A modular data center dry cooler

Through modular design and removable wall radiator, the problem of low risk resistance caused by the integration of existing dry cooler coils is solved, and the dry cooler risk resistance and heat dissipation efficiency is achieved.

CN222736468UActive Publication Date: 2025-04-08HONGSHENG THERMAL SYST LTD

Patent Information

Application Number
CN202420818253.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-19
Publication Date
2025-04-08
Estimated Expiration
2034-04-19

AI Technical Summary

Technical Problem

Due to the integrated coil structure of the existing dry cooler, if the coil is damaged by external factors, the entire dry cooler will not be able to continue to be used, and the risk resistance is low.

Method used

With a modular design, the dry cooler consists of multiple independent heat dissipation equipment, each heat dissipation equipment includes a detachable wall radiator, and the liquid inlet manifold and the liquid outlet manifold are independently connected to achieve rapid disassembly and replacement of the heat dissipation equipment.

Benefits of technology

The risk resistance of the dry cooler is improved. If a certain heat dissipation equipment fails, it can be disassembled and replaced in time without affecting the normal operation of other heat dissipation equipment, ensuring the overall heat dissipation effect of the dry cooler.

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Abstract

The utility model provides a modular data center dry cooler, which relates to the field of dry coolers and includes several heat dissipation devices; the heat dissipation devices include a base, a bottom plate, a front plate, a rear plate, a top plate, two partition-type radiators and a fan; a vent is provided on the top plate; the fan is located above the vent; the two partition-type radiators are respectively located on the left and right sides of the top plate; the top plate, the bottom plate, the front plate and the rear plate are all detachably fixed to the partition-type radiators; all heat dissipation devices are closely arranged along the front-to-back direction; it also includes two liquid inlet main pipes and two liquid outlet main pipes; the liquid inlet main pipes and the liquid outlet main pipes are arranged on the left and right sides of the heat dissipation device; the partition-type radiator includes a core, an upper head and a lower head; the upper head is connected to the adjacent liquid inlet main pipe; the lower head is connected to the adjacent liquid outlet main pipe. The utility model can solve the problem of the prior art that the entire dry cooler cannot be used when the coil is damaged by external factors due to the integration of the coil, thereby improving the risk resistance of the dry cooler.
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Description

Technical Field

[0001] The utility model relates to the field of dry coolers, in particular to a modular data center dry cooler. Background Art

[0002] A dry cooler, also known as a dry type cooler, cools the liquid in the tube by letting the liquid flow inside the tube and letting natural wind flow outside the tube to lower the temperature of the liquid in the tube and achieve the purpose of cooling.

[0003] The Chinese patent application No. 201621299777.3 discloses a frame-type dry cooler, which includes an aluminum profile frame; a coil arranged in the aluminum profile frame, the coil is arranged in a V-shape in the aluminum profile frame, and the coil is placed along the length direction of the aluminum profile frame; a fan is arranged on the top of the aluminum profile frame, and the fan is located above the coil; the coil includes fins and a heat exchange medium inlet pipe and a heat exchange medium outlet pipe connected to the heat exchange medium circulation system, the heat exchange medium inlet pipe and the heat exchange medium outlet pipe are respectively connected to the fin through a U-shaped connecting pipe, and the heat exchange medium inlet pipe and the heat exchange medium outlet pipe are respectively provided with an external pipe, and the end of the external pipe is provided with a connecting flange, and the external pipe is connected to the cabinet connecting pipe through the connecting flange. The patent arranges the coil in a V-shape in the aluminum profile frame. Compared with arranging the coil perpendicular to the wind direction of the dry cooler, the V-shaped arrangement enlarges the volume of the coil, can produce a larger contact area with the air at the same time, and improves the heat dissipation efficiency.

[0004] However, in the process of using the dry cooler provided by the patent, since the coil structure is integrated, the coil length is adjusted according to the size of the dry cooler, and the fins are connected only through a heat exchange medium inlet pipe and a heat exchange medium outlet pipe. If the coil is damaged by external factors, the entire dry cooler cannot continue to be used, and the dry cooler has low risk resistance. Utility Model Content

[0005] In response to the above-mentioned problems, the utility model provides a modular data center dry cooler, which can solve the problem in the prior art that the entire dry cooler cannot be used when the coil is damaged by external factors due to the integrated coil, thereby improving the risk resistance of the dry cooler.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] The utility model provides a modular data center dry cooler, comprising a plurality of heat dissipation devices;

[0008] The heat dissipation device comprises a base, a bottom plate, a front plate, a rear plate, a top plate, two partition-type radiators and a fan; the bottom plate is horizontally fixed on the base; the front plate and the rear plate are vertically fixed on the bottom plate; the top plate is horizontally arranged and fixed with the front plate and the rear plate; a vent is provided on the top plate for the fan to extract internal air; the fan is arranged above the vent; the two partition-type radiators are respectively arranged on the left and right sides of the top plate; the top plate, the bottom plate, the front plate and the rear plate are all detachably fixed to the partition-type radiator;

[0009] All the heat dissipation devices are closely arranged along the front-to-back direction;

[0010] It also includes two liquid inlet pipes and two liquid outlet pipes for transporting coolant; the two liquid inlet pipes are respectively located on the left and right sides of the heat dissipation device; the two liquid outlet pipes are respectively located on the left and right sides of the heat dissipation device;

[0011] The partition-type radiator comprises a core, an upper head and a lower head; the upper head is fixed to the top of the core; the lower head is fixed to the bottom of the core; the upper head is connected to the adjacent liquid inlet main pipe; the lower head is connected to the adjacent liquid outlet main pipe.

[0012] The modular data center dry cooler provided by the utility model is preferably arranged such that the top of the partition-type radiator on the left side is tilted toward the left side compared to the bottom; the top of the partition-type radiator on the right side is tilted toward the right side compared to the bottom; and the two partition-type radiators are arranged in a V shape.

[0013] In the modular data center dry cooler provided by the utility model, preferably, the liquid inlet main pipe is located above the liquid outlet main pipe.

[0014] The modular data center dry cooler provided by the utility model is preferably provided with a receiving member on the top of the bottom plate; the receiving member comprises a trough body without front and rear side walls, a left pad, a left baffle, a right pad and a right baffle; the top of the left side wall of the trough body is connected and fixed to the right side of the left pad, and the left side of the left pad is vertically fixed to the left baffle; the left pad is arranged obliquely to the bottom plate; the top of the right side wall of the trough body is connected and fixed to the left side of the right pad, and the right side of the right pad is vertically fixed to the right baffle; the right pad is arranged obliquely to the bottom plate;

[0015] The bottoms of the front plate and the rear plate are fixed to the bottom upper surface and the left and right side walls of the trough body; the partition-type radiator is arranged close to the side edges of the front plate and the rear plate; the bottom of the partition-type radiator on the left side is vertically placed on the left pad and in contact with the left baffle; the bottom of the partition-type radiator on the right side is vertically placed on the right pad and in contact with the right baffle;

[0016] The base includes four vertically arranged support rods; the four support rods are respectively located at the upper left, lower left, upper right and lower right of the base; the support rods located at the upper left and lower left are fixed to the partition-type radiator on the left; the support rods located at the upper right and lower right are fixed to the partition-type radiator on the right.

[0017] The modular data center dry cooler provided by the utility model is preferably configured such that the bases of all the heat dissipation devices can be spliced ​​and combined.

[0018] In the modular data center dry cooler provided by the utility model, preferably, the partition-type radiator is one of a plate-fin radiator or a tube-belt radiator.

[0019] The above technical solution has the following advantages or beneficial effects:

[0020] The two heat sinks are connected along the length of the heat sink to the top and bottom of the heat sink to the bottom. The heat sinks are connected along the length of the heat sink to the top and bottom of the heat sink to the bottom. The invention effectively avoids affecting the heat dissipation effect of the whole dry cooler; at the same time, the top plate, the bottom plate, the front plate and the rear plate are all detachably fixed to the partition-type radiator; if the partition-type radiator fails, the faulty partition-type radiator can be removed in time, and the connecting channel between the liquid inlet main pipe and the partition-type radiator and the connecting channel between the liquid outlet main pipe and the partition-type radiator can be closed, and the faulty partition-type radiator will not affect other heat dissipation devices in operation. Compared with the integrated coil structure of the prior art, the coil length is adjusted according to the size of the dry cooler, and it is connected to the fins only through a heat exchange medium inlet pipe and a heat exchange medium outlet pipe. If the fins, the heat exchange medium inlet pipe or the heat exchange medium outlet pipe in the coil are damaged by external factors, the entire dry cooler cannot be used any more; by setting up multiple heat dissipation devices, a detachable partition-type radiator is set on the heat dissipation device, and each partition-type radiator is independently connected to the liquid inlet main pipe and the liquid outlet main pipe, the risk resistance of the dry cooler can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention and its features, appearance and advantages will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings. The same reference numerals indicate the same parts in all the drawings. The drawings are not drawn to scale, but the emphasis is on illustrating the subject matter of the present invention.

[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of a modular data center dry cooler provided in Example 1 of the utility model.

[0023] Figure 2 It is a top view structural schematic diagram of a modular data center dry cooler provided in Example 1 of the utility model.

[0024] Figure 3 It is a rear structural schematic diagram of a modular data center dry cooler provided in Example 1 of the utility model.

[0025] Figure 4 yes Figure 3 Schematic diagram of the enlarged structure at the circled position. DETAILED DESCRIPTION

[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0027] Embodiment 1:

[0028] like Figures 1 to 3 As shown, a modular data center dry cooler provided by Embodiment 1 of the utility model includes a plurality of heat dissipation devices 1;

[0029] The heat dissipation device 1 includes a base 11, a bottom plate 12, a front plate 13, a rear plate 14, a top plate 15, two partition-type radiators 16 and a fan 17; the bottom plate 12 is horizontally fixed on the base 11; the front plate 13 and the rear plate 14 are vertically fixed on the bottom plate 12; the top plate 15 is horizontally arranged and fixed with the front plate 13 and the rear plate 14; a vent 151 is provided on the top plate 15 for the fan 17 to extract internal air; the fan 17 is arranged above the vent 151; the two partition-type radiators 16 are respectively arranged on the left and right sides of the top plate 15; the top plate 15, the bottom plate 12, the front plate 13 and the rear plate 14 are all detachably fixed to the partition-type radiators 16;

[0030] All heat dissipation devices 1 are closely arranged along the front-to-back direction;

[0031] It also includes two liquid inlet pipes 2 and two liquid outlet pipes 3 for transporting the coolant; the two liquid inlet pipes 2 are respectively located on the left and right sides of the heat dissipation device 1; the two liquid outlet pipes 3 are respectively located on the left and right sides of the heat dissipation device 1;

[0032] The partition-type radiator 16 includes a core 161, an upper head 162 and a lower head 163; the upper head 162 is fixed to the top of the core 161; the lower head 163 is fixed to the bottom of the core 161; the upper head 162 is connected to the adjacent liquid inlet main pipe 2, and the lower head 163 is connected to the adjacent liquid outlet main pipe 3.

[0033] When the modular data center dry cooler provided in Example 1 of the utility model is used, the liquid inlet main pipe 2 is connected to the water outlet of the data center, and the liquid outlet main pipe 3 is connected to the water inlet of the data center; the liquid inlet main pipe 2 transports the cooling liquid flowing into the water outlet of the data center to the partition radiators 16 located at the left and right ends of the heat dissipation device 1, and extracts the air inside the heat dissipation device through the fan 17 located at the top of the heat dissipation device 1. At this time, the air outside the heat dissipation device 1 flows into the heat dissipation device 1 because the fan 17 extracts the air inside the heat dissipation device 1. The air outside the heat dissipation device 1 flows into the heat dissipation device 1 from the partitions on the left and right ends of the heat dissipation device 1. The external air enters the interior of the heat dissipation device 1 through the outer fins of the partition-type radiator 16. When passing through the partition-type radiators 16 at the left and right ends of the heat dissipation device 1, the external air exchanges heat with the heat carried by the coolant in the partition-type radiator 16, so that the external air absorbs the heat of the coolant in the partition-type radiator 16, thereby achieving the effect of lowering the temperature of the coolant. The air sucked into the heat dissipation device 1 is discharged from the vent 151 through the fan 17 on the top of the heat dissipation device 1, and the coolant that has undergone heat exchange flows from the partition-type radiator 16 into the liquid outlet main pipe 3, and the coolant is re-delivered to the water inlet end of the data center through the liquid outlet main pipe 3.

[0034] The modular data center dry cooler provided in Example 1 of the utility model is provided with a plurality of heat dissipation devices 1, and all the heat dissipation devices 1 are closely arranged in the front-to-back direction, and the heat dissipation device 1 includes two partition wall radiators 16, and the two partition wall radiators 16 are located on the left and right sides of the heat dissipation device 1, and the partition wall radiator 16 includes a core 161, an upper head 162 and a lower head 163, and the upper head 162 is connected to the adjacent liquid inlet main pipe 2, and the lower head 163 is connected to the adjacent liquid outlet main pipe 3; the water outlet end of the data center is connected to the liquid inlet main pipe 2, and the coolant in the liquid inlet main pipe 2 enters the partition wall radiators 16 in a plurality of heat dissipation devices 1 for heat dissipation, and the coolant entering the partition wall radiator 16 from the liquid inlet main pipe 2 is separated and dissipated by a plurality of independent heat dissipation devices 1. Compared with the prior art in which the aluminum profile frame is extended to achieve the change and adjustment of the size of the dry cooler, assembling a plurality of heat dissipation devices 1 into a dry cooler is more convenient for management, assembly and transportation, and is convenient for temporarily adding more heat dissipation devices 1 to obtain a better heat dissipation effect, and when the heat dissipation device 1 appears In case of a fault, the overall heat dissipation effect of the dry cooler can be effectively avoided; at the same time, the top plate 15, the bottom plate 12, the front plate 13 and the rear plate 14 are all detachably fixed to the partition wall radiator 16; if a fault occurs in the partition wall radiator 16, the faulty partition wall radiator 16 can be removed in time, and the connecting channel between the liquid inlet main pipe 2 and the partition wall radiator 16 and the connecting channel between the liquid outlet main pipe 3 and the partition wall radiator 16 can be closed, and the faulty partition wall radiator 16 will not affect other working heat dissipation devices 1. The coil structure is integrated with the prior art, and the length of the coil is adjusted according to the size of the dry cooler. It is connected to the fins only through a heat exchange medium inlet pipe and a heat exchange medium outlet pipe. If the fins, the heat exchange medium inlet pipe or the heat exchange medium outlet pipe in the coil are damaged by external factors, the entire dry cooler cannot be used any more. By setting up multiple heat dissipation devices 1, a detachable partition radiator 16 is set on the heat dissipation device 1, and each partition radiator 16 is independently connected to the liquid inlet main pipe 2 and the liquid outlet main pipe 3, the risk resistance of the dry cooler can be improved.

[0035] The modular data center dry cooler provided in Example 1 of the utility model is preferably configured such that the top of the partition wall radiator 16 on the left side is tilted to the left side compared to the bottom; the top of the partition wall radiator 16 on the right side is tilted to the right side compared to the bottom; the two partition wall radiators 16 are configured in a V shape;

[0036] The two partition wall radiators 16 are arranged in a V-shape. Compared with arranging the two partition wall radiators 16 vertically to the bottom plate 12, the V-shape arrangement can use a partition wall radiator 16 with a larger area. The partition wall radiator 16 with a larger area can generate a larger contact area with the air at the same time, thereby improving the heat dissipation efficiency.

[0037] In the modular data center dry cooler provided in Example 1 of the utility model, preferably, the liquid inlet main pipe 2 is located above the liquid outlet main pipe 3, the coolant in the partition wall radiator 16 flows along the up and down direction of the core 161, and the air flows through the core 161 along the front and back direction of the core 161, and the upper head 162 is detachably fixed to the top plate 15, and the lower head 163 is detachably fixed to the bottom plate 12, so that the upper head 162 is connected to the liquid inlet main pipe 2, and the lower head 163 is connected to the liquid outlet main pipe 3;

[0038] When the coolant from the water outlet of the data center is transported from the liquid inlet main pipe 2, the coolant flows into the upper head 162 from the liquid inlet main pipe 2, and flows from the upper head 162 to the lower head 163 from high to low, and enters the liquid outlet main pipe 3 from the lower head 163 after heat dissipation. The flow direction of the coolant in the partition type radiator 16 is from high to low. The setting of this flow direction speeds up the time required for the coolant to circulate in the partition type radiator 16, thereby improving the circulation and heat dissipation efficiency of the coolant between the dry cooler and the data center.

[0039] like Figure 4 As shown, the modular data center dry cooler provided by Example 1 of the utility model, preferably, a receiving member 121 is provided on the top of the bottom plate 12; the receiving member 121 includes a trough body 1211 without front and rear side walls, a left pad 1212, a left baffle 1213, a right pad 1214 and a right baffle 1215; the top of the left side wall of the trough body 1211 is connected and fixed to the right side of the left pad 1212, and the left side of the left pad 1212 is vertically fixed to the left baffle 1213; the left pad 1212 is arranged obliquely to the bottom plate 12; the top of the right side wall of the trough body 1211 is connected and fixed to the left side of the right pad 1214, and the right side of the right pad 1214 is vertically fixed to the right baffle 1215; the right pad 1214 is arranged obliquely to the bottom plate 12;

[0040] When the above-mentioned receiving member 121 is used, it is easier to assemble the heat dissipation device 1. The bottom of the front plate 13 and the rear plate 14 are fixed to the bottom upper surface of the groove body 1211 and the left and right side walls, and the partition wall radiator 16 is set close to the side edges of the front plate 13 and the rear plate 14. At this time, the bottom of the partition wall radiator 16 on the left side is placed vertically on the left pad 1212 and contacts with the left baffle 1213. The left pad 1212 receives the partition wall radiator 16 on the left side, and the left baffle 1213 limits the bottom of the partition wall radiator 16 on the left side. The left pad 1212 is set obliquely to the bottom plate 12 so that the partition wall radiator 16 on the left side can be The top of the radiator 16 is tilted to the left compared to the bottom, so that a larger volume of the partition-type radiator 16 can be used to improve the heat dissipation capacity; similarly, the bottom of the partition-type radiator 16 on the right side is vertically placed on the right pad 1214 and contacts the right baffle 1215, the right pad 1214 receives the partition-type radiator 16 on the right side, and the right baffle 1215 limits the bottom of the partition-type radiator 16 on the right side. The right pad 1215 is arranged obliquely to the bottom plate 12, so that the top of the partition-type radiator 16 on the right side is tilted to the right compared to the bottom, so that a larger volume of the partition-type radiator 16 can be used to improve the heat dissipation capacity;

[0041] The base 11 includes four vertically arranged support rods 111; the four support rods 111 are respectively located at the upper left, lower left, upper right and lower right of the base 11; the support rods 111 located at the upper left and lower left are fixed to the partition wall radiator 11 on the left; the support rods 111 located at the upper right and lower right are fixed to the partition wall radiator 16 on the right; when assembling the partition wall radiators 16 on the left and right sides of the heat dissipation device 1, the bottoms of the partition wall radiators 16 on the left and right sides are placed on the receiving member 121. If the partition wall radiators 16 are not fixed to the top plate 15, the bottom plate 12, the front plate 13 and the rear plate 14, the support rods 111 are fixed to the partition wall radiators 16, and the limiting effect of the receiving member 121 on the partition wall radiators 16 can be used to fix the partition wall radiators 16. The partition radiator 16 is supported, making it easier to assemble the partition radiators 16 on the left and right sides onto the heat dissipation device 1; when the partition radiator 16 has been fixedly assembled onto the heat dissipation device 1, the support rod 111 can support the middle part of the partition radiator 16 to prevent metal fatigue in the middle section of the partition radiator 16 and further damage the partition radiator 16; when it is necessary to remove the partition radiator 16 from the heat dissipation device 1, if the partition radiator 16 is removed from the top plate 15, the bottom plate 12, the front plate 13 and the rear plate 14, the partition radiator 16 can be fully stressed under the action of the receiving member 121 and the support rod 111, preventing the partition radiator 16 from falling from a high place after being removed from the top plate 15, the bottom plate 12, the front plate 13 and the rear plate 14.

[0042] In the modular data center dry cooler provided in Example 1 of the utility model, preferably, the bases 11 of all heat dissipation devices 1 can be spliced ​​and combined to facilitate the assembly and overall management of the dry cooler.

[0043] In the modular data center dry cooler provided in Example 1 of the utility model, preferably, the partition wall radiator 16 is a plate-fin radiator, which is a compact radiator. Compared with the coil used in the prior art, the plate-fin radiator has a larger heat exchange area under the same volume, and the heat exchange efficiency is higher when using the plate-fin radiator.

[0044] In this embodiment, the partition-type radiator 16 may also be a tube-belt radiator, or other radiators having functions similar to those of the plate-fin radiator.

[0045] In summary, the modular data center dry cooler provided by the utility model can solve the problem in the prior art that the entire dry cooler cannot be used when the coil is damaged by external factors due to the integrated coil, thereby improving the risk resistance of the dry cooler.

[0046] Those skilled in the art should understand that those skilled in the art can implement the above-mentioned variations by combining the prior art and the above-mentioned embodiments, which will not be described in detail here. Such variations do not affect the essential content of the present utility model, and will not be described in detail here.

[0047] The above describes the preferred embodiments of the utility model. It should be understood that the utility model is not limited to the above-mentioned specific embodiments, and the devices and structures that are not described in detail should be understood to be implemented in a common manner in the art; any technician familiar with the art can make many possible changes and modifications without departing from the technical solution of the utility model, or modify them into equivalent embodiments with equivalent changes, which does not affect the essential content of the utility model. Therefore, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the utility model without departing from the content of the technical solution of the utility model still falls within the scope of protection of the technical solution of the utility model.

Claims

1. A modular data center dry cooler, characterized in that: Including several heat dissipation devices; The heat dissipation device comprises a base, a bottom plate, a front plate, a rear plate, a top plate, two partition-type radiators and a fan; the bottom plate is horizontally fixed on the base; the front plate and the rear plate are vertically fixed on the bottom plate; the top plate is horizontally arranged and fixed with the front plate and the rear plate; a vent is provided on the top plate for the fan to extract internal air; the fan is arranged above the vent; the two partition-type radiators are respectively arranged on the left and right sides of the top plate; the top plate, the bottom plate, the front plate and the rear plate are all detachably fixed to the partition-type radiator; All the heat dissipation devices are closely arranged along the front-to-back direction; It also includes two liquid inlet pipes and two liquid outlet pipes for transporting coolant; the two liquid inlet pipes are respectively located on the left and right sides of the heat dissipation device; the two liquid outlet pipes are respectively located on the left and right sides of the heat dissipation device; The partition-type radiator comprises a core, an upper head and a lower head; the upper head is fixed to the top of the core; the lower head is fixed to the bottom of the core; the upper head is connected to the adjacent liquid inlet main pipe; the lower head is connected to the adjacent liquid outlet main pipe.

2. The modular data center dry cooler according to claim 1, characterized in that: The top of the partition-type radiator on the left is tilted toward the left side compared to the bottom; the top of the partition-type radiator on the right is tilted toward the right side compared to the bottom; the two partition-type radiators are arranged in a V shape.

3. The modular data center dry cooler according to claim 1, characterized in that: The liquid inlet main pipe is located above the liquid outlet main pipe.

4. The modular data center dry cooler according to claim 2, characterized in that: A receiving member is provided at the top of the bottom plate; the receiving member comprises a trough body without front and rear side walls, a left pad, a left baffle, a right pad and a right baffle; the top of the left side wall of the trough body is connected and fixed to the right side of the left pad, and the left side of the left pad is vertically fixed to the left baffle; the left pad is arranged obliquely to the bottom plate; the top of the right side wall of the trough body is connected and fixed to the left side of the right pad, and the right side of the right pad is vertically fixed to the right baffle; the right pad is arranged obliquely to the bottom plate; The bottoms of the front plate and the rear plate are fixed to the bottom upper surface and the left and right side walls of the trough body; the partition-type radiator is arranged close to the side edges of the front plate and the rear plate; the bottom of the partition-type radiator on the left side is vertically placed on the left pad and in contact with the left baffle; the bottom of the partition-type radiator on the right side is vertically placed on the right pad and in contact with the right baffle; The base includes four vertically arranged support rods; the four support rods are respectively located at the upper left, lower left, upper right and lower right of the base; the support rods located at the upper left and lower left are fixed to the partition-type radiator on the left; the support rods located at the upper right and lower right are fixed to the partition-type radiator on the right.

5. The modular data center dry cooler according to claim 1, characterized in that: The bases of all the heat dissipation devices can be spliced ​​and combined.

6. The modular data center dry cooler according to any one of claims 1 to 5, characterized in that: The partition-type radiator is a plate-fin radiator or a tube-belt radiator.

Citation Information

Patent Citations

  • Frame -type dry cooling ware

    CN206247603U

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