Radiator, radiating assembly and power module

Abstract

The utility model discloses a heat radiator, a heat radiation assembly and a power module, the heat radiator comprises a wave-shaped laminated sheet which is laminated, the wave-shaped laminated sheet comprises a first section and a second section, and the wavelength of the first section is larger than that of the second section; the fluid sequentially cools the power device, and because the temperature of the fluid is gradually increased and the heat dissipation effect becomes poor during cooling, the wavelength is gradually reduced, so that the contact surface between the fluid and the wave-shaped lamination is gradually increased, and the heat dissipation effect is improved. The at least two groups of wave-shaped lamination groups comprise a first wave-shaped lamination group and a second wave-shaped lamination group which are oppositely arranged, and the wave crests of the first wave-shaped lamination group and the wave crests of the second wave-shaped lamination group are arranged in a staggered manner in the flowing direction of the fluid, so that the movement of the fluid is accelerated. According to the design of the radiator provided by the utility model, a better radiating function can be realized through the optimization of the shape and arrangement of the wave-shaped laminations.

Description

Technical Field

[0001] The present invention relates to the field of vehicle technology, and in particular to a radiator, a heat dissipation component and a power module. Background Art

[0002] The current automotive industry is developing rapidly, and the heat generated by power devices continues to increase. The more accumulated heat, the more likely it is that the temperature will be too high, which will cause damage to automotive parts. At present, water cooling is mostly used to dissipate heat from power devices. The fluid flows in the heat exchange channel from the inlet to the outlet, taking away the heat generated by the power device. When the fluid reaches the rear of the heat exchange channel, the fluid temperature rises, making the heat dissipation effect worse and unable to better meet the heat dissipation needs. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art.

[0004] According to a first aspect of the utility model, a radiator is provided, comprising at least one stacked corrugated laminate, the radiator being configured to allow a fluid to flow through a surface of the corrugated laminate so that the fluid exchanges heat with the radiator, the corrugated laminate comprising a first section and a second section, the wavelength of the first section being greater than the wavelength of the second section. The utility model can improve the heat dissipation effect and better meet the heat dissipation requirements.

[0005] Optionally, the first section and the second section are arranged sequentially along the flow direction of the fluid.

[0006] Optionally, the wavy laminate includes at least one heat dissipation section, and one heat dissipation section includes a plurality of bands arranged along the flow direction of the fluid, and the wavelengths of the plurality of bands gradually decrease.

[0007] Optionally, the number of the heat dissipation section is one; or

[0008] There are multiple heat dissipation sections, and the multiple heat dissipation sections are arranged along the flow direction of the fluid.

[0009] Optionally, the wavy laminate further comprises a starting section located at one end of the wavy laminate, and the starting section is parallel to the flow direction of the fluid; and / or

[0010] The corrugated laminate further includes an end section located at the other end of the corrugated laminate, and the end section is parallel to the flow direction of the fluid.

[0011] Optionally, the heat sink includes at least two groups of wavy laminations arranged along a first direction, each group of the wavy laminations includes at least one wavy lamination, and the first direction is a width direction of the wavy laminations.

[0012] Optionally, the at least two groups of wavy lamination groups include a first wavy lamination group and a second wavy lamination group that are arranged opposite to each other, and along the flow direction of the fluid, the crests of the first wavy lamination group and the crests of the second wavy lamination group are staggered.

[0013] Optionally, the wavy lamination group is composed of a plurality of wavy laminations connected in series.

[0014] According to a second aspect of the utility model, a heat dissipation component is provided, comprising a heat exchange channel and a radiator, wherein the radiator is arranged inside the heat exchange channel, and the inside of the heat exchange channel is used for the fluid to flow through so that the fluid exchanges heat with the radiator.

[0015] Optionally, the heat dissipation component includes two heat exchange channels, and the two heat exchange channels are arranged relatively spaced apart.

[0016] Optionally, the two heat exchange channels are interconnected.

[0017] Optionally, the heat dissipation component further includes a first connecting flow channel and a second connecting flow channel which are arranged at intervals, wherein the first connecting flow channel connects the two heat exchange flow channels, and the second connecting flow channel connects the two heat exchange flow channels.

[0018] Optionally, the heat exchange channel includes an inlet and an outlet, and the inlet and the outlet are connected to the interior of the heat exchange channel.

[0019] A third aspect of the utility model provides a power module, comprising a power device and the heat dissipation assembly, wherein the heat dissipation assembly is configured to exchange heat for the power device.

[0020] Optionally, the power device is arranged in contact with the heat exchange channel.

[0021] Optionally, the heat dissipation component includes two heat exchange channels, the two heat exchange channels are arranged relatively spaced apart, and the power device is arranged between the two heat exchange channels.

[0022] According to the radiator of the utility model, a better heat dissipation function can be achieved by optimizing the shape of the wave-shaped laminated sheets.

[0023] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 is a schematic diagram of a heat sink according to an embodiment of the present application;

[0026] Figure 2 is a schematic diagram of a heat sink according to another embodiment of the present application;

[0027] Figure 3 is a schematic diagram of a heat sink according to another embodiment of the present application;

[0028] Figure 4 is a schematic diagram of a heat sink according to another embodiment of the present application;

[0029] Figure 5 is a schematic diagram of a heat sink according to another embodiment of the present application;

[0030] Figure 6 is a schematic diagram of a heat dissipation assembly according to another embodiment of the present application;

[0031] Figure 7 is a schematic diagram of a power module according to another embodiment of the present application;

[0032] Figure 8 is a cross-sectional schematic diagram of a power module according to another embodiment of the present application;

[0033] Fig. 9 is a schematic diagram of heat dissipation of a wavy laminate according to an embodiment of the present application;

[0034] Fig.10 It is a schematic diagram of a diamond-shaped heat sink according to an embodiment of the present application.

[0035] Fig.11 Schematic diagram of a uniform wave dissipation heat sink according to an embodiment of the present application.

[0036] Fig.12 It is a schematic diagram of simulation results according to an embodiment of the present application.

[0037] Fig.13 Schematic diagram of power device distribution of a diamond-shaped heat sink according to an embodiment of the present application.

[0038] Fig.14 This is a schematic diagram of the distribution of power devices of a uniform wave heat sink according to an embodiment of the present application.

[0039] Reference numerals:

[0040] 10. Radiator

[0041] 1. Wave-shaped lamination

[0042] 32. Fluid

[0043] 11a. The first section of the wavy laminate

[0044] 11b. The second section of the wavy laminate

[0045] 12. Heat dissipation section

[0046] 13. Initial paragraph

[0047] 14. Ending paragraph

[0048] 30. Heat dissipation components

[0049] 31.Heat exchange channel

[0050] 42. First-class channel

[0051] 43. Second Stream Channel

[0052] 52. Entrance

[0053] 53. Export

[0054] 52a. Water inlet exterior

[0055] 52b.Inside the water inlet

[0056] 53a.Outlet exterior

[0057] 53b. Inside the water outlet

[0058] 100.Radiator base

[0059] 200. Top of radiator

[0060] 40.Power module

[0061] 41. Power devices DETAILED DESCRIPTION

[0062] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0063] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0064] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0065] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0066] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0067] The following is a detailed description of the technical content, structural features, achieved objectives and effects of the present invention, which are described in detail in conjunction with the implementation methods and the accompanying drawings.

[0068] See also Figure 1 According to the first embodiment of the present application, a heat sink 10 is provided, comprising at least one stacked corrugated laminate 1. The heat sink 10 is configured to allow a fluid 32 to flow through the surface of the corrugated laminate 1 so that the fluid 32 exchanges heat with the heat sink 10. The corrugated laminate 1 comprises a first section 11a and a second section 11b. The wavelength of the first section 11a is greater than the wavelength of the second section 11b. The contact area between the heat sink 10 and the fluid 32 is different due to different wavelengths, and the heat dissipation effect is different. The smaller the wavelength, the larger the contact area. The wavelength of the first section 11a is greater than the wavelength of the second section 11b, and the heat dissipation effect is better than that of a uniform wavelength, which is more conducive to heat dissipation.

[0069] In some possible embodiments, the first section 11a and the second section 11b of the corrugated laminate 1 are sequentially arranged along the flow direction X of the fluid 32. The fluid 32 flows from the first section 11a of the corrugated laminate 1 to the second section 11b. When the fluid 32 flows to the second section 11b, the temperature is higher than when it flows to the first section 11a of the corrugated laminate 1. The wavelength of the first section 11a is designed to be greater than the wavelength of the second section 11b. At the position where the temperature of the fluid 32 becomes higher, a smaller wavelength is used to dissipate excess heat. The temperature of the fluid 32 rises slowly toward the rear end of the radiator 10. The radiator 10 with the same wavelength cannot meet the heat dissipation requirements of the power device 41. The utility model adopts the principle that within the same unit length, the smaller the wavelength, the larger the contact area. By making the wavelength of the rear section smaller than that of the front section, the heat dissipation capacity of the rear end of the radiator 10 is improved.

[0070] See also Figure 2 In some possible embodiments, the corrugated laminate 1 includes at least one heat dissipation section 12, and one heat dissipation section 12 includes a plurality of bands arranged along the flow direction of the fluid 32, and the wavelengths of the plurality of bands gradually decrease. The wavelengths of the plurality of bands of the heat dissipation section 12 gradually decrease for heat dissipation with greater requirements. For modules with large heat dissipation requirements, a plurality of gradually decreasing bands are used to continuously increase the contact area between the corrugated laminate 1 and the fluid 32.

[0071] In some possible embodiments, the number of heat dissipation sections 12 is one; or the number of heat dissipation sections 12 is multiple, and the multiple heat dissipation sections 12 are arranged along the flow direction X of the fluid 32. For areas with different heat dissipation requirements, new heat dissipation sections 12 can be re-arranged, that is, different types of heat sinks 10 can be used for different heat dissipation areas.

[0072] See also Figure 3 In some possible embodiments, the corrugated laminate 1 further includes a starting section located at one end of the corrugated laminate 1, and the starting section 13 is parallel to the flow direction X of the fluid 32; and / or the corrugated laminate 1 further includes an ending section 14 located at the other end of the corrugated laminate 1, and the ending section 14 is parallel to the flow direction of the fluid. This embodiment ensures that the pressure of the heat exchange flow channel 31 at the inlet 52 and the outlet 53 is as small as possible. After the fluid 32 enters the flow channel 32 from the inlet 52 and flows out of the flow channel 32 from the outlet 53, the starting section 13 and the ending section 14 of the radiator 10 are parallel to the flow direction of the fluid 32, rather than other methods, and the pressure loss is small.

[0073] See also Figures 4 to 5 In some possible embodiments, the heat sink 10 includes at least two groups of wavy laminations 20 arranged along a first direction Y, each group of wavy laminations 20 includes at least one wavy lamination 1, and the first direction Y is the width direction of the wavy laminations 1. The wavy laminations 20 perform double-sided heat dissipation on the power device 41 between the two wavy laminations 20, and compared with single-sided heat dissipation, double-sided heat dissipation is better than single-sided heat dissipation.

[0074] In some possible embodiments, at least two groups of wavy laminations 20 include a first wavy lamination group 21 and a second wavy lamination group 22 that are arranged opposite to each other. Along the flow direction X of the fluid 32, the crests of the first wavy lamination group 21 and the crests of the second wavy lamination group 22 are staggered. The upper and lower groups of waves of the first wavy lamination group 21 and the second wavy lamination group 22 are oriented in opposite directions, that is, along the flow direction X of the fluid 32, the crests and troughs of the fluid 32 passing through the wavy lamination group 20 are staggered. The flow rate and direction of the fluid 32 are changed to achieve the effect of "cross" heat exchange.

[0075] See also Figure 6 to Figure 7 According to a possible embodiment of the present application, a heat dissipation assembly 30 is provided, including a heat exchange channel 31 and a radiator 10. The heat exchange channel 31 is provided with the radiator 10 inside. The heat exchange channel 31 is used for a fluid 32 to flow through so that the fluid 32 exchanges heat with the radiator 10. The heat exchange channel 31 is used for the fluid 32 to dissipate heat for the radiator 10. The heat dissipation channel 31 and the radiator 10 are connected together by welding.

[0076] In some possible embodiments, the heat dissipation assembly 30 includes two heat exchange channels 31, which are arranged at intervals relative to each other. The two heat exchange channels 31 are arranged at intervals along the first direction Y, and respectively place the first wavy lamination group 21 and the second wavy lamination group 22.

[0077] In some possible embodiments, the two heat exchange channels 31 are interconnected to allow the fluid 32 to circulate for heat dissipation.

[0078] In some possible embodiments, the heat dissipation assembly 30 further includes a first connecting flow channel 42 and a second connecting flow channel 43 which are arranged at intervals, wherein the first connecting flow channel 42 connects the two heat exchange flow channels 31, and the second connecting flow channel 43 connects the two heat exchange flow channels 31. The two heat exchange flow channels 31 are connected through the first connecting flow channel 42 and the second connecting flow channel 43 so that the fluid 32 circulates to dissipate heat.

[0079] In some possible embodiments, the heat exchange channel 31 includes an inlet 52 and an outlet 53, and the inlet 52 and the outlet 53 are connected to the interior of the heat exchange channel 31. The inlet 52 is the inlet of the fluid 32, and the outlet 53 is the outlet of the fluid 32. The diameter of the water inlet in the inner direction 52b is equal to the diameter of the water inlet in the outer direction 52a, and the diameter of the water outlet in the inner direction 53b is equal to the diameter of the water outlet in the outer direction 53a. According to the principles of fluid mechanics, when the pipeline suddenly expands and contracts, there is a local flow loss caused by the sudden change in speed. The equal diameter ensures that the pressure loss in the water inlet and outlet parts is as small as possible, and this part of the loss is used for the heat exchange fins, effectively enhancing the heat exchange and reducing the chip temperature.

[0080] See also Figures 8 to 14 According to a possible embodiment of the present application, a power module 40 is provided, including a power device 41 and a heat dissipation assembly 30, wherein the heat dissipation assembly 30 is configured to exchange heat with the power device 41. The heat dissipated by the power device 41 is mainly absorbed from the root position 100 of the heat sink 10, and heat exchange with the fluid 32 is achieved by penetrating into the head 200 of the fluid 32. The single wavy laminate is arranged in a line at a certain interval, and a "hot spot" with a certain gap is formed at its root. The size of the chip in the actual power device can be, for example, but not limited to greater than 1mm*1mm, and the thickness of the wavy laminate 1 can be, for example, but not limited to less than 1mm. By "crossing" the upper and lower arrangements, these intersections can be uniformized, the chip can absorb as much heat as possible, the chip temperature can be reduced, and heat dissipation can be achieved.

[0081] In some possible embodiments, the power device 41 is disposed in contact with the heat exchange channel 31 . The power device 41 dissipates heat through a heat sink disposed in the heat exchange channel 31 .

[0082] In some possible embodiments, the heat dissipation assembly 30 includes two heat exchange channels 31, the two heat exchange channels 31 are arranged relatively spaced apart, and the power device 41 is arranged between the two heat exchange channels 31. This is the best example of the utility model, and the heat dissipated by the heat dissipation assembly 30 can be dissipated by the radiators distributed up and down.

[0083] See also Figures 10 to 14 , two comparative schemes are provided, and through experiments, the heat dissipation effect of the utility model is obtained, which is described in detail below.

[0084] Fig.10 is a schematic diagram of a diamond-shaped heat sink according to an embodiment of the present application, Fig.11 is a schematic diagram of a uniform wave dissipation heat sink according to an embodiment of the present application, Figure 5 It is a schematic diagram of a heat sink according to the present application in the first direction Y. Based on the comparison of the above three different heat sinks, the verification results in the table below are obtained: Fig.12 , Fig.13 as well as Fig.14 The specific temperature distribution diagrams of the three schemes. The experimental premise is to use the same power device loss, module distribution, and heat sinks of different shapes. The highest chip temperature in the heat dissipation process is 136°C, the highest chip temperature of the diamond heat sink is 149.5°C, and the heat dissipation efficiency of this scheme is 8% higher than that of the diamond heat sink. The highest chip temperature of the uniform wave heat sink is 159°C, and the heat dissipation efficiency of this scheme is 14% higher than that of the uniform wave heat sink.

[0085]

[0086] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0087] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0088] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A radiator, characterized in that: The heat sink comprises at least one stacked corrugated laminate, the heat sink is configured to allow a fluid to flow through a surface of the corrugated laminate so as to exchange heat between the fluid and the heat sink, the corrugated laminate comprises a first section and a second section, and a wavelength of the first section is greater than a wavelength of the second section.

2. The heat sink according to claim 1, characterized in that: The first section and the second section are arranged sequentially along the flow direction of the fluid.

3. The heat sink according to claim 1, characterized in that: The wavy laminate includes at least one heat dissipation section, and one heat dissipation section includes a plurality of wave bands arranged along the flow direction of the fluid, and the wavelengths of the plurality of wave bands gradually decrease.

4. The heat sink according to claim 3, characterized in that: The number of the heat dissipation section is one; or There are multiple heat dissipation sections, and the multiple heat dissipation sections are arranged along the flow direction of the fluid.

5. The heat sink according to claim 1, characterized in that The wavy laminate further comprises a starting section located at one end of the wavy laminate, and the starting section is parallel to the flow direction of the fluid; and / or The corrugated laminate further includes an end section located at the other end of the corrugated laminate, and the end section is parallel to the flow direction of the fluid.

6. The heat sink according to claim 1, characterized in that The heat sink comprises at least two groups of corrugated laminations arranged along a first direction, each group of the corrugated laminations comprises at least one corrugated lamination, and the first direction is a width direction of the corrugated laminations.

7. The heat sink according to claim 6, characterized in that The at least two groups of wavy lamination groups include a first wavy lamination group and a second wavy lamination group that are arranged opposite to each other. Along the flow direction of the fluid, the crests of the first wavy lamination group and the crests of the second wavy lamination group are staggered.

8. A heat dissipation component, characterized in that: It comprises a heat exchange channel and the radiator according to any one of claims 1 to 7, wherein the radiator is arranged inside the heat exchange channel, and the inside of the heat exchange channel is used for the fluid to flow through so that the fluid exchanges heat with the radiator.

9. The heat dissipation assembly according to claim 8, characterized in that: The heat dissipation component includes two heat exchange channels, and the two heat exchange channels are arranged relatively spaced apart.

10. The heat dissipation assembly according to claim 9, characterized in that: The two heat exchange channels are connected to each other.

11. The heat dissipation assembly according to claim 10, characterized in that: The heat dissipation component further includes a first connecting flow channel and a second connecting flow channel which are spaced apart from each other. The first connecting flow channel connects the two heat exchange flow channels, and the second connecting flow channel connects the two heat exchange flow channels.

12. The heat dissipation assembly according to any one of claims 8 to 11, characterized in that: The heat exchange channel includes an inlet and an outlet, and the inlet and the outlet are in communication with the interior of the heat exchange channel.

13. A power module, characterized in that: The invention comprises a power device and a heat dissipation assembly as claimed in any one of claims 8 to 12, wherein the heat dissipation assembly is configured to exchange heat for the power device.

14. The power module according to claim 13, characterized in that: The power device is arranged in contact with the heat exchange channel.

15. The power module according to claim 13, characterized in that: The heat dissipation component includes two heat exchange channels, the two heat exchange channels are arranged relatively spaced apart, and the power device is arranged between the two heat exchange channels.

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