Injection molding system

Abstract

The utility model discloses an injection molding system. The injection molding system comprises a first carrier, a first ejector, a second carrier, a second ejector and a bridging mechanism. The first carrier is configured to hold a first mold. The first ejector is disposed above the first carrier and configured to eject a first polymeric material. The second carrier is configured to hold a second mold. The second ejector is disposed above the second carrier and configured to eject a second polymeric material. The bridging mechanism is arranged between the first carrier and the second carrier and can move relative to the first carrier and the second carrier. The bridging mechanism is configured to receive a third mold from the first carrier or the second carrier and transport the third mold between the first carrier and the second carrier.

Description

Technical Field

[0001] The present invention relates to an injection molding system, and more particularly, to an injection molding system for forming an object including more than one part having different physical or functional properties. Background Art

[0002] Foamed polymer materials have many advantages, such as high strength, low weight, impact resistance, heat insulation, etc. Foamed objects can be manufactured by injection molding or extrusion molding. For example, after the polymer material is melted and mixed with a foaming agent to form a mixture, force or pressure is applied to the mixture to inject or extrude the mixture into a cavity of a mold, and the mixture is foamed and cooled in the cavity to form the foamed object.

[0003] However, it is necessary to improve the properties of foamed articles made by injection molding systems, such as making different parts of the foamed articles have different properties. Therefore, it is necessary to improve the structure of injection molding systems and methods for making foamed articles.

[0004] new content

[0005] An object of the present invention is to provide an injection molding system.

[0006] According to a specific embodiment of the present invention, an injection molding system is provided. The injection molding system includes: a first carrier configured to hold a first mold; a first ejector disposed above the first carrier and configured to eject a first polymer material; a second carrier configured to hold a second mold; a second ejector disposed above the second carrier and configured to eject a second polymer material; and a bridge mechanism disposed between the first carrier and the second carrier and movable relative to the first carrier and the second carrier. The bridge mechanism is configured to receive a lower mold from the first carrier or the second carrier and to transport the lower mold between the first carrier and the second carrier.

[0007] Simple diagram description

[0008] The present invention will be better understood from the following embodiments in conjunction with the reference figures. It should be noted that, in accordance with standard practice in the industry, the various features are not drawn to scale. In fact, the sizes of the various features may be arbitrarily enlarged or reduced for clarity.

[0009] Figure 1A Schematic perspective view of an injection molding system according to some specific embodiments of the present invention.

[0010] Figure 1B Schematic top view of an injection molding system according to some specific embodiments of the present invention.

[0011] Figure 2 Schematic cross-sectional view of the first molding station in a closed configuration according to some specific embodiments of the present invention.

[0012] Figure 3 Schematic cross-sectional view of the second molding station in a closed configuration according to some specific embodiments of the present invention.

[0013] Figure 4 The figure is a flow chart showing an injection molding method according to some specific embodiments of the present invention.

[0014] Figures 5 to 31 The schematic diagram is a diagram illustrating exemplary operations in an injection molding method according to a specific embodiment of the present invention. Implementation

[0015] [Cross reference to related applications]

[0016] This application claims priority to U.S. Provisional Patent Application No. 63 / 491,529 filed on March 21, 2023, and U.S. Patent Application No. 18 / 542,758 filed on December 17, 2023, the entire contents of both applications are incorporated herein by reference.

[0017] The following disclosure provides many different embodiments or examples for implementing different features of the provided patent subject matter. The specific examples of components and configurations described below are used to simplify the present invention. Of course, these are only examples and are not restrictive. For example, in the following description, a first feature formed above or on a second feature may include a specific embodiment in which the first and second features are in direct contact, and may also include a specific embodiment in which additional features are formed between the first and second features, so that the first and second features may not be in direct contact. In addition, the present invention may repeat reference numerals and / or symbols in various examples. This repetition is for simplicity and clarity, and does not itself require a relationship between the various embodiments and / or configurations discussed.

[0018] Additionally, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," and "upper" may be used herein to describe the relationship of one element or feature to another element or features in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted similarly accordingly.

[0019] Although it has been clarified that the numerical ranges and parameters of the wide range of this creation are approximate values, the numerical values ​​proposed in the specific examples are described as accurately as possible. However, any numerical value inherently has certain errors, which must be caused by the standard deviation found in the corresponding test measurements. In addition, as used herein, the term "about" generally refers to within 10%, 5%, 1% or 0.5% of a particular value or range. Alternatively, the term "about" refers to within an acceptable standard error of the mean value when considered by those skilled in the art. Except in the operation / working examples, or unless otherwise expressly provided, all numerical ranges, quantities, values ​​and percentages, such as those disclosed herein, material quantities, durations, temperatures, operating conditions, quantity ratios, etc., should be understood to be modified by the term "about" in all cases. Therefore, unless otherwise stated, the numerical parameters proposed in this creation and claims are approximate values ​​that can be changed as needed. At least, each numerical parameter should be interpreted according to the number of significant digits described and by applying ordinary rounding techniques. The range can be expressed in this article as from one end point to another or between two end points. Unless otherwise stated, all ranges disclosed herein include endpoints.

[0020] Figure 1A is a schematic perspective view of an injection molding system 100 according to some specific embodiments of the present invention, and Figure 1B for Figure 1A FIG. 1 is a schematic top view of an injection molding system 100 . The injection molding system 100 includes a first carrier 101 and a second carrier 102 disposed adjacent to the first carrier 101 .

[0021] In some embodiments, the first carrier 101 may rotate about a first center C1 and in a first direction R1, and the second carrier 102 may rotate about a second center C2 and in a second direction R2. In some embodiments, the first carrier 101 and the second carrier 102 are ring-shaped. In some embodiments, the first carrier 101 and the second carrier 102 are turntables. In some embodiments, the first carrier 101 may rotate in the same direction as the second carrier 102. For example, both the first carrier 101 and the second carrier 102 may rotate in a counterclockwise direction. In some embodiments, the first carrier 101 may rotate in a direction opposite to the second carrier 102. For example, the first carrier 101 may rotate in a counterclockwise direction, while the second carrier 102 may rotate in a clockwise direction, and vice versa. In some embodiments, the first carrier 101 and the second carrier 102 are automatically operated and controlled. In some specific embodiments, the first carrier 101 and the second carrier 102 may communicate with each other via any appropriate communication protocol, such as a programmable logic control (PLC) protocol.

[0022] In some specific embodiments, a plurality of molding stations 200 are disposed on the first carrier 101 and the second carrier 102. Each molding station 200 includes a lower mold 201 and an upper mold 202 disposed above the lower mold 201. In the specific embodiment of the injection molding system 100, the molding station 200 disposed on the first carrier 101 is referred to as a first molding station 200a, and the molding station 200 disposed on the second carrier 102 is referred to as a second molding station 200b.

[0023] Figure 2 FIG. 2 is a schematic cross-sectional view of a first molding station 200a in a closed configuration according to some specific embodiments of the present invention. Figure 2 In the embodiment, the first molding station 200a includes a lower mold 201 and a first upper mold 202a. In some embodiments, the first upper mold 202a corresponds to the lower mold 201 in certain configurations (such as size, shape, etc.). The first upper mold 202a can be placed on and engaged with the lower mold 201. In some embodiments, when the first molding station 200a is in a closed configuration, the first mold cavity 203a is defined by the first upper mold 202a and the lower mold 201. Although Figure 2 Only one first mold cavity 203a is illustrated in the closed configuration, but it will be appreciated that any suitable number of first mold cavities 203a may be arranged in the closed configuration.

[0024] In some specific embodiments, the first gate 204a is disposed at the first upper mold 202a. The first gate 204a is configured to extend through the first upper mold 202a and can communicate with the first mold cavity 203a when the first molding station 200a is in a closed configuration. For simplicity and clarity, only one first gate 204a is illustrated, but it can be understood that any suitable number of first gates 204a can be configured at the first upper mold 202a.

[0025] In some specific embodiments, a removable plate (not shown) may be placed between the first upper mold 202a and the lower mold 201 to adjust the volume of the first mold cavity 203a. For example, if the removable plate is inserted into the first mold cavity 203a and disposed between the first upper mold 202a and the lower mold 201, the first mold cavity 203a will be reduced. Therefore, when the first molding station 200a is closed, the volume of the first mold cavity 203a can be adjusted by inserting the removable plate between the first upper mold 202a and the lower mold 201.

[0026] Figure 3 FIG. 2 is a schematic cross-sectional view of the second molding station 200b in a closed configuration according to some specific embodiments of the present invention. Figure 3, the second molding station 200b includes a lower mold 201 and a second upper mold 202b. In some embodiments, the second upper mold 202b corresponds to the lower mold 201 in certain configurations (such as size, shape, etc.). The second upper mold 202b can be placed on and engaged with the lower mold 201. In some embodiments, when the second molding station 200b is in a closed configuration, the second mold cavity 203b is defined by the second upper mold 202b and the lower mold 201.

[0027] In some embodiments, the second gate 204b is disposed at the second upper mold 202b. The second gate 204b is configured to extend through the second upper mold 202b and can communicate with the second mold cavity 203b when the second molding station 200b is in a closed configuration. In some embodiments, a removable plate (not shown) can be placed between the second upper mold 202b and the lower mold 201 to adjust the volume of the second mold cavity 203b.

[0028] In some embodiments, each of the first carrier 101 and the second carrier 102 includes a plurality of holders (not shown) for holding the first upper mold 202a or the second upper mold 202b. Figure 2 The first upper mold 202a and Figure 3 The second upper mold 202b has a different configuration. In some specific embodiments, Figure 2 The lower mold 201 of the first molding station 200a and Figure 3 The lower mold 201 of the second molding station 200b has the same configuration.

[0029] Please also refer to Figure 1A and Figure 1B , the injection molding system 100 further includes a first injector 104 adjacent to the first carrier 101 and a second injector 105 adjacent to the second carrier 102. The first injector 104 is disposed above one of the first molding stations 200a and is configured to discharge a first polymer material M1 into a first mold cavity 203a defined by a corresponding lower mold 201 and a corresponding first upper mold 202a of one of the first molding stations 200a. Similarly, the second injector 105 is disposed above one of the second molding stations 200b and is configured to discharge a second polymer material M2 into a second mold cavity 203b defined by a corresponding lower mold 201 and a corresponding second upper mold 202b of one of the second molding stations 200b. In some embodiments, the first polymeric material M1 may flow from the first ejector 104 into the first mold cavity 203a through the first gate 204a, and the second polymeric material M2 may flow from the second ejector 105 into the second mold cavity 203b through the second gate 204b.

[0030] In some embodiments, the first ejector 104 is coupled to a first mixing unit (not shown) configured to mix the polymeric material with a blowing agent to produce a first polymeric material and deliver the first polymeric material to the first ejector 104. In some embodiments, similarly, the second ejector 105 is coupled to a second mixing unit (not shown) configured to mix the polymeric material with a blowing agent to produce a second polymeric material and deliver the second polymeric material to the second ejector 105.

[0031] In some embodiments, the first ejector 104 is disposed above the first carrier 101. In some embodiments, when the first carrier 101 rotates, the holders (not shown) pass under the first ejector 104 one by one. In some embodiments, the first ejector 104 is fixedly mounted above the first carrier 101. The first carrier 101 is movable relative to the first ejector 104, and the first ejector 104 is fixed relative to the first carrier 101.

[0032] In some embodiments, the second ejector 105 is disposed above the second carrier 102. In some embodiments, when the second carrier 102 rotates, the holders (not shown) pass under the second ejector 102 one by one. In some embodiments, the second ejector 105 is fixedly mounted above the second carrier 102. The second carrier 102 is movable relative to the second ejector 105, and the second ejector 105 is fixed relative to the second carrier 102.

[0033] In some embodiments, the first polymer material M1 and the second polymer material M2 have the same or different physical properties (such as density, hardness, Young's modulus, etc.). In some embodiments, the first polymer material M1 and the second polymer material M2 include thermoplastic polyurethane (TPU), polyurethane (PU), plastic or any other suitable material. In some embodiments, the first polymer material and the second polymer material are foamed materials.

[0034] The injection molding system 100 further includes a bridge mechanism 103 disposed between the first carrier 101 and the second carrier 102. The bridge mechanism 103 can rotate or move relative to the first carrier 101 and the second carrier 102. The bridge mechanism 103 is configured to connect the first carrier 101 and the second carrier 102 to sequentially transfer the lower mold 201 from the first carrier 101 to the second carrier 102, or vice versa.

[0035] In some embodiments, the bridge mechanism 103 is annular. In some embodiments, the bridge mechanism 103 can rotate around the third center C3 and along the third direction R3. In some embodiments, the bridge mechanism 103 can rotate clockwise or counterclockwise. In some embodiments, the bridge mechanism 103 can be removed and disassembled from the injection molding system 100. The operation of the bridge mechanism 103 is not affected by the first carrier 101 and the second carrier 102. In some embodiments, the first center C1 of the first carrier 101, the third center C3 of the bridge mechanism 103, and the second center C2 of the second carrier 102 are arranged on a straight line. In other words, the first carrier 101 and the second carrier 102 are arranged on two opposite sides of the bridge mechanism 103.

[0036] In a specific embodiment of the injection molding system 100, the bridge mechanism 103 includes two conveying units 103a and 103b. The conveying units 103a and 103b are arranged on opposite sides of the bridge mechanism 103. Each of the conveying units 103a and 103b is configured to convey the lower mold 201 from the first carrier 101 to the bridge mechanism 103 or vice versa, or from the second carrier 102 to the bridge mechanism 103 or vice versa. In some specific embodiments, each of the conveying units 103a and 103b is a track, a belt or any other conveying device. In some specific embodiments, the bridge mechanism 103 may include a single or more than two conveying units.

[0037] The bridge mechanism 103 further includes two receiving spaces 103c and 103d. The receiving spaces 103c and 103d are arranged on opposite sides of the bridge mechanism 103. Each of the receiving spaces 103c and 103d is configured to receive and temporarily hold the lower mold 201 to be transported. In some specific embodiments, during the rotation of the bridge mechanism 103, the lower mold 201 can be held in one of the receiving spaces 103c and 103d. In some specific embodiments, during the rotation of the bridge mechanism 103, the two lower molds 201 can be held in the receiving spaces 103c and 103d, respectively. In some specific embodiments, the receiving space 103c and the conveying unit 103a are positioned close to each other, or are set to be placed together or adjacent to each other, and the receiving space 103d and the conveying unit 103b are positioned close to each other.

[0038] In some embodiments, the injection molding system 100 further includes an additional processing unit (not shown) disposed adjacent to the bridge mechanism 103. In some embodiments, the additional processing unit is configured to process or process the lower mold 201 while the lower mold 201 is held in the receiving space 103c or 103d. In some embodiments, the additional processing unit is configured to perform various processes, such as inserting a color block into the lower mold 201, trimming a flow channel or other excess portion from the intermediate product in the lower mold 201, heating or preheating the lower mold 201 and / or the intermediate product in the lower mold 201, cleaning the lower mold 201, etc. In some embodiments, the additional processing unit includes an ejector, a cutter, a heater, a cleaner, etc.

[0039] Figure 4 The flowchart of the injection molding method 300 according to some specific embodiments of the present invention is shown. The injection molding method 300 includes a plurality of operations S302 to S316, and the description and explanation are not considered to be limiting on the order of the operations. Figures 5 to 31 3 is a schematic top view or cross-sectional view of various stages of the injection molding method 300. In some embodiments, the operations of the injection molding method 300 can be repeated and performed automatically.

[0040] To illustrate the concepts of the present invention and the injection molding method 300, various embodiments are provided below. However, the present invention is not intended to be limited to a particular embodiment. In addition, the elements, conditions, or parameters illustrated in different embodiments may be combined or modified to form different combinations of embodiments, as long as the elements, parameters, or conditions used do not conflict. For ease of description, reference numerals having similar or identical functions and characteristics are repeated in different embodiments and drawings.

[0041] First, in operation S302 of the injection molding method 300, an injection molding system 100 is provided or received, such as Figure 5 shown. Figure 5 The injection molding system 100 has Figure 1A and Figure 1B The same configuration as the injection molding system shown. For simplicity, Figure 5 Only two lower molds 201 on the first carrier 101 and two lower molds 201 on the second carrier 102 are shown. However, it should be understood that each of the lower molds 201 on the first carrier 101 is located below a corresponding one of the first upper molds 202a, and each of the lower molds 201 on the second carrier 102 is located below a corresponding one of the second upper molds 202b. Furthermore, the number of lower molds 201 on the first carrier 101 and the second carrier 102 is not intended to be limited.

[0042] In some embodiments, the first ejector 104 is disposed above one of the first molding stations 200a, and the second ejector 105 is disposed above one of the second molding stations 200b. In some embodiments, all first upper molds 202a are fixedly attached to the first carrier 101, and all second upper molds 202b are fixedly attached to the second carrier 102.

[0043] like Figure 5 As shown, the lower mold 201 on the first carrier 101 is called a first lower mold 201-1 and a second lower mold 201-2, and the lower mold 201 on the second carrier 102 is called a third lower mold 201-3 and a fourth lower mold 201-4. The first ejector 104 is disposed above the second lower mold 201-2 and a corresponding one of the first upper molds 202a, and the second ejector 105 is disposed above the fourth lower mold 201-4 and a corresponding one of the second upper molds 202b.

[0044] Please refer again Figure 4 In operation S304 of the injection molding method 300, the lower mold (eg, Figure 5 The lower mold 201-2) is engaged with a corresponding one of the first upper molds 202a to form a first mold cavity 203a.

[0045] Next, in operation S306 of the injection molding method 300, the first polymer material M1 is injected into the first mold cavity by the first injector 104. Figure 6 As shown, the first polymer material M1 from the first ejector 104 is injected into the first mold cavity 203a through the first gate 204a, and the first mold cavity 203a is formed by the lower mold 201-2 below the first ejector 104 and the corresponding first upper mold 202a. In some embodiments, the first polymer material M1 includes thermoplastic polyurethane (TPU), polyurethane (PU), plastic, or any other suitable material. In some embodiments, the first polymer material M1 includes a physical foaming agent, such as a supercritical fluid. In some embodiments, the physical foaming agent is gaseous nitrogen, carbon dioxide, etc. In some embodiments, the first polymer material M1 is foamable, non-foamable, or slightly foamable.

[0046] After the first polymer material M1 is injected, the first carrier 101 and the second carrier 102 rotate along the first direction R1 and the second direction R2 respectively. Figure 7The first carrier 101 and the second carrier 102 are shown rotated. In some embodiments, the first carrier 101 and the second carrier 102 rotate at a predetermined interval. In some embodiments, the first carrier 101 and the second carrier 102 rotate independently or synchronously. In some embodiments, the first carrier 101 and the second carrier 102 rotate at different speeds or the same speed. In some embodiments, the first direction R1 and the second direction R2 may be the same or different from each other. Figure 7 As shown, after the rotation, the first lower mold 201-1 and a corresponding one of the first upper molds 202a are disposed adjacent to the first receiving space 103c of the bridge mechanism 103, and the third lower mold 201-3 and a corresponding one of the second upper molds 202b are disposed adjacent to the second receiving space 103d of the bridge mechanism 103. In some specific embodiments, the first lower mold 201-1 is aligned with the first receiving space 103c, and the third lower mold 201-3 is aligned with the second receiving space 103d.

[0047] After the first carrier 101 rotates, the first lower mold 201-1 is separated from the corresponding one of the first upper molds 202a. Figure 8 As shown. Figure 8 In the open configuration, no first polymer material M1 is injected into the first mold cavity 203a of the lower mold 201-1. Similarly, after the rotation of the second carrier 102, the third lower mold 201-3 is separated from the corresponding one of the second upper molds 202b, as shown in FIG. Fig. 9 That is, the first lower mold 201 - 1 can move relative to the first carrier 101 , and the third lower mold 201 - 3 can move relative to the second carrier 102 .

[0048] After the first lower mold 201-1 and the third lower mold 201-3 are separated, the first lower mold 201-1 is moved from the first carrier 101 to the first receiving space 103c of the bridge mechanism 103 by the first conveying unit 103a, and the third lower mold 201-3 is moved from the second carrier 102 to the second receiving space 103d of the bridge mechanism 103 by the second conveying unit 103b. Fig.10 shown.

[0049] After the first lower mold 201-1 and the third lower mold 201-3 move to the bridge mechanism 103, the bridge mechanism 103 rotates along the third direction R3 to transport the first lower mold 201-1 and the third lower mold 201-3. In some embodiments, the first carrier 101 and the second carrier 102 stop rotating during the rotation of the bridge mechanism 103. In some embodiments, as Fig.11As shown, the bridge mechanism 103 rotates a predetermined angle so that the first lower mold 201-1 is away from the first carrier 101, and the third lower mold 201-3 is away from the second carrier 102. After rotating the predetermined angle, the first lower mold 201-1 and the third lower mold 201-3 are processed by one or more additional processing units (not shown) configured at or above the bridge mechanism 103.

[0050] In some specific embodiments, the bridge mechanism 103 then continues to rotate so that the first lower mold 201-1 is disposed adjacent to the second carrier 102, and the third lower mold 201-3 is disposed adjacent to the first carrier 101, such as Fig.12 In some specific embodiments, the bridging mechanism 103 is directly Fig.10 Rotate the position shown to Fig.12 shown in the position instead of Fig.11 Stop at the position shown. Fig.12 As shown, after the rotation of the bridge mechanism 103 , the first lower mold 201 - 1 is disposed adjacent to the second carrier 102 , and the third lower mold 201 - 3 is disposed adjacent to the first carrier 101 .

[0051] Next, the first lower mold 201-1 is moved from the bridge mechanism 103 to the second carrier 102, and the third lower mold 201-3 is moved from the bridge mechanism 103 to the first carrier 101, as shown in FIG. Fig.13 In some specific embodiments, the first lower mold 201-1 is moved by the first conveying unit 103a to leave the first receiving space 103c and enter the second carrier 102, and the third lower mold 201-3 is moved by the second conveying unit 103b to leave the second receiving space 103d and enter the first carrier 101. Therefore, the first lower mold 201-1 is conveyed from the first carrier 101 to the second carrier 102, and the third lower mold 201-3 is conveyed from the second carrier 102 to the first carrier 101. In other words, the bridging mechanism 103 is capable of exchanging the first lower mold 201-1 and the third lower mold 201-3 between the first carrier 101 and the second carrier 102.

[0052] After the first lower mold 201-1 is moved to the second carrier 102 and the third lower mold 201-3 is moved to the first carrier 101, a corresponding one of the first upper molds 202a is tightly engaged with the third lower mold 201-3 on the first carrier 101, as shown in FIG. Fig.14 As shown, a corresponding one of the second upper molds 202b is tightly engaged with the first lower mold 201-1 on the second carrier 102, as shown in FIG. Fig.15 shown.

[0053] Then, the first carrier 101 and the second carrier 102 rotate along the first direction R1 and the second direction R2 respectively. Fig.16 In some embodiments, the first carrier 101 and the second carrier 102 rotate at a predetermined interval. After the rotation, the first lower mold 201-1 and the corresponding one of the second upper molds 202b are configured to be away from the bridge mechanism 103, and the third lower mold 201-3 and the corresponding one of the first upper molds 202a are also configured to be away from the bridge mechanism 103.

[0054] In some specific embodiments, after rotation, the second lower mold 201-2 and the corresponding one of the first upper molds 202a are disposed adjacent to the second receiving space 103d, and the fourth lower mold 201-4 and the corresponding one of the second upper molds 202b are disposed adjacent to the first receiving space 103c. In some specific embodiments, the second lower mold 201-2 is aligned with the second receiving space 103d, and the fourth lower mold 201-4 is aligned with the first receiving space 103c.

[0055] After the first carrier 101 rotates, the second lower mold 201-2 is separated from the corresponding one of the first upper molds 202a. Fig.17 Similarly, after the second carrier 102 rotates, the fourth lower mold 201-4 is separated from the corresponding one of the second upper molds 202b, as shown in FIG. Fig.18 That is, the second lower mold 201 - 2 can move relative to the first carrier 101 , and the fourth lower mold 201 - 4 can move relative to the second carrier 102 .

[0056] As mentioned above and Figure 6 As shown, the first polymer material M1 has been injected into the first mold cavity 203a through the first injector 104 (at Figure 4 ), and thus the first polymer material M1 is disposed in Fig.17 The second lower mold 201-2 has been detached.

[0057] Please refer again Figure 4 In operation S308 of the injection molding method 300, the lower mold 201 carrying the first polymer material M1 moves to the bridge mechanism 103. Then, in operation S310, the bridge mechanism 103 rotates to transfer the lower mold 201 carrying the first polymer material M1 to the second carrier 102. Then, in operation S312, the transferred lower mold 201 is engaged with one of the second upper molds 202b to form a second mold cavity 203b.

[0058] For example, Fig.19As shown, the second lower mold 201-2 carrying the first polymer material M1 is moved from the first carrier 101 to the second receiving space 103d by the second conveying unit 103b, and the fourth lower mold 201-4 is moved from the second carrier 102 to the first receiving space 103c by the first conveying unit 103a. Then, the bridge mechanism 103 rotates along the third direction R3 to convey the second lower mold 201-2 and the fourth lower mold 201-4, as shown in FIG. Fig. 20 In some embodiments, the first carrier 101 and the second carrier 102 are suspended from rotating during the rotation of the bridge mechanism 103. In some embodiments, the bridge mechanism 103 rotates so that the second lower mold 201-2 is disposed adjacent to the second carrier 102 and the fourth lower mold 201-4 is disposed adjacent to the first carrier 101. In some embodiments, the rotation of the bridge mechanism 103 is similar to that described above and Fig.12 Steps shown.

[0059] In some specific embodiments, the bridging mechanism 103 is similar to Fig.11 The second lower mold 201-2 is rotated by a predetermined angle in the manner shown, so that the second lower mold 201-2 is away from the first carrier 101, and the fourth lower mold 201-4 is away from the second carrier 102. After rotating by the predetermined angle, the second lower mold 201-2 and the fourth lower mold 201-4 are processed by one or more additional processing units (not shown) configured at or above the bridge mechanism 103.

[0060] After the bridge mechanism 103 rotates, the second lower mold 201-2 is moved from the bridge mechanism 103 into the second carrier 102, and the fourth lower mold 201-4 is moved from the bridge mechanism 103 into the first carrier 101. In some specific embodiments, the fourth lower mold 201-4 is moved by the first conveying unit 103a to leave the first receiving space 103c and enter the first carrier 101, and the second lower mold 201-2 is moved by the second conveying unit 103b to leave the second receiving space 103d and enter the second carrier 102. Therefore, the second lower mold 201-2 is conveyed from the first carrier 101 to the second carrier 102, and the fourth lower mold 201-4 is conveyed from the second carrier 102 to the first carrier 101. Therefore, the second lower mold 201-2 carrying the first polymer material M1 is moved from the first carrier 101 to the second carrier 102 through the bridge mechanism 103.

[0061] After the fourth lower mold 201-4 is moved to the first carrier 101, a corresponding one of the first upper molds 202a is tightly engaged with the fourth lower mold 201-4 on the first carrier 101, as shown in FIG. Fig. 22Similarly, after the second lower mold 201-2 is moved to the second carrier 102, a corresponding one of the second upper molds 202b is tightly engaged with the second lower mold 201-2 on the second carrier 102, as shown in FIG. Fig.23 The closed configuration is shown in FIG.

[0062] Next, the first carrier 101 and the second carrier 102 rotate along the first direction R1 and the second direction R2, respectively. In some specific embodiments, the first carrier 101 and the second carrier 102 rotate at a predetermined interval. After the rotation, the second lower mold 201-2 and the corresponding one of the second upper molds 202b are configured to be away from the bridge mechanism 103, and the fourth lower mold 201-4 and the corresponding one of the first upper molds 202a are also configured to be away from the bridge mechanism 103.

[0063] In some specific embodiments, the first carrier 101 is configured to continue to rotate along the first direction R1, so that the fourth lower mold 201-4 and the corresponding one of the first upper molds 202a are disposed below the first ejector 104. Fig.25 Similarly, the second carrier 102 is configured to continue rotating along the second direction R2 so that the second lower mold 201 - 2 and a corresponding one of the second upper molds 202 b are disposed below the second ejector 105 .

[0064] Please refer again Figure 4 In operation S314 of the injection molding method 300, after the lower mold 201 carrying the first polymer material M1 rotates below the second ejector 105, the second polymer material M2 is ejected into the second mold cavity 203b by the second ejector 105. Therefore, in operation S316, a product including the first polymer material M1 and the second polymer material M2 is obtained.

[0065] For example, after the second lower mold 201-2 and the corresponding one of the second upper molds 202b are rotated below the second ejector 105 by the second carrier 102, the second polymer material M2 is injected from the second ejector 105 into the second molding station 200b located below the second ejector 105, as shown in FIG. Fig.26As shown. The second polymer material M2 is injected into the second mold cavity 203b through the second gate 204b. As mentioned above, when the second molding station 200b is in a closed configuration, the second mold cavity 203b is defined by the second upper mold 202b and the corresponding lower mold 201. In some specific embodiments, the second polymer material M2 includes thermoplastic polyurethane (TPU), polyurethane (PU), plastic or any other suitable material. In some specific embodiments, the second polymer material M2 includes a physical foaming agent, such as a supercritical fluid. In some specific embodiments, the physical foaming agent is gaseous nitrogen, carbon dioxide, etc. In some specific embodiments, the second polymer material M2 is foamable, non-foamable or slightly foamable.

[0066] The first polymeric material M1 is different from the second polymeric material M2. In some embodiments, the first polymeric material M1 and the second polymeric material M2 have different materials, different physical properties, etc. In some embodiments, the first polymeric material M1 and the second polymeric material M2 have different densities, hardnesses, etc.

[0067] After the second polymer material M2 is injected into the first mold cavity 203, the second carrier 203 rotates along the second direction R2, so that the second lower mold 201-2 and the corresponding one of the second upper molds 202b move away from the second ejector 105. After the second lower mold 201-2 and the corresponding one of the second upper molds 202b are moved away from the second ejector 105, the corresponding one of the second upper molds 202b is separated from the second lower mold 201-2, so that the article M including the first polymer material M1 and the second polymer material M2 can be taken out from the second lower mold 201-2. In some specific embodiments, the article M is a part of footwear (such as an outer sole, an inner sole, a midsole, etc.) or any other product.

[0068] After the product M is taken out from the second lower mold 201-2, the first carrier 101 and the second carrier 102 continue to rotate as described above. After the rotation, the first lower mold 201-1 and the third lower mold 201-3 have been exchanged by the bridge mechanism 103, as shown in FIG. Fig.28 The first lower mold 201-1 is an empty mold from which the product M has been taken out, and the third lower mold 201-3 is a lower mold that carries the first polymer material M1 ejected by the first ejector 104. Furthermore, in order to convey the second lower mold 201-2 and the fourth lower mold 201-4 through the bridge mechanism 103, the second lower mold 201-2 and a corresponding one of the second upper molds 202b are arranged adjacent to the first receiving space 103c of the bridge mechanism 103, and the fourth lower mold 201-4 and a corresponding one of the first upper molds 202a are arranged adjacent to the second receiving space 103d of the bridge mechanism 103.

[0069] In some specific embodiments, the bridging mechanism 103 (eg Fig.29 The first carrier 101 and the second carrier 102 can be idle, stopped, unused, or even disconnected or removed from the injection molding system 100, and the first carrier 101 and the second carrier 102 can be operated independently and independently perform the related steps of the injection molding method as described above. The rotation of the first carrier 101 is independent of the rotation of the second carrier 102.

[0070] In some specific embodiments, when the bridge mechanism 103 is not in use or is removed, the first upper mold 202a and the lower mold 201 on the first carrier 101 are moved by the rotation of the first carrier 101. When the first upper mold 202a and the corresponding lower mold 201 have been conveyed and then arranged under the first ejector 104, the first polymer material M1 is injected from the first ejector 104 into the first mold cavity 203a through the first gate 204a, as shown in FIG. Fig.30 After the first polymer material M1 is ejected, the first upper mold 202a and the corresponding lower mold 201 are moved away from the first ejector 104 by the rotation of the first carrier 101. After being moved away from the first ejector 104, the first upper mold 202a is separated from the corresponding lower mold 201, so that a product having the first polymer material M1 is formed in the corresponding lower mold 201 and can be taken out from the corresponding lower mold 201.

[0071] Similarly, when the bridge mechanism 103 is not in use or is removed, the first upper mold 202a and the lower mold 201 on the first carrier 102 are moved by the rotation of the first carrier 102. When the second upper mold 202b and the corresponding lower mold 201 have been conveyed and then arranged under the second ejector 105, the second polymer material M2 is injected from the second ejector 105 into the second mold cavity 203b through the second gate 204b, as shown in FIG. Fig.31 After the second polymer material M2 is injected, the second upper mold 202b and the corresponding lower mold 201 are moved away from the second ejector 105 by the rotation of the second carrier 102. After being moved away from the second ejector 105, the second upper mold 202b is separated from the corresponding lower mold 201, so that a product having the second polymer material M2 is formed in the corresponding lower mold 201 and can be taken out from the corresponding lower mold 201.

[0072] When the bridge mechanism 103 is not in use or removed, the first polymer material M1 and the second polymer material M2 are the same or different materials. In some embodiments, the first polymer material M1 and the second polymer material M2 have the same or different physical properties.

[0073] In some embodiments, the injection molding system 100 is controlled by a controller (not shown). The controller is configured to control the rotation of the first carrier 101, the rotation of the second carrier 102, and the rotation of the bridge mechanism 103, such as the direction, angle, and speed of the rotation, so as to form a product including more than one part with different physical or functional characteristics. Furthermore, the controller is configured to standby or stop the bridge mechanism 103 to form a product including a single physical or functional characteristic.

[0074] According to a specific embodiment of the present invention, the bridge mechanism 103 is used to transfer the lower mold between the first carrier 101 and the second carrier 102 by rotating or moving the bridge mechanism 103. Through the bridge mechanism 103, the first ejector 104 and the second ejector 105 continuously perform two different injections on the first carrier 101 and the second carrier 102, thereby reducing the manufacturing time of the product including more than one part with different physical or functional characteristics.

[0075] The above summarizes the features of several specific embodiments so that those skilled in the art can better understand the aspects of this creation. Those skilled in the art should understand that they can easily use this creation as a basis for designing or modifying other processes and structures to achieve the same purpose and / or achieve the same advantages as the specific embodiments cited herein. Those skilled in the art should also understand that this equivalent structure does not deviate from the spirit and scope of this creation, and that various changes, substitutions and modifications can be made to it without deviating from the spirit and scope of this creation.

[0076] Furthermore, the scope of the present application is not intended to be limited to the specific embodiments of the processes, machines, generation, material compositions, components, methods, and steps described in the specification. As will be readily understood by those skilled in the art from the disclosure of the present invention, processes, machines, generation, material compositions, components, methods, or steps (currently existing or to be developed in the future) may be used according to the present invention to perform substantially the same functions or achieve substantially the same results as the corresponding embodiments described herein. Therefore, the scope of the patent application hereafter is intended to include such processes, machines, generation, material compositions, components, methods, and steps within its scope.

[0077] Explanation of symbols

[0078] 100: Injection molding system

[0079] 101: First Vehicle

[0080] 102: Second Vehicle

[0081] 103: Bridging mechanism

[0082] 103a: first conveying unit

[0083] 103b: Second conveying unit

[0084] 103c: First receiving space

[0085] 103d: Second receiving space

[0086] 104: First ejector

[0087] 105: Second ejector

[0088] 200: Forming station

[0089] 200a: First molding station

[0090] 200b: Second molding station

[0091] 201: Lower mold

[0092] 201-1: The first mold

[0093] 201-2: The second mold

[0094] 201-3: The third lower mold

[0095] 201-4: The fourth mold

[0096] 202: Upper mold

[0097] 202a: first upper mold

[0098] 202b: Second upper mold

[0099] 203a: first mold cavity

[0100] 203b: Second mold cavity

[0101] 204a: first gate

[0102] 204b: Second gate

[0103] 300: Injection molding method

[0104] C1: First Center

[0105] C2: Second Center

[0106] C3: The Third Center

[0107] M1: First polymer material

[0108] M2: Second polymer material

[0109] R1: First direction

[0110] R2: Second direction

[0111] R3: Third direction

[0112] S302-S316: Operation.

Claims

1. An injection molding system, characterized in that: include: a first carrier configured to hold a first mold; a first ejector disposed above the first carrier and configured to eject a first polymer material; a second carrier configured to hold a second mold; a second ejector disposed above the second carrier and configured to eject a second polymeric material; and A bridge mechanism is disposed between the first carrier and the second carrier and is movable relative to the first carrier and the second carrier, and is configured to receive a lower mold from the first carrier or the second carrier and transport the lower mold between the first carrier and the second carrier.

2. The injection molding system according to claim 1, characterized in that The lower mold disposed adjacent to the first mold may be transferred from the first carrier to the second carrier to be disposed adjacent to the second mold, or the lower mold disposed adjacent to the second mold may be transferred from the second carrier to the first carrier to be disposed adjacent to the first mold.

3. The injection molding system according to claim 1, characterized in that: A first mold cavity is defined by the first mold and the lower mold, and a second mold cavity is defined by the second mold and the lower mold, wherein the first polymer material is injected into the first mold cavity by the first ejector, and the second polymer material is injected into the second mold cavity by the second ejector.

4. The injection molding system according to claim 3, characterized in that: The first mold includes a first gate configured to receive the first polymeric material from the first ejector and communicate with the first mold cavity, and the second mold includes a second gate configured to receive the second polymeric material from the second ejector and communicate with the second mold cavity.

5. The injection molding system according to claim 1, wherein: The bridging mechanism includes: a first conveying unit configured to convey the lower mold from the first carrier to a first receiving space of the bridge mechanism; and A second conveying unit is configured to convey the lower mold from the second carrier to a second receiving space of the bridge mechanism.

6. The injection molding system according to claim 5, characterized in that: The first receiving space and the second receiving space are arranged on two opposite sides of the bridge mechanism.

7. The injection molding system according to claim 6, characterized in that: Each of the first conveying unit and the second conveying unit is a track or a belt.

8. The injection molding system according to claim 1, wherein: The first polymeric material and the second polymeric material are foamable, non-foamable or slightly foamable materials.

9. The injection molding system according to claim 1, wherein: The first carrier and the second carrier are rotatable relative to the bridge mechanism.

10. The injection molding system according to claim 9, characterized in that: A first center of the first carrier, a second center of the second carrier, and a third center of the bridge mechanism are arranged on a straight line.

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