A PCB electroplating slot hole ring structure for preventing board explosion
By designing the structure of copper hole ring, limit ring and ink in the electroplating slot hole of the printed circuit board, the problem of explosive plate caused by local high temperature in the spot welding process is solved, and the effect of effectively preventing the separation of copper and substrate is achieved.
Patent Information
- Application Number
- CN202421149562.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-24
- Publication Date
- 2025-04-08
- Estimated Expiration
- 2034-05-24
AI Technical Summary
In the spot welding process of printed circuit boards, the electroplating slot holes may be subjected to local high temperatures, causing the copper to separate from the substrate, which is called a blast board, affecting the use of the entire PCB.
A PCB electroplating slot hole ring structure is designed to prevent explosion plates, which includes a copper hole ring, a limit ring and ink. The outer ring of the hole ring is close to the inner wall of the electroplating slot hole, the limit ring is adhered to the spot welding surface of the PCB board, the ink covers the surface of the hole ring, and extends across the outer ring of the hole ring to the inner ring of the limit ring.
By setting ink to cover the surface of the hole ring, the impact of local high temperature on the electroplating slot holes during spot welding is avoided, and the separation of copper and substrate is prevented, thereby effectively preventing the explosive plate.
Smart Images
Figure CN222736351U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of printed circuit board manufacturing, in particular to a PCB electroplating slot hole ring structure for preventing board explosion. Background Art
[0002] There is a spot welding process for printed circuit boards: after the electroplated slots are plugged with inverted pins, spot welding is performed. This method is usually used in the production of electronic equipment where various components and circuit boards need to be connected.
[0003] However, in this production process, the electroplated slot holes may be subjected to local high temperatures, resulting in separation of copper from the substrate (commonly known as board explosion), which in turn affects the use of the entire PCB. Utility Model Content
[0004] The utility model provides a PCB electroplating slot hole ring structure for preventing board explosion, aiming to solve the existing problems.
[0005] The utility model is implemented as follows: a PCB electroplating slot hole ring structure for preventing board explosion, the PCB electroplating slot hole ring structure for preventing board explosion comprises: a PCB board, the PCB board is provided with a plurality of electroplating slot holes, each electroplating slot hole is provided with a hole ring, the outer ring of the hole ring is tightly attached to the inner wall of the electroplating slot hole, the hole ring is made of copper, a limiting ring is provided on the outer periphery of the circular ring end of the hole ring, the limiting ring is adhered to the spot welding surface of the PCB board, the height of the limiting ring is greater than the height of the hole ring, and ink is provided on the side of the hole ring facing away from the PCB board, and the ink spans the outer ring of the hole ring and extends to the inner ring of the limiting ring.
[0006] Preferably, the plurality of electroplating slots are divided into two rows and arranged on the PCB board.
[0007] Preferably, one end of the hole ring facing the spot welding surface of the electroplating slot is in a circular shape, and the other end exposed outside the electroplating slot is cut into a plurality of thin copper sheets.
[0008] Preferably, the width of the circular end of the hole ring is 21 mil.
[0009] Preferably, the inner ring of the limiting ring is provided with an arc groove.
[0010] Preferably, the width of the ink-covered hole ring is 12 mil.
[0011] Compared with the prior art, the beneficial effects of the utility model are:
[0012] The PCB electroplating slot hole ring structure for preventing board explosion has ink covered on the hole ring surface to avoid deformation of the electroplating slot hole caused by local high temperature during spot welding, thereby preventing the separation of copper from the substrate. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0014] Figure 1 It is a side view structural schematic diagram of the utility model;
[0015] Figure 2 It is a schematic diagram of the cross-sectional structure of the utility model;
[0016] Figure 3 yes Figure 2 Schematic diagram of the enlarged structure of part A.
[0017] The numbers in the attached drawings are: 1, PCB board; 2, electroplating slot hole; 3, hole ring; 4, ink; 5, limit ring. DETAILED DESCRIPTION
[0018] In order to more fully understand the technical content of the utility model, the technical solution of the utility model is further introduced and illustrated in conjunction with specific embodiments below, but it is not limited to this. The technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the utility model.
[0019] In the description of the embodiments of the present utility model, it should be noted that if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate an orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, it is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0020] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0021] Example 1
[0022] refer to Figures 1 to 3 The PCB electroplating slot hole ring structure for preventing board explosion includes: a PCB board 1, a plurality of electroplating slot holes 2, a plurality of hole rings 3, ink 4 and a plurality of limit rings 5. The PCB board 1 is provided with a plurality of electroplating slot holes 2, and the plurality of electroplating slot holes 2 are arranged on the PCB board 1 in two rows. A hole ring 3 is arranged in each electroplating slot hole 2, and the outer ring of the hole ring 3 is close to the inner wall of the electroplating slot hole 2. The hole ring 3 is made of copper, and one end of the hole ring 3 facing the spot welding surface of the electroplating slot hole 2 is in a circular ring shape, and the other end exposed outside the electroplating slot hole 2 is cut into a plurality of thin copper sheets, and the width of the circular ring end is 21mil. One end of the hole ring 3 provided with the thin copper sheet passes through the electroplating slot hole 2 until the circular ring end of the electroplating slot hole 2 is close to the spot welding surface of the PCB board 1, and then the thin copper sheet is bent. The copper sheet is made to be close to the non-spot welding surface of the PCB board 1 to complete the fixation of the hole ring 3. A limiting ring 5 is provided on the outer periphery of the circular ring end of the hole ring 3. The limiting ring 5 is adhered to the spot welding surface of the PCB board 1. An arc groove is provided on the inner circle of the limiting ring 5. The height of the limiting ring 5 is greater than the height of the hole ring 3. Ink 4 is provided on the side of the hole ring 3 facing away from the PCB board 1. The ink 4 extends across the outer circle of the hole ring 3 to the inner circle of the limiting ring 5. The width of the hole ring 3 covered by the ink 4 is 12 mil. The limiting ring 5 is used to limit the position of the ink 4 to prevent the ink 4 from excessively extending when dripping ink. The ink 4 covers the surface of the hole ring 3 to avoid the local high temperature during spot welding affecting the electroplating slot hole 2 and causing the electroplating slot hole 2 to deform, thereby preventing the copper from separating from the substrate.
[0023] It should be noted that the standard parts used in this application document can all be purchased from the market, and the specific connection methods of each part are connected by conventional means such as mature bolts, rivets, welding, etc. in the prior art. In addition, the machinery, parts and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, so no specific description will be given here.
[0024] The embodiments described above are only part of the embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any ordinary technician in the field can make equivalent substitutions or changes within the technical scope disclosed by the present invention according to the technical solution and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A PCB electroplating slot hole ring structure for preventing board explosion, characterized in that: The PCB electroplating slot hole ring structure for preventing board explosion comprises: a PCB board (1), the PCB board (1) is provided with a plurality of electroplating slot holes (2), each electroplating slot hole (2) is provided with a hole ring (3), the outer ring of the hole ring (3) is closely attached to the inner wall of the electroplating slot hole (2), the hole ring (3) is made of copper, a limiting ring (5) is provided on the outer periphery of the circular ring end of the hole ring (3), the limiting ring (5) is adhered to the spot welding surface of the PCB board (1), the height of the limiting ring (5) is greater than the height of the hole ring (3), and ink (4) is provided on a side of the hole ring (3) facing away from the PCB board (1), and the ink (4) spans the outer ring of the hole ring (3) and extends to the inner ring of the limiting ring (5).
2. The PCB electroplating slot hole ring structure for preventing board explosion as claimed in claim 1, characterized in that: The plurality of electroplating slot holes (2) are arranged in two rows on the PCB board (1).
3. The PCB electroplating slot hole ring structure for preventing board explosion as claimed in claim 1, characterized in that: One end of the hole ring (3) facing the spot welding surface of the electroplating slot hole (2) is in a circular shape, and the other end, which is exposed outside the electroplating slot hole (2), is cut into a plurality of thin copper sheets.
4. The PCB electroplating slot hole ring structure for preventing board explosion as claimed in claim 3, characterized in that: The width of the circular ring end of the hole ring (3) is 21 mil.
5. The PCB electroplating slot hole ring structure for preventing board explosion as claimed in claim 1, characterized in that: The inner ring of the limiting ring (5) is provided with an arc groove.
6. The PCB electroplating slot hole ring structure for preventing board explosion as claimed in claim 3, characterized in that: The ink (4) covers the hole ring (3) to a width of 12 mil.