A copper-embedded PCB board that is easy to dissipate heat

Abstract

The utility model discloses a copper-embedded PCB board that is easy to dissipate heat, and relates to the technical field of PCB boards, including a PCB board body; four base frames are connected to the bottom of the PCB board body, and the four base frames are distributed at the four corners of the PCB board body, and a fixing rod is connected between every two base frames, and a heat dissipation mechanism is provided between the two fixing rods; the heat dissipation mechanism includes two heat dissipation frames, and both of the two heat dissipation frames are provided with air outlets, and the ends of the two heat dissipation frames are connected with sliders. The utility model is connected to the copper plate and the heat-conducting layer through the heat dissipation holes, and the copper plate and the heat-conducting layer together constitute a heat conduction path. The heat dissipation holes and the copper plate or the heat-conducting layer can form a larger heat exchange area, and the heat-conducting layer is filled with thermal paste, which can improve the heat conduction efficiency, so that the heat is more easily transferred to the heat dissipation holes or the external environment, and the overall heat dissipation capacity is enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB boards, and in particular to a copper-embedded PCB board which is convenient for heat dissipation. Background Art

[0002] Copper-embedded PCB is a highly efficient heat dissipation PCB that uses copper foil as an internal heat-conducting layer in the design of printed circuit boards (PCBs). The main purpose of this design is to improve the efficiency of heat conduction, thereby effectively reducing the heat generated by electronic components during operation. It is widely used in high-power electronic devices such as servers, data centers, automotive electronics, and industrial control systems. It is usually made of multiple layers of materials, including an insulation layer and a conductor layer. The copper plate embedded inside the PCB is a highly thermally conductive material that is used to quickly conduct the heat generated by the electronic components in the circuit. This design uses a variety of thermal management measures to ensure that the PCB can still operate stably in a high-temperature environment and protect electronic components from overheating. It provides an efficient heat conduction path and effectively dissipates heat to the external environment;

[0003] The Chinese patent authorization announcement number is CN220235219U, and the name is a heat dissipation type PCB board, including a PCB board body, the surface of which is slidably connected to two positioning frames, the cross-section of which is "U"-shaped, and two elastic pads are slidably connected between the two positioning frames and the PCB board body, respectively, and the surface of the positioning frame is provided with two limiting holes, the inner wall of the limiting hole is threadedly connected to a mounting cylinder, the inner wall of the mounting cylinder is threadedly connected to an auxiliary rod, and the surfaces of the four mounting cylinders are fixedly installed with square plates, and the surface of the square plates is provided with anti-slip protrusions. The utility model solves the disadvantage of the existing technology that the PCB board is not easy to dissipate heat;

[0004] The disadvantages of the above scheme are: although the above scheme can dissipate heat for the PCB board, such a PCB board usually does not include a special heat dissipation layer or embedded copper foil, so its heat conduction efficiency is low, which may cause the electronic components to operate at a higher operating temperature, and the heat dissipation of the PCB board mainly depends on the surface and edges, which limits the technical problem of effective heat dissipation. Utility Model Content

[0005] The utility model aims to provide a copper-embedded PCB board that is easy to dissipate heat, so as to solve the technical problems in the prior art that the heat conduction efficiency of the PCB board is low, which may cause the electronic components to operate at a higher operating temperature, and the heat dissipation of the PCB board mainly depends on the surface and edges, which limits the effective dissipation of heat.

[0006] The technical problem to be solved by the utility model can be achieved through the following technical solutions:

[0007] A copper-embedded PCB board that is convenient for heat dissipation, comprising a PCB board body;

[0008] Four base frames are connected to the bottom of the PCB body, and the four base frames are distributed at the four corners of the PCB body. A fixing rod is connected between every two base frames, and a heat dissipation mechanism is provided between the two fixing rods.

[0009] The heat dissipation mechanism includes two heat dissipation frames, each of which is provided with an air outlet, the ends of the two heat dissipation frames are connected with a slider, each end of the heat dissipation frame is connected with a bolt, the fixing rod is provided with a slide groove which is matched with the slider, the two sliders are slidably connected in the slide groove, and a connecting rod is connected between the two heat dissipation frames;

[0010] A copper plate is embedded in the PCB body, a heat-conducting layer is arranged at the bottom of the copper plate, and a heat-dissipating hole is arranged at the bottom of the PCB body.

[0011] As a further solution of the utility model: the heat dissipation frame is connected to the sliding block by bolts.

[0012] As a further solution of the utility model: the connecting rod and the heat dissipation frame are connected by screws.

[0013] As a further solution of the utility model: the interior of the heat-conducting layer is filled with heat-conducting paste.

[0014] As a further solution of the utility model: the heat dissipation holes are connected to the copper plate and the heat conducting layer.

[0015] As a further solution of the utility model: each of the heat dissipation holes is connected with a heat dissipation fin.

[0016] Beneficial effects of the utility model:

[0017] 1. The utility model is connected with the copper plate and the heat-conducting layer through the heat dissipation holes. The copper plate and the heat-conducting layer together constitute a heat conduction path. The heat dissipation holes and the copper plate or the heat-conducting layer can form a larger heat exchange area. The heat-conducting layer is filled with thermal paste, which can improve the heat conduction efficiency, make it easier to transfer heat to the heat dissipation holes or the external environment, and enhance the overall heat dissipation capacity.

[0018] 2. The utility model has a fixing rod connected between the base frames, and the heat dissipation mechanism is installed on the fixing rod. By sliding the connecting rod, the heat dissipation frame drives the slider to slide in the slide groove provided on the fixing rod. At the same time, the air outlet holes on the heat dissipation frame discharge air to dissipate the heat of the PCB board body. The connecting rod is connected to the heat dissipation frame and fixed by screws to maintain the overall stability and connectivity of the heat dissipation mechanism. The bottom of the PCB board body is provided with heat dissipation holes to quickly conduct heat, and the heat dissipation fins help the heat to be dissipated by air convection. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The utility model is further described below in conjunction with the accompanying drawings.

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2 It is a schematic diagram of the bottom structure of the utility model;

[0022] Figure 3 It is a schematic diagram of the heat dissipation frame structure in the utility model.

[0023] In the figure: 1. PCB board body; 2. Copper plate; 3. Thermal conductive layer; 4. Base frame; 5. Fixing rod; 6. Heat dissipation fins; 8. Heat dissipation frame; 9. Connecting rod; 10. Slider; 11. Bolt; 12. Heat dissipation hole; 13. Air outlet. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] like Figure 1-Figure 3 As shown, a copper-embedded PCB board that is easy to dissipate heat includes a PCB board body 1, four base frames 4 are connected to the bottom of the PCB board body 1, and the four base frames 4 are distributed at the four corners of the PCB board body 1. A fixing rod 5 is connected between every two of the base frames 4, and a heat dissipation mechanism is provided between the two fixing rods 5;

[0026] The heat dissipation mechanism includes two heat dissipation frames 8, each of which is provided with an air outlet 13, and the ends of the two heat dissipation frames 8 are connected with a slider 10, and each end of the heat dissipation frame 8 is connected with a bolt 11, and the heat dissipation frame 8 is connected to the slider 10 by the bolt 11, and the fixing rod 5 is provided with a slide groove that is matched with the slider 10, and the two sliders 10 are slidably connected in the slide groove, and a connecting rod 9 is connected between the two heat dissipation frames 8, and the connecting rod 9 is connected to the heat dissipation frame 8 by screws;

[0027] A copper plate 2 is embedded inside the PCB board body 1, a heat-conducting layer 3 is provided at the bottom of the copper plate 2, and the heat-conducting layer 3 is filled with thermal paste. A heat-dissipating hole 12 is provided at the bottom of the PCB board body 1, and the heat-dissipating hole 12 is connected to the copper plate 2 and the heat-conducting layer 3; each of the heat-dissipating holes 12 is connected to a heat-dissipating fin 6.

[0028] Working principle of the utility model: the device is connected with the copper plate 2 and the heat-conducting layer 3 through the heat-dissipating holes 12, and the copper plate 2 and the heat-conducting layer 3 together constitute a heat conduction path. The heat-dissipating holes 12 and the copper plate 2 or the heat-conducting layer 3 can form a larger heat exchange area. The heat-conducting layer 3 is filled with thermal paste, which can improve the heat conduction efficiency, so that the heat can be more easily transferred to the heat-dissipating holes 12 or the external environment, thereby enhancing the overall heat dissipation capacity; the fixing rods 5 are connected between the base frames 4, and the heat dissipation mechanism is installed on the fixing rods 5. By sliding the connecting rods 9, the heat dissipation frame 8 drives the slider 10 to slide in the slide groove opened on the fixing rods 5, and at the same time, the air outlets 13 on the heat dissipation frame 8 discharge air to dissipate the PCB board body 1. The connecting rods 9 are connected to the heat dissipation frame 8 and fixed by screws to maintain the overall stability and connectivity of the heat dissipation mechanism; the bottom of the PCB board body 1 is provided with heat-dissipating holes 12 to quickly conduct heat, and the heat dissipation fins 6 help the heat to be dissipated by air convection;

[0029] When the electronic components on the PCB body 1 generate heat, the heat is conducted to the heat dissipation holes 12 through the copper plate 2 and the heat conductive layer 3. The heat dissipation holes 12 transfer the heat to the heat dissipation fins 6, and the heat is dissipated to the external environment through air convection. This design uses various thermal management measures to ensure that the PCB board can still operate stably in a high temperature environment and protect the electronic components from overheating.

[0030] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A copper-embedded PCB board that is convenient for heat dissipation, comprising a PCB board body (1); characterized in that: The bottom of the PCB body (1) is connected to four base frames (4), the four base frames (4) are distributed at four corners of the PCB body (1), a fixing rod (5) is connected between every two base frames (4), and a heat dissipation mechanism is provided between the two fixing rods (5); The heat dissipation mechanism comprises two heat dissipation frames (8), each of the two heat dissipation frames (8) is provided with an air outlet (13), the ends of the two heat dissipation frames (8) are connected with a slider (10), each end of the heat dissipation frame (8) is connected with a bolt (11), the fixing rod (5) is provided with a slide groove which is matched with the slider (10), the two sliders (10) are slidably connected in the slide groove, and a connecting rod (9) is connected between the two heat dissipation frames (8); A copper plate (2) is embedded in the PCB body (1), a heat-conducting layer (3) is provided at the bottom of the copper plate (2), and a heat-dissipating hole (12) is provided at the bottom of the PCB body (1).

2. A copper-embedded PCB board for heat dissipation according to claim 1, characterized in that: The heat dissipation frame (8) is connected to the slide block (10) via bolts (11).

3. The copper-embedded PCB board for heat dissipation according to claim 1, characterized in that: The connecting rod (9) and the heat dissipation frame (8) are connected via screws.

4. The copper-embedded PCB board for heat dissipation according to claim 1, characterized in that: The heat-conducting layer (3) is filled with heat-conducting paste.

5. The copper-embedded PCB board for heat dissipation according to claim 1, characterized in that: The heat dissipation holes (12) are connected to the copper plate (2) and the heat conducting layer (3).

6. The copper-embedded PCB board for heat dissipation according to claim 1, characterized in that: Each of the heat dissipation holes (12) is connected to a heat dissipation fin (6).

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