the anti-wrinkle structure 413 may include a break 413A or a slot 413B. The break 413A may include a continuous break and / or a discontinuous break. The slot 413B may be an integral break 413A, or the slot 413B may include a plurality of adjacently arranged breaks 413A.

[0084] In some exemplary embodiments, the predetermined area P may correspond to a position where unevenness or wrinkles are easily generated at the corner of the driver chip 200. For example, the predetermined area P may include: a first area P1 located at the edge of the first chip protective glue 410 and corresponding to the corner of the driver chip 200; and / or a second area P2 located in the middle of the first chip protective glue 410 and adjacent to the corner of the driver chip 200.

[0085] In the above scheme, the positions where unevenness or wrinkles are easily generated when the first chip protection glue 410 is attached are mainly concentrated at the positions corresponding to the corners of the driving chip 200. Therefore, a break 413A or a groove 413B can be set at least at the positions where unevenness or wrinkles are easily generated corresponding to the corners of the driving chip 200 to reduce the occurrence of unevenness or wrinkles when the first chip protection glue 410 is attached.

[0086] In some embodiments, Fig.15 As shown, the first region P1 includes at least one corner of the first chip protection glue 410 , and the groove 413B is provided in the first region P1 , and the groove 413B can be an integral fracture.

[0087] For example, Fig.15 As shown, the shape of the groove 413B can be constructed as follows: along the direction from the center of the first chip protection glue 410 to the corner corresponding to the groove 413B, the opening size of the groove 413B gradually increases. In this way, the groove 413B is reserved for the corner position of the first chip protection glue 410, which makes it easier to attach and flatten the first chip protection glue 410.

[0088] It should be noted that the shape of the slot 413B is not limited thereto.

[0089] It should also be noted that the slot 413B may be disposed at one corner or multiple corners of the first chip protection glue 410 , for example, Fig.15 It is shown that the grooves 413B are disposed at four corners of the first chip protection adhesive 410 , but the present invention is not limited thereto.

[0090] In addition, in some other embodiments, Fig.16 As shown, the first region P1 includes at least one corner of the first chip protective glue 410, and the groove 413B is provided in the first region P1, and the groove 413B includes a plurality of adjacently arranged fractures 413A. Exemplarily, the plurality of fractures 413A in each groove 413B are sequentially arranged at intervals along the turning direction of the corresponding corner of the driver chip 200. In this way, the groove 413B is reserved for the corner position of the first chip protective glue 410, which makes it easier to attach and flatten the first chip protective glue 410.

[0091] It should be noted that the arrangement and shape of the plurality of breakouts 413A in the slot 413B are not limited thereto.

[0092] It should also be noted that the slot 413B may be disposed at one corner or multiple corners of the first chip protection glue 410 , for example, Fig.16 It is shown that the grooves 413B are disposed at four corners of the first chip protection adhesive 410 , but the present invention is not limited thereto.

[0093] In addition, in some other embodiments, Fig.17As shown, a break 413A is provided in the middle of the first chip protection glue 410 and in the second area P2 adjacent to the corner of the driver chip 200, and at least one break 413A is provided corresponding to one corner of the driver chip 200. Since one of the positions where wrinkles and unevenness occur when the first chip protection glue 410 is attached is at the corner of the first chip protection glue 410, the break 413A is provided in the second area P2 of the first chip protection glue 410 adjacent to the corner of the driver chip 200, which can effectively improve the wrinkle problem of the first chip protection glue 410 when attached.

[0094] For example, Fig.17 As shown, each of the break 413A extends along the turning direction of the corresponding corner of the driver chip 200. For example, the break 413A is arc-shaped, which is more convenient for attaching and flattening the first chip protection glue 410. It is understandable that in actual applications, the shape of the break 413A is not limited thereto.

[0095] It should also be noted that the break 413A may be disposed at one corner or multiple corners of the driver chip 200. For example, Fig.17 It is shown that the break openings 413A are disposed at four corners of the driving chip 200 , but the present invention is not limited thereto.

[0096] In addition, in some other embodiments, Fig.18 As shown, a break 413A is provided in the middle of the first chip protection glue 410 and in the second area P2 adjacent to the corner of the driver chip 200, and at least one break 413A is provided corresponding to one corner of the driver chip 200. The break 413A can be a continuous break or a discontinuous break, and the first area P1 includes at least one corner of the first chip protection glue 410, and the groove 413B is provided in the first area P1, and the groove 413B includes a plurality of adjacently arranged break 413A.

[0097] In other embodiments, Fig.19 As shown, a break 413A is provided in the middle of the first chip protection glue 410 and adjacent to the corner of the driver chip 200, and at least one break 413A is provided corresponding to one corner of the driver chip 200. The break 413A can be a continuous break or a discontinuous break, and the first area P1 includes at least one corner of the first chip protection glue 410, and the groove 413B is provided in the first area P1, and the groove 413B is an integral break 413A.

[0098] It should be understood that the above is merely an exemplary description of the structure and position of the anti-wrinkle structure 413 . However, in other embodiments not shown, the structure and position of the anti-wrinkle structure 413 are not limited thereto.

[0099] The first chip protection adhesive 410 can be any suitable structure such as a single-sided tape, a coating adhesive layer, etc. Exemplarily, the first chip protection adhesive 410 is a single-sided tape, and its adhesive surface is attached to the first surface DA and the side surface of the driver chip 200 away from the first surface DA. However, it is not limited thereto.

[0100] In some other exemplary embodiments of the present disclosure, Fig.23 As shown, the chip protection component 400 may include: a second chip protection glue 420, the second chip protection glue 420 is provided with a groove area 421, the driving chip 200 is accommodated in the groove area 421, so that the second chip protection glue 420 surrounds the driving chip 200, and the second chip protection glue 420 only covers the first area DA1.

[0101] In some embodiments, Fig.26 As shown, at least one edge of the groove area 421 contacts or conflicts with the driver chip 200. In this way, the distance between at least one side edge of the groove area 421 and the driver chip 200 can be reduced to better protect the driver chip 200; at the same time, when attaching the second chip protection glue 420, the edge of the groove area 421 that contacts or conflicts with the driver chip 200 can be used as a positioning reference to facilitate attachment; in addition, the second chip protection glue 420 can be prevented from being offset during assembly or use.

[0102] In some embodiments, Fig. 27 As shown, the four edges of the groove area 421 are in contact with or against the driver chip 200, so as to completely surround the driver chip 200. In this way, the surrounding sides of the driver chip 200 can be further better protected.

[0103] In some embodiments, Fig.28 As shown, at least one corner of the groove area 421 can be set to be recessed or rounded. In this way, the corner of the groove area 421 is recessed or rounded, which can avoid the groove area 421 from breaking or warping at the corner compared to the corner of the groove area 421 being a right angle. In some embodiments, Fig.29 As shown, the driver chip 200 at most partially overlaps with the groove area 421. In this way, the driver chip 200 is at least partially exposed by the groove area 421, which is beneficial to the heat dissipation of the driver chip 200.

[0104] In some embodiments, Fig.30 As shown, the second chip protection glue 420 only covers the first area DA1 and a part of the driving chip 200. In other words, the second chip protection glue 420 can partially cover the driving chip 200, and the trench area 421 partially exposes the driving chip 200. In this way, the second chip protection glue 420 can further protect a part of the surface area of ​​the driving chip 200.

[0105] In some embodiments, Fig.31 As shown, the second chip protection glue 420 covers the four edge positions of the driver chip 200. In this way, the four side edges of the driver chip 200 can be further better protected.

[0106] In some embodiments, Fig.32 As shown, at least one of the four edge portions of the driver chip 200 is provided with an uneven structure 210, and the uneven structure 210 may be continuously convex and concave, and may be wavy, and the second chip protection glue 420 at least covers the uneven structure 210. In this way, the second chip protection glue 420 at least covers the uneven structure 210 on the driver chip 200 to prevent the uneven structure 210 from contacting or colliding with other components. For example, the uneven structure 210 may include pins or wiring on the driver chip 200.

[0107] In some embodiments, Fig.33 As shown, the chip protection member 400 may further include a third chip protection glue 440, which covers at least one edge position of the driver chip 200, extends in at least one direction of an edge adjacent to the edge position, and covers the original second chip protection glue 420. In this way, the driver chip 200 may be further protected by using the third chip protection glue 440 to cover at least one edge of the driver chip 200.

[0108] In the above scheme, the second chip protection glue 420 is used to surround the periphery of the driver chip 200 to protect the driver chip 200. During the display module assembly process, when the driver chip 200 interferes with or collides with a protective cover plate, the second chip protection glue 420 surrounds the driver chip 200 on the periphery, which can reduce the collision of the protective cover plate with the driver chip 200 and avoid reliability problems.

[0109] In some exemplary embodiments, in a direction perpendicular to the first surface DA, the second chip protective adhesive 420 has a first height, the driver chip 200 has a second height, and the first height is greater than or equal to the second height. In this way, the second chip protective adhesive 420 is higher than the driver chip 200, which can prevent the protective cover from contacting the driver chip 200 during the display module assembly process, so as to further protect the driver chip 200.

[0110] In some exemplary embodiments, the height difference between the first height and the second height is greater than or equal to 0.3 mm, so that the protective cover can be effectively prevented from hitting the driver chip 200. It should be noted that, unless otherwise specified, the values ​​in this application are not absolute definitions, but express the range of variation within a certain range of the reference value. For example, each value may include a range of variation of less than or equal to 10% of the value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to 3%, less than or equal to 2%, less than or equal to 1%, less than or equal to 0.5%, less than or equal to 0.1%, less than or equal to 0.05%, etc.

[0111] It should be noted that the chip protection component 400 may only use the first chip protection glue 410; the chip protection component 400 may also only use the second chip protection glue 420; in other embodiments, the chip protection component 400 may also include both the first chip protection glue 410 and the second chip protection glue 420. The chip protection component 400 is not limited to the first chip protection glue 410 and the second chip protection glue 420, and may also be implemented by other suitable structures.

[0112] In some embodiments of the present disclosure, Figure 6 As shown, the bonding surface of at least one of the first chip protection glue 410 and the second chip protection glue 420 for bonding to the first surface DA includes a first bonding area S1 and a second bonding area S2, the first bonding area S1 is bonded to the panel circuit board 300, and the second bonding area S2 is bonded to the side surface of the driving chip 200 away from the first surface DA and the first area DA1.

[0113] By adopting the above scheme, at least one of the first chip protection glue 410 and the second chip protection glue 420 can also be connected to the panel circuit board 300. In other words, at least one of the first chip protection glue 410 and the second chip protection glue 420 can be integrated with the panel circuit board 300 as an integral component. Figure 6 and Fig.14 FIG. 4 is a schematic diagram showing the structure of the first chip protection glue 410 and the panel circuit board 300 when they are integrated.

[0114] Specifically, taking the first chip protection glue 410 as an example, after the binding process between the panel circuit board 300 and the driver chip 200 is completed, the first chip protection glue 410 can be used to cover the driver chip 200 and the first area DA1, and then the protective cover plate is bonded to the display panel 10. During the bonding process of the protective cover plate, the first chip protection glue 410 covers and wraps the driver chip 200, thereby avoiding direct contact and collision between the protective cover plate and the driver chip 200.

[0115] Fig.13 FIG. 1 is a schematic diagram showing a structure of a panel circuit board 300. Fig.14 FIG. 4 is a schematic diagram showing the structure of the panel circuit board 300 integrated with the first chip protection glue 410. Fig.13 and Fig.14 As shown, by pasting the first chip protection glue 410 on the panel circuit board 300, an integrated design is achieved without adding an additional structure of the panel circuit board 300. In addition, by integrating the first chip protection glue 410 on the panel circuit board 300, there is no need to attach a chip protection film separately, which can simplify the process, improve product yield, and reduce costs.

[0116] It is understandable that, in other embodiments, at least one of the first chip protection adhesive 410 and the second chip protection adhesive 420 may also be provided independently of the panel circuit board 300 .

[0117] In some exemplary embodiments, the peeling force between the first adhesive area S1 and the panel circuit board 300 is greater than or equal to the peeling force between the second adhesive area S2 and the driving chip 200. In other words, the peeling force between the first chip protection glue 410 and the panel circuit board 300 is greater.

[0118] By adopting the above scheme, when the binding area D2 is bent through the bending area D1, if the first chip protection glue 410 pulls the driving chip 200, the first chip protection glue 410 is more likely to be peeled off from the driving chip 200 to avoid excessive pulling force on the driving chip 200 and damaging the driving chip 200.

[0119] In addition, if the peeling force between the first chip protective adhesive 410 and the driver chip 200 is too small, there may be a risk that the first chip protective adhesive 410 will accidentally fall off. Therefore, the peeling force between the first chip protective adhesive 410 and the driver chip 200 cannot be too small.

[0120] Exemplarily, the peeling force between the second bonding area S2 and the driver chip 200 is greater than or equal to 600 gf / inch; the peeling force between the first bonding area S1 and the panel circuit board 300 is greater than or equal to 1000 gf / inch. Unless otherwise specified, the numerical values ​​in this application are not absolute definitions, but express the range of variation within a certain range of the reference value. For example, the numerical value may include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to 3%, less than or equal to 2%, less than or equal to 1%, less than or equal to 0.5%, less than or equal to 0.1%, less than or equal to 0.05%.

[0121] This configuration not only satisfies the requirement that the peeling force between the first chip protection glue 410 and the driver chip 200 cannot be too small, but also avoids excessive pulling force on the driver chip 200 to damage the driver chip 200. However, the present invention is not limited thereto.

[0122] In addition, since the first chip protective glue 410 will cover and wrap the driver chip 200, and the second chip protective glue 420 will surround the driver chip 200, and the driver chip 200 will generate heat during operation. Therefore, in order to avoid affecting the heat dissipation of the driver chip 200, in some exemplary embodiments, the main body material of at least one of the first chip protective glue 410 and the second chip protective glue 420 may include a heat dissipation material. Exemplarily, the heat dissipation material can be made of any suitable material such as graphite, metal, carbon fiber or heat dissipation resin.

[0123] In some embodiments, Figure 8 and Fig. 9 As shown, the first chip protection glue 410 may include a first film layer 411 and at least one second film layer 412, the first film layer 411 is an insulating tape, which can ensure the insulation between the driving chip 200 and the first chip protection glue 410; the second film layer 412 is stacked on the side of the insulating tape away from the first surface DA, and the second film layer 412 can be used as a heat dissipation layer, a grounding layer or an anti-signal interference layer, etc.

[0124] For example, Figure 8 As shown, the at least one second film layer 412 includes a conductive film layer 4121, and the conductive film layer 4121 is configured as a ground layer or an anti-signal interference layer heat dissipation film; or, as Fig. 9As shown, the at least one second film layer 412 includes a heat dissipation layer 4122 and a conductive film layer 4121 stacked on the side of the heat dissipation layer 4122 away from the first film layer 411, and the conductive film layer 4121 is configured as a ground layer or an anti-signal interference layer. Exemplarily, the conductive film layer 4121 can be any suitable film layer such as a metal foil layer and a conductive cloth. In practical applications, the stacked film layer structure of the first chip protection glue 410 can be reasonably selected in combination with product requirements, and is not limited thereto.

[0125] See also Figure 6 , Fig.13 and Fig.14 As shown, a second area 300A is provided at a position of the panel circuit board 300 adjacent to the binding area D2, and the first chip protection glue 410 can be bonded to the second area 300A. The thickness of the second area 300A can be less than the thickness of other areas. After the first chip protection glue 410 is attached to the second area 300A, the surface of the first chip protection glue 410 can be roughly flush with the surfaces of other areas of the panel circuit board 300 adjacent to the second area 300A, so as to ensure the surface flatness of the connection between the panel circuit board 300 and the first chip protection glue 410. It should be noted that the term "roughly flush" can mean that two surfaces are arranged along the same plane within a micrometer range, for example, arranged along the same plane within 40μm, 30μm, 20μm, 10μm or 1μm.

[0126] It should also be noted that the first chip protection glue 410 adopts a multi-layer stacking structure, which can meet the performance requirements of the first chip protection glue 410 such as heat dissipation on the one hand, and on the other hand, it is also conducive to meeting the surface flatness requirements at the connection between the panel circuit board 300 and the first chip protection glue 410.

[0127] In some exemplary embodiments, Figure 4 As shown, the binding area D2 is provided with an alignment mark MA, and either the first chip protection glue 410 or the second chip protection glue 420 is provided with an avoidance hollowing area MB at a position corresponding to the alignment mark MA, and the avoidance hollowing area MB is used to avoid the alignment mark MA. Figure 4 As shown, the alignment mark MA may include a first alignment mark MA1 applied in the bending process of the bending zone D1 , a second alignment mark MA2 applied in the bending process of the bending zone D1 , and the like.

[0128] See also Figure 4As shown, when the chip protection component 400 includes the first chip protection glue 410, the first chip protection glue 410 is provided with a first avoidance hollowing area MB1 at a position corresponding to the first alignment mark MA1, and a second avoidance hollowing area MB2 at a position corresponding to the second alignment mark MA2. It should be noted that the avoidance hollowing area MB can be a hollow slot or a hole design. The shape of the avoidance hollowing area MB can include but is not limited to any suitable regular or irregular shape such as arc, circle, rectangle, triangle, etc.

[0129] In some embodiments, Figure 4 and Figure 6 As shown, at least part of the alignment mark MA is located near at least one side edge of the binding area D2 extending along the first direction X, and the first direction X is the direction from the binding area D2 to the display area AA; and at least part of the avoidance hollowing area MB is constructed as a notch structure provided on at least one side edge of the first chip protection glue 410 extending along the first direction X. For example, Figure 4 and Figure 6 As shown, the first avoidance hollowing area MB1 is an arc-shaped notch structure. It can be understood that the shape of the avoidance hollowing area MB is not limited to an arc shape, and can also be any other suitable shape.

[0130] In addition, in some other embodiments, Figure 5 and Figure 7 As shown, at least part of the alignment mark MA is located near at least one side edge of the binding area D2 extending along the first direction X, and the first direction X is the direction from the binding area D2 to the display area AA; and at least part of the avoidance hollowing area MB is constructed as an open hole structure provided on at least one side edge of the first chip protection glue 410 extending along the first direction X. In other words, there is a certain distance between the avoidance hollowing area MB and the edge of the first chip protection glue 410 extending along the first direction X. This arrangement can protect the location of the avoidance hollowing area MB when the bending area is bent, thereby reducing the occurrence of warping and other problems at the boundary of the avoidance hollowing area MB. For example, as Figure 5 As shown, the first avoidance hollowing area MB1 is a circular opening structure. It is understandable that the shape of the avoidance hollowing area MB is not limited to a circle, and can also be any other suitable shape. In order to ensure the avoidance effect of the avoidance hollowing area MB on the alignment mark MA, the avoidance hollowing area MB is designed to be outwardly expanded compared to the corresponding alignment mark MA, and the outward expansion size is greater than or equal to 2mm. In other words, a gap is reserved between the side wall of the avoidance hollowing area MB and the alignment mark MA, and the gap is greater than 1mm.

[0131] In some exemplary embodiments, Fig.24 and Fig.25 As shown, the driving chip 200 includes a first side a and a second side b relative to each other in a direction from the binding area D2 to the display area AA (i.e., the first direction X in the figure), and a third side c and a fourth side d located between the first side a and the second side b, wherein the first side a is closer to the display area AA than the second side b; wherein the second chip protection glue 420 is at least arranged on the first side a.

[0132] By adopting the above scheme, a protective cover is attached to the light-emitting side of the display panel 10. In order to avoid interference, collision and other problems when the protective cover is attached to the driver chip 200, the second chip protection glue 420 is at least arranged on one side of the driver chip 200 close to the display area AA (that is, the first side a), which can protect the driver chip 200.

[0133] In some embodiments, Fig.24 As shown, the second chip protection glue 420 is distributed around the driver chip 200 to completely surround the driver chip 200; in other embodiments, such as Fig.18 As shown, the second chip protection glue 420 is distributed on at least one of the third side c and the fourth side d, and the first side a, so as to half surround the driver chip 200. It should be understood that in actual applications, the structure and size of the second chip protection glue 420 can be designed according to the actual product structure, and is not limited thereto.

[0134] In addition, in some embodiments, there is a gap between the groove sidewall of the groove area 421 and the driver chip 200. In other words, the groove area 421 is designed to be outwardly expanded compared to the driver chip 200 to prevent the second chip protection glue 420 from squeezing the driver chip 200 during the process of attaching the second chip protection glue 420 to the first surface DA or attaching the protection cover. Exemplarily, the gap is greater than or equal to 0.5 mm. The shape of the groove area 421 can be adapted to the shape of the driver chip 200. However, it is not limited thereto.

[0135] In addition, the attaching process of the second chip protective glue 420 to the first surface DA is performed before the binding process of the panel circuit board, or after the binding process and before the protective cover bonding process. If the attaching process of the second chip protective glue 420 is completed before the binding process, in some exemplary embodiments, the size of the groove area 421 in the first direction X and the second direction Y of the second chip protective glue 420 is greater than the threshold value; the first direction X is the direction from the binding area D2 to the display area AA, the second direction Y is parallel to the first surface DA and perpendicular to the first direction X, and the threshold value is the corresponding size of the binding pressure head in the first direction X and the second direction during the binding process of the driver chip 200 and the panel circuit board 300. In this way, the second chip protective glue 420 can be prevented from being burned during the binding process.

[0136] In addition, in some embodiments, the second chip protection glue 420 can be a glue layer with a certain thickness made of resin or other materials. However, it is not limited thereto, for example, the second chip protection glue 420 can also be a multi-layer stacked structure similar to the first chip protection glue 410 .

[0137] In addition, in some embodiments, the second chip protection glue 420 can be an independent component. Fig.23 As shown, in some embodiments, the second chip protection glue 420 and the panel circuit board 300 are independent of each other. In other embodiments, the second chip protection glue 420 can also be integrated with the panel circuit board 300 to form an integral component.

[0138] In some embodiments, Fig.35 and Fig.36 As shown, the panel circuit board 300 includes a circuit board body 310; the chip protection component 400 also includes a release film 430, the release film 430 is used to be adhered to the circuit board body 310 and can be peeled off from the circuit board body 310, the release film 430 includes: a first film area 431 set corresponding to the circuit board body 310, and a second film area 432 set corresponding to the first area DA1, wherein the second chip protection glue 420 is attached to the second film area 432, and the second film area 432 and the second chip protection glue 420 have at least partially overlapped orthographic projection patterns on the first surface DA and matched shapes.

[0139] In the above scheme, the second chip protection glue 420 is directly attached to the release film 430, and the release film 430 covers the circuit board body 310 to protect the panel circuit board 300 during the process. After the bonding process of the protective cover plate 20 is completed, the release film 430 can be torn off, and the second chip protection glue 420 can be peeled off from the first surface DA along with the release film 430. In this way, the release film 430 of the panel circuit board 300 can be directly used as a carrier to carry the second chip protection glue 420. In other words, the second chip protection glue 420 is integrated on the release film 430 of the panel circuit board 300, and the bonding operation of the release film 430 and the second chip protection glue 420 can be completed in one step, simplifying the process.

[0140] Since the release film 430 needs to be peeled off from the panel circuit board 300 in the subsequent process, the peeling force between the release film 430 and the circuit board body 310 cannot be too large to facilitate the subsequent peeling; and during the bonding process of the protective cover plate 20, the second chip protection glue 420 needs to be firmly attached to the release film 430 to ensure reliability, and the peeling force between the second chip protection glue 420 and the release film 430 cannot be too small. Therefore, in some embodiments, the peeling force between the first film area 431 and the circuit board body 310 is less than or equal to the peeling force between the second film area 432 and the second chip protection glue 420.

[0141] In some embodiments, Fig.36 As shown, the release film 430 may include a first surface 430A and a second surface 430B opposite to each other, and the release film 430 may be constructed as a double-sided adhesive, the adhesive surface of the first film area 431 is located on the first surface 430A, the adhesive surface of the second film area 432 is located on the second surface 430B, and the area on the second surface 430B except the second film area 432 is a non-adhesive area, the first surface 430A is attached to the circuit board body 310, and the second chip protection adhesive 420 may be located on the side of the release film 430 away from the first surface DA. However, it is not limited thereto.

[0142] In other embodiments, the release film 430 can be constructed as a single-sided adhesive, the bonding surface of the first film area 431 and the bonding surface of the second film area 432 are both located on the first surface 430A, the second surface 430B is a non-adhesive surface, and the first surface 430A is attached to the circuit board body 310. At this time, the second chip protection adhesive 420 can be located on the side of the release film 430 close to the first surface DA.

[0143] It should be noted that the release film 430 can be attached to the circuit board body 310 before the binding process of the panel circuit board 300. Therefore, the release film 430 and the second chip protection glue 420 need to avoid the binding pressure head to avoid being burned by the binding pressure head.

[0144] Specifically, in some embodiments, in the second chip protection glue 420, the size of the groove area 421 in the first direction X and the second direction Y is greater than a threshold value; the first direction XX is the direction from the binding area D2 to the display area AA, the second direction Y is parallel to the first surface DA and perpendicular to the first direction X, and the threshold value is the size of the binding head in the first direction X and the second direction Y during the binding process of the driving chip 200 and the panel circuit board 300. In this way, the second chip protection glue 420 can be prevented from being burned during the binding process.

[0145] It should also be noted that since the second chip protection glue 420 is higher than the driving chip 200 to provide better protection for the driving chip 200, the sum of the thickness of the second film area 432 and the second chip protection glue 420 in the direction perpendicular to the first surface DA may be greater than or equal to the height of the driving chip 200.

[0146] Exemplarily, the sum of the thickness of the second film area 432 and the second chip protection glue 420 may be greater than or equal to 0.3 mm. In addition, the thickness of the release film 430 cannot be too thick to ensure that it can be peeled off smoothly later. Exemplarily, the thickness of the release film 430 is 0.15 mm, and the thickness of the second chip protection glue 420 may be 0.15 mm. It should be understood that the above is only an example, and the thickness of the release film 430 and the second chip protection glue 420 is not limited to this. In addition, unless otherwise specified, the numerical value in this application is not an absolute definition, but expresses a range of variation within a certain range of the reference value. For example, the numerical value may include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to 3%, less than or equal to 2%, less than or equal to 1%, less than or equal to 0.5%, less than or equal to 0.1%, less than or equal to 0.05%.

[0147] In addition, in some embodiments, the panel circuit board 300 may be a flexible circuit board (FPC) or a printed circuit board (PCB). Fig.34As shown, the panel circuit board 300 may include a circuit board body 310, on which a plurality of exposed conductive points 311 are provided; the chip protection component 400 also includes a circuit board covering layer 312 covering the circuit board body 310, and the circuit board covering layer 312 is configured as a conductive layer, and is electrically connected to some of the exposed conductive points 311, and the circuit board covering layer 312 can be used as a grounding film layer or an anti-signal interference film layer.

[0148] Exemplarily, the circuit board cover layer 312 can be connected to at least one of the first chip protection glue 410 and the second chip protection glue 420 as an integral component. In some embodiments, the circuit board cover layer 312 and the heat dissipation layer 4122 are connected as an integral structure. For example, Fig.34 The schematic diagram shows a structure in which the circuit board cover layer 312 and the second chip protection adhesive 420 are connected as an integral component.

[0149] The display panel provided in the embodiments of the present disclosure can be applied to a folding display device, but is not limited thereto. For example, in the display panel provided in the embodiments of the present disclosure, in order to increase the layout space of the battery compartment 500 in the display device, the driver chip 200 is arranged close to the edge of the protective cover plate 20. For example, when the bending area D1 is not bent, along the first direction X pointing from the binding area D2 to the display area AA, the distance between the driver chip 200 and the protective cover plate 20 can be 0.1 to 1 mm. In other words, taking the side edge of the protective cover plate 20 on the binding side D1 as a reference, the driver chip 200 deviates by 0.1 to 1 mm in the direction away from the display area AA compared to the protective cover plate 20.

[0150] Exemplarily, when the display panel is used in a display device, the distance between the battery compartment 500 and the edge of the protective cover plate 20 is greater than or equal to 2 mm, based on the edge of the protective cover plate 20 on the binding side D1. The ratio of the orthographic projection area of ​​the battery compartment on the protective cover plate 20 to the area of ​​the protective cover plate 20 is 60% to 90%. For example, the ratio of the orthographic projection area of ​​the battery compartment 500 on the protective cover plate 20 to the area of ​​the protective cover plate 20 is greater than or equal to 80%.

[0151] It should be noted that, unless otherwise specified, the above values ​​are not absolute definitions, but express the range of variation of the reference value within a certain range. For example, the value may include a range of variation less than or equal to 10% of the value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to 3%, less than or equal to 2%, less than or equal to 1%, less than or equal to 0.5%, less than or equal to 0.1%, less than or equal to 0.05%.

[0152] In addition, the embodiment of the present disclosure further provides a panel circuit board 300, the panel circuit board 300 includes a circuit board body 310 and a chip protection member 400 disposed on the circuit board body 310, wherein the chip protection member 400 is configured to be attached to the first area DA1 of the display panel 10. The specific structure of the chip protection member 400 has been described in detail when the structure of the chip protection member 400 in the display panel 10 is described in the present disclosure, and will not be repeated here.

[0153] In addition, the embodiment of the present disclosure further provides a display module, including: the display panel 10 provided in the embodiment of the present disclosure and a protective cover plate 20, wherein the protective cover plate 20 is arranged on the light-emitting side of the display panel 10. Obviously, the display module provided in the embodiment of the present disclosure also has the beneficial effects brought by the display panel provided in the embodiment of the present disclosure, which will not be described in detail here.

[0154] In addition, an embodiment of the present disclosure also provides a method for manufacturing a display module, the method comprising the following steps: bonding a protective cover plate 20 to the light-emitting side of the display panel to obtain the display module, wherein before the display panel is bonded to the protective cover plate 20, a chip protection component 400 is provided in at least the first area DA1 of the display panel.

[0155] In some exemplary embodiments, the method specifically comprises the following steps:

[0156] Step S01, providing a display substrate 100 and a panel circuit board 300, wherein the bending area D1 of the display substrate 100 is in an unbent state, the release film 430 is attached to the circuit board body 310 of the panel circuit board 300, and the second film area 432 of the release film 430 is correspondingly attached to the first area DA1, so that the second chip protection glue 420 surrounds the periphery of the driving chip 200;

[0157] Step S02, binding and connecting the driving chip 200 and the panel circuit board 300;

[0158] Step S03, bending the bending area D1 in a direction away from the light emitting side of the display panel, so that the panel circuit board 300 is located on a side of the display panel away from the light emitting side;

[0159] Step S04, attaching the protective cover plate 20 to the light emitting side of the display panel;

[0160] Step S05 , tearing off the release film 430 , so as to peel off the release film 430 and the second chip protection adhesive 420 from the display panel at the same time.

[0161] There are a few points to note:

[0162] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0163] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0164] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0165] The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A display panel, characterized in that: include: A display substrate, comprising a display area and a peripheral area, wherein the peripheral area comprises a bending area connected to the display area and a binding area connected to the bending area; A driving chip is disposed in the binding area; and A panel circuit board is electrically connected to the driving chip, and the binding area is bent through the bending area toward a direction away from the light emitting side of the display panel, so that the panel circuit board is located on a side of the display panel away from the light emitting side; wherein, The driving chip is bound and connected to the first surface of the peripheral area. The area on the first surface surrounding the periphery of the driving chip is the first area. A chip protection component is provided at least in the first area.

2. The display panel according to claim 1, characterized in that: The chip protection component comprises: a first chip protection glue, wherein the first chip protection glue at least covers a surface of the driver chip facing away from the first surface and the first area; and / or, A second chip protective adhesive is provided with a groove area on the second chip protective adhesive, and the driving chip is accommodated in the groove area, so that the second chip protective adhesive surrounds the driving chip, and the second chip protective adhesive only covers the first area.

3. The display panel according to claim 2, characterized in that: The bonding surface of at least one of the first chip protection glue and the second chip protection glue used to bond to the first surface includes a first bonding area and a second bonding area, the first bonding area is bonded to the panel circuit board, and the second bonding area is bonded to a side surface of the driving chip facing away from the first surface and the first area.

4. The display panel according to claim 3, characterized in that: The peeling force between the first adhesive area and the panel circuit board is greater than or equal to the peeling force between the second adhesive area and the driving chip.

5. The display panel according to claim 4, characterized in that: The peeling force between the first adhesive area and the panel circuit board is greater than or equal to 1000 gf / inch; the peeling force between the second adhesive area and the driving chip is greater than or equal to 600 gf / inch.

6. The display panel according to claim 2, characterized in that: The main material of at least one of the first chip protection glue and the second chip protection glue includes a heat dissipation material.

7. The display panel according to claim 2, characterized in that: At least one of the first chip protection adhesive and the second chip protection adhesive comprises a first film layer and at least one second film layer, the first film layer is an insulating tape, and the second film layer is stacked on a side of the insulating tape away from the first surface.

8. The display panel according to claim 7, characterized in that: The at least one second film layer comprises a conductive film layer, and the conductive film layer is configured as a ground layer or an anti-signal interference layer heat dissipation film; or, The at least one second film layer includes a heat dissipation layer and a conductive film layer stacked on a side of the heat dissipation layer away from the first film layer, and the conductive film layer is configured as a ground layer or an anti-signal interference layer.

9. The display panel according to claim 2, characterized in that: In a direction perpendicular to the first surface, the second chip protection glue has a first height, the driving chip has a second height, and the first height is greater than or equal to the second height.

10. The display panel according to claim 9, characterized in that: A height difference between the first height and the second height is greater than or equal to 0.3 mm.

11. The display panel according to claim 2, characterized in that: The driving chip includes a first side and a second side opposite to each other in a direction from the display area to the binding area, and a third side and a fourth side located between the first side and the second side, wherein the first side is closer to the display area than the second side; wherein the second chip protection glue is at least arranged on the first side.

12. The display panel according to claim 11, characterized in that: The second chip protection glue is distributed on four sides of the driver chip to fully surround the driver chip; or, the second chip protection glue is distributed on at least one of the third side and the fourth side, and the first side to half surround the driver chip.

13. The display panel according to claim 11, characterized in that: There is a gap between the groove sidewall of the groove area and the driving chip.

14. The display panel according to claim 13, characterized in that: The gap is greater than or equal to 0.5 mm.

15. The display panel according to claim 2, characterized in that: The panel circuit board includes a circuit board body; the chip protection component also includes a release film, which is used to be adhered to the circuit board body and can be peeled off from the circuit board body, and the release film includes: a first film area set corresponding to the circuit board body, and a second film area set corresponding to the first area, wherein the second chip protection glue is attached to the second film area, and the second film area and the second chip protection glue have at least partially overlapped orthographic projection patterns on the first surface and matched shapes.

16. The display panel according to claim 15, characterized in that: The peeling force between the first film area and the circuit board body is less than or equal to the peeling force between the second film area and the second chip protection adhesive.

17. The display panel according to claim 15, characterized in that: In the second chip protection glue, the dimensions of the groove area in the first direction and the second direction are greater than a threshold; wherein, the first direction is the direction from the binding area to the display area, the second direction is parallel to the first surface and perpendicular to the first direction, and the threshold is the corresponding dimensions of the binding pressure head in the first direction and the second direction during the binding process of the driver chip and the panel circuit board.

18. The display panel according to claim 2, characterized in that: The binding area is provided with an alignment mark, and either the first chip protection glue or the second chip protection glue is provided with an avoidance hollowing area at a position corresponding to the alignment mark, and the avoidance hollowing area is used to avoid the alignment mark.

19. The display panel according to claim 2, characterized in that: The panel circuit board may include a circuit board body, on which an exposed conductive point is provided; the chip protection component also includes a circuit board covering layer covering the circuit board body, and the circuit board covering layer is configured as a conductive layer, specifically, the circuit board covering layer can be used as a grounding film layer or an anti-signal interference film layer; the circuit board covering layer is connected to at least one of the first chip protection glue and the second chip protection glue and serves as an integral component.

20. A panel circuit board, characterized in that: Applicable to the display panel according to any one of claims 1 to 19, the panel circuit board comprises a circuit board body and a chip protection component provided on the circuit board body, wherein the chip protection component is configured to be pasted on a first area of ​​the display panel.

21. A display module, characterized in that: include: The display panel according to any one of claims 1 to 19; The protective cover plate is arranged on the light emitting side of the display panel.

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