A discharging structure for producing anti-adhesion solder paste

Abstract

The utility model relates to the technical field of solder paste production, and in particular to an anti-adhesion discharging structure for solder paste production, comprising two discharging pipes and a rotating cylinder, wherein the upper and lower surfaces of the rotating cylinder are respectively connected to the end faces of the two discharging pipes in a sealed rotation manner, and the inner wall of the rotating cylinder is circumferentially fixedly installed with a plurality of scraper rods; a gear ring is fixedly sleeved on the rotating cylinder, and a mounting plate is fixedly installed on the surface of the two discharging pipes, and a driving motor is fixedly installed on the upper surface of the mounting plate located below, and a gear meshing with the gear ring is fixedly sleeved on the output shaft of the driving motor, and a rotating rod is fixedly installed on the top of the output shaft of the driving motor. In the process of solder paste being discharged from the discharging pipe, the plurality of scraper rods can be controlled to rotate, so as to scrape off the solder paste attached to the inner wall of the discharging pipe, so as to prevent the solder paste attached to the inner wall of the discharging pipe from causing the diameter of the discharging pipe to become smaller or blocked.

Description

Technical Field

[0001] The utility model relates to the technical field of solder paste production, in particular to an anti-adhesion discharging structure for solder paste production. Background Art

[0002] Solder paste is a paste-like mixture formed by mixing solder powder, flux and other surfactants, thixotropic agents, etc. It has a certain viscosity at room temperature and can initially stick electronic components to a predetermined position. At the welding temperature, as the solvent and some additives evaporate, the components to be welded are welded to the printed circuit pads to form a permanent connection.

[0003] After the existing solder paste is produced, it will be discharged from the discharge pipe. Due to its viscosity, some of the solder paste may adhere to the inner wall of the discharge pipe, causing the discharge pipe to become smaller or blocked, resulting in poor discharge effect. Utility Model Content

[0004] The purpose of the utility model is to solve the following shortcomings in the prior art: after the existing solder paste is produced, it will be discharged from a discharge pipe. Due to its viscosity, part of the solder paste may adhere to the inner wall of the discharge pipe, thereby causing the discharge pipe to become smaller or blocked, resulting in a poor discharge effect. A discharge structure for solder paste production with anti-adhesion is proposed.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A discharging structure for anti-adhesion solder paste production, comprising two discharging pipes and a rotating cylinder, wherein the upper and lower surfaces of the rotating cylinder are respectively connected to the end faces of the two discharging pipes in a sealing and rotating manner, and the inner wall of the rotating cylinder is fixedly mounted with a plurality of scraping rods in a circumferential shape, and the plurality of scraping rods are in sliding contact with the inner walls of the two discharging pipes;

[0007] A gear ring is fixedly mounted on the rotating cylinder, and mounting plates are fixedly installed on the surfaces of the two discharge pipes. A driving motor is fixedly mounted on the upper surface of the mounting plate located below, and a gear meshing with the gear ring is fixedly mounted on the output shaft of the driving motor. A rotating rod is fixedly mounted on the top end of the output shaft of the driving motor, and the top end of the rotating rod is rotatably connected to the lower surface of the mounting plate located above.

[0008] Preferably, an impact component is provided on the upper surface of the discharge pipe, and the impact component is used to impact the discharge pipe.

[0009] Preferably, the impact assembly includes two impact rods, an L-shaped connecting rod is symmetrically fixedly installed on the surface of the discharge pipe located above, a mounting ring is fixedly installed on the bottom end of the connecting rod, the two impact rods are respectively slidably installed in the two mounting rings, and are respectively connected to the two mounting rings through two groups of telescopic parts, and the two impact rods are controlled to move by the pressing assembly.

[0010] Preferably, the telescopic component comprises a telescopic spring sleeved on the impact rod, a mounting block is fixedly mounted on one end of the impact rod, and two ends of the telescopic spring are fixedly connected to the mounting block and the mounting ring respectively.

[0011] Preferably, the pressure assembly includes a slider and two pressure rods symmetrically fixedly mounted on the surface of the slider, the surface of the rotating rod is provided with a reciprocating thread, the slider is threadedly sleeved on the rotating rod, and the surface of the impact rod is fixedly provided with a pressure block having a longitudinal cross-section of an isosceles triangle through a connecting rod, the two pressure blocks are respectively located on the moving paths of the two pressure rods, and the slider is restricted in rotation by a limiting component.

[0012] Preferably, the limiting component includes two limiting rods symmetrically fixedly mounted on the lower surface of the mounting plate located above, and the sliding block is slidably sleeved on the two limiting rods.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. Through the coordination between the gear ring, gear and driving motor, the multiple scraper rods can be controlled to rotate during the discharge of solder paste from the discharge pipe. During the rotation, the multiple scraper rods will slide and contact with the inner walls of the two discharge pipes, thereby scraping off the solder paste attached to the inner wall of the discharge pipe, so as to avoid the solder paste attached to the inner wall of the discharge pipe causing the discharge pipe to become smaller or blocked;

[0015] 2. When the output shaft of the driving motor rotates with the rotating rod, the multiple impact rods will intermittently collide with the discharge pipe. The force generated by the collision will accelerate the discharge of the solder paste in the discharge pipe, and at the same time, it can also make some of the solder paste attached to the inner wall of the discharge pipe fall off. There is no need for additional electric drive devices, and no additional electricity costs will be incurred. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the front three-dimensional structure of an anti-adhesion discharging structure for solder paste production proposed by the utility model;

[0017] Figure 2 This is a top view of a three-dimensional structure schematic diagram of an anti-adhesion solder paste production discharging structure proposed by the utility model;

[0018] Figure 3 for Figure 1A magnified view of the structure at center;

[0019] Figure 4 for Figure 1 Enlarged view of the structure at point B in the middle.

[0020] In the figure: 1 discharge pipe, 2 rotating cylinder, 3 scraper rod, 4 gear ring, 5 mounting plate, 6 driving motor, 7 gear, 8 rotating rod, 9 impact rod, 10 connecting rod, 11 mounting ring, 12 telescopic spring, 13 slider, 14 pressure rod, 15 pressure block, 16 limiting rod. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0022] The terms such as "upper", "lower", "left", "right", "middle" and "one" cited in the present utility model are only for the convenience of description and are not used to limit the scope of application of the present utility model. Changes or adjustments in their relative relationships shall be regarded as the scope of application of the present utility model without substantially changing the technical content.

[0023] Reference Figure 1-Figure 4 , a discharging structure for anti-adhesion solder paste production, comprising two discharging pipes 1 and a rotating cylinder 2, wherein the upper and lower surfaces of the rotating cylinder 2 are respectively connected to the end faces of the two discharging pipes 1 in a sealed and rotating manner, and a plurality of scraping rods 3 are fixedly installed on the inner wall of the rotating cylinder 2 in a circular shape, and the plurality of scraping rods 3 are in sliding contact with the inner walls of the two discharging pipes 1;

[0024] A gear ring 4 is fixedly sleeved on the rotating cylinder 2, and mounting plates 5 are fixedly installed on the surfaces of the two discharge pipes 1. A driving motor 6 is fixedly installed on the upper surface of the mounting plate 5 located at the bottom. A gear 7 meshing with the gear ring 4 is fixedly sleeved on the output shaft of the driving motor 6. A rotating rod 8 is fixedly installed on the top of the output shaft of the driving motor 6. The top of the rotating rod 8 is rotatably connected to the lower surface of the mounting plate 5 located at the top.

[0025] When the solder paste is discharged into the two discharge pipes 1, the drive motor 6 can be started, and the output shaft of the drive motor 6 will rotate with the rotating rod 8 and the gear 7, and the gear ring 4 meshing with the gear 7 will rotate with the rotating cylinder 2, and the multiple scraping rods 3 located on the inner wall of the rotating cylinder 2 will rotate together and slide in contact with the inner walls of the two discharge pipes 1, so that the solder paste attached to the inner wall of the discharge pipe 1 can be scraped off, avoiding the solder paste attached to the inner wall of the discharge pipe 1 causing the pipe diameter of the discharge pipe 1 to become smaller or blocked.

[0026] An impact assembly is provided on the surface of the discharge pipe 1 located at the top, and the impact assembly is used to impact the discharge pipe 1. The impact assembly includes two impact rods 9, and an L-shaped connecting rod 10 is symmetrically fixedly installed on the surface of the discharge pipe 1 located at the top. A mounting ring 11 is fixedly installed at the bottom end of the connecting rod 10. The two impact rods 9 are respectively slidably installed in the two mounting rings 11, and are respectively connected to the two mounting rings 11 through two sets of telescopic components. The telescopic components include a telescopic spring 12 sleeved on the impact rod 9, and a mounting block is fixedly installed at one end of the impact rod 9. The two ends of the telescopic spring 12 are respectively fixedly connected to the mounting block and the mounting ring 11;

[0027] The two impact rods 9 are controlled to move by a pressure assembly, which includes a slider 13 and two pressure rods 14 symmetrically fixedly mounted on the surface of the slider 13. A reciprocating thread is provided on the surface of the rotating rod 8. The slider 13 is threadedly sleeved on the rotating rod 8. A pressure block 15 with an isosceles triangle longitudinal section is fixedly mounted on the surface of the impact rod 9 through a connecting rod. The two pressure blocks 15 are respectively located on the moving paths of the two pressure rods 14. The slider 13 is restricted in rotation by a limiting component. The limiting component includes two limiting rods 16 symmetrically fixedly mounted on the lower surface of the mounting plate 5 located above. The slider 13 is slidably sleeved on the two limiting rods 16.

[0028] When the driving motor 6 drives the rotating rod 8 to rotate, the slider 13 threadedly connected to the rotating rod 8 will drive the two pressure rods 14 to reciprocate vertically under the limiting action of the two limiting rods 16. During the upward movement of the two pressure rods 14, the surfaces will respectively slide in contact with the lower inclined surfaces of the two pressure blocks 15. Under the pressure of the inclined surfaces, the two impact rods 9 will move laterally away from each other, and the two telescopic springs 12 will shrink together. At this time, the ends of the two impact rods 9 that are close to each other will no longer be in contact with the surface of the discharge pipe 1. As the pressure rods 14 move upward, when the pressure rods 14 no longer contact with the pressure blocks 15, the pressure applied by the pressure rods 14 to the pressure blocks 15 disappears. The impact rod 9 will quickly move and reset under the elastic potential energy of the telescopic spring 12, and the end of the impact rod 9 will collide with the surface of the discharge pipe 1. Then, when the pressure rod 14 moves downward, the surface of the pressure rod 14 will slide and contact with the upper inclined surface of the pressure block 15. Under the pressure of the inclined surface, the impact rod 9 will move in the direction away from the discharge pipe 1, and the end of the impact rod 9 will no longer contact with the surface of the discharge pipe 1. As the pressure rod 14 moves downward, when the pressure rod 14 no longer contacts with the pressure block 15, the pressure force exerted by the pressure rod 14 on the pressure block 15 disappears, and the impact rod 9 will quickly move and reset under the elastic potential energy of the telescopic spring 12, and the end of the impact rod 9 will collide with the surface of the discharge pipe 1.

[0029] That is, the multiple impact rods 9 will intermittently collide with the discharge pipe 1. The force generated by the impact will accelerate the discharge of the solder paste in the discharge pipe 1, and at the same time, it can also make some of the solder paste attached to the inner wall of the discharge pipe 1 fall off. There is no need for additional electric drive devices, and no additional electricity costs will be generated.

[0030] In the utility model, when the solder paste is discharged into the two discharge pipes 1, the drive motor 6 can be started, and the output shaft of the drive motor 6 will rotate with the rotating rod 8 and the gear 7, and the gear ring 4 meshing with the gear 7 will rotate with the rotating cylinder 2, and the multiple scraping rods 3 located on the inner wall of the rotating cylinder 2 will rotate together and slide in contact with the inner walls of the two discharge pipes 1, so that the solder paste attached to the inner wall of the discharge pipe 1 can be scraped off, avoiding the solder paste attached to the inner wall of the discharge pipe 1 causing the pipe diameter of the discharge pipe 1 to become smaller or blocked.

[0031] In the present invention, unless otherwise clearly specified or limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense.

[0032] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A discharging structure for anti-adhesion solder paste production, comprising two discharging pipes (1) and a rotating cylinder (2), characterized in that: The upper and lower surfaces of the rotating cylinder (2) are respectively connected to the end surfaces of the two discharge pipes (1) in a sealing manner and in rotation, and a plurality of scraper rods (3) are fixedly mounted on the inner wall of the rotating cylinder (2) in a circular shape, and the plurality of scraper rods (3) are in sliding contact with the inner walls of the two discharge pipes (1); A gear ring (4) is fixedly sleeved on the rotating cylinder (2), and mounting plates (5) are fixedly mounted on the surfaces of the two discharge pipes (1). A driving motor (6) is fixedly mounted on the upper surface of the mounting plate (5) located below. A gear (7) meshingly connected to the gear ring (4) is fixedly sleeved on the output shaft of the driving motor (6). A rotating rod (8) is fixedly mounted on the top end of the output shaft of the driving motor (6), and the top end of the rotating rod (8) is rotatably connected to the lower surface of the mounting plate (5) located above.

2. The discharging structure for producing anti-adhesion solder paste according to claim 1, characterized in that: An impact component is provided on the surface of the discharge pipe (1) located at the top, and the impact component is used to impact the discharge pipe (1).

3. The discharging structure for producing anti-adhesion solder paste according to claim 2, characterized in that: The impact assembly comprises two impact rods (9), an L-shaped connecting rod (10) is symmetrically fixedly installed on the surface of the discharge pipe (1) located above, and a mounting ring (11) is fixedly installed at the bottom end of the connecting rod (10). The two impact rods (9) are respectively slidably installed in the two mounting rings (11) and are respectively connected to the two mounting rings (11) through two groups of telescopic components. The movement of the two impact rods (9) is controlled by the pressure assembly.

4. The discharging structure for producing anti-adhesion solder paste according to claim 3, characterized in that: The telescopic component comprises a telescopic spring (12) sleeved on the impact rod (9), one end of the impact rod (9) is fixedly mounted with a mounting block, and the two ends of the telescopic spring (12) are respectively fixedly connected to the mounting block and the mounting ring (11).

5. The discharging structure for producing anti-adhesion solder paste according to claim 4, characterized in that: The pressing assembly comprises a slider (13) and two pressing rods (14) symmetrically fixedly mounted on the surface of the slider (13); a reciprocating thread is provided on the surface of the rotating rod (8); the slider (13) is threadedly sleeved on the rotating rod (8); a pressing block (15) having a longitudinal section of an isosceles triangle is fixedly mounted on the surface of the impact rod (9) via a connecting rod; the two pressing blocks (15) are respectively located on the moving paths of the two pressing rods (14); and the slider (13) is restricted in rotation by a restriction component.

6. The discharging structure for producing anti-adhesion solder paste according to claim 5, characterized in that: The limiting component comprises two limiting rods (16) symmetrically fixedly mounted on the lower surface of the mounting plate (5) located above, and the sliding block (13) is slidably sleeved on the two limiting rods (16).

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