Automatic loading and unloading equipment for silicon wafer grinding machine

Abstract

The utility model discloses an automatic loading and unloading device for a silicon wafer grinder, comprising: a silicon wafer grinder; a silicon wafer loading mechanism, which includes a silicon wafer cassette carrier, a silicon wafer handling robot, a loading transfer platform and a loading and handling assembly, wherein the loading and handling assembly is located on one side of the silicon wafer grinder; a silicon wafer unloading mechanism, which is located on one side of the silicon wafer grinder, wherein the silicon wafer unloading mechanism includes an unloading and handling assembly and an unloading transfer platform. The utility model uses various manipulators and transfer mechanisms in conjunction with visual positioning, visual debris inspection and other systems to achieve fully automated silicon wafer grinding loading and unloading production, which saves manpower while greatly improving the production capacity of the grinder within a single working day, and has a major breakthrough in improving the overall production capacity of silicon wafer manufacturing plants that are not planned for automation; secondly, a spray cleaning mechanism for cleaning the silicon wafer grinder is designed to achieve automatic cleaning of the silicon wafer grinder, which can reduce the frequency of equipment maintenance.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer processing, in particular to automatic loading and unloading equipment for a silicon wafer grinding machine. Background Art

[0002] The silicon wafer grinding process is very common in the semiconductor field. It has two main applications. One is that after the chip is manufactured, the excess thickness is ground and thinned on the back to remove the unused parts to facilitate the subsequent packaging and testing process. The other is that during the wafer manufacturing process, in order to improve the surface state of the silicon wafer and increase the flatness, the silicon wafer is polished to facilitate the subsequent polishing process. Currently, a silicon wafer grinder is required for grinding.

[0003] At present, due to the characteristics of silicon wafer grinding equipment, the loading and unloading of silicon wafers, the loading and unloading of quartz (grinding) blocks and the subsequent cleaning of the grinding equipment are all manual operations, which not only consumes manpower but also affects the production capacity of the silicon wafer grinder during the working day.

[0004] In view of this, an automatic loading and unloading device for a silicon wafer grinder is proposed. Utility Model Content

[0005] The purpose of the utility model is to provide an automatic loading and unloading device for a silicon wafer grinder in order to solve the above-mentioned problems.

[0006] The technical solution adopted by the utility model is as follows: an automatic loading and unloading device for a silicon wafer grinder, comprising: a silicon wafer grinder; a silicon wafer loading mechanism, which includes a silicon wafer cassette carrier, a silicon wafer handling robot, a loading transfer platform and a loading and handling component, the loading and handling component is located on one side of the silicon wafer grinder; a silicon wafer unloading mechanism, which is located on one side of the silicon wafer grinder, the silicon wafer unloading mechanism includes an unloading and handling component and an unloading transfer platform; the loading and handling component and the unloading and handling component both include a robotic arm and a visual handling structure located at the tail joint of the robotic arm, the visual handling structure includes a mounting bracket and a visual debris detection component and a visual positioning component located on both sides of the mounting bracket, the bottom end of the mounting bracket is circumferentially provided with four independent silicon wafer adsorption lifting cylinders and a vacuum suction cup assembly for adsorbing silicon wafers located at the telescopic end of the silicon wafer adsorption lifting cylinder.

[0007] In a preferred embodiment, the silicon wafer cassette carrier platform is of front-opening type as a whole, the bottom of the silicon wafer handling robot is provided with an AGV trolley, and the silicon wafer cassette carrier platform and the loading transfer platform are within the operating track of the silicon wafer handling robot.

[0008] In a preferred embodiment, the loading transfer platform includes a storage box with an upper platform, the upper end of the upper platform has four silicon wafer placement platforms, and the bottom of two silicon wafer placement platforms away from the silicon wafer handling robot are provided with jacking support rods, and one end of the storage box is equipped with a jacking cylinder connected to the jacking support rod.

[0009] In a preferred embodiment, the visual debris detection component includes a visual camera with a lens facing downward, an outer end ring of the visual camera is provided with an LED light source, and the visual positioning component includes a lifting cylinder installed on the mounting bracket, a tripod is installed at the telescopic end of the lifting cylinder and displacement sensors are provided at the three ends of the tripod.

[0010] In a preferred embodiment, it further comprises a cleaning machine, a cleaning machine loading robot is provided on one side of the cleaning machine, and the unloading transfer platform and the cleaning machine are within the running track of the cleaning machine loading robot.

[0011] In a preferred embodiment, the material transfer platform includes a platform body, the upper side of the platform body has a placement groove for placing silicon wafers, and both sides of the upper end of the platform body are provided with a plurality of pure water nozzles connected to the pure water system.

[0012] In a preferred embodiment, it also includes a spraying mechanism, which includes a servo motor, a rotary reducer is installed at the output end of the servo motor, a spray pipe is installed at the upper end of the rotary reducer, and a plurality of spray nozzles are arranged on the spray pipe. The silicon wafer grinder is located within the running track of the spraying mechanism.

[0013] In a preferred embodiment, it further comprises a quartz block placement box, wherein a plurality of placement slots for placing quartz blocks are provided at the upper end of the quartz block placement box, and the quartz block placement box is located within the running track of the loading and transporting assembly.

[0014] In a preferred embodiment, the robotic arm is a six-degree-of-freedom robotic arm.

[0015] In a preferred embodiment, a protective cover is further included, the silicon wafer grinder, the silicon wafer loading mechanism and the silicon wafer unloading mechanism are all located inside the protective cover, and the protective cover is provided with a door body.

[0016] In summary, due to the adoption of the above technical solution, the beneficial effects of the utility model are:

[0017] 1. In the present invention, various types of manipulators and transfer mechanisms are used to realize fully automated silicon wafer grinding and loading and unloading production, which saves manpower and greatly improves the production capacity of the grinder within a single working day, and has a major breakthrough in improving the overall production capacity of silicon wafer manufacturing factories that are not planned for automation.

[0018] 2. In the present invention, visual positioning and visual debris inspection systems are integrated in the loading and unloading handling components, which can automatically position and guide the loading and unloading of silicon wafers, and can also automatically determine whether the silicon wafers are broken after grinding before unloading, thereby ensuring the loading and unloading accuracy while also ensuring the detection of OK and NG products of the products ground;

[0019] 3. In the utility model, a spray cleaning mechanism for cleaning the silicon wafer grinder and a cleaning part for the material discharging and grabbing part are designed, which can realize automatic cleaning of the silicon wafer grinder and the material discharging and grabbing part, and can reduce the frequency of equipment maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0021] Figure 2 It is a schematic diagram of the overall top plan structure of the utility model;

[0022] Figure 3 It is a three-dimensional structural schematic diagram of the loading and transferring platform in the utility model;

[0023] Figure 4 It is a three-dimensional structural schematic diagram of the combination of the mounting bracket, the visual debris detection component, the visual positioning component and the vacuum suction cup component in the utility model;

[0024] Figure 5 It is a schematic diagram of the three-dimensional structure of the installation bracket in the utility model extending into the material transfer platform;

[0025] Figure 6 It is a three-dimensional structural schematic diagram of the spray washing mechanism in the utility model.

[0026] Markings in the figure: 1-silicon wafer cassette carrier, 2-protective cover, 3-silicon wafer grinder, 4-silicon wafer handling robot, 5-cleaning machine loading robot, 6-unloading handling assembly, 7-spray washing mechanism, 71-spray nozzle, 72-spray pipe, 73-rotational reducer, 74-servo motor, 8-loading handling assembly, 9-loading transfer platform, 91-storage box, 92-silicon wafer placement flat, 93-lifting support rod, 94-lifting cylinder, 95-upper platform, 10-quartz block placement box, 11-unloading transfer platform, 111-platform body, 112-placing slot, 113-pure water nozzle, 12-visual handling structure, 121-mounting bracket, 122-visual camera, 123-LED light source, 124-silicon wafer adsorption lifting cylinder, 125-vacuum suction cup assembly, 126-displacement sensor, 127-lifting cylinder. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0028] Reference Figure 1-6 , an automatic loading and unloading device for a silicon wafer grinder, comprising: a silicon wafer grinder 3; a silicon wafer loading mechanism, which includes a silicon wafer cassette carrier 1, a silicon wafer handling robot 4, a loading transfer platform 9 and a loading and handling component 8, the loading and handling component 8 is located on one side of the silicon wafer grinder 3; a silicon wafer unloading mechanism, which is located on one side of the silicon wafer grinder 3, the silicon wafer unloading mechanism includes an unloading and handling component 6 and an unloading transfer platform 11, the loading and handling component 8 and the unloading and handling component 6 both include a mechanical arm and a visual handling structure 12 located at the tail joint of the mechanical arm, the visual handling structure 12 includes an installation The bracket 121 and the visual debris detection components and the visual positioning components located on both sides of the mounting bracket 121, the bottom end of the mounting bracket 121 is circumferentially provided with four independent silicon wafer adsorption and lifting cylinders 124 and the vacuum suction cup assembly 125 for adsorbing silicon wafers located at the telescopic end of the silicon wafer adsorption and lifting cylinder 124. The utility model uses various types of manipulators and transfer mechanisms to realize fully automated silicon wafer grinding and loading and unloading production, which saves manpower and greatly improves the production capacity of the grinder within a single working day, and has a major breakthrough in improving the overall production capacity of silicon wafer manufacturing factories that have not planned automation.

[0029] Among them, the vacuum suction cup assembly 125 is a structure commonly used in some existing transfer equipment, and the details will not be elaborated.

[0030] Furthermore, the silicon wafer cassette carrier 1 is of front-opening type as a whole, and the bottom of the silicon wafer handling robot 4 is provided with an AGV trolley. The silicon wafer cassette carrier 1 and the loading transfer platform 9 are within the operating track of the silicon wafer handling robot 4. The silicon wafer handling robot 4 also includes a six-axis robotic arm and an electric gripper or fork finger located on the six-axis robotic arm.

[0031] The silicon wafer cassette carrier 1 and the silicon wafer handling robot 4 are both existing technologies that have been realized, and how to realize the handling and loading of silicon wafers will not be elaborated in detail here.

[0032] Furthermore, the loading transfer platform 9 includes a storage box 91 with an upper platform 95, the upper end of the upper platform 95 has four silicon wafer placing flats 92, and the bottom of the two silicon wafer placing flats 92 away from the silicon wafer handling robot 4 is provided with a lifting support rod 93. A lifting cylinder 94 connected to the lifting support rod 93 is installed at one end of the storage box 91. Because the grinder grinds 20 silicon wafers at a time, and the loading capacity of the upper silicon wafer cassette carrier 1 is 25 wafers, a storage box 91 for temporary storage of silicon wafers is manufactured under the material transfer platform 9.

[0033] Furthermore, the visual debris detection component includes a visual camera 122 with a lens facing downward, an LED light source 123 is provided on the outer end ring of the visual camera (industrial camera) 122, and the visual positioning component includes a lifting cylinder 127 installed on the mounting bracket 121, a tripod is installed at the telescopic end of the lifting cylinder 127, and displacement sensors 126 are provided at the three ends of the tripod. The loading and unloading handling components are integrated with visual positioning and visual debris inspection systems. The visual camera 122 can automatically determine whether the silicon wafer is fragmented after grinding before unloading, and the LED light source 123 can provide auxiliary fill light, thereby ensuring the quality of image acquisition and realizing automatic detection of OK and NG products after grinding. At the same time, the visual positioning component and the visual camera 122 can also automatically position and guide the loading and unloading of silicon wafers, thereby ensuring the loading and unloading accuracy.

[0034] The principle of detecting whether the silicon wafer is placed flat is that after the silicon wafer is placed in a predetermined position, the lifting cylinder 127 drives the displacement sensor 126 downward, and determines whether the silicon wafer is placed flat by detecting the displacement of three points.

[0035] Furthermore, it also includes a cleaning machine 4, and a cleaning machine loading robot 5 is provided on one side of the cleaning machine 4. The unloading transfer platform 11 and the cleaning machine 4 are within the running track of the cleaning machine loading robot 5. The cleaning machine loading robot 5 includes a six-degree-of-freedom robotic arm and a suction cup assembly located at the tail joint of the six-degree-of-freedom robotic arm, so that the silicon wafers in the unloading transfer platform 11 can be moved into the cleaning machine 4 for cleaning.

[0036] It should be mentioned here that the cleaning machine 4 and the silicon wafer grinding machine 3 are both currently realized technologies, and the specific structures will not be elaborated.

[0037] Furthermore, the material transfer platform 11 includes a platform body 111, and a placement groove 112 for placing silicon wafers is provided on the upper side of the platform body 111. A plurality of pure water nozzles 113 connected to the pure water system are provided on both sides of the upper end of the platform body 111. The pure water nozzles 113 are connected to an external pure water supply system (not shown in the figure). When the material handling component 6 moves the ground silicon wafers onto the placement groove 112, pure water is supplied to the pure water nozzles 113 through the pure water supply system. The material grabbing part is automatically cleaned by pure water, which can reduce the frequency of equipment maintenance.

[0038] Furthermore, it also includes a spraying mechanism 7, which includes a servo motor 74. A rotary reducer 73 is installed at the output end of the servo motor 74. A spray pipe 72 is installed at the upper end of the rotary reducer 73. A plurality of spray nozzles 71 are arranged on the spray pipe 72. The silicon wafer grinder 3 is located within the running track of the spraying mechanism 7. The spray pipe 72 is connected to an external water supply system (not shown in the figure). When the silicon wafer grinder 3 needs to be cleaned, the servo motor 74 drives the spray pipe 72 to rotate, and the spray pipe 72 is sent into the planetary gear position of the grinder. Then, cleaning water is sent into the spray pipe 72 through the water supply system, and then sprayed out through the spray nozzle 71 to clean the internal components of the silicon wafer grinder 3.

[0039] Furthermore, the robotic arm is a six-degree-of-freedom robotic arm. Due to the high degree of freedom of the six-degree-of-freedom robotic arm, it can drive the conveying part and the visual inspection and positioning part to move at multiple angles and directions, thereby realizing conveying and visual inspection operations at multiple positions.

[0040] The spray cleaning mechanism 7 can be designed into multiple groups according to actual conditions and arranged outside the silicon wafer grinder 3 .

[0041] Furthermore, it also includes a quartz block placement box 10, and a plurality of placement slots for placing quartz blocks are opened at the upper end of the quartz block placement box 10. The quartz block placement box 10 is located within the running track of the loading and conveying component 8, and the quartz blocks can also be automatically loaded through the loading and conveying component 8.

[0042] Furthermore, it also includes a protective cover 2, a silicon wafer grinder 3, a silicon wafer loading mechanism and a silicon wafer unloading mechanism are all located on the inner side of the protective cover 2, and the protective cover 2 is provided with a door body. The automatic loading and unloading parts and the grinder body can be isolated from the outside through the protective cover 2 to ensure the safety of operation. When adding materials or maintenance is required, it can be entered through the door body for operation.

[0043] It should be noted that the electrically driven components mentioned above are all controlled by an external PLC terminal, and a program is designed through the PLC terminal to control the automatic operation of the entire equipment. The above-mentioned electrical connection method is a commonly used connection method in the current existing technology, and the specific structure and circuit will not be elaborated.

[0044] In summary, the use of various types of manipulators and transfer mechanisms can realize fully automated silicon wafer grinding and loading and unloading production, which saves manpower and greatly improves the production capacity of the grinder within a single working day. At the same time, the loading and unloading handling components are integrated with visual positioning and visual debris inspection systems, which can automatically position and guide the loading and unloading of silicon wafers, and can also automatically determine whether the silicon wafers are fragmented after grinding before unloading, thereby ensuring the loading and unloading accuracy while also ensuring the detection of OK and NG products of the products. This is a major breakthrough in improving the overall production capacity of silicon wafer manufacturing plants that have not planned automation.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An automatic loading and unloading device for a silicon wafer grinder, characterized in that: include: Silicon wafer grinding machine; A silicon wafer loading mechanism, which includes a silicon wafer cassette carrier, a silicon wafer handling robot, a loading transfer platform and a loading and handling assembly, wherein the loading and handling assembly is located on one side of the silicon wafer grinder; A silicon wafer unloading mechanism, which is located on one side of the silicon wafer grinder, and includes an unloading and handling assembly and an unloading transfer platform; The loading and unloading handling components both include a robotic arm and a visual handling structure located at the tail joint of the robotic arm, the visual handling structure includes a mounting bracket and a visual debris detection component and a visual positioning component located on both sides of the mounting bracket, the bottom end of the mounting bracket is circumferentially provided with four independent silicon wafer adsorption and lifting cylinders and a vacuum suction cup assembly for adsorbing silicon wafers located at the telescopic end of the silicon wafer adsorption and lifting cylinder.

2. The automatic loading and unloading device for a silicon wafer grinding machine according to claim 1, characterized in that: The silicon wafer cassette carrying platform is of front-opening type as a whole, an AGV trolley is provided at the bottom of the silicon wafer handling robot, and the silicon wafer cassette carrying platform and the loading transfer platform are within the running track of the silicon wafer handling robot.

3. The automatic loading and unloading device for a silicon wafer grinding machine according to claim 1, characterized in that: The loading transfer platform includes a storage box with an upper platform, the upper end of the upper platform has four silicon wafer placement platforms, and the bottom of two silicon wafer placement platforms away from the silicon wafer handling robot are provided with jacking support rods, and one end of the storage box is equipped with a jacking cylinder connected to the jacking support rods.

4. The automatic loading and unloading device for a silicon wafer grinding machine according to claim 1, characterized in that: The visual debris detection component includes a visual camera with a lens facing downward, and an outer end ring of the visual camera is provided with an LED light source. The visual positioning component includes a lifting cylinder installed on the mounting bracket, and a tripod is installed at the telescopic end of the lifting cylinder and displacement sensors are provided at the three ends of the tripod.

5. The automatic loading and unloading device for a silicon wafer grinding machine according to claim 1, characterized in that: It also includes a cleaning machine, a cleaning machine loading robot is provided on one side of the cleaning machine, and the unloading transfer platform and the cleaning machine are within the running track of the cleaning machine loading robot.

6. The automatic loading and unloading device for a silicon wafer grinding machine according to claim 1, characterized in that: The material transfer platform comprises a platform body, the upper side of which is provided with a placement groove for placing silicon wafers, and both sides of the upper end of the platform body are provided with a plurality of pure water nozzles connected with a pure water system.

7. The automatic loading and unloading device for a silicon wafer grinding machine according to claim 1, characterized in that: It also includes a spray cleaning mechanism, which includes a servo motor. A rotary reducer is installed at the output end of the servo motor. A spray pipe is installed at the upper end of the rotary reducer. A plurality of spray nozzles are arranged on the spray pipe. The silicon wafer grinder is located within the running track of the spray cleaning mechanism.

8. The automatic loading and unloading device for a silicon wafer grinding machine according to claim 1, characterized in that: It also includes a quartz block placement box, the upper end of which is provided with a plurality of placement slots for placing quartz blocks, and the quartz block placement box is located within the running track of the loading and transporting assembly.

9. The automatic loading and unloading device for a silicon wafer grinding machine according to claim 1, characterized in that: The robotic arm is a six-degree-of-freedom robotic arm.

10. The automatic loading and unloading device for a silicon wafer grinding machine according to claim 1, characterized in that: It also includes a protective cover, the silicon wafer grinder, the silicon wafer loading mechanism and the silicon wafer unloading mechanism are all located inside the protective cover, and the protective cover is provided with a door body.

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