A capacitor circuit board with a stepped structure

Abstract

The utility model relates to the technical field of circuit boards, and more specifically, to a capacitor circuit board with a stepped structure, which aims to solve the technical problem that the positions of the heat sink and the heat-conducting column in the prior art are fixed, which makes it difficult for the heat on the circuit board far away from the heat-conducting column and the heat sink to be absorbed by both, thereby causing the circuit board to be unable to dissipate heat uniformly as a whole, and includes a bottom substrate and an upper substrate pressed on the upper side thereof. The external gas is guided by a fan, so that the gas is discharged from the exhaust hole, and the air on the upper side of the upper substrate is stirred, so that the gas on the upper substrate flows due to the change in air pressure, so that part of the heat is discharged into the outside air with the flow of the gas, and the other part contacts the heat sink, is absorbed by the heat sink, and is transferred to the heat dissipation channel by the heat sink, and then guided to the outside air by the fan, so as to achieve comprehensive and efficient heat dissipation of the bottom substrate, the upper substrate and the capacitor element.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and more specifically to a capacitor circuit board with a stepped structure. Background Art

[0002] A stepped capacitor circuit board refers to a capacitor circuit board that uses a stepped structure in its design, which can provide greater capacitance and improve the performance of the capacitor circuit board. For example, by increasing the surface area, the capacitance value of the capacitor can be increased. In addition, the stepped structure can also achieve a more compact layout, save space, and consider the signal transmission path and impedance matching in the design.

[0003] The prior art discloses a utility model patent called a stepped capacitor circuit board with application number CN202322961954.6. When the capacitor circuit board and the capacitor element generate heat during operation, the heat is diffused on the heat sink by conduction, and then the heat is diffused faster by a fan, and part of the heat is conducted to the heat sink by a heat conducting column for heat dissipation.

[0004] However, when it is in use, it only relies on the heat sink and the thermally conductive column to absorb the heat on the circuit board, and then the heat is dissipated by the fan. The positions of the heat sink and the thermally conductive column are fixed, which makes it difficult for the heat on the circuit board far away from the thermally conductive column and the heat sink to be absorbed by both, resulting in the inability to evenly dissipate the heat of the entire circuit board. Utility Model Content

[0005] The purpose of the utility model is to overcome the shortcomings of the prior art, meet actual needs, and provide a capacitor circuit board with a stepped structure to solve the technical problem that the positions of the heat sink and the thermal conductive column in the prior art are fixed, which makes it difficult for the heat on the circuit board far away from the thermal conductive column and the heat sink to be absorbed by both, thereby resulting in the inability to uniformly dissipate heat for the entire circuit board.

[0006] In order to solve the above technical problems, the utility model provides the following technical solutions: a capacitor circuit board with a stepped structure, comprising a bottom substrate and an upper substrate pressed on the upper side thereof, and a plurality of stepped grooves opened on the top of the upper substrate, the bottom substrate and the upper substrate are both provided with a plurality of capacitor elements, and the capacitor elements on the bottom substrate are located in the stepped grooves, a heat dissipation plate is fixed to the bottom of the bottom substrate, a plurality of symmetrically arranged heat dissipation channels are opened on a side of the heat dissipation plate opposite to the bottom substrate, an air duct is also opened on a side of the heat dissipation plate opposite to the bottom substrate, a partition plate is fixedly connected to the inner wall of the air duct, the partition plate is used to divide the air duct into an upper and lower cavity, and the lower cavity of the air duct is connected to the interior of the heat dissipation channel, and a heat dissipation mechanism for dissipating heat to the upper substrate, the bottom substrate and the capacitor elements is arranged in the air duct;

[0007] The heat dissipation mechanism includes a fan, which is symmetrically arranged on the partition plate, and is used to connect the upper and lower cavities of the air duct. An insulating tube is fixedly connected to the upper side of the upper substrate, and the bottom of the insulating tube passes through the upper substrate and the bottom substrate to the air duct, and is connected to the upper cavity of the air duct. An exhaust column is fixedly connected to the inner wall of the insulating tube, and the interior of the exhaust column is hollow and connected to the interior of the insulating tube. A plurality of exhaust holes connected to the interior of the exhaust column are evenly opened on the outer wall of the exhaust column, and a plurality of groups of symmetrically arranged heat sinks are arranged on the upper side of the upper substrate; the fan guides the external air so that the air is discharged from the exhaust holes, and the air on the upper side of the upper substrate is stirred, so that the gas on the upper substrate flows due to the change in air pressure, and a part of the heat is discharged to the external air along with the flow of the gas, and the other part contacts the heat sink and is absorbed by the heat sink, thereby realizing comprehensive and efficient heat dissipation of the bottom substrate, the upper substrate and the capacitor element.

[0008] Preferably, an insulating ring is fixedly connected to the upper side of the upper substrate, the insulating ring passes through the upper substrate and the bottom substrate and is connected to the inside of the heat dissipation channel, the heat sink is fixedly connected to the inner wall of the insulating ring, and the bottom of the heat sink extends into the heat dissipation channel; when the fan rotates to guide external air into the heat dissipation channel for circulation, it can contact the heat sink extending into the heat dissipation channel, so that the heat sink and the circulating gas can exchange heat, thereby increasing the heat dissipation effect of the heat sink.

[0009] Preferably, the outer edge of the heat sink extending into the heat dissipation channel is in contact with the inner wall of the heat dissipation channel, and the outer wall of the heat sink extending into the heat dissipation channel is provided with a flow groove, and the flow grooves on two adjacent heat sinks are arranged in a staggered manner; the staggered flow grooves make it necessary for gas to pass through the flow grooves in sequence if it wants to flow inside the heat dissipation channel, thereby increasing the contact area between the airflow and the heat sink, thereby increasing the heat dissipation effect of the heat sink.

[0010] Preferably, the upper sides of the heat sinks are arranged in a trapezoidal shape; the trapezoidal arrangement of the heat sinks allows the gas discharged from the exhaust holes to pass through the upper sides of the heat sinks more evenly, making it easier for the gas to flow between the heat sinks, thereby increasing the heat exchange effect of the heat sinks.

[0011] Preferably, the top of the insulating ring is provided with a plurality of heat-conducting holes penetrating therethrough; through the provided heat-conducting holes, a portion of the gas carrying heat on the upper side of the upper substrate can be sucked into the heat dissipation channel and then discharged through the exhaust holes, thereby increasing the overall heat dissipation effect.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The utility model guides the external air through the fan, so that the gas is discharged from the exhaust hole, and stirs the air on the upper side of the upper substrate, so that the gas on the upper substrate flows due to the change of air pressure, so that part of the heat is discharged into the external air with the flow of the gas, and the other part contacts the heat sink, is absorbed by the heat sink, and is transferred to the heat dissipation channel by the heat sink, and then guided to the external air by the fan, thereby realizing comprehensive and efficient heat dissipation of the bottom substrate, the upper substrate and the capacitor element.

[0014] 2. The utility model also guides external air into the heat dissipation channel for circulation through the rotation of the fan, which can contact the heat sink extending into the heat dissipation channel, so that the heat sink and the circulating gas can exchange heat, thereby increasing the heat dissipation effect of the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the disassembly structure of the utility model;

[0017] Figure 3 It is a cross-sectional view of the heat dissipation plate in the utility model;

[0018] Figure 4 for Figure 3 A local enlarged view of point A in FIG.

[0019] Figure 5It is a cross-sectional view of the exhaust column in the utility model.

[0020] Description of the numbers in the figure:

[0021] 1. Bottom substrate; 2. Upper substrate; 3. Step groove; 4. Capacitor element; 5. Heat sink; 6. Heat dissipation channel; 7. Air induction groove; 8. Partition plate; 9. Fan; 10. Insulation tube; 11. Exhaust column; 12. Exhaust hole; 13. Heat sink; 14. Insulation ring; 15. Flow groove; 16. Thermal hole. DETAILED DESCRIPTION

[0022] like Figures 1 to 5 As shown, the utility model relates to a capacitor circuit board with a stepped structure, comprising a bottom substrate 1 and an upper substrate 2 pressed on the upper side thereof, and a plurality of stepped grooves 3 opened on the top of the upper substrate 2, the bottom substrate 1 and the upper substrate 2 are both provided with a plurality of capacitor elements 4, and the capacitor elements 4 on the bottom substrate 1 are located in the stepped grooves 3, a heat sink 5 is fixed to the bottom of the bottom substrate 1, a plurality of symmetrically arranged heat dissipation channels 6 are opened on a side of the heat sink 5 opposite to the bottom substrate 1, an air induction groove 7 is also opened on a side of the heat sink 5 opposite to the bottom substrate 1, a partition plate 8 is fixedly connected to the inner wall of the air induction groove 7, the partition plate 8 is used to divide the air induction groove 7 into an upper and lower cavity, and the lower cavity of the air induction groove 7 is connected to the inside of the heat dissipation channel 6, and a heat dissipation mechanism for dissipating heat from the upper substrate 2, the bottom substrate 1 and the capacitor element 4 is arranged in the air induction groove 7;

[0023] The heat dissipation mechanism includes a fan 9, which is symmetrically arranged on the partition plate 8. The fan 9 is used to connect the upper and lower cavities of the air induction groove 7. An insulating tube 10 is fixedly connected to the upper side of the upper substrate 2. The bottom of the insulating tube 10 passes through the upper substrate 2 and the bottom substrate 1 to the air induction groove 7 and is connected to the upper cavity of the air induction groove 7. An exhaust column 11 is fixedly connected to the inner wall of the insulating tube 10. The interior of the exhaust column 11 is hollow and connected to the interior of the insulating tube 10. The outer wall of the exhaust column 11 is evenly provided with a plurality of exhaust holes 12 connected to the interior thereof. The upper side of the upper substrate 2 is provided with a plurality of exhaust holes 12 connected to the interior thereof. The heat sink 13 is symmetrically arranged in a group; the external air is guided by the fan 9 so that the gas is discharged from the exhaust hole 12, and the air on the upper side of the upper substrate 2 is stirred, so that the gas on the upper substrate 2 flows due to the change in air pressure, thereby fully absorbing the heat dissipated by the operation of the capacitor element 4 and the upper substrate 2 and the bottom substrate 1, and a part of the heat is discharged into the external air with the flow of gas, and the other part contacts with the heat sink 13 and is absorbed by the heat sink 13, thereby realizing comprehensive and efficient heat dissipation of the bottom substrate 1, the upper substrate 2 and the capacitor element 4.

[0024] Furthermore, an insulating ring 14 is fixedly connected to the upper side of the upper substrate 2, the insulating ring 14 passes through the upper substrate 2 and the bottom substrate 1 and is connected to the inside of the heat dissipation channel 6, the heat sink 13 is fixedly connected to the inner wall of the insulating ring 14, and the bottom of the heat sink 13 extends into the heat dissipation channel 6; when the fan 9 rotates to guide the external air into the heat dissipation channel 6 for circulation, it can contact the heat sink 13 extending into the heat dissipation channel 6, so that the heat sink 13 exchanges heat with the circulating gas, thereby increasing the heat dissipation effect of the heat sink 13.

[0025] Furthermore, the outer edge of the heat sink 13 extending into the heat dissipation channel 6 is in contact with the inner wall of the heat dissipation channel 6, and the outer wall of the heat sink 13 extending into the heat dissipation channel 6 is provided with a flow groove 15, and the flow grooves 15 on two adjacent heat sinks 13 are arranged in a staggered manner; the staggered flow grooves 15 make it necessary for the gas to pass through the flow grooves 15 in sequence if it wants to flow inside the heat dissipation channel 6, thereby increasing the contact area between the airflow and the heat sink 13, thereby increasing the heat dissipation effect of the heat sink 13.

[0026] Furthermore, the upper sides of the heat sink 13 are arranged in a trapezoidal shape; the trapezoidal arrangement of the heat sink 13 allows the gas discharged from the exhaust hole 12 to pass through the upper side of the heat sink 13 more evenly, making it easier for the gas to flow between the heat sink 13, thereby increasing the heat exchange effect of the heat sink 13.

[0027] Furthermore, a plurality of heat-conducting holes 16 are provided on the top of the insulating ring 14 and penetrate the insulating ring 14. Through the provided heat-conducting holes 16, a portion of the gas carrying heat on the upper side of the upper substrate 2 can be sucked into the heat dissipation channel 6 and then discharged from the exhaust holes 12, thereby increasing the overall heat dissipation effect.

[0028] Working principle: This embodiment provides a capacitor circuit board with a stepped structure. When in use, the fan 9 operates to suck external air from the heat dissipation channel 6 into the lower cavity of the air duct slot 7. During the circulation of the gas inside the heat dissipation channel 6, the gas passes through the bottom of the heat sink 13 and the circulation groove 15 in sequence, thereby absorbing the heat of the heat sink 13, and enters the upper cavity from the lower cavity of the air duct slot 7, enters the heat conduction pipe, and then enters the exhaust column 11, and is finally discharged from the exhaust hole 12 to stir the air on the upper side of the upper substrate 2, so that the gas on the upper substrate 2 flows due to the change in air pressure, and a part of the heat is discharged to the external air with the flow of the gas, and the other part contacts the heat sink 13 and is absorbed by the heat sink 13, thereby achieving comprehensive and efficient heat dissipation of the bottom substrate 1, the upper substrate 2 and the capacitor element 4.

[0029] The embodiments of the present invention disclose preferred embodiments, but are not limited thereto. A person skilled in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. However, as long as they do not deviate from the spirit of the present invention, they are all within the protection scope of the present invention.

Claims

1. A capacitor circuit board with a stepped structure, comprising a bottom substrate (1) and an upper substrate (2) pressed on the upper side thereof, and a plurality of stepped grooves (3) opened on the top of the upper substrate (2), the bottom substrate (1) and the upper substrate (2) are both provided with a plurality of capacitor elements (4), and the capacitor elements (4) on the bottom substrate (1) are located in the stepped grooves (3), characterized in that: A heat sink (5) is fixed to the bottom of the bottom substrate (1); a plurality of symmetrically arranged heat dissipation channels (6) are provided on a side of the heat sink (5) opposite to the bottom substrate (1); an air induction groove (7) is also provided on a side of the heat sink (5) opposite to the bottom substrate (1); a partition plate (8) is fixedly connected to the inner wall of the air induction groove (7); the partition plate (8) is used to divide the air induction groove (7) into an upper cavity and a lower cavity; the lower cavity of the air induction groove (7) is connected to the interior of the heat dissipation channel (6); a heat dissipation mechanism for dissipating heat from the upper substrate (2), the bottom substrate (1) and the capacitor element (4) is provided in the air induction groove (7).

2. The capacitor circuit board with a stepped structure according to claim 1, characterized in that: The heat dissipation mechanism comprises a fan (9), wherein the fan (9) is symmetrically arranged on the partition plate (8), and the fan (9) is used to connect the upper and lower cavities of the air induction groove (7). An insulating tube (10) is fixedly connected to the upper side of the upper substrate (2), and the bottom of the insulating tube (10) passes through the upper substrate (2) and the bottom substrate (1) to the air induction groove (7) and is connected to the upper cavity of the air induction groove (7). An exhaust column (11) is fixedly connected to the inner wall of the insulating tube (10), and the interior of the exhaust column (11) is hollow and connected to the interior of the insulating tube (10). The outer wall of the exhaust column (11) is evenly provided with a plurality of exhaust holes (12) connected to the interior thereof. A plurality of groups of symmetrically arranged heat sinks (13) are provided on the upper side of the upper substrate (2).

3. The capacitor circuit board with a stepped structure according to claim 2, characterized in that: An insulating ring (14) is fixedly connected to the upper side of the upper substrate (2); the insulating ring (14) penetrates the upper substrate (2) and the bottom substrate (1) and is in communication with the interior of the heat dissipation channel (6); the heat sink (13) is fixedly connected to the inner wall of the insulating ring (14), and the bottom of the heat sink (13) extends into the heat dissipation channel (6).

4. The capacitor circuit board with a stepped structure according to claim 3, characterized in that: The outer edge of the heat sink (13) extending into the heat dissipation channel (6) is in contact with the inner wall of the heat dissipation channel (6), and the outer wall of the heat sink (13) extending into the heat dissipation channel (6) is provided with a flow groove (15), and the flow grooves (15) on two adjacent heat sinks (13) are arranged in a staggered manner.

5. The capacitor circuit board with a stepped structure according to claim 2, characterized in that: The upper sides of the heat sinks (13) are arranged in a trapezoidal shape.

6. The capacitor circuit board with a stepped structure according to claim 3, characterized in that: A plurality of heat-conducting holes (16) passing through the insulating ring (14) are provided on the top thereof.

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