A micro-elastic PCB fine circuit grinding ceramic plate

Abstract

The utility model relates to the technical field of PCB fine circuit grinding ceramic plates, and specifically is a micro-elastic PCB fine circuit grinding ceramic plate. The utility model comprises a PCB board main body and a heat dissipation component. The PCB board main body comprises a first ceramic plate, which is in a rectangular plate shape. A first semi-cured plate is arranged on the lower surface of the first ceramic plate, an elastic plate is arranged on the lower surface of the first semi-cured plate, a second semi-cured plate is arranged on the lower surface of the elastic plate, and a second ceramic plate is arranged on the lower surface of the second semi-cured plate. Since the PCB board main body comprises the first ceramic plate, the first semi-cured plate, the elastic plate, the second semi-cured plate and the second ceramic plate, the elastic plate is used to increase the elasticity of the PCB board main body, so as to prevent the PCB board main body from being broken under a strong impact, and to dissipate heat on the PCB board main body through a heat dissipation block, a heat conducting rod and a heat dissipation plate, so as to conduct the temperature inside the PCB board main body away, so as to prevent the circuit inside the PCB board main body from being damaged and the life of the PCB board main body from being affected.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB fine circuit grinding ceramic plates, in particular to a micro-elastic PCB fine circuit grinding ceramic plate. Background Art

[0002] Ceramic plates made of zirconium oxide or aluminum oxide have strong weather resistance. Sunlight, rain, and moisture have no effect on the surface and substrate.

[0003] In the prior art, a ceramic PCB board, such as that proposed in patent application number "CN201621148518.0", includes a substrate and a PCB body arranged on the substrate, a ceramic body is arranged between the substrate and the PCB body, fixed connection holes with staggered positions are evenly arranged on the two end surfaces of the ceramic body, and locking pins that cooperate with the fixed connection holes are arranged on the substrate and the PCB body.

[0004] However, in the above patent, the ceramic PCB is relatively hard and is easily broken under a strong impact. The high temperature inside the ceramic PCB cannot be conducted away, causing damage to the circuit inside the ceramic PCB, thereby reducing the life of the ceramic PCB. Utility Model Content

[0005] The purpose of the utility model is to provide a micro-elastic PCB fine circuit grinding ceramic plate to solve the problems raised in the above background technology.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] A micro-elastic PCB fine-circuit grinding ceramic plate comprises a PCB board body and a heat dissipation component. The PCB board body comprises a first ceramic board, and the first ceramic board is in a rectangular plate shape.

[0008] A first prepreg is disposed on the lower surface of the first ceramic plate, an elastic plate is disposed on the lower surface of the first prepreg, a second prepreg is disposed on the lower surface of the elastic plate, and a second ceramic plate is disposed on the lower surface of the second prepreg.

[0009] Preferably, the upper surface of the first ceramic plate and the lower surface of the second ceramic plate are both provided with cable grooves, and one side of the first ceramic plate and the second ceramic plate are both provided with laser holes.

[0010] Preferably, a through hole is provided between the first ceramic plate and the second ceramic plate, and the through hole passes through the first prepreg plate, the elastic plate and the second prepreg plate.

[0011] Preferably, a buried hole is provided between the first prepreg board and the second prepreg board, and the buried hole passes through the elastic plate.

[0012] Preferably, the heat dissipation assembly includes a heat dissipation block, and four heat dissipation blocks are respectively arranged at the four corners of the PCB board body, the upper surfaces of the four heat dissipation blocks are respectively provided with fixing screws, and the lower ends of the four fixing screws respectively penetrate the PCB board body, and the lower surfaces of the four heat dissipation blocks are respectively provided with anti-slip bumps.

[0013] Preferably, two heat-conducting rods are arranged inside the PCB board body, and the two heat-conducting rods respectively penetrate the first ceramic plate, the first semi-cured plate, the elastic plate, the second semi-cured plate and the second ceramic plate, and the upper ends of the two heat-conducting rods are provided with heat dissipation plates.

[0014] Beneficial effects of the utility model:

[0015] The utility model discloses a PCB board body comprising a first ceramic board, a first semi-cured board, an elastic board, a second semi-cured board and a second ceramic board, wherein the elasticity of the PCB board body is increased by the elastic board, thereby preventing the PCB board body from being broken under a strong impact, and dissipating heat to the PCB board body by means of a heat dissipation block, a heat conducting rod and a heat dissipation plate, thereby conducting away the temperature inside the PCB board body, thereby preventing the circuit inside the PCB board body from being damaged and preventing the life of the PCB board body from being affected. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the prior art description are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the second ceramic plate and laser hole structure of the utility model;

[0019] Figure 3 This is a schematic diagram of the anti-skid bump and cable trough structure of the utility model;

[0020] Figure 4 It is a schematic diagram of the buried hole and through hole structure of the utility model.

[0021] The reference numerals in the figures are as follows:

[0022] 1. PCB board body; 2. First ceramic board; 3. First semi-cured board; 4. Elastic board; 5. Second semi-cured board; 6. Second ceramic board; 7. Laser hole; 8. Buried hole; 9. Through hole; 10. Heat sink; 11. Fixing screw; 12. Anti-slip bump; 13. Heat-conducting rod; 14. Heat sink; 15. Cable trough. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] A micro-elastic PCB fine-circuit grinding ceramic plate comprises a PCB board body 1 and a heat dissipation component. The PCB board body 1 comprises a first ceramic board 2, and the first ceramic board 2 is in a rectangular plate shape.

[0025] A first prepreg plate 3 is disposed on the lower surface of the first ceramic plate 2 , an elastic plate 4 is disposed on the lower surface of the first prepreg plate 3 , a second prepreg plate 5 is disposed on the lower surface of the elastic plate 4 , and a second ceramic plate 6 is disposed on the lower surface of the second prepreg plate 5 .

[0026] like Figure 1 The first ceramic plate 2, the first semi-cured plate 3, the elastic plate 4, the second semi-cured plate 5 and the second ceramic plate 6 are bonded and fixed by an adhesive. The adhesive forms an adhesive layer on both sides of the elastic plate 4, the upper surface of the first semi-cured plate 3 and the lower surface of the second semi-cured plate 5. The adhesive layer is made of epoxy phenolic glue with a thickness of 0.01mm. The elastic plate 4 is made of polyimide with a thickness of 0.7mm. The first ceramic plate 2 and the second ceramic plate 6 are both made of alumina with a thickness of 0.5mm. The first semi-cured plate 3 and the second semi-cured plate 5 are made of epoxy resin and glass fiber cloth with a thickness of 0.5mm.

[0027] The upper surface of the first ceramic plate 2 and the lower surface of the second ceramic plate 6 are both provided with cable grooves 15 , and one side of the first ceramic plate 2 and the second ceramic plate 6 are both provided with laser holes 7 .

[0028] like Figure 1 and Figure 2 The upper surface of the first ceramic plate 2 and the lower surface of the second ceramic plate 6 are both provided with a cable groove 15, the diameter of the cable groove 15 is 0.3 mm, and the laser hole 7 is a laser processing process in which the laser is focused as a high-intensity heat source to heat the material, so that the material in the laser action area is melted or vaporized and then evaporated, thereby forming a hole.

[0029] A through hole 9 is provided between the first ceramic plate 2 and the second ceramic plate 6 , and the through hole 9 passes through the first prepreg plate 3 , the elastic plate 4 and the second prepreg plate 5 .

[0030] like Figure 1 and Figure 4, the signals and power supplies between different circuit layers are connected through the through hole 9, the elastic plate 4 is set between the first semi-cured plate 3 and the second semi-cured plate 5, the first ceramic plate 2 is set on the upper surface of the first semi-cured plate 3, and the second ceramic plate 6 is set on the lower surface of the second semi-cured plate 5.

[0031] A buried hole 8 is provided between the first prepreg board 3 and the second prepreg board 5 , and the buried hole 8 passes through the elastic plate 4 .

[0032] like Figure 1 and Figure 4 The signals and power supply between the first prepreg board 3 and the second prepreg board 5 are connected through the buried via 8 .

[0033] The heat dissipation assembly includes a heat dissipation block 10, and four heat dissipation blocks 10 are respectively arranged at the four corners of the PCB board body 1, and the upper surfaces of the four heat dissipation blocks 10 are respectively provided with fixing screws 11, and the lower ends of the four fixing screws 11 respectively penetrate the PCB board body 1, and the lower surfaces of the four heat dissipation blocks 10 are respectively provided with anti-slip bumps 12.

[0034] like Figure 1 , Figure 2 and Figure 3 Four heat sinks 10 are respectively arranged at the four corners of the PCB body 1, the positions of the heat sinks 10 and the PCB body 1 are fixed by fixing screws 11, the friction force of the lower surface of the heat sink 10 is increased by anti-slip bumps 12, and the heat is dissipated from the PCB body 1 by the heat sink 10.

[0035] Two heat-conducting rods 13 are arranged inside the PCB board body 1. The two heat-conducting rods 13 respectively penetrate the first ceramic board 2, the first semi-cured board 3, the elastic board 4, the second semi-cured board 5 and the second ceramic board 6. The upper ends of the two heat-conducting rods 13 are both provided with heat dissipation plates 14.

[0036] like Figure 1 and Figure 4 Two heat-conducting rods 13 are passed through the interior of the PCB board body 1, and the heat-conducting rods 13 and the heat dissipation plate 14 cooperate to dissipate heat from the PCB board body 1.

[0037] The working principle of the micro-elastic PCB fine circuit grinding ceramic plate provided by the utility model is as follows:

[0038] The first ceramic board 2, the first semi-cured board 3, the elastic board 4, the second semi-cured board 5 and the second ceramic board 6 are fixed by the heat dissipation block 10 and the fixing screws 11. The elasticity of the PCB board body 1 is increased by the elastic board 4. The signals and power supplies between different circuit layers of the PCB board body 1 are connected by the buried holes 8 and the through holes 9. The heat dissipation of the PCB board body 1 is carried out by the cooperation of the heat conducting rod 13 and the heat dissipation plate 14 and the heat dissipation block 10.

[0039] Compared with the related art, the micro-elastic PCB fine circuit grinding ceramic plate provided by the utility model has the following beneficial effects:

[0040] In the utility model, since the PCB board body 1 includes the first ceramic board 2, the first prepreg board 3, the elastic board 4, the second prepreg board 5 and the second ceramic board 6, the elastic board 4 increases the elasticity of the PCB board body 1, thereby preventing the PCB board body 1 from being broken under a strong impact;

[0041] The heat dissipation block 10, the heat-conducting rod 13 and the heat dissipation plate 14 are used to dissipate the heat of the PCB body 1, and the temperature inside the PCB body 1 is conducted away to prevent the circuit inside the PCB body 1 from being damaged and the life of the PCB body 1 from being affected.

[0042] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. A micro-elastic PCB fine circuit grinding ceramic plate, comprising a PCB board body (1) and a heat dissipation component, characterized in that: The PCB board body (1) comprises a first ceramic board (2), and the first ceramic board (2) is in the shape of a rectangular plate; A first semi-cured plate (3) is arranged on the lower surface of the first ceramic plate (2), an elastic plate (4) is arranged on the lower surface of the first semi-cured plate (3), a second semi-cured plate (5) is arranged on the lower surface of the elastic plate (4), and a second ceramic plate (6) is arranged on the lower surface of the second semi-cured plate (5).

2. A micro-elastic PCB fine circuit grinding ceramic plate according to claim 1, characterized in that: The upper surface of the first ceramic plate (2) and the lower surface of the second ceramic plate (6) are both provided with a cable arrangement groove (15), and one side of the first ceramic plate (2) and the second ceramic plate (6) are both provided with a laser hole (7).

3. A micro-elastic PCB fine circuit grinding ceramic plate according to claim 1, characterized in that: A through hole (9) is provided between the first ceramic plate (2) and the second ceramic plate (6), and the through hole (9) passes through the first prepreg plate (3), the elastic plate (4) and the second prepreg plate (5).

4. A micro-elastic PCB fine circuit grinding ceramic plate according to claim 1, characterized in that: A buried hole (8) is provided between the first semi-cured plate (3) and the second semi-cured plate (5), and the buried hole (8) passes through the elastic plate (4).

5. A micro-elastic PCB fine circuit grinding ceramic plate according to claim 1, characterized in that: The heat dissipation assembly comprises a heat dissipation block (10), wherein four heat dissipation blocks (10) are respectively arranged at four corners of a PCB board body (1), the upper surfaces of the four heat dissipation blocks (10) are respectively provided with fixing screws (11), and the lower ends of the four fixing screws (11) respectively penetrate the PCB board body (1), and the lower surfaces of the four heat dissipation blocks (10) are respectively provided with anti-slip bumps (12).

6. A micro-elastic PCB fine circuit grinding ceramic plate according to claim 1, characterized in that: Two heat-conducting rods (13) are arranged inside the PCB board body (1), and the two heat-conducting rods (13) respectively penetrate the first ceramic board (2), the first semi-cured board (3), the elastic board (4), the second semi-cured board (5) and the second ceramic board (6), and the upper ends of the two heat-conducting rods (13) are both provided with heat dissipation plates (14).

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