A mouse IC component

By using a hook fixing IC assembly and a heat-insulating film protection lens assembly in the mouse IC assembly, the problems of offset and hot air damage during the soldering process of traditional optoelectronic mouse IC assembly are solved, and the welding accuracy and service life of the product are improved.

CN222748955UActive Publication Date: 2025-04-11张永琼
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Patent Information

Application Number
CN202421533870.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-01
Publication Date
2025-04-11
Estimated Expiration
2034-07-01

AI Technical Summary

Technical Problem

Traditional optoelectronic mouse IC components are easily deviated due to tin-liquid buoyancy during the soldering process, and optical lenses are easily subjected to hot air scalding and external influences, resulting in a reduced service life.

Method used

A mouse IC assembly is designed, using an IC fixing bottom shell and a hook to fix it on the PCB board to avoid deviation caused by tin liquid buoyancy, and a lens assembly is installed in the IC fixing bottom shell to cover the insulation film to prevent heat gas damage.

Benefits of technology

It effectively avoids the offset and hot gas damage of IC components during soldering, improves the welding accuracy and service life of IC components, and reduces production costs.

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Abstract

The utility model discloses a mouse IC component, which is provided with a PCB board and an IC component, wherein the IC component is provided with an IC upper cover and an IC fixed bottom shell, wherein the IC upper cover is connected with the IC fixed bottom shell; the IC upper cover is provided with a plastic shell, wherein the plastic shell is connected with the IC fixed bottom shell, wherein a wick and a sensing chip are installed at the bottom of the plastic shell; a lens component is installed above the IC fixed bottom shell, wherein a light isolation sheet is installed above the lens component, and a light transmission hole and a light filtering hole are provided at the bottom of the IC fixed bottom shell; the utility model: by adding a hook to the IC fixed bottom shell, the IC component is firmly fixed on the PCB board, and no specific clamp is required in the soldering process, thereby avoiding the situation that the IC component is soldered and shifted due to the buoyancy of the tin liquid, thus saving the production cost, having strong applicability, and increasing the yield rate of the IC component products; the lens component is arranged in the IC fixed bottom shell, and a heat insulation film is used when entering the soldering furnace to isolate the hot air from the outside, thereby avoiding burns due to the hot air, reducing the contact with the outside, and greatly increasing the service life.
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Description

Technical Field

[0001] The utility model relates to the technical field of mouse, in particular to a mouse IC component. Background Art

[0002] With the development of electronic technology, electronic computers have become an indispensable tool in our lives and offices. Among them, the mouse, as the main input device of electronic computers, has a great impact on our operating efficiency. In the earliest years, mechanical mice were used. The principle of mechanical mice is to use conductive rubber rollers and negative electric positioning axes to position and move, but the accuracy of mechanical mice is too poor, so they were eliminated. Nowadays, the most common one should be the optical mouse. Its working principle is to receive the reflected light through the light source body and reflect it to the optical sensor (sensing chip). Among them, the optical sensor (sensing chip), optical lens and light source body are essential components of the optical mouse. The industry generally integrates these three components into one, also known as a three-in-one integrated IC or IC component.

[0003] Traditional optical mice generally solder IC components to PCB boards through hardware components, which require tinning. When the IC components enter the tin furnace, the tin liquid has a certain buoyancy, which will lift the IC components and cause them to deviate from the predetermined welding position. Therefore, in the traditional soldering process, specific fixtures are required to assist in soldering, which has low applicability and high cost. In addition, traditional IC components directly expose the optical lens to the outside, which is easily burned by hot air during the soldering process. The convex surface of the optical imaging is easily fogged and blurred, resulting in poor IC soldering effect or even loss of function. In daily use, the optical lens is also easily affected by the outside world, resulting in a reduced service life. Utility Model Content

[0004] Purpose of the utility model: In order to overcome the deficiencies in the prior art, the utility model provides a mouse IC component.

[0005] Technical solution: To achieve the above purpose, the mouse IC component of the utility model is provided with a PCB board and an IC component, wherein the IC component is provided with an IC upper cover and an IC fixed bottom shell, and the IC upper cover is connected to the IC fixed bottom shell;

[0006] The IC upper cover is provided with a plastic shell, the plastic shell is connected to the IC fixed bottom shell, and a wick and a sensor chip are installed at the bottom of the plastic shell;

[0007] A lens assembly is installed above the IC fixed bottom shell, a light isolation sheet is installed above the lens assembly, and a light transmission hole and a light filtering hole are opened at the bottom of the IC fixed bottom shell.

[0008] Furthermore, the lens assembly is provided with an arc-shaped lens portion and a convex lens portion, a light-isolating sheet is installed between the arc-shaped lens portion and the convex lens portion, the arc-shaped lens portion and the convex lens portion are separated by the light-isolating sheet, and the wick and the sensing chip are separated by the light-isolating sheet.

[0009] Furthermore, the position of the wick corresponds to the arc-shaped lens portion, the position of the sensor chip corresponds to the convex lens portion, the arc-shaped lens portion is located above the light-transmitting hole, and the convex lens portion is located above the light-filtering hole.

[0010] Furthermore, the light-isolating sheet is provided with a blocking portion, a wick passing hole is provided on one side of the blocking portion, and a light-filtering light-transmitting hole is provided on the other side.

[0011] Furthermore, hooks are fixedly connected on both sides of the IC fixed bottom shell, and the bottom of the IC fixed bottom shell is also covered with a heat insulation film. The hooks are connected to the bottom of the PCB board to fix the IC fixed bottom shell to prevent the IC fixed bottom shell from shifting under the action of buoyancy. The heat insulation film prevents hot air from entering the IC fixed bottom shell to damage the lens assembly when the IC assembly passes through the tin furnace.

[0012] Furthermore, a plurality of hardware components are fixedly connected to the periphery of the plastic shell, and the hardware components are fixedly connected to the PCB board.

[0013] The beneficial effects of the utility model are:

[0014] 1. In the utility model, by adding a hook on the IC fixing bottom shell, the IC component is firmly fixed on the PCB board, and no specific clamp is needed during the soldering process, thereby avoiding the situation where the IC component welding is offset due to the buoyancy of the tin liquid, saving production costs, having strong applicability, and increasing the yield rate of IC component products.

[0015] 2. In the utility model, by setting the lens assembly in the IC fixed bottom shell, the heat insulation film is used to isolate the hot air from the outside when entering the tin furnace, thereby avoiding the risk of burns caused by hot air, the optical imaging convex surface is easily fogged and blurred, resulting in poor IC passing effect, or even loss of function. In addition, because the lens assembly is set inside, the contact with the outside world is reduced, and the service life is also greatly increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Attached Figure 1 This is a cross-sectional view of the overall structure of the mouse IC component of the first embodiment of the present invention;

[0017] Attached Figure 2 This is one of the IC component cross-sectional views of a mouse IC component of the present embodiment;

[0018] Attached Figure 3 This is the second cross-sectional view of the IC component of the mouse IC component of the first embodiment of the present invention;

[0019] Attached Figure 4 This is an exploded view of the mouse IC component of the first embodiment of the present invention;

[0020] Attached Figure 5 This is a schematic diagram of the structure of a lens assembly of a mouse IC assembly in the present embodiment;

[0021] Attached Figure 6 This is a schematic diagram of the structure of a light-isolating sheet of a mouse IC component in the first embodiment of the present invention;

[0022] Attached Figure 7 is a cross-sectional view of a light-isolating sheet of a mouse IC assembly of the first embodiment of the present invention;

[0023] Attached Figure 8 It is a partial structural diagram of a mouse IC component of the present embodiment;

[0024] Attached Fig. 9 It is a partial structural cross-sectional view of a mouse IC component of the first embodiment of the present invention;

[0025] Attached Fig.10 This is a schematic diagram of the partial structure of the IC cover of the mouse IC assembly of the second embodiment of the present invention;

[0026] Attached Fig.11 This is a cross-sectional view of the overall structure of the mouse IC component of the second embodiment; DETAILED DESCRIPTION

[0027] The utility model is further described below in conjunction with the accompanying drawings.

[0028] Embodiment 1

[0029] like Figures 1 to 9 The mouse IC component shown is provided with a PCB board 101 and an IC component 1, the IC component 1 is provided with an IC upper cover 2 and an IC fixed bottom shell 3, the IC upper cover 2 is fixedly connected to the IC fixed bottom shell 3 to form an inner cavity, the IC upper cover 2 is provided with a plastic shell 21, the plastic shell 21 is fixedly connected to the IC fixed bottom shell 3, a plurality of hardware components 24 are fixedly connected to the periphery of the plastic shell 21, the hardware components 24 are fixedly connected to the PCB board 101, hooks 33 are fixedly connected to both sides of the IC fixed bottom shell 3, and the IC fixed bottom shell 3 is fixed to the PCB board 101 through the hooks 33;

[0030] A lamp wick 22 and a sensor chip 23 are installed at the bottom of the plastic shell 21, a light transmission hole 31 and a light filtering hole 32 are opened at the bottom of the IC fixed bottom shell 3, and the bottom of the IC fixed bottom shell 3 is also covered with a heat insulation film 34. A lens assembly 4 is installed above the IC fixed bottom shell 3, and a light isolation sheet 5 is installed above the lens assembly 4. The light isolation sheet 5 is provided with a blocking portion 51. A lamp wick transmission hole 52 is opened on one side of the blocking portion 51, and a light filtering light transmission hole 53 is opened on the other side. The arc lens portion 41 and the convex lens portion 41 are connected to each other. The mirror portion 42 is separated by a blocking portion 51, the wick 22 and the sensing chip 23 are separated by the blocking portion 51, the wick 22 is arranged above the arc lens portion 41, the sensing chip 23 is arranged above the convex lens portion 42, the arc lens portion 41 is located above the light transmission hole 31, the convex lens portion 42 is located above the filter hole 32, the wick transmission hole 52 is arranged between the wick 22 and the arc lens portion 41, and the filter transmission hole 53 is arranged between the convex lens portion 42 and the sensing chip 23.

[0031] The operating principle of the mouse IC component:

[0032] During soldering, the mouse IC component enters the solder furnace, and the hook 33 on the IC fixed bottom shell 3 fixes the IC fixed bottom shell 3. The mouse IC component will not be lifted up due to the buoyancy of the tin liquid, resulting in deviation. The heat insulation film 34 on the IC fixed bottom shell 3 and the plastic shell 21 of the IC upper cover 2 isolate the hot air to prevent damage to the internal lens component 4.

[0033] When in use, the flash light emitted by the wick 22 passes through the arc lens portion 41 to the desktop, and then is reflected by the desktop to the filter hole 32 on the IC fixed bottom shell 3 to collect the effective light onto the convex lens portion 42, and then the image is transmitted to the sensing chip 23 through the convex lens, thereby producing different image change principles. The arc lens portion 41 is provided with an arc-shaped light-collecting surface to further expand the light-collecting area, and the light isolation sheet 5 separates the light from the two to prevent light interference.

[0034] Embodiment 2: This embodiment is basically the same as Embodiment 1, except that:

[0035] Figure 10 to Figure 11 In the mouse IC assembly shown, the light-isolating sheet 5 is no longer a separate assembly, but is integrated into the plastic shell 21. The plastic shell 21 and the light-isolating sheet 5 are integrally formed, which reduces one component, makes installation more convenient, and increases production efficiency.

[0036] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A mouse IC component, provided with a PCB board (101), characterized in that: An IC component (1) is provided, the IC component (1) is provided with an IC upper cover (2) and an IC fixed bottom shell (3), and the IC upper cover (2) is connected to the IC fixed bottom shell (3); The IC upper cover (2) is provided with a plastic shell (21), the plastic shell (21) is connected to the IC fixed bottom shell (3), and a lamp wick (22) and a sensor chip (23) are installed at the bottom of the plastic shell (21); A lens assembly (4) is installed above the IC fixed bottom shell (3), a light isolation sheet (5) is installed above the lens assembly (4), and a light transmission hole (31) and a light filtering hole (32) are provided at the bottom of the IC fixed bottom shell (3).

2. The mouse IC assembly according to claim 1, characterized in that: The lens assembly (4) is provided with an arc-shaped lens portion (41) and a convex lens portion (42); a light isolation sheet (5) is installed between the arc-shaped lens portion (41) and the convex lens portion (42); the arc-shaped lens portion (41) and the convex lens portion (42) are separated by the light isolation sheet (5); and the lamp core (22) and the sensor chip (23) are separated by the light isolation sheet (5).

3. The mouse IC assembly according to claim 2, characterized in that: The position of the wick (22) corresponds to the arc-shaped lens portion (41), the position of the sensing chip (23) corresponds to the convex lens portion (42), the arc-shaped lens portion (41) is located above the light-transmitting hole (31), and the convex lens portion (42) is located above the light-filtering hole (32).

4. The mouse IC assembly according to claim 3, characterized in that: The light-isolating sheet (5) is provided with a blocking portion (51), one side of the blocking portion (51) is provided with a lamp core passing hole (52), and the other side of the blocking portion (51) is provided with a light filtering light-transmitting hole (53).

5. The mouse IC assembly according to claim 1, characterized in that: Hooks (33) are fixedly connected to both sides of the IC fixing bottom shell (3), and the bottom of the IC fixing bottom shell (3) is also covered with a heat insulation film (34).

6. The mouse IC assembly according to claim 1, characterized in that: A plurality of hardware components (24) are fixedly connected to the periphery of the plastic shell (21), and the hardware components (24) are fixedly connected to the PCB board (101).