A semiconductor thermal transient tester

Abstract

The utility model discloses a semiconductor thermal transient tester, including a test main shell, both sides of which are provided with a pre-test material table and a post-test material table, the test main shell, the pre-test material table and the post-test material table are all installed above the bottom platform through a support frame; the pre-test material table and the post-test material table are both rotatably installed on the top of the support frame, and a rotating motor for driving the pre-test material table and the post-test material table to rotate is installed inside the support frame; a constant temperature chamber is provided inside the test main shell, and a test seat is installed at the bottom of the constant temperature chamber, an inlet and an outlet are opened at the top of the test main shell, and a cover plate is provided at the bottom of the inlet and an outlet; a device transfer mechanism is installed above the test main shell. The thermal transient tester provided by the utility model can realize the rapid and accurate placement of semiconductor devices, significantly improve the efficiency of the test, and is conducive to the uninterrupted testing of batch semiconductor devices; semiconductor devices can be automatically and accurately placed at the test station to ensure the accuracy of the test results.

Description

Technical Field

[0001] The utility model relates to a semiconductor thermal transient tester, belonging to the technical field of thermal characteristic instruments. Background Art

[0002] Thermal transient tester is a semiconductor thermal characteristic thermal test instrument, which can be used to test the junction temperature, steady-state thermal resistance, transient thermal resistance of semiconductor discrete devices and modules, and can also be used to test the thermal characteristics of IC, SoC, SIP, heat sink, heat pipe, etc. By non-destructively testing the transient change of voltage over time of packaged semiconductor devices, accurate and highly repeatable junction temperature thermal resistance data and internal structural information can be quickly obtained. T3STER supports online testing of devices, junction-to-case thermal resistance testing, etc. The test results can generate thermal resistance and thermal capacitance models for use in thermal simulation software, and can also be used to calibrate detailed simulation models.

[0003] The prior art generally has the following deficiencies in the process of thermal transient testing of packaged semiconductor devices: manual placement of semiconductor devices is not convenient for quick placement, resulting in low test efficiency and being unfavorable for uninterrupted testing of batch semiconductor devices; manual placement of semiconductor devices at the test station is prone to deviations, which affects the accuracy of the test results.

[0004] In summary, the existing technology obviously has inconveniences and defects in practical use, so it is necessary to improve it. Utility Model Content

[0005] In view of the deficiencies in the background technology, the utility model provides a semiconductor thermal transient tester, which can realize fast and accurate placement of semiconductor devices, significantly improve the test efficiency, and facilitate uninterrupted testing of batch semiconductor devices; semiconductor devices can be automatically and accurately placed at the test station to ensure the accuracy of the test results.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] A semiconductor thermal transient tester comprises a test main housing, a pre-test material platform and a post-test material platform are arranged on both sides of the test main housing, and the test main housing, the pre-test material platform and the post-test material platform are all installed above the bottom platform through a support frame;

[0008] The pre-measurement material platform and the post-measurement material platform are both rotatably mounted on the top of the support frame, and a rotating motor for driving the pre-measurement material platform and the post-measurement material platform to rotate is installed inside the support frame;

[0009] A constant temperature chamber is provided inside the test main shell, a test seat is installed at the bottom of the constant temperature chamber, an inlet and outlet are opened on the top of the test main shell, a cover is provided at the bottom of the inlet and outlet, and the side of the cover is connected to the test main shell through a rebound hinge; a device transfer mechanism is installed above the test main shell.

[0010] Furthermore, the test main housing is fixedly mounted on the top of the support frame.

[0011] Furthermore, a plurality of device-carrying holes distributed in a circular pattern are provided in the upper surfaces of the pre-measurement material platform and the post-measurement material platform.

[0012] Furthermore, the device transport mechanism includes a transverse slide rail, which is fixed to the side of the supporting longitudinal beam, and the supporting longitudinal beam is fixed to the bottom platform along the vertical direction.

[0013] Furthermore, a sliding block is provided on the side of the transverse slide rail away from the supporting longitudinal beam, and a stepping motor is provided at the end of the transverse slide rail for driving the sliding block to move along the transverse slide rail.

[0014] Furthermore, a telescopic cylinder is fixedly mounted on a side of the sliding block away from the transverse sliding rail, and the telescopic cylinder is arranged downward in a vertical direction.

[0015] Furthermore, a pneumatic clamp for grasping semiconductor devices is installed on the head of the telescopic cylinder.

[0016] Compared with the prior art, the utility model has the following advantages after adopting the above technical solution:

[0017] By arranging a device transfer mechanism above the test main shell, the device transfer mechanism can transfer the semiconductor devices on the pre-test material table to the test seat in the test main shell for thermal transient testing, and can transfer the tested semiconductor devices in the test main shell to the post-test material table, which can not only ensure the accuracy of the test results, but also significantly improve the test efficiency, which is conducive to uninterrupted testing of batch semiconductor devices; both the pre-test material table and the post-test material table can be rotated under the drive of the rotating motor, which is convenient for the device transfer mechanism to accurately pick up and place semiconductor devices.

[0018] The utility model is described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the utility model;

[0020] Figure 2 It is a schematic diagram of the internal structure of the test main shell.

[0021] In the figure, 1-test main shell, 2-pre-test material platform, 3-post-test material platform, 4-support frame, 5-bottom platform, 6-test seat, 7-inlet and outlet, 8-cover plate, 9-rebound hinge, 10-lateral slide rail, 11-support longitudinal beam, 12-slider, 13-stepping motor, 14-telescopic cylinder, 15-pneumatic clamp, 16-rotating motor, 17-semiconductor device. DETAILED DESCRIPTION

[0022] In order to have a clearer understanding of the technical features, purposes and effects of the utility model, the specific implementation methods of the utility model are now described with reference to the accompanying drawings.

[0023] like Figure 1 and Figure 2 As shown together, the utility model provides a semiconductor thermal transient tester, including a test main shell 1, with a pre-test material table 2 and a post-test material table 3 on both sides of the test main shell 1, and the test main shell 1, the pre-test material table 2 and the post-test material table 3 are all installed above the bottom platform 5 through a support frame 4.

[0024] The test main housing 1 is fixedly mounted on the top of the support frame 4 .

[0025] The pre-measurement material platform 2 and the post-measurement material platform 3 are both rotatably mounted on the top of the support frame 4 , and a rotating motor 16 for driving the pre-measurement material platform 2 and the post-measurement material platform 3 to rotate is installed inside the support frame 4 .

[0026] A plurality of device-carrying holes distributed in a circumference are provided in the upper surfaces of the pre-test material platform 2 and the post-test material platform 3. The pre-test material platform 2 is used to support the semiconductor device 17 before the test, and the post-test material platform 3 is used to support the semiconductor device 17 after the test.

[0027] A constant temperature chamber is provided inside the test main housing 1 , and a test socket 6 is installed at the bottom of the constant temperature chamber. The test socket 6 is used for thermal transient testing of the semiconductor device 17 .

[0028] An inlet and outlet 7 is provided at the top of the test main housing 1, and a cover plate 8 is provided at the bottom of the inlet and outlet 7. The side of the cover plate 8 is connected to the test main housing 1 through a rebound hinge 9. The cover plate 8 can be automatically reset after being flipped down, so as to ensure that the inside of the test main housing 1 is in a constant temperature state as much as possible.

[0029] A device transfer mechanism is installed above the test main shell 1, and the device transfer mechanism is used to transfer the semiconductor device 17 on the pre-test material stage 2 to the test main shell 1 for testing, and transfer the tested semiconductor device 17 in the test main shell 1 to the post-test material stage 3.

[0030] The device transfer mechanism includes a transverse slide rail 10, which is fixed to the side of a supporting longitudinal beam 11. The height of the transverse slide rail 10 can be adjusted, and the supporting longitudinal beam 11 is fixed to the bottom platform 5 in the vertical direction.

[0031] A slider 12 is provided on one side of the transverse slide rail 10 away from the supporting longitudinal beam 11 , and a stepping motor 13 is provided at the end of the transverse slide rail 10 for driving the slider 12 to move along the transverse slide rail 10 .

[0032] A telescopic cylinder 14 is fixedly mounted on the side of the slider 12 away from the transverse slide rail 10 . The telescopic cylinder 14 is arranged vertically downward. A pneumatic clamp 15 is mounted on the head of the telescopic cylinder 14 . The pneumatic clamp 15 is used to grasp the semiconductor device 17 .

[0033] The specific working principle of this utility model:

[0034] By setting up a device transfer mechanism above the test main shell 1, the device transfer mechanism can move the semiconductor device 17 longitudinally or transversely. The device transfer mechanism can transfer the semiconductor device 17 on the pre-test material table 2 to the test seat 6 in the test main shell 1 for thermal transient testing, and can transfer the tested semiconductor device 17 in the test main shell 1 to the post-test material table 3, thereby significantly improving the test efficiency and facilitating uninterrupted testing of batch semiconductor devices 17.

[0035] Both the pre-test material platform 2 and the post-test material platform 3 can be rotated under the drive of the rotary motor 16, so that the device transfer mechanism can facilitate the precise placement of the semiconductor device 17.

[0036] The above is an example of the best implementation of the utility model, and the parts not described in detail are common knowledge of ordinary technicians in this field. The protection scope of the utility model is based on the content of the claims, and any equivalent transformation based on the technical inspiration of the utility model is also within the protection scope of the utility model.

Claims

1. A semiconductor thermal transient tester, characterized in that: The test apparatus comprises a main test housing (1), wherein a pre-test material platform (2) and a post-test material platform (3) are arranged on both sides of the main test housing (1); the main test housing (1), the pre-test material platform (2) and the post-test material platform (3) are all mounted above a bottom platform (5) via a support frame (4); the pre-test material platform (2) and the post-test material platform (3) are both rotatably mounted on the top of the support frame (4), and a rotating motor (16) is installed inside the support frame (4) for driving the pre-test material platform (2) and the post-test material platform (3) to rotate; A constant temperature chamber is provided inside the test main housing (1), a test seat (6) is installed at the bottom of the constant temperature chamber, an inlet and outlet (7) is provided at the top of the test main housing (1), a cover plate (8) is provided at the bottom of the inlet and outlet (7), and the side of the cover plate (8) is connected to the test main housing (1) via a rebound hinge (9); a device transfer mechanism is installed above the test main housing (1).

2. A semiconductor thermal transient tester as claimed in claim 1, characterized in that: The test main housing (1) is fixedly mounted on the top of the support frame (4).

3. A semiconductor thermal transient tester as claimed in claim 1, characterized in that: A plurality of device-carrying holes distributed in a circumference are provided in the upper surfaces of the pre-measurement material platform (2) and the post-measurement material platform (3).

4. A semiconductor thermal transient tester as claimed in claim 1, characterized in that: The device transfer mechanism comprises a transverse slide rail (10), wherein the transverse slide rail (10) is fixedly connected to the side of a supporting longitudinal beam (11), and the supporting longitudinal beam (11) is fixedly connected to the bottom platform (5) in a vertical direction.

5. A semiconductor thermal transient tester as claimed in claim 4, characterized in that: A sliding block (12) is provided on the side of the transverse sliding rail (10) away from the supporting longitudinal beam (11), and a stepping motor (13) capable of driving the sliding block (12) to move along the transverse sliding rail (10) is provided at the end of the transverse sliding rail (10).

6. A semiconductor thermal transient tester as claimed in claim 5, characterized in that: A telescopic cylinder (14) is fixedly mounted on the side of the sliding block (12) away from the transverse sliding rail (10), and the telescopic cylinder (14) is arranged downward in the vertical direction.

7. A semiconductor thermal transient tester as claimed in claim 6, characterized in that: A pneumatic clamp (15) for grasping a semiconductor device (17) is installed at the head of the telescopic cylinder (14).

Images