Embedded packaging ceramic substrate

Abstract

The utility model discloses an embedded packaging ceramic substrate, which comprises a ceramic body, a first conductive layer, a second conductive layer, heat-conducting glue, a first heat-conducting layer and an insulating layer, the first conductive layer is arranged on the bottom end surface of the assembling groove and is in contact conduction with the conductive column; the first heat-conducting layer is arranged on the lower surface of the ceramic body and is in fit contact with the lower end surface of the heat-conducting glue; the insulating layer is filled and molded in the assembling groove. The assembling groove used for assembling the electronic device is formed in the upper surface of the ceramic body, a metal box dam is not needed, the structure of the ceramic substrate is simplified, the overall size of the ceramic substrate is reduced, the space requirement of the ceramic substrate for the use environment is lowered, heat-conducting glue is formed in the conductive groove in a matched mode, and the heat-conducting glue can make contact with the electronic device with the maximum area, so that the service life of the electronic device is prolonged. In addition, the heat-conducting glue is in contact with the heat-conducting layer in an attached mode, so that the heat dissipation efficiency of the ceramic substrate is greatly improved, and the packaging requirement of a high-power device is met.

Description

Technical Field

[0001] The utility model relates to the field of ceramic substrate technology, in particular to an embedded packaged ceramic substrate. Background Art

[0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface (single or double sides) of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent soft solderability and high adhesion strength, and can be etched with various patterns like PCB boards, and has a large current carrying capacity. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. Ceramic substrates generally have a structure including a ceramic base layer and a metal dam, and a packaging cavity is formed by the metal dam. After the UV chip is packaged, a light-transmitting cover is set to seal the opening of the packaging cavity.

[0003] The existence of the metal dam makes the structure of the ceramic substrate more complicated, the overall size is larger, and the space requirements for the use environment are higher. At the same time, most ceramic substrates dissipate heat through the ceramic itself, and the heat dissipation effect is not ideal, which cannot meet the packaging requirements of high-power devices. Therefore, it is necessary to improve the current ceramic substrate. Utility Model Content

[0004] In view of this, the present invention aims to address the deficiencies in the prior art, and its main purpose is to provide an embedded package ceramic substrate, which can effectively solve the problems of the existing ceramic substrate having a complex structure, a large overall size, and an unsatisfactory heat dissipation effect.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] An embedded package ceramic substrate comprises a ceramic body, a first conductive layer, a second conductive layer, a thermally conductive adhesive, a first thermally conductive layer and an insulating layer; an assembly groove for assembling electronic devices is provided on the upper surface of the ceramic body, a thermally conductive groove and a conductive groove penetrating the lower surface of the ceramic body are provided on the bottom end surface of the assembly groove, and a conductive column is provided in the conductive groove; the first conductive layer is arranged on the bottom end surface of the assembly groove and is in contact and conduction with the conductive column; the second conductive layer is arranged on the lower surface of the ceramic body, and the second conductive layer is in conduction with the first conductive layer through the conductive column; the thermally conductive adhesive is filled and formed in the conductive groove, and the lower end surface of the thermally conductive adhesive is flush with the lower surface of the ceramic body; the first thermally conductive layer is arranged on the lower surface of the ceramic body and is in contact with the lower end surface of the thermally conductive adhesive; the insulating layer is filled and formed in the assembly groove, and the upper end surface of the insulating layer is flush with the upper surface of the ceramic body.

[0007] As a preferred solution, the opening of the assembly groove is trumpet-shaped.

[0008] As a preferred solution, the first heat conducting layers are all made of graphene material.

[0009] As a preferred solution, a second heat-conducting layer is provided on the side wall of the assembly groove.

[0010] As a preferred solution, the second heat conducting layer is made of graphene.

[0011] As a preferred solution, the first conductive layer is located at the periphery of the bottom end surface of the assembly groove.

[0012] As a preferred solution, the insulating layer is made of transparent material.

[0013] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0014] By opening an assembly groove for assembling electronic devices on the upper surface of the ceramic body, no metal dam is required, the structure of the ceramic substrate is simplified, the overall size of the ceramic substrate is reduced, and the space requirement of the ceramic substrate for the use environment is reduced. In addition, a thermal conductive adhesive is formed in the conductive groove, and the thermal conductive adhesive can contact the electronic device with the maximum area, so that the heat conduction area of ​​the electronic device is maximized. In addition, the thermal conductive adhesive is in close contact with the thermal conductive layer, which greatly enhances the heat dissipation efficiency of the ceramic substrate, so that it meets the packaging requirements of high-power devices.

[0015] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments: BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a cross-sectional view of a preferred embodiment of the utility model.

[0017] Description of the accompanying drawings:

[0018] 10. Ceramic body 101. Assembly groove

[0019] 102. Heat conduction groove 103. Electrical conduction groove

[0020] 11. Conductive column 20, first conductive layer

[0021] 30. Second conductive layer 40. Thermal conductive adhesive

[0022] 50. First heat conducting layer 60. Insulating layer

[0023] 70. Electronic device 80. Second heat conducting layer. DETAILED DESCRIPTION

[0024] Please refer to Figure 1As shown, it shows the specific structure of a preferred embodiment of the utility model, including a ceramic body 10, a first conductive layer 20, a second conductive layer 30, a thermal conductive adhesive 40, a first thermal conductive layer 50 and an insulating layer 60.

[0025] The upper surface of the ceramic body 10 is provided with an assembly groove 101 for assembling the electronic device 70, and the bottom end surface of the assembly groove 101 is provided with a heat-conducting groove 102 and a conductive groove 103 that penetrate the lower surface of the ceramic body 10, and a conductive column 11 is provided in the conductive groove 103; in the present embodiment, the opening of the assembly groove 101 is trumpet-shaped, and a second heat-conducting layer 80 is provided on the side wall of the assembly groove 101; the second heat-conducting layer 80 is made of graphene.

[0026] The first conductive layer 20 is disposed on the bottom surface of the assembly groove 101 and is in contact with the conductive column 11 . In this embodiment, the first conductive layer 20 is located at the periphery of the bottom surface of the assembly groove 101 to increase the contact area between the thermal conductive adhesive 40 and the electronic device 70 .

[0027] The second conductive layer 30 is disposed on the lower surface of the ceramic body 10 , and the second conductive layer 30 is electrically connected to the first conductive layer 20 through the conductive pillars 11 .

[0028] The thermal conductive adhesive 40 is filled and formed in the conductive slot 103 , and the lower end surface of the thermal conductive adhesive 40 is flush with the lower surface of the ceramic body 10 .

[0029] The first heat-conducting layer 50 is disposed on the lower surface of the ceramic body 10 and is in contact with the lower end surface of the heat-conducting adhesive 40 . In the present embodiment, the first heat-conducting layer 50 is made of graphene.

[0030] The insulating layer 60 is filled and formed in the assembly groove 101 , and the upper end surface of the insulating layer 60 is flush with the upper surface of the ceramic body 10 ; in this embodiment, the insulating layer 60 is made of a transparent material.

[0031] The assembly method of this embodiment is described in detail as follows:

[0032] First, the electronic device 70 is embedded in the assembly groove 101 so that the electronic device 70 is conductively connected to the first conductive layer 20. Next, glue is injected into the conductive groove 103 so that the thermal conductive glue 40 is formed in the conductive groove 103 and contacts the electronic device 70. Then, the insulating layer 60 is formed by glue dot. Finally, the first thermal conductive layer 50 is attached to the external heat sink, and the second conductive layer 30 is conductively connected to the external circuit.

[0033] During operation, the heat generated by the electronic device 70 is transferred to the thermal conductive adhesive 40 and the second thermal conductive layer 80, and the thermal conductive adhesive 40 is transferred to the first thermal conductive layer 50, and finally transferred to the heat sink, thereby achieving efficient heat dissipation.

[0034] The design focus of the utility model is: by opening an assembly groove for assembling electronic devices on the upper surface of the ceramic body, no metal dam is required, the structure of the ceramic substrate is simplified, the overall size of the ceramic substrate is reduced, and the space requirement of the ceramic substrate for the use environment is reduced. In addition, a thermally conductive adhesive is formed in the conductive groove, and the thermally conductive adhesive can contact the electronic device with the maximum area, so that the heat conduction area of ​​the electronic device is maximized. In addition, the thermally conductive adhesive is in close contact with the thermally conductive layer, which greatly enhances the heat dissipation efficiency of the ceramic substrate, so that it meets the packaging requirements of high-power devices.

[0035] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. An embedded package ceramic substrate, characterized in that: The invention comprises a ceramic body, a first conductive layer, a second conductive layer, a thermally conductive adhesive, a first thermally conductive layer and an insulating layer; an assembly groove for assembling electronic devices is provided on the upper surface of the ceramic body, a thermally conductive groove and a conductive groove penetrating the lower surface of the ceramic body are provided on the bottom end surface of the assembly groove, and a conductive column is provided in the conductive groove; the first conductive layer is arranged on the bottom end surface of the assembly groove and is in contact and conduction with the conductive column; the second conductive layer is arranged on the lower surface of the ceramic body, and the second conductive layer is in conduction with the first conductive layer through the conductive column; the thermally conductive adhesive is filled and formed in the conductive groove, and the lower end surface of the thermally conductive adhesive is flush with the lower surface of the ceramic body; the first thermally conductive layer is arranged on the lower surface of the ceramic body and is in contact with the lower end surface of the thermally conductive adhesive; the insulating layer is filled and formed in the assembly groove, and the upper end surface of the insulating layer is flush with the upper surface of the ceramic body.

2. The embedded package ceramic substrate according to claim 1, characterized in that: The opening of the assembly groove is in a trumpet shape.

3. The embedded package ceramic substrate according to claim 1, characterized in that: The first heat-conducting layers are all made of graphene.

4. The embedded package ceramic substrate according to claim 1, characterized in that: A second heat-conducting layer is arranged on the side wall of the assembly groove.

5. The embedded package ceramic substrate according to claim 4, characterized in that: The second heat-conducting layer is made of graphene.

6. The embedded package ceramic substrate according to claim 1, characterized in that: The first conductive layer is located at the periphery of the bottom end surface of the assembly groove.

7. The embedded package ceramic substrate according to claim 1, characterized in that: The insulating layer is made of transparent material.

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