Power adapter

Abstract

The utility model provides a power adapter. The power adapter includes: a shell; an electric control component, which is arranged in the shell; and a heat dissipation component, wherein the heat dissipation component includes a heat-conducting structure and a heat dissipation element, wherein the heat-conducting structure is arranged between the electric control component and the heat dissipation element, and the heat dissipation element is arranged on a side of the heat-conducting structure close to the shell. In this embodiment, a heat dissipation component is arranged between the electric control component and the shell of the power adapter, wherein the heat dissipation component includes a heat-conducting structure and a heat dissipation element, so that the electric control component can conduct heat to the heat dissipation element through the heat-conducting structure for heat dissipation. By arranging the heat dissipation component as multiple heat dissipation elements, the problem of uneven heat conduction and poor heat dissipation effect of the power adapter is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment accessories, in particular to a power adapter. Background Art

[0002] With the improvement of living standards, portable electronic products such as smart phones, tablet computers, and media players usually need to be charged by chargers because the charging technology is not yet developed. Existing power adapters are generally equipped with electronic control components. Since the electronic control components will cause the power adapter to heat up seriously, in order to solve the heat dissipation problem, the existing power adapters generally fill the electronic control components with thermal conductive glue to help dissipate heat. However, this heat dissipation method causes uneven heat conduction of the power adapter and poor heat dissipation effect. Utility Model Content

[0003] In order to improve at least some of the above shortcomings or deficiencies, an embodiment of the present invention provides a power adapter, which can solve the problems of uneven heat conduction and poor heat dissipation effect of the power adapter.

[0004] Specifically, an embodiment of the utility model provides a power adapter, comprising: a shell; an electronic control component, arranged in the shell; and a heat dissipation component, the heat dissipation component comprising a heat-conducting structure and a heat sink, the heat-conducting structure is arranged between the electronic control component and the heat sink, and the heat sink is arranged on a side of the heat-conducting structure close to the shell.

[0005] In an embodiment of the present invention, the heat sink is a metal heat sink; the heat sink assembly further includes: an insulating structure, which is arranged between the heat conductive structure and the heat sink.

[0006] In one embodiment of the present invention, the heat dissipation assembly further includes: an insulating protective layer, wherein the insulating protective layer is disposed between the heat-conducting structure and the insulating structure.

[0007] In one embodiment of the utility model, the insulating protection layer is provided with a heat conduction avoidance opening, and the heat conduction avoidance opening is provided corresponding to the heat generating chip on the electronic control component.

[0008] In one embodiment of the present invention, the insulating structure is an insulating member, and the insulating member is arranged between the heat-conducting structure and the heat sink; or the insulating structure is an insulating tape, and the insulating tape is attached to the heat sink.

[0009] In one embodiment of the present invention, the heat-conducting structure includes a heat-conducting glue filled in a gap between the electronic control component and the housing.

[0010] In one embodiment of the present invention, the heat-conducting structure is a heat-conducting member arranged between the electronic control component and the heat sink.

[0011] In one embodiment of the utility model, it also includes pins and interfaces arranged on the shell and electrically connected to the electronic control components respectively, wherein the electronic control components include: a control circuit board, on which a control chip is arranged; an input circuit board, electrically connected to the control circuit board, and the pins are electrically connected to the input circuit board; and an output circuit board, electrically connected to the control circuit board, and the interface is electrically connected to the output circuit board; and a transformer assembly, electrically connected to the control circuit board.

[0012] In one embodiment of the present utility model, the heat dissipation component includes: a first heat dissipation component, which is arranged between the control circuit board and the housing.

[0013] In one embodiment of the present utility model, the heat dissipation assembly further includes: a second heat dissipation assembly, which is arranged between the output circuit board and the housing.

[0014] In one embodiment of the present utility model, the heat dissipation assembly further includes: a third heat dissipation assembly, which is arranged between the transformer assembly and the housing.

[0015] In one embodiment of the utility model, the output circuit board is arranged on one side of the transformer assembly; the second heat dissipation assembly includes: a second heat-conducting structure and a second heat dissipation member, the second heat-conducting structure is arranged on the output circuit board and between the second heat dissipation member, and the second heat-conducting structure is provided with an avoidance position corresponding to the interface; the third heat dissipation assembly includes: a third heat-conducting structure and a third heat dissipation member, the third heat-conducting structure is arranged between the transformer assembly and the third heat dissipation member; wherein, the second heat dissipation member and the third heat dissipation member are connected or integrally formed.

[0016] In an embodiment of the present invention, a heat-conducting structure is further provided between the output circuit board and the transformer assembly.

[0017] In an embodiment of the present utility model, the first heat dissipation assembly includes a first heat dissipation element, and a grounding portion is provided on the first heat dissipation element. The grounding portion is connected to a grounding terminal on the control circuit board.

[0018] It can be seen from the above that the above technical features of the utility model can have one or more of the following beneficial effects: by setting a heat dissipation component between the electronic control component and the shell of the power adapter, the heat dissipation component includes a heat-conducting structure and a heat sink, so that the electronic control component can transfer heat to the heat sink through the heat-conducting structure for heat dissipation, and by setting the heat dissipation component as multiple heat sinks, the problem of uneven thermal conductivity and poor heat dissipation of the power adapter is solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 and Figure 2 A schematic diagram of the structure of a power adapter provided in an embodiment of the utility model.

[0021] Figure 3 and Figure 4 A schematic diagram of an exploded view of the power adapter provided in this embodiment.

[0022] Figure 5 for Figure 1 Another exploded schematic diagram of the power adapter.

[0023] Figure 6 for Figure 5 Schematic diagram of the exploded view of the electronic control components.

[0024] Figure 7 for Figure 6 Schematic diagram of the structure of the second heat sink and the third heat sink.

[0025] Figure 8 for Figure 6 Schematic diagram of the structure of the central electronic control circuit board. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1 and Figure 2 A power adapter 1 provided in an embodiment of the utility model may include, for example: a housing 100 , a plug pin 110 , an interface 120 , an electric control component 300 and a heat dissipation component 200 .

[0028] See also Figure 3 and Figure 4The housing 100 may, for example, form an accommodation space, the electric control component 300 is arranged in the accommodation space of the housing 100, and the heat dissipation component 200 is arranged between the electric control component 300 and the housing 100. The pin 110 and the interface 120 may, for example, be arranged on the housing 100, and are electrically connected to the electric control component 300 respectively. The housing 100 may, for example, be connected to a pin housing 101, the pin 110 is arranged on the pin housing 101, and the pin 110 may, for example, be electrically connected to the electric control component 300 through a wire. The housing 100 may, for example, also be provided with an interface through hole 102, the interface 120 is electrically connected to the electric control component 300, and leaks out through the interface through hole 102. The interface 120 may, for example, be a USB interface, a TYPE-C interface, etc., and the interface type may be set according to actual needs. The number of interfaces 120 may, for example, be one or more, and the interface types of multiple interfaces 120 may be the same or different, and the present embodiment is not limited thereto.

[0029] See also Figure 5 The heat dissipation component 200 includes a heat-conducting structure and a heat sink. The heat-conducting structure is arranged between the electric control component and the heat sink. The heat sink is arranged on the side of the heat-conducting structure close to the housing 100. The electric control component 300 is used to realize the electrical function of the power adapter. The electric control component 300 generates heat when working. The heat-conducting structure can be attached to the electric control component 300 or arranged close to the electric control component 300. The heat-conducting structure conducts the heat generated by the electric control component 300 to the heat sink, and the heat is dissipated through the heat sink. In this way, by setting the heat dissipation component as multiple heat sinks, the problem of uneven heat conduction and poor heat dissipation effect of the power adapter 1 is solved.

[0030] The heat-conducting structure may be, for example, a heat-conducting part, which may be, for example, a heat-conducting material, such as a structure made of graphene, a heat-conducting silicone sheet, or a heat-conducting insulating material. The heat-conducting structure may also be, for example, a heat-conducting adhesive, which may be applied to the electronic control component. The heat sink may be, for example, a structure having a heat-dissipating material, such as a graphene heat sink, a heat sink, a metal heat sink, etc. Preferably, the heat sink is a copper sheet. In some implementations of this embodiment, the heat-conducting structure includes a heat-conducting adhesive filled in the gap between the electronic control component 300 and the housing 100. In other implementations, the heat-conducting structure is a heat-conducting part arranged between the electronic control component 300 and the heat sink.

[0031] When the heat sink is a metal heat sink, the heat sink assembly has a better heat dissipation effect. Since there is a risk of internal leakage when the heat sink is a metal heat sink, the power adapter 1 has a safety risk. Therefore, the heat sink assembly 200 also includes an insulating structure, which is arranged between the heat-conducting structure and the heat sink. The insulating structure can be, for example, an insulating material, such as insulating glue, rubber, plastic, glass, ceramic products, mica, asbestos, etc., and a suitable insulating material can be selected according to actual needs to prepare the insulating structure. By arranging an insulating structure between the heat-conducting structure and the heat sink, the problem of internal leakage can be avoided, thereby improving the heat dissipation effect while ensuring safety. The insulating structure can be, for example, an insulating member made of an insulating material, and the shape and size of the insulating member can be set according to the shape and size of the heat-conducting structure and the heat sink. The insulating structure can also be, for example, an insulating tape, which is attached to the heat sink, and can be attached to the side of the heat sink close to the heat-conducting structure. Of course, for the stability of the insulating tape attachment, it can also be attached to other positions of the heat sink, and this embodiment is not limited to this.

[0032] Furthermore, the heat dissipation component 200 may also include, for example, an insulating protective layer, which is disposed between the heat-conducting structure and the insulating structure. The insulating protective layer may also be, for example, an insulating material. By providing the insulating protective layer, it is possible to prevent the pins on the circuit board of the electric control component 300 from piercing the insulating structure to cause a safety hazard, and the insulation effect can be further improved to improve the safety of the power adapter 1. A heat-conducting avoidance port is provided on the insulating protective layer, and the heat-conducting avoidance port is provided corresponding to the heating chip on the electric control component. For example, an opening or a through hole may be provided at the position of the insulating protective layer corresponding to the heating chip, so as to prevent the insulating protective layer from affecting the heat-conducting effect of the heat-conducting structure on the heating chip.

[0033] See also Figure 6 The electric control component 300 may include, for example, a control circuit board 310, an input circuit board 330, an output circuit board 320 and a transformer component 340. Figure 8, a control chip 311 is arranged on the control circuit board 310, and the control chip 311 generates heat when working, and the control chip 311 is a heating chip. The input circuit board 330 is electrically connected to the control circuit board 310, and the pin 110 is electrically connected to the input circuit board 330. The output circuit board 320 is electrically connected to the control circuit board 310, and the interface 120 is electrically connected to the output circuit board 320. The transformer assembly 340 is electrically connected to the control circuit board 310 to achieve voltage transformation. Among them, the transformer assembly 340, the control circuit board 310, and the output circuit board 320 generate a large amount of heat when working, which is the main heating area. The electric control assembly 300 may also include, for example, a first capacitor 350, a second capacitor 360 and a mounting frame 370, and the electrical components in the electric control assembly 300 are connected by the mounting frame 370 to form a compact structure. The first capacitor 350 may be, for example, a high-voltage capacitor, which is arranged between the pin 110 and the transformer assembly 340, and the second capacitor 360 is arranged between the output circuit board 320 and the housing 100.

[0034] See also Figure 5 The heat dissipation assembly 200 includes a first heat dissipation assembly, a second heat dissipation assembly, and a third heat dissipation assembly. The first heat dissipation assembly is arranged between the control circuit board 310 and the housing 100; the second heat dissipation assembly is arranged between the output circuit board 320 and the housing 100; and the third heat dissipation assembly is arranged between the transformer assembly 340 and the housing 100. By respectively arranging heat dissipation assemblies for the transformer assembly 340, the control circuit board 310, and the output circuit board 320, the heat dissipation effect can be further improved.

[0035] See also Figure 5 The first heat dissipation component includes, for example, a first heat-conducting structure 211 and a first heat sink 213, and may also include, for example, a first insulating structure 212. The first heat-conducting structure 211 is arranged between the control circuit board 310 and the first heat sink 213. The first heat-conducting structure 211, the first heat sink 213 and the first insulating structure 212 can refer to the aforementioned heat-conducting structure, heat sink and insulating structure, and are arranged according to actual needs. For example, a grounding portion 2131 may also be arranged on the first heat sink 213, and the grounding portion 2131 is connected to the ground terminal on the control circuit board 310. By setting the grounding portion 2131, when the radiation amount is high, the radiation can be reduced, thereby avoiding affecting external devices.

[0036] The output circuit board 320 may be, for example, disposed on one side of the transformer assembly 340. The second heat dissipation assembly includes: a second heat-conducting structure 221 and a second heat dissipation member 223. The second heat-conducting structure 221 is disposed on the output circuit board 320 and between the second heat dissipation member 223, and the second heat-conducting structure 221 is provided with a relief position corresponding to the interface 120. In one implementation of this embodiment, the second heat-conducting structure 221 may be, for example, Figure 5The T-shaped structure shown avoids the interface 120; of course, the avoidance position may also be, for example, a through hole provided on the second heat conducting structure 221. The second heat dissipation assembly may also include, for example, a second insulating structure (not shown).

[0037] The third heat dissipation assembly includes: a third heat-conducting structure 231 and a third heat dissipation member 233. The third heat-conducting structure 231 is arranged between the transformer assembly 340 and the third heat dissipation member 233. The third heat dissipation assembly may also include, for example, a third insulation structure 232. The third heat dissipation member 233 may be arranged around the transformer assembly 340, so as to increase the heat dissipation area and further improve the heat dissipation effect. Figure 7 , the second heat sink 223 and the third heat sink 233 are connected or integrally formed. Further, the second insulation structure and the third insulation structure 232 can also be connected or integrally formed, for example. Through such a setting, the structural tightness can be improved, the manufacturing convenience can be improved, and the assembly difficulty can be reduced, while the heat dissipation effect can be improved.

[0038] Furthermore, a heat conducting structure is provided between the output circuit board 320 and the transformer assembly 340, which can further conduct the heat of the transformer assembly 340 through the output circuit board 320, further improving the heat dissipation effect. An insulating sheet may also be provided between the first capacitor 310 and the pin 110 bracket, for example, to improve safety.

[0039] It can be seen from the above that the above technical features of the utility model can have one or more of the following beneficial effects: by setting a heat dissipation component 200 between the electronic control component 300 and the shell 100 of the power adapter 1, the heat dissipation component 200 includes a heat-conducting structure and a heat sink, so that the electronic control component 300 can transfer heat to the heat sink through the heat-conducting structure for heat dissipation, and by setting the heat dissipation component 200 as a multiple heat sink, the problem of uneven thermal conductivity and poor heat dissipation effect of the power adapter 1 is solved.

[0040] In addition, it can be understood that the aforementioned embodiments are merely illustrative descriptions of the present invention. Under the premise that the technical features do not conflict, the structures do not contradict, and the purpose of the present invention is not violated, the technical solutions of the various embodiments can be arbitrarily combined and used in combination.

[0041] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0042] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0043] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A power adapter, characterized in that: include: A housing, wherein the housing forms a housing space; An electric control component is arranged in the accommodation space of the housing; as well as A heat dissipation component is arranged in the accommodating space of the shell, the heat dissipation component includes a heat-conducting structure and a heat sink, the heat sink is a metal heat sink, the heat-conducting structure is arranged between the electronic control component and the heat sink, the heat-conducting structure is attached to the electronic control component, and the heat sink is arranged on a side of the heat-conducting structure close to the shell.

2. The power adapter according to claim 1, wherein: The heat dissipation assembly further includes an insulating structure disposed between the heat-conducting structure and the heat dissipation element.

3. The power adapter according to claim 2, wherein: The heat dissipation assembly further includes: an insulating protective layer, wherein the insulating protective layer is arranged between the heat-conducting structure and the insulating structure.

4. The power adapter according to claim 3, characterized in that: The insulating protection layer is provided with a heat conduction avoidance opening, and the heat conduction avoidance opening is arranged corresponding to the heat generating chip on the electric control component.

5. The power adapter according to claim 2, wherein: The insulating structure is an insulating member, and the insulating member is arranged between the heat-conducting structure and the heat sink; or the insulating structure is an insulating tape, and the insulating tape is attached to the heat sink.

6. The power adapter according to claim 1, wherein: The heat-conducting structure includes a heat-conducting glue filled in a gap between the electric control component and the housing.

7. The power adapter according to claim 1, wherein: The heat-conducting structure is a heat-conducting member arranged between the electronic control component and the heat sink.

8. The power adapter according to any one of claims 1 to 7, characterized in that: It also includes pins and interfaces that are arranged on the housing and are electrically connected to the electric control components respectively, wherein the electric control components include: A control circuit board, wherein a control chip is arranged on the control circuit board; an input circuit board electrically connected to the control circuit board, and the pins are electrically connected to the input circuit board; and an output circuit board electrically connected to the control circuit board, and the interface is electrically connected to the output circuit board; and The transformer assembly is electrically connected to the control circuit board.

9. The power adapter according to claim 8, wherein: The heat dissipation component comprises: The first heat dissipation component is arranged between the control circuit board and the housing.

10. The power adapter according to claim 9, wherein: The heat dissipation component further includes: a second heat dissipation component, which is arranged between the output circuit board and the housing.

11. The power adapter according to claim 10, wherein: The heat dissipation component further includes: a third heat dissipation component, which is arranged between the transformer component and the shell.

12. The power adapter according to claim 11, wherein: The output circuit board is arranged on one side of the transformer assembly; The second heat dissipation assembly comprises: a second heat-conducting structure and a second heat dissipating member, the second heat-conducting structure is arranged between the output circuit board and the second heat dissipating member, and the second heat-conducting structure is provided with an avoidance position corresponding to the interface; The third heat dissipation component includes: a third heat-conducting structure and a third heat dissipation member, wherein the third heat-conducting structure is arranged between the transformer component and the third heat dissipation member; wherein the second heat dissipation member and the third heat dissipation member are connected or integrally formed.

13. The power adapter according to claim 12, wherein: A heat-conducting structure is also provided between the output circuit board and the transformer assembly.

14. The power adapter according to claim 9, wherein: The first heat dissipation assembly includes a first heat dissipation member, a grounding portion is provided on the first heat dissipation member, and the grounding portion is connected to a grounding terminal on the control circuit board.

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