A novel magnetic device fixing and heat dissipation device
By using a combination of thermally conductive AB glue and fixing screws in the fixing and heat dissipation device of magnetic devices, combined with the recessed installation groove and conductive silicone strip, the problems of high-power magnetic device radiator in the prior art are solved, and efficient heat dissipation, precise positioning and wide applicability are achieved.
Patent Information
- Application Number
- CN202421258908.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-03
- Publication Date
- 2025-04-08
- Estimated Expiration
- 2034-06-03
AI Technical Summary
The radiator of existing high-power magnetic devices has high cost, complex assembly, low production efficiency, poor heat dissipation effect, low protection performance, poor electromagnetic shielding performance, and poor positioning accuracy of magnetic devices.
A new magnetic device fixing and heat dissipation device including radiator components, magnetic device components, thermal AB glue and fixing screws is used to connect and fill the gap with thermal AB glue. Combined with the recessed installation groove and conductive silicone strips, efficient heat dissipation and precise positioning are achieved.
It improves heat dissipation efficiency, protection and shielding performance, reduces production costs and mold costs, simplifies the assembly process, improves positioning accuracy and stability, and has a wide range of applications.
Smart Images
Figure CN222736483U_ABST
Abstract
Claims
1. A novel magnetic device fixing and heat dissipation device, characterized in that: It includes a heat sink assembly, a magnetic device assembly, a thermally conductive AB glue and fixing screws, wherein the heat sink assembly and the magnetic device assembly are connected and fixed by the fixing screws, and the gap between the heat sink assembly and the magnetic device assembly is filled with the thermally conductive AB glue; The heat sink assembly is provided with a recessed mounting groove, the magnetic device assembly is arranged in the mounting groove, and one side of the magnetic device assembly is exposed from the mounting groove.
2. The novel magnetic device fixing and heat dissipation device as claimed in claim 1, characterized in that: The thermally conductive AB glue is filled in the installation groove, and the thermally conductive AB glue fills the gap between the magnetic device assembly and the side wall of the installation groove.
3. The novel magnetic device fixing and heat dissipation device as claimed in claim 1, characterized in that: The radiator assembly includes a radiator body, a sealing plate, a mounting plate and stainless steel screws. The mounting groove is arranged on the radiator body. The sealing plate is fixedly connected to both sides of the mounting groove by stainless steel screws. The mounting plate is connected to the inner side of the sealing plate. The mounting plate is located in the mounting groove.
4. The novel magnetic device fixing and heat dissipation device as claimed in claim 3, characterized in that: The radiator assembly comprises a conductive silicone strip, which is arranged on the periphery of the upper surface of the radiator body, and a plurality of heat dissipation fins are arranged on the radiator body.
5. The novel magnetic device fixing and heat dissipation device as claimed in claim 3, characterized in that: The magnetic device assembly includes a PCB board, an SMT nut, an SMT hollow column, a guide copper bar, an inductor and a transformer. The SMT nut, the SMT hollow column, the guide copper bar, the inductor and the transformer are directly connected to the PCB board by soldering. The SMT nut and the guide copper bar are located on the upper surface of the PCB board and exposed from the mounting groove, and the SMT hollow column, the inductor and the transformer are located on the lower surface of the PCB board.
6. The novel magnetic device fixing and heat dissipation device as claimed in claim 5, characterized in that: The heat sink body is provided with a fixing hole matching the SMT hollow column, the SMT hollow column is inserted into the fixing hole, and the magnetic device assembly is installed and fixed on the heat sink body by inserting a fixing screw into the SMT hollow column.
7. The novel magnetic device fixing and heat dissipation device as claimed in claim 5, characterized in that: A circular hole is provided on the PCB board, the circular hole is connected to the mounting groove, and the circular hole is used to pour thermal conductive AB glue into the mounting groove from the outside, and then heat and cure the thermal conductive AB glue.
8. The novel magnetic device fixing and heat dissipation device as claimed in claim 7, characterized in that: The heat-conductive AB glue isolates the inductor, the transformer and the heat sink body.