Automotive brake pads with chip removal structure

Abstract

The utility model relates to the technical field of automobile parts, and discloses an automobile brake pad with a chip removal structure, including a friction layer, the left front and rear ends of the friction layer are provided with chip removal grooves, the right side of the friction layer is fixedly connected with a base material layer, the right side of the base material layer is fixedly connected with an adhesive component, the right side of the adhesive component is fixedly connected with a back plate, the top front and rear sides of the back plate are fixedly connected with damping blocks, the right side of the back plate is fixedly connected with a noise-proof and shock-absorbing gasket, the adhesive component is made of organic resin, the adhesive component includes an adhesive layer, and the left side of the adhesive layer is fixedly connected to the left side of the base material layer. In the utility model, by opening a chip removal groove, the debris or dust generated by the friction of the brake pad during use can be discharged through the chip removal groove, thereby preventing the brake pad from malfunctioning due to excessive debris and dust after long-term use of the brake pad.

Description

Technical Field

[0001] The utility model relates to the technical field of automobile parts, in particular to an automobile brake pad with a chip removal structure. Background Art

[0002] The most critical part of the brake pad is its friction material layer, which is usually made of composite materials, including organic resins, metal powders, fibers and fillers. These materials come into contact with the brake disc during braking and convert friction into heat energy to slow down and stop the vehicle. The tribological and dynamic properties of the brake pad directly affect the braking performance and driving experience, which involves detailed research and optimization of friction coefficient, braking distance, thermal attenuation and anti-fading.

[0003] However, some existing automobile brake pads have the problem of being unable to discharge the debris and dust generated by the brake pads during braking. Therefore, after the brake pads are used for a long time, the dust and debris generated will cause the braking effect of the brake pads to decrease, and then cause braking failure. Therefore, an automobile brake pad with a chip removal structure is proposed to solve the above problem. Summary of the invention

[0004] In order to make up for the above shortcomings, the utility model provides an automobile brake pad with a chip removal structure, aiming to improve the problem in the prior art that the chips and dust generated by the brake pad during braking cannot be removed.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] An automobile brake pad with a chip removal structure comprises a friction layer, wherein both front and rear ends of the left side of the friction layer are provided with chip removal grooves, a base material layer is fixedly connected to the right side of the friction layer, an adhesive component is fixedly connected to the right side of the base material layer, a back plate is fixedly connected to the right side of the adhesive component, damping blocks are fixedly connected to the top front and rear sides of the back plate, and a noise-proof and shock-absorbing gasket is fixedly connected to the right side of the back plate;

[0007] The material of the bonding component is organic resin.

[0008] The adhesive assembly comprises an adhesive layer, the left side of the adhesive layer is fixedly connected to the left side of the base material layer, the right side of the adhesive layer is fixedly connected to the left side of the back plate, and the material of the adhesive layer is organic resin.

[0009] The friction layer is made of a composite material containing organic resin and metal powder, and the base material layer is made of a steel plate.

[0010] The material of the back plate is aluminum alloy, and the material of the noise-proof and shock-absorbing gasket is rubber.

[0011] The utility model has the following beneficial effects:

[0012] 1. In the utility model, the chip discharge groove is provided so that the debris or dust generated by the friction of the brake pad during use can be discharged through the chip discharge groove, thereby preventing the brake pad from malfunctioning due to excessive debris and dust generated after the brake pad is used for a long time. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 The utility model is a three-dimensional schematic diagram of the automobile brake pad with a chip removal structure.

[0014] Figure 2 This is an exploded view of the automobile brake pad with a chip removal structure proposed by the utility model.

[0015] Figure 3 This is a schematic structural diagram of the friction layer of the automobile brake pad with a chip removal structure proposed by the utility model.

[0016] Legend:

[0017] 1. Friction layer; 2. Chip groove; 3. Base material layer; 4. Adhesive layer; 5. Back plate; 6. Damping block; 7. Noise-proof and shock-absorbing gasket. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] Reference Figure 1 - Figure 3 The utility model provides an embodiment: a car brake pad with a chip removal structure, comprising a friction layer 1, which is the main working part of the car brake pad. The material of the friction layer 1 is a composite material containing organic resin and metal powder. This composite material is intended to provide excellent friction performance and wear resistance during braking. The left front and rear ends of the friction layer 1 are both provided with chip removal grooves 2. The chip removal grooves 2 are used to effectively remove the wear debris generated during braking, keep the friction layer 1 clean, and improve the braking efficiency and safety. The right side of the friction layer 1 is fixedly connected with a base material layer 3, which is made of steel plate. Its main function is to provide structural support and stability for the brake pad, and to serve as the basis of the friction layer 1. The material of the friction layer 1 is a composite material containing organic resin and metal powder, and the material of the base material layer 3 is a steel plate. The right side of the base material layer 3 is fixedly connected with an adhesive component.

[0020] The right side of the bonding assembly is fixedly connected with a back plate 5, which is a component located at the bottom of the brake pad and is made of aluminum alloy. The function of the back plate 5 is to provide additional structural support and help conduct heat to maintain the working stability of the brake pad under high temperature conditions. The top front and rear sides of the back plate 5 are fixedly connected with damping blocks 6. The damping blocks 6 installed on the top front and rear sides of the back plate 5 are used to absorb the vibration and noise that may be generated during braking, further improving driving comfort and reducing the noise level of the braking system. The right side of the back plate 5 is fixedly connected with a noise-proof and shock-absorbing gasket 7, which is made of aluminum alloy and rubber. The right side of the back plate 5 is fixedly connected with a noise-proof and shock-absorbing gasket 7, which is made of rubber. This gasket is designed to reduce the noise conducted by the friction layer 1 and the back plate 5 during the braking operation, further improving the quietness of the driving experience.

[0021] The material of the adhesive assembly is organic resin, and the adhesive assembly includes an adhesive layer 4, the left side of the adhesive layer 4 is fixedly connected to the left side of the base material layer 3, and the right side of the adhesive layer 4 is fixedly connected to the left side of the back plate 5. The material of the adhesive layer 4 is organic resin, and the adhesive assembly includes an adhesive layer 4 and a back plate 5. The adhesive layer 4 is made of organic resin, the left side is fixedly connected to the left side of the base material layer 3, and the right side is fixedly connected to the left side of the back plate 5, and its function is to firmly bond the base material layer 3 and the back plate 5 together.

[0022] Working principle: Friction layer 1 is the surface layer of the brake pad, and its material is a composite material containing organic resin and metal powder. When braking, friction layer 1 contacts the brake disc and slows down or stops the vehicle through friction. Chip removal grooves 2 are opened at the front and rear ends of the left side of friction layer 1. The function of these grooves is to effectively discharge the debris and heat generated by the wear of friction layer 1 during braking, so as to maintain the performance and stability of the brake pad and reduce the noise during braking. The base material layer 3 is located on the back of friction layer 1 and is made of steel plate. The base material layer 3 provides structural support and stability for the brake pad, and can effectively disperse and conduct the heat generated during braking to prevent the friction layer 1 from overheating. The bonding layer 4 is used to firmly bond the base material layer 3 and the back plate 5 to ensure the structural stability of the entire brake pad. The back plate 5 is the support structure of the brake pad and is made of aluminum alloy. The back plate 5 not only provides mechanical support for the brake pad, but also helps to disperse and dissipate the heat generated during braking to prevent the brake pad from overheating. The damping block 6 is located on the front and rear sides of the top of the back plate 5. Its function is to absorb the vibration and vibration that may be generated during braking, further improving the driving comfort. The noise-proof and shock-absorbing gasket 7 is installed on the right side of the back plate 5 and is made of rubber. It is used to reduce the noise generated during braking and provide a quieter driving experience.

[0023] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An automobile brake pad with a chip removal structure, comprising a friction layer (1), characterized in that: The friction layer (1) is provided with chip removal grooves (2) at both the front and rear ends of the left side, the friction layer (1) is fixedly connected to a base material layer (3) on the right side, the base material layer (3) is fixedly connected to an adhesive component on the right side, the adhesive component is fixedly connected to a back plate (5) on the right side, the top of the back plate (5) is fixedly connected to damping blocks (6) on both the front and rear sides, and the back plate (5) is fixedly connected to a noise-proof and shock-absorbing gasket (7) on the right side.

2. The automobile brake pad with a chip removal structure according to claim 1, characterized in that: The material of the bonding component is organic resin.

3. The automobile brake pad with a chip removal structure according to claim 1, characterized in that: The adhesive assembly comprises an adhesive layer (4), the left side of the adhesive layer (4) being fixedly connected to the left side of the base material layer (3), and the right side of the adhesive layer (4) being fixedly connected to the left side of the back plate (5), and the material of the adhesive layer (4) is organic resin.

4. The automobile brake pad with a chip removal structure according to claim 1, characterized in that: The material of the back plate (5) is aluminum alloy, and the material of the noise-proof and shock-absorbing gasket (7) is rubber.

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