A light emitting diode display screen packaging mold and tooling

Abstract

The utility model relates to a light-emitting diode display screen packaging mold and tooling, the light-emitting diode display screen packaging mold includes a display substrate provided with a light-emitting diode; a frame glue component, which is arranged around the display substrate; the frame glue component is provided with at least one group of glue injection ports along the height direction of the light-emitting diode, the glue injection ports are used to inject a flowing packaging colloid, the flowing packaging colloid is solidified on the horizontal surface of the light-emitting diode to form a packaging glue layer; a capping substrate, which is located on the side of the frame glue component away from the display substrate; the display substrate, the frame glue component and the capping substrate form a closed cavity structure. The embodiment of the utility model can form a closed cavity structure by combining the display substrate, the frame glue component and the capping substrate, the flowing packaging colloid can flow into the closed cavity structure through the glue injection port, solidify to form a packaging glue layer, thereby improving the packaging performance of the light-emitting diode display screen.

Description

Technical Field

[0001] The utility model relates to the technical field of display device production, in particular to a light emitting diode display screen packaging mold and a light emitting diode display screen packaging tooling. Background Art

[0002] At present, micro-LED (micro-Light Emitting Diode) as a new generation of display technology has the advantages of high brightness, high color gamut, high contrast, and higher viewing angle display. Micro-LED has broad application prospects in outdoor fields such as wearable and automotive.

[0003] In order to prevent color crosstalk and improve product image quality, Micro-LED will design a pixel blocking structure between the gaps of LED chips during packaging, and obtain a high optical density (OD) packaging layer through packaging to prevent color crosstalk. As the PPI (Pixels Per Inch) of micro LED display products increases, the pixel spacing between R / G / B (red / green / blue) gradually becomes smaller, resulting in poor flatness and gap filling performance of the current packaged LED display, resulting in poor sealing performance. Utility Model Content

[0004] One of the purposes of the utility model is to provide a light emitting diode display screen packaging mold to solve the problem that the flatness and gap filling performance of the light emitting diode display screen after packaging in the prior art are poor, resulting in poor sealing performance; the second purpose is to provide a light emitting diode display screen packaging tooling.

[0005] In order to achieve the above object, the technical solution adopted by the present invention is as follows:

[0006] A light emitting diode display screen packaging mold, comprising:

[0007] A display substrate provided with light emitting diodes;

[0008] A frame glue component is arranged around the display substrate; the frame glue component is provided with at least one group of glue injection ports along the height direction of the light-emitting diode, the glue injection ports are used to inject a flowing encapsulation colloid, and the flowing encapsulation colloid is solidified on the horizontal surface of the light-emitting diode to form an encapsulation glue layer;

[0009] The capping substrate is located at a side of the frame adhesive component away from the display substrate; the display substrate, the frame adhesive component and the capping substrate form a closed cavity structure.

[0010] Furthermore, a plurality of groups of injection ports are arranged at different heights in the height direction of the light emitting diode, and the injection ports at different heights are used to inject the flowing encapsulation colloid to form an encapsulation glue layer of corresponding height.

[0011] Further, the glue injection port includes:

[0012] A glue inlet is arranged on one side of the frame glue component;

[0013] A glue outlet is arranged on the other side of the frame glue component;

[0014] The flowable encapsulating colloid is transmitted and circulated between the glue inlet and the glue outlet.

[0015] Furthermore, the same group of glue injection ports includes at least one glue inlet and a number of glue outlets matching the at least one glue inlet.

[0016] Furthermore, the glue inlet and the glue outlet are arranged opposite to each other, and the flowing encapsulating colloid between the glue inlet and the glue outlet covers the display substrate.

[0017] Furthermore, the light emitting diode display screen packaging mold is applied in a vacuum environment, and the flowing packaging colloid is in a vacuum environment and is transmitted and circulated between the glue inlet and the glue outlet.

[0018] Furthermore, the frame glue component is arranged in a target area of ​​the display substrate, and the target area is located between the light-emitting diode and an outer edge of the display substrate.

[0019] Furthermore, the cross-sectional area of ​​the capping substrate is larger than the enclosed area of ​​the frame glue component.

[0020] Furthermore, the frame glue component is formed by coating the flowing packaging colloid on the display substrate.

[0021] A light emitting diode display screen packaging tool comprises the light emitting diode display screen packaging mold as described above.

[0022] The utility model has the following advantages:

[0023] (1) A display substrate having a light-emitting diode is provided; a frame glue component is provided around the display substrate; the frame glue component is provided with at least one group of glue injection ports along the height direction of the light-emitting diode, the glue injection ports are used to inject a flowing encapsulating colloid, and the flowing encapsulating colloid is solidified on the horizontal plane of the light-emitting diode to form a packaging glue layer; a capping substrate is located on the side of the frame glue component away from the display substrate; the display substrate, the frame glue component and the capping substrate form a closed cavity structure. The display substrate, the frame glue component and the capping substrate are combined into a closed cavity structure, and the fluidity of the encapsulating glue is utilized to flow between the gaps of the light-emitting diodes. The flowing encapsulating colloid can flow into the closed cavity structure through the glue injection ports and flow freely between the gaps of the light-emitting diodes. The free flow of the flowing encapsulating colloid solidifies to form a packaging glue layer, thereby achieving better packaging flatness and gap-filling properties of the light-emitting diode display screen, and improving the sealing properties of the light-emitting diode display screen.

[0024] (2) By providing at least one set of glue injection ports along the height direction of the light-emitting diode on the frame glue component, when using the light-emitting diode display screen packaging mold of the embodiment of the utility model, a packaging process of multiple layers of packaging glue can be performed in one mold, thereby improving the packaging efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of a light emitting diode display screen packaging mold of the utility model Figure 1 ;

[0026] Figure 2 This is a schematic diagram of a light emitting diode display screen packaging mold of the utility model Figure 2 ;

[0027] Figure 3 It is a schematic diagram of a glue outlet and a glue inlet of a light emitting diode display screen packaging mold of the utility model;

[0028] Figure 4 This is a schematic diagram of the process implementation of a light emitting diode display screen packaging mold of the utility model;

[0029] Figure 5 This is a schematic diagram of a light emitting diode display screen packaging mold of the utility model Figure 3 ;

[0030] Figure 6 This is a schematic diagram of a light emitting diode display screen packaging structure of the utility model Figure 1 ;

[0031] Figure 7 This is a schematic diagram of a light emitting diode display screen packaging structure of the utility model Figure 2 ;

[0032] Figure 8 This is a schematic diagram of a light emitting diode display screen packaging structure of the utility model Figure 3 .

[0033] Among them, 100-display substrate, 110-light-emitting diode, 200-frame glue component, 210-packaging glue layer, 220-glue injection port, 221-glue inlet, 222-glue outlet, 300-top substrate. DETAILED DESCRIPTION

[0034] The following will refer to the accompanying drawings and preferred embodiments to illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be understood that the preferred embodiments are only for illustrating the present invention, not for limiting the scope of protection of the present invention.

[0035] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and thus the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed at will, and the component layout may also be more complicated.

[0036] In the present application, unless otherwise clearly specified and limited, the terms "fixed", "set", "installed", and "connected" may mean that one element is directly on another element or there may be an element in the middle, "fixed" may be understood as "fixed connection", and "set", "installed", and "connected" may all be understood as a type of connection. At the same time, the connection may include a mechanical connection or a structural connection, and may also be understood as an electrical connection, a thermal connection, or a communication connection. For mechanical or structural connections, the connection includes a detachable connection and a non-detachable connection. For example, a fixed connection may include a detachable fixed connection, a non-detachable fixed connection, or an integrally formed connection. A rotating connection may include a detachable rotating connection and a non-detachable rotating connection. A sliding connection may include a detachable sliding connection and a non-detachable sliding connection. The connection may also be a direct connection or an indirect connection through a component. For example, for a detachable fixed connection, it means that in the installed state, the positional relationship between at least two connected objects can be fixed; similar examples include a rotating connection, a sliding connection, and the like.

[0037] The implementation of the technical solution of the utility model is further described in detail below in conjunction with the accompanying drawings.

[0038] Reference Figure 1 , showing a schematic diagram of a light emitting diode display screen packaging mold according to an embodiment of the utility model Figure 1 ;reference Figure 2 , showing a schematic diagram of a light emitting diode display screen packaging mold according to an embodiment of the utility model Figure 2 ;The LED display screen packaging mold includes:

[0039] A display substrate 100 provided with a light emitting diode 110;

[0040] A frame glue component 200 is arranged around the display substrate 100; the frame glue component 200 is provided with at least one group of glue injection ports 220 along the height direction of the light-emitting diode 110, and the glue injection ports 220 are used to inject a flowing encapsulating colloid, and the flowing encapsulating colloid is solidified on the horizontal plane of the light-emitting diode 110 to form an encapsulating glue layer 210;

[0041] The capping substrate 300 is located at a side of the frame adhesive component 200 away from the display substrate 100 ; the display substrate 100 , the frame adhesive component 200 and the capping substrate 300 form a closed cavity structure.

[0042] In an embodiment of the utility model, the light-emitting diode 110 display screen packaging mold may include a display substrate 100, a frame glue component 200 and a capping substrate 300. Among them, a light-emitting diode 110 is arranged on the display substrate 100. The light-emitting diode 110 can be a Micro-LED chip, based on the electroluminescent properties of a light-emitting diode (LED). It is composed of an array of micron-sized semiconductor light-emitting units and is an electroluminescent device that converts electrical energy into light energy. Each chip is an independent light-emitting unit. During the manufacturing process, these micron-sized LED chips are precisely placed on the drive circuit substrate to form a pixel array. The drive circuit substrate can be a hard or flexible substrate, and then a protective layer and an external electrode are prepared thereon by methods such as physical vapor deposition, and finally packaged. In addition, a substrate substrate, a drive structure layer, and other film layer structures can be set on the display substrate 100. These parts are stacked in sequence on the display substrate 100 to jointly realize the display function of the display screen. The pixel circuit array and the drive circuit array in the drive structure layer are arranged in sequence along the row direction, responsible for controlling the display of each pixel. The light emitting structure layer is responsible for emitting light to form an image. Secondly, the material selection of the display substrate 100 has an important influence on the performance of the display screen. Common substrate materials include glass fiber, epoxy resin, polyimide, etc. These materials have good electrical insulation properties and can meet the working requirements of the display substrate 100.

[0043] The frame glue component 200 can be arranged around the display substrate 100; that is, the frame glue component 200 can surround the display substrate 100. The frame glue component 200 is provided with at least one set of glue injection ports 220 along the height direction of the light-emitting diode 110, and the glue injection ports 220 can pass the flowing packaging colloid. The glue injection ports 220 are used to inject the flowing packaging colloid, and the flowing packaging colloid is solidified on the horizontal surface of the light-emitting diode 110 to form the packaging glue layer 210.

[0044] The capping substrate 300 is located on a side of the frame adhesive component 200 away from the display substrate 100; Figure 1 As shown, the capping substrate 300 is located at the upper end of the frame glue component 200. The display substrate 100, the frame glue component 200 and the capping substrate 300 form a closed cavity structure. The flowing encapsulating colloid injected through the glue injection port 220 is self-leveled by the gravity of the flowing encapsulating colloid within the internal range of the closed cavity structure, thereby forming a cured encapsulating glue layer 210.

[0045] Further, the glue injection port 220 includes: a glue inlet 221, which is arranged on one side of the frame glue component 200;

[0046] The glue outlet 222 is arranged at the other side of the frame glue component 200;

[0047] The flowing encapsulation colloid is transferred and circulated between the glue inlet 221 and the glue outlet 222. In practical applications, the glue injection port 220 may include a glue inlet 221 and a glue outlet 222. The glue inlet 221 may be provided on one side of the frame glue component 200; the flowing encapsulation colloid enters the closed cavity structure formed by the display substrate 100, the frame glue component 200 and the capping substrate 300 from the glue inlet 221, and flows in the closed cavity structure. The glue outlet 222 is provided on the other side of the frame glue component 200, and the flowing encapsulation colloid overflowing in the closed cavity structure overflows through the glue outlet 222, that is, the flowing encapsulation colloid is transferred and circulated between the glue inlet 221 and the glue outlet 222, so as to maintain levelness at the corresponding height, and solidify to form the encapsulation glue layer 210.

[0048] For example, see Figure 3In order to allow the subsequent packaging glue to flow freely, the sealing glue leaves at least one glue inlet 221 and one glue outlet 222. To ensure that the packaging glue flows and covers the entire display substrate 100, the flow of the glue inlet 221 and the sealing glue outlet is required to cover the display substrate 100. The top view of the display substrate 100 corresponds to A\B\C\D on the top and bottom and left and right, respectively. One or more groups of packaging glue injection ports 220 can be designed on the A and B sides, respectively. If the A position is the glue inlet 221, the B position is the glue outlet 222. Or if the B position is the glue inlet 221, then A is the glue outlet 222. One or more groups of packaging glue ports can also be designed on the C\D sides, respectively. If the C position is the glue inlet 221, then the D position is the glue outlet 222, or if the D position is the glue inlet 221, then the C position is the glue outlet 222.

[0049] Furthermore, the glue inlet 221 and the glue outlet 222 are arranged opposite to each other, and the flowing encapsulating colloid between the glue inlet 221 and the glue outlet 222 covers the display substrate 100 .

[0050] In the embodiment of the utility model, the glue inlet 221 and the glue outlet 222 can be arranged relative to each other, such as Figure 3 As shown, the glue inlet 221 and the glue outlet 222 are arranged relatively to each other. When the flowing encapsulation colloid flows between the glue inlet 221 and the glue outlet 222, the flowing encapsulation colloid can cover the display substrate 100, thereby further ensuring that the encapsulation glue layer 210 formed by the curing of the flowing encapsulation colloid can better seal the light-emitting diodes 110 on the entire display substrate 100.

[0051] Furthermore, the same group of glue injection ports 220 includes at least one glue inlet 221 and glue outlets 222 matching the number of the at least one glue inlet 221 .

[0052] In practical applications, the number of the glue inlet 221 and the glue outlet 222 for forming the same level of the encapsulation glue layer 210 matches, and the number is at least one. For example, when there is one glue inlet 221 for forming the same level of the encapsulation glue layer 210, the number of the glue outlet 222 is also one. When there are two glue inlets 221 for forming the same level of the encapsulation glue layer 210, the number of the glue outlet 222 is also two.

[0053] Furthermore, the light emitting diode 110 display screen packaging mold is applied in a vacuum environment, and the flowing packaging colloid is in a vacuum environment and is transmitted and circulated between the glue inlet 221 and the glue outlet 222 .

[0054] The LED 110 display screen packaging mold of the embodiment of the utility model can be used in a vacuum environment, that is, in a vacuum environment, the LED 110 display screen packaging mold is used to package the LED 110 display screen. The flowing packaging colloid is transmitted and circulated between the glue inlet 221 and the glue outlet 222 in a vacuum environment, and the external pressure is used to make the packaging glue layer 210 more uniform.

[0055] Furthermore, the frame glue component 200 is disposed in a target area of ​​the display substrate 100 , and the target area is located between the light emitting diode 110 and an outer edge of the display substrate 100 .

[0056] The frame glue component 200 can be set in a target area of ​​the display substrate 100, and the target area is located between the light-emitting diode 110 and the outer edge of the display substrate 100. The position of the target area may be determined according to needs, thereby improving the area adaptability range of the package and improving the practicality of the light-emitting diode 110 display screen packaging mold.

[0057] Furthermore, the frame glue component 200 is formed by coating the flowing encapsulation glue on the display substrate 100 .

[0058] In actual applications, a flowing encapsulation colloid can be coated on the edge of the display substrate 100, i.e., the target area. After the flowing encapsulation colloid is cured, a frame glue component 200 can be formed. The light-emitting diode 110 chip can be surrounded by the frame glue component 200. After the frame glue is cured, it can effectively support the top substrate 300, thereby realizing the curing of encapsulation glue at different heights.

[0059] Furthermore, the cross-sectional area of ​​the capping substrate 300 is larger than the enclosed area of ​​the frame glue component 200 .

[0060] The cross-sectional area of ​​the capping substrate 300 can be larger than the enclosed area of ​​the frame glue component 200, so that the capping substrate 300 can completely seal the entire enclosed portion of the frame glue component 200, so that the sealing glue layer can be sealed by the capping substrate 300 when solidifying, thereby improving the quality of the package.

[0061] Furthermore, a plurality of groups of injection ports 220 are arranged at different heights in the height direction of the light emitting diode 110 , and the injection ports 220 at different heights are used to inject the flowing encapsulation colloid to form an encapsulation glue layer 210 of corresponding height.

[0062] In the embodiment of the utility model, multiple groups of injection ports 220 can be set at different heights in the height direction of the light-emitting diode 110, and the injection ports 220 at different heights are used to inject the flowing encapsulation colloid to form the encapsulation glue layer 210 of the corresponding height. For example, a group of injection ports 220 can be set at the first height, that is, the inlet port 221 and the outlet port 222 are set at the first height, and the flowing encapsulation colloid is injected, and the flowing encapsulation colloid flows on the inlet port 221 and the outlet port 222 corresponding to the first height, and solidifies to form the encapsulation glue layer 210 corresponding to the first height.

[0063] In order to enable those skilled in the art to clearly use the LED 110 display screen packaging mold of the present invention, the packaging process using the LED 110 display screen packaging mold is described:

[0064] You can refer to Figure 4 , the first step: obtain a display substrate 100 with a Micro-LED chip. The second step: apply frame glue on the edge of the display substrate 100, the frame glue surrounds the Micro-LED chip, and after the frame glue is cured, a frame glue component 200 is formed, which can provide effective support. The frame glue component 200 has a glue inlet 221 and a glue outlet 222, and the purpose of uniformly arranging the frame glue in the cavity can be achieved by controlling the opening / height / colloid flow rate of the glue inlet 221 / glue outlet 222. The third step: attach the top substrate 300, and the size of the top substrate 300 can be larger than the size of the frame glue. The fourth step: the frame glue is cured. This step can make the display substrate 100 and the top substrate 300 bonded together by the frame glue to obtain the required packaging cavity, that is, to form a closed cavity structure. The fifth step: packaging glue perfusion, that is, using external pressure to make the packaging glue evenly enter from the glue inlet 221, and through the flow of the packaging glue in the packaging cavity, the black glue of the target height is obtained. Step 6: The encapsulation glue is cured to form an encapsulation glue layer 210, and the encapsulation is completed. Step 7: The top substrate 300 is peeled off. Figure 5 As shown, this can be achieved by laser or cutting.

[0065] Specifically, since a variety of different packaging forms can be formed during packaging, different injection ports 220 can be set at different heights, so that different steps are performed to form corresponding packaging. Figure 6 , forming a packaged display screen with a package glue layer 210 of a target height, and continuing with the above process flow, the package is completed according to the steps 1-2-3-4-5-6-7. Figure 7 , forming two target heights of the encapsulation glue layer 210 of the encapsulation display screen, and continuing with the above process flow, the encapsulation is completed according to the steps of 1-2-3-4-5-6-5-6-7. Figure 8, forming a packaged display screen with three target heights of the packaging glue layer 210, and continuing with the above process flow, the packaging is completed according to the steps of 1-2-3-4-5-6-5-6-5-6-7.

[0066] A display substrate 100 is provided with a light-emitting diode 110; a frame glue component 200 is arranged around the display substrate 100; the frame glue component 200 is provided with at least one group of glue injection ports 220 along the height direction of the light-emitting diode 110, and the glue injection ports 220 are used to inject flowing packaging colloid, and the flowing packaging colloid is solidified on the horizontal plane of the light-emitting diode 110 to form a packaging glue layer 210; a capping substrate 300 is located on a side of the frame glue component 200 away from the display substrate 100; the display substrate 100, the frame glue component 200 and the capping substrate 300 form a closed cavity structure. The display substrate 100, the frame glue component 200 and the capping substrate 300 are combined into a closed cavity structure, and the fluidity of the packaging glue is utilized to flow between the gaps of the light-emitting diodes 110. The fluid packaging glue can flow into the closed cavity structure through the glue injection port 220, and freely flow between the gaps of the light-emitting diodes 110. The free flow of the fluid packaging glue solidifies to form a packaging glue layer 210, thereby achieving better packaging flatness and gap-filling properties of the light-emitting diode 110 display screen, and improving the sealing of the light-emitting diode 110 display screen. By providing at least one group of glue injection ports 220 in the frame glue component 200 along the height direction of the light-emitting diode 110, when the light-emitting diode 110 display screen packaging mold of the embodiment of the utility model is used, a packaging process of multiple layers of packaging glue can be performed in one mold, thereby improving the packaging efficiency.

[0067] The embodiment of the utility model further discloses a light emitting diode 110 display screen packaging tool, comprising the light emitting diode 110 display screen packaging mold as described in the above embodiment.

[0068] In addition, the LED 110 display screen packaging tooling may also include a laser generator, and the packaged capping substrate 300 is cut based on the laser emitted by the laser generator to separate the capping substrate 300 and the packaged LED 110 display screen.

[0069] Specifically, the light emitting diode 110 display screen packaging mold includes:

[0070] A display substrate 100 provided with a light emitting diode 110;

[0071] A frame glue component 200 is arranged around the display substrate 100; the frame glue component 200 is provided with at least one group of glue injection ports 220 along the height direction of the light-emitting diode 110, and the glue injection ports 220 are used to inject a flowing encapsulating colloid, and the flowing encapsulating colloid is solidified on the horizontal plane of the light-emitting diode 110 to form an encapsulating glue layer 210;

[0072] The capping substrate 300 is located at a side of the frame adhesive component 200 away from the display substrate 100 ; the display substrate 100 , the frame adhesive component 200 and the capping substrate 300 form a closed cavity structure.

[0073] Optionally, a plurality of groups of injection ports 220 are arranged at different heights in the height direction of the light emitting diode 110 , and the injection ports 220 at different heights are used to inject the flowing encapsulation colloid to form an encapsulation glue layer 210 of corresponding height.

[0074] Optionally, the glue injection port 220 includes:

[0075] The glue inlet 221 is arranged on one side of the frame glue component 200;

[0076] The glue outlet 222 is arranged at the other side of the frame glue component 200;

[0077] The flowing encapsulating colloid is transmitted and circulated between the glue inlet 221 and the glue outlet 222 .

[0078] Optionally, the same group of glue injection ports 220 includes at least one glue inlet 221 and a number of glue outlets 222 matching the number of the at least one glue inlet 221 .

[0079] Optionally, the glue inlet 221 and the glue outlet 222 are arranged opposite to each other, and the flowing encapsulating colloid between the glue inlet 221 and the glue outlet 222 covers the display substrate 100 .

[0080] Optionally, the light emitting diode 110 display screen packaging mold is applied in a vacuum environment, and the flowing packaging colloid is in a vacuum environment and is transmitted and circulated between the glue inlet 221 and the glue outlet 222 .

[0081] Optionally, the frame glue component 200 is disposed in a target area of ​​the display substrate 100 , and the target area is located between the light emitting diode 110 and an outer edge of the display substrate 100 .

[0082] Optionally, a cross-sectional area of ​​the capping substrate 300 is larger than an enclosed area of ​​the frame glue component 200 .

[0083] Optionally, the frame glue component 200 is formed by coating the flowing encapsulation colloid on the display substrate 100 .

[0084] The utility model comprises a display substrate 100 provided with a light-emitting diode 110; a frame glue component 200, which is arranged around the display substrate 100; the frame glue component 200 is provided with at least one group of glue injection ports 220 along the height direction of the light-emitting diode 110, and the glue injection ports 220 are used to inject a flowing packaging colloid, and the flowing packaging colloid is solidified on the horizontal plane of the light-emitting diode 110 to form a packaging glue layer 210; a capping substrate 300, which is located on a side of the frame glue component 200 away from the display substrate 100; the display substrate 100, the frame glue component 200 and the capping substrate 300 form a closed cavity structure. A closed cavity structure is formed by combining the display substrate 100, the frame glue component 200 and the capping substrate 300. The fluidity of the packaging glue is utilized to flow between the gaps of the light-emitting diodes 110. The flowing packaging glue can flow into the closed cavity structure through the injection port 220 and flow freely between the gaps of the light-emitting diodes 110. The free flow of the flowing packaging glue solidifies to form a packaging glue layer 210, thereby achieving better packaging flatness and filling properties of the light-emitting diode 110 display screen, and improving the sealing of the light-emitting diode 110 display screen.

[0085] The terms "first", "second", etc. are used for descriptive purposes only and should not be understood as suggesting or implying relative importance or implicitly indicating the number or order of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. In addition, the terms "including", "comprising" and "having" and any of their variations are intended to cover non-exclusive inclusions. As used in this application, the term "and / or" includes any and all combinations of one or more of the associated listed items, and the phrase "at least one of A and B" refers to only A, only B, or both A and B. It should be understood that in this specification, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "height", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships or dimensions that are based on the orientations or positional relationships or dimensions shown in the accompanying drawings, and these terms are used only for the convenience of description and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the scope of protection of the present utility model.

[0086] The above embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Any equivalent substitution or change made by a person skilled in the art based on the present invention is within the protection scope of the present invention.

Claims

1. A light emitting diode display screen packaging mold, characterized in that: include: A display substrate provided with light emitting diodes; A frame glue component is arranged around the display substrate; the frame glue component is provided with at least one group of glue injection ports along the height direction of the light-emitting diode, the glue injection ports are used to inject a flowing encapsulation colloid, and the flowing encapsulation colloid is solidified on the horizontal surface of the light-emitting diode to form an encapsulation glue layer; The capping substrate is located at a side of the frame adhesive component away from the display substrate; the display substrate, the frame adhesive component and the capping substrate form a closed cavity structure.

2. The light emitting diode display screen packaging mold according to claim 1, characterized in that: A plurality of groups of glue injection ports are arranged at different heights in the height direction of the light emitting diode, and the glue injection ports at different heights are used to inject the flowing encapsulation colloid to form an encapsulation glue layer of corresponding height.

3. The light emitting diode display screen packaging mold according to claim 1, characterized in that: The glue injection port comprises: A glue inlet is arranged on one side of the frame glue component; A glue outlet is arranged on the other side of the frame glue component; The flowable encapsulating colloid is transmitted and circulated between the glue inlet and the glue outlet.

4. The light emitting diode display screen packaging mold according to claim 3, characterized in that: The same group of glue injection ports includes at least one glue inlet and a number of glue outlets matching the at least one glue inlet.

5. The light emitting diode display screen packaging mold according to claim 3, characterized in that: The glue inlet and the glue outlet are arranged opposite to each other, and the flowing encapsulating colloid between the glue inlet and the glue outlet covers the display substrate.

6. The light emitting diode display screen packaging mold according to claim 3, characterized in that: The light emitting diode display screen packaging mold is applied in a vacuum environment, and the flowing packaging colloid is in a vacuum environment and is transmitted and circulated between the glue inlet and the glue outlet.

7. The light emitting diode display screen packaging mold according to claim 1, characterized in that: The frame glue component is arranged in a target area of ​​the display substrate, and the target area is located between the light emitting diode and an outer edge of the display substrate.

8. The light emitting diode display screen packaging mold according to claim 1, characterized in that: The cross-sectional area of ​​the capping substrate is larger than the enclosed area of ​​the frame adhesive component.

9. The light emitting diode display screen packaging mold according to claim 1, characterized in that: The frame glue component is formed by coating the flowing packaging colloid on the display substrate.

10. A light emitting diode display screen packaging tool, characterized in that: It comprises the light emitting diode display screen packaging mold as described in any one of claims 1 to 9.

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