Ion implanter with position offset detection device

Abstract

The utility model provides an ion implanter with a position deviation detection device. The ion implanter comprises a wafer bearing disc, a transmission assembly, a control system connected with the transmission assembly, a scanning system, a pedometer connected with the scanning system and the position deviation detection device installed on the scanning system. And the pedometer and the position deviation detection device are both connected with the control system. According to the ion implanter with the position deviation detection device, the pedometer and the position deviation detection device are simultaneously used for detecting whether the scanning system moves to the preset target bearing position or not, and when the control system receives the same signal voltage, the transmission assembly can be controlled to transmit a wafer, so that the wafer can be accurately positioned. The accuracy of the relative position of the scanning system and the wafer is improved; and when the control system does not receive the same signal voltage, an alarm is displayed and wafer transmission is controlled to be stopped, so that an operator can find that the ion implanter is abnormal, and the problems of product scrapping and the like caused by collision and non-uniform wafer doping in wafer transmission when the pedometer is abnormal are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor integrated circuit manufacturing, in particular to an ion implanter with a position deviation detection device. Background Art

[0002] As an advanced doping technology, ion implantation can adjust the electrical properties of the wafer implantation area, change the substrate crystal form and assist other process steps. The typical ion implantation process uses a high-energy ion beam to introduce impurities into semiconductor silicon wafers. Introducing impurities into silicon wafers at a uniform depth and doping dose is very important to ensure the normal operation of the formed semiconductor devices.

[0003] At present, ion implantation is a crucial process in the manufacture of large-scale and ultra-large-scale integrated circuits. The principle of the ion implanter is to ionize atoms or gas molecules to make them positive ions, and then obtain target ions with a certain energy through a series of screening and acceleration and deceleration processes. Then, after the adjustment of the beam shape, the elimination of energy pollution, the parallelization of ion motion, and the neutralization of electrons, the impurity ions are implanted onto the wafer.

[0004] See also Figure 1 , Figure 1 The following is a schematic diagram of the structure of an AMAT ion implanter in the related art. Figure 1 As shown, the AMAT ion implanter includes a wafer carrier 10 for carrying and fixing a wafer 101, a robot 11 for conveying the wafer 101, a controller 12 connected to the robot 11, a Y-Scan system 13 for accurately controlling the ion beam scanning movement in the Y-axis direction to perform ion implantation on the wafer, and a pedometer 14 connected to the Y-Scan system 13; the pedometer 14 is connected to the controller 12, and the pedometer 14 is used to detect the movement steps and position information of the Y-Scan system 13 in the Y-axis direction; the controller 12 controls the movement of the robot 11 to convey the wafer 101 according to the output information of the pedometer 14 received, so that when ion implantation is performed, the Y-Scan system 13 can always maintain the accuracy of the relative position with the wafer 101.

[0005] However, when the pedometer 14 loses steps, it means that the pedometer 14 has not detected the correct information, which will cause the relative position of the Y-Scan system 13 and the wafer 101 to deviate, which may easily lead to collisions during the transportation of the wafer 101 and uneven doping and scrapping of the wafer 101. Utility Model Content

[0006] The purpose of the utility model is to provide an ion implanter with a position deviation detection device to solve one or more problems existing in the prior art, such as deviation in the relative position between the Y-Scan system and the wafer due to a pedometer step loss failure, collision during wafer transfer, and uneven wafer doping leading to scrapping.

[0007] To achieve the above-mentioned purpose, the utility model is implemented through the following technical solutions: an ion implanter, the ion implanter includes a wafer carrier for carrying and fixing a wafer, a conveying component for conveying the wafer, a control system connected to the conveying component, a scanning system for controlling the scanning movement of an ion beam to perform ion implantation on the wafer, a pedometer connected to the scanning system, and a position offset detection device installed on the scanning system; the pedometer and the position offset detection device are both connected to the control system; the pedometer is configured to: detect the real-time motion position information of the scanning system, and generate a first signal voltage from the real-time motion position information and transmit it to the control system; the position offset detection device is configured to: transmit a second signal voltage to the control system when the scanning system moves to a preset target carrying position; the control system is configured to: control the conveying component to convey the wafer when the received first signal voltage is the same as the second signal voltage; and display an alarm when the received first signal voltage is different from the second signal voltage, and control the conveying component to stop conveying the wafer.

[0008] Optionally, the position deviation detection device includes a fixing part installed on the scanning system and a sensor installed on the fixing part; the sensor is connected to the control system, and the sensor is configured as follows: when the scanning system moves to the preset target carrying position, the sensor is triggered by a signal to transmit the second signal voltage to the control system.

[0009] Optionally, the control system includes a transmission controller, the pedometer and the sensor are both connected to a signal-bearing port of the transmission controller, and an output end of the transmission controller is connected to the transmission component.

[0010] Optionally, the sensor includes a photoelectric sensor.

[0011] Optionally, the scanning system includes an ion beam scanner for scanning an ion beam to the wafer, a scanning frame for carrying and fixing the ion beam scanner, and a transmission structure connected to the ion beam scanner, and the pedometer is connected to the transmission structure; the transmission structure is used to drive the ion beam scanner to move along the Y-axis direction, and the pedometer is used to detect real-time motion position information of the ion beam scanner; the fixing part is installed on the scanning frame, and the sensor is fixedly connected to the fixing part.

[0012] Optionally, the fixing member is installed at the bottom of the scanning frame.

[0013] Optionally, the fixing member includes an L-shaped bracket, one branch of the L-shaped bracket is provided with a fixing hole for fixed connection with the scanning frame, and the other branch of the L-shaped bracket is provided with a connecting hole for corresponding connection with the sensor.

[0014] Optionally, the L-shaped bracket is made of nickel-plated iron plate.

[0015] Optionally, two L-shaped brackets are provided.

[0016] Optionally, the conveying assembly includes a conveying arm and a driving motor for driving the conveying arm to move, and the control system is connected to the driving motor.

[0017] Compared with the prior art, the ion implanter with a position deviation detection device provided by the utility model has the following beneficial effects:

[0018] The utility model provides an ion implanter, which includes a wafer carrier plate for carrying and fixing wafers, a conveying component for conveying the wafers, a control system connected to the conveying component, a scanning system for controlling the scanning movement of an ion beam to perform ion implantation on the wafers, a pedometer connected to the scanning system, and a position offset detection device installed on the scanning system; the pedometer and the position offset detection device are both connected to the control system; the pedometer is configured to: detect real-time motion position information of the scanning system, and generate a first signal voltage from the real-time motion position information and transmit it to the control system; the position offset detection device is configured to: transmit a second signal voltage to the control system when the scanning system moves to a preset target carrying position; the control system is configured to: control the conveying component to convey the wafer when the received first signal voltage is the same as the second signal voltage; and display an alarm when the received first signal voltage is different from the second signal voltage, and control the conveying component to stop conveying the wafer. Therefore, the ion implanter provided by the utility model can detect the real-time motion position information of the scanning system by connecting a pedometer to the scanning system; by connecting the pedometer to the control system, the acquired real-time motion position information of the scanning system can be generated into a first signal voltage and transmitted to the control system, which lays a foundation for improving the accuracy of the relative position between the scanning system and the wafer. By installing a position offset detection device on the scanning system, it can detect whether the scanning system moves to the preset target bearing position; by connecting the position offset detection device to the control system, it can transmit a second signal voltage to the control system when the scanning system moves to the preset target bearing position, which lays a foundation for improving the accuracy of the relative position between the scanning system and the wafer. By setting up a control system to receive a first signal voltage from a pedometer and a second signal voltage from a position offset detection device, the pedometer and the position offset detection device can be used simultaneously to detect whether the scanning system has moved to a preset target carrying position; by connecting the transmission component to the control system, when the received first signal voltage is the same as the second signal voltage, the control system can control the transmission component to transmit the wafer, thereby improving the accuracy of the relative position between the scanning system and the wafer; when the received first signal voltage is different from the second signal voltage, the control system can display an alarm and control the transmission component to stop transmitting the wafer, so that the operator can promptly discover the abnormal state of the ion implanter, thereby avoiding problems such as collision of the wafer transmission and uneven wafer doping resulting in product scrapping when the pedometer is abnormal.

[0019] Furthermore, the position shift detection device includes a fixing part installed on the scanning system and a sensor installed on the fixing part; the sensor is connected to the control system, and the sensor is configured such that when the scanning system moves to the preset target bearing position, the sensor is triggered by a signal and transmits the second signal voltage to the control system. Therefore, the ion implanter provided by the utility model can ensure that the sensor is evenly stressed by installing a fixing part on the scanning system to make the measurement result of the sensor more accurate, thereby further improving the accuracy of the relative position between the scanning system and the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the structure of an AMAT ion implanter provided by the prior art;

[0021] Figure 2 A schematic diagram of the structure of an ion implanter provided in one embodiment of the utility model;

[0022] Figure 3 for Figure 2 The structural schematic diagram of the position deviation detection device shown;

[0023] The following are the descriptions of the reference numerals:

[0024] 10-wafer carrier plate, 101-wafer, 11-robot arm, 12-controller, 13-Y-Scan system, 14-pedometer, 20-transmission component, 201-transmission arm, 202-drive motor, 21-control system, 22-scanning system, 23-position offset detection device, 231-fixing part, 2311-L-shaped bracket, 23111-fixing hole, 23112-connecting hole, 232-sensor. DETAILED DESCRIPTION

[0025] The following is a further detailed description of the ion implanter with position offset detection device proposed by the utility model in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the utility model will be clearer. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model. In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, please refer to the drawings. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model. Any modification of the structure, change of the proportional relationship or adjustment of the size, under the same or similar conditions as the effect that the utility model can produce and the purpose that can be achieved, should still fall within the scope of the technical content disclosed by the utility model. The specific design features of the utility model disclosed herein include, for example, specific dimensions, directions, positions and shapes, which will be determined in part by the specific environment to be applied and used. Furthermore, in the embodiments described below, the same reference numerals may be used in common among different drawings to indicate the same parts or parts having the same functions, and their repeated descriptions may be omitted.

[0026] In the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] One embodiment of the present invention provides an ion implanter. Figure 2 and Figure 3 , Figure 2 A schematic diagram of the structure of an ion implanter provided in one embodiment of the utility model; Figure 3 for Figure 2 The schematic diagram of the structure of the position deviation detection device 23 is shown. Figure 2 and Figure 3It can be seen that the ion implanter includes a wafer carrier 10 for carrying and fixing a wafer 101, a conveying assembly 20 for conveying the wafer 101, a control system 21 connected to the conveying assembly 20, a scanning system 22 for controlling the ion beam scanning movement to perform ion implantation on the wafer 101, a pedometer 14 connected to the scanning system 22, and a position offset detection device 23 installed on the scanning system 22; the pedometer 14 and the position offset detection device 23 are both connected to the control system 21; the pedometer 14 is configured to: detect the real-time position of the scanning system 22 The motion position information is obtained by the scanning system 22, and the real-time motion position information is used to generate a first signal voltage which is transmitted to the control system 21; the position offset detection device 23 is configured to transmit a second signal voltage to the control system 21 when the scanning system 22 moves to a preset target carrying position; the control system 21 is configured to control the conveying component 20 to convey the wafer 101 when the received first signal voltage is the same as the second signal voltage; and display an alarm when the received first signal voltage is different from the second signal voltage, and control the conveying component 20 to stop conveying the wafer 101.

[0028] Therefore, the ion implanter provided in this embodiment can detect the real-time motion position information of the scanning system 22 by connecting the pedometer 14 to the scanning system 22; by connecting the pedometer 14 to the control system 21, the acquired real-time motion position information of the scanning system 22 can be generated into a first signal voltage and transmitted to the control system 21, which lays a foundation for improving the accuracy of the relative position between the scanning system 22 and the wafer 101. By installing a position offset detection device 23 on the scanning system 22, it can detect whether the scanning system 22 moves to the preset target bearing position; by connecting the position offset detection device 23 to the control system 21, when the scanning system 22 moves to the preset target bearing position, a second signal voltage can be transmitted to the control system 21, which lays a foundation for improving the accuracy of the relative position between the scanning system 22 and the wafer 101. By setting up a control system 21 to receive a first signal voltage from the pedometer 14 and a second signal voltage from the position offset detection device 23, the pedometer 14 and the position offset detection device 23 can be used simultaneously to detect whether the scanning system 22 moves to a preset target carrying position; by connecting the transmission component 20 with the control system 21, when the received first signal voltage is the same as the second signal voltage, the control system 21 can control the transmission component 20 to transmit the wafer 101, thereby improving the accuracy of the relative position between the scanning system 22 and the wafer 101; when the received first signal voltage is different from the second signal voltage, the control system 21 can display an alarm and control the transmission component 20 to stop transmitting the wafer 101, so that the operator can promptly discover the abnormal state of the ion implanter, thereby avoiding problems such as collision of the wafer 101 during transmission and uneven doping of the wafer 101 resulting in product scrapping when the pedometer 14 is abnormal.

[0029] Exemplarily, the conveying assembly 20 includes a conveying arm 201 and a driving motor 202 for driving the conveying arm 201 to move, and the control system 21 is connected to the driving motor 202. Thus, the control system 21 controls the driving motor 202 to rotate to drive the conveying arm 201 to move.

[0030] Preferably, the position deviation detection device 23 includes a fixing part 231 installed on the scanning system 22 and a sensor 232 installed on the fixing part 231; the sensor 232 is connected to the control system 21, and the sensor 232 is configured such that when the scanning system 22 moves to the preset target bearing position, the sensor 232 is triggered by a signal and transmits the second signal voltage to the control system 21. Therefore, by installing the fixing part 231 on the scanning system 22 to fix the sensor 232, it can be ensured that the force on the sensor 232 is uniform, so that the measurement result of the sensor 232 is more accurate, thereby further improving the accuracy of the relative position between the scanning system 22 and the wafer 101.

[0031] Furthermore, the control system 21 includes a transmission controller, the pedometer 14 and the sensor 232 are both connected to the bearer signal port of the transmission controller, and the bearer signal port is used to receive the first signal voltage and the second signal voltage; the output end of the transmission controller is connected to the drive motor 202 in the transmission component 20, so that the transmission controller can control the drive motor 202 to rotate according to the received instructions to drive the transmission arm 201 to move.

[0032] Preferably, the sensor 232 comprises a photoelectric sensor. Thus, the photoelectric sensor can accurately and quickly detect whether the scanning system 22 moves to the preset target bearing position.

[0033] Specifically, in one exemplary embodiment, the model of the photoelectric sensor is OPB943W51Z. It should be noted that, as can be understood by those skilled in the art, the present invention does not impose too many restrictions on the model of the photoelectric sensor, and it is only necessary that when the scanning system 22 moves to the preset target bearing position, the photoelectric sensor can transmit the second signal voltage to the control system 21.

[0034] Further, the scanning system 22 includes an ion beam scanner (not shown in the figure) for scanning the ion beam to the wafer 101, a scanning frame (not shown in the figure) for carrying and fixing the ion beam scanner, and a transmission structure (not shown in the figure) connected to the ion beam scanner, and the pedometer 101 is connected to the transmission structure; the transmission structure is used to drive the ion beam scanner to move along the Y-axis direction, and the pedometer 14 is used to detect the real-time motion position information of the ion beam scanner; the fixing member 231 is installed on the scanning frame, and the sensor 232 is fixedly connected to the fixing member 231. Therefore, the pedometer 14 is connected to the transmission structure, and the movement steps and position information of the ion beam scanner in the Y-axis direction can be detected. By installing the fixing member 231 on the scanning frame to fix the sensor 232, when the ion beam scanner moves to the preset target bearing position, the sensor 232 can be triggered by a signal.

[0035] Exemplarily, the fixing member 231 is installed at the bottom of the scanning frame, and the sensor 232 fixedly connected to the fixing member 231 is located near the end of the travel of the scanning frame. It should be noted that the utility model does not impose too many restrictions on the specific installation position of the sensor 232 on the scanning system 22, and it is only necessary that the sensor 232 can be triggered by a signal when the ion beam scanner moves to the preset target bearing position.

[0036] Preferably, the fixing member 231 includes an L-shaped bracket 2311, one branch of the L-shaped bracket 2311 is provided with a fixing hole 23111 for fixed connection with the scanning frame, and the other branch of the L-shaped bracket 2311 is provided with a connecting hole 23112 for corresponding connection with the sensor 232. Thus, the sensor 232 is installed through the L-shaped bracket 2311, so that the sensor 232 can be more stably connected to the scanning frame, thereby improving the accuracy of the measurement result of the sensor 232.

[0037] Specifically, the scanning frame is provided with a mounting hole (not shown in the figure), and the L-shaped bracket 2311 is fixedly connected to the scanning frame through the fixing hole 23111, the mounting hole and bolts (not shown in the figure); the sensor 232 is provided with a through hole (not shown in the figure), and the L-shaped bracket 2311 is fixedly connected to the sensor 232 through the connecting hole 23112, the through hole and bolts.

[0038] Furthermore, the L-shaped bracket 2311 is made of nickel-plated iron plate, thereby improving the corrosion resistance and wear resistance of the L-shaped bracket 2311.

[0039] Preferably, two L-shaped brackets 2311 are provided, one branch of each L-shaped bracket 2311 is fixed to the scanning frame, and the other branch of each L-shaped bracket 2311 is fixedly connected to the sensor 232. Thus, the sensor 232 can be more firmly connected to the scanning frame.

[0040] In summary, the ion implanter with a position offset detection device provided by the utility model has the following advantages: the ion implanter provided by the utility model comprises a wafer carrier for carrying and fixing a wafer, a conveying component for conveying the wafer, a control system connected to the conveying component, a scanning system for controlling the scanning movement of an ion beam to perform ion implantation on the wafer, a pedometer connected to the scanning system, and a position offset detection device installed on the scanning system; the pedometer and the position offset detection device are both connected to the control system; the pedometer is configured to: detect the real-time motion position information of the scanning system, and generate a first signal voltage from the real-time motion position information and transmit it to the control system; the position offset detection device is configured to: transmit a second signal voltage to the control system when the scanning system moves to a preset target carrying position; the control system is configured to: control the conveying component to convey the wafer when the received first signal voltage is the same as the second signal voltage; and display an alarm when the received first signal voltage is different from the second signal voltage, and control the conveying component to stop conveying the wafer. Therefore, the ion implanter provided by the utility model can detect the real-time motion position information of the scanning system by connecting a pedometer to the scanning system; by connecting the pedometer to the control system, the acquired real-time motion position information of the scanning system can be generated into a first signal voltage and transmitted to the control system, which lays a foundation for improving the accuracy of the relative position between the scanning system and the wafer. By installing a position offset detection device on the scanning system, it can detect whether the scanning system moves to the preset target bearing position; by connecting the position offset detection device to the control system, it can transmit a second signal voltage to the control system when the scanning system moves to the preset target bearing position, which lays a foundation for improving the accuracy of the relative position between the scanning system and the wafer. By setting up a control system to receive a first signal voltage from a pedometer and a second signal voltage from a position offset detection device, the pedometer and the position offset detection device can be used simultaneously to detect whether the scanning system has moved to a preset target carrying position; by connecting the transmission component to the control system, when the received first signal voltage is the same as the second signal voltage, the control system can control the transmission component to transmit the wafer, thereby improving the accuracy of the relative position between the scanning system and the wafer; when the received first signal voltage is different from the second signal voltage, the control system can display an alarm and control the transmission component to stop transmitting the wafer, so that the operator can promptly discover the abnormal state of the ion implanter, thereby avoiding problems such as collision of the wafer transmission and uneven wafer doping resulting in product scrapping when the pedometer is abnormal.

[0041] Furthermore, the position shift detection device includes a fixing part installed on the scanning system and a sensor installed on the fixing part; the sensor is connected to the control system, and the sensor is configured such that when the scanning system moves to the preset target bearing position, the sensor is triggered by a signal and transmits the second signal voltage to the control system. Therefore, the ion implanter provided by the utility model can ensure that the sensor is evenly stressed by installing a fixing part on the scanning system to make the measurement result of the sensor more accurate, thereby further improving the accuracy of the relative position between the scanning system and the wafer.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model.

Claims

1. An ion implanter, characterized in that: The ion implanter includes a wafer carrier for carrying and fixing a wafer, a conveying assembly for conveying the wafer, a control system connected to the conveying assembly, a scanning system for controlling the scanning movement of an ion beam to perform ion implantation on the wafer, a pedometer connected to the scanning system, and a position deviation detection device installed on the scanning system; The pedometer and the position deviation detection device are both connected to the control system; The pedometer is configured to: detect the real-time motion position information of the scanning system, and generate a first signal voltage from the real-time motion position information and transmit it to the control system; The position deviation detection device is configured to: transmit a second signal voltage to the control system when the scanning system moves to a preset target bearing position; The control system is configured to: when the first signal voltage received is the same as the second signal voltage, control the conveying component to convey the wafer; when the first signal voltage received is different from the second signal voltage, display an alarm and control the conveying component to stop conveying the wafer.

2. The ion implanter according to claim 1, wherein: The position deviation detection device includes a fixing part installed on the scanning system and a sensor installed on the fixing part; the sensor is connected to the control system, and the sensor is configured as follows: when the scanning system moves to the preset target carrying position, the sensor is triggered by a signal and transmits the second signal voltage to the control system.

3. The ion implanter according to claim 2, characterized in that: The control system comprises a transmission controller, the pedometer and the sensor are both connected to the signal-bearing port of the transmission controller, and the output end of the transmission controller is connected to the transmission component.

4. The ion implanter according to claim 2, characterized in that: The sensor comprises a photoelectric sensor.

5. The ion implanter according to claim 2, characterized in that: The scanning system includes an ion beam scanner for scanning an ion beam to the wafer, a scanning frame for carrying and fixing the ion beam scanner, and a transmission structure connected to the ion beam scanner, and the pedometer is connected to the transmission structure; the transmission structure is used to drive the ion beam scanner to move along the Y-axis direction, and the pedometer is used to detect real-time movement position information of the ion beam scanner; the fixing part is installed on the scanning frame, and the sensor is fixedly connected to the fixing part.

6. The ion implanter according to claim 5, characterized in that: The fixing member is installed at the bottom of the scanning frame.

7. The ion implanter according to claim 5, characterized in that: The fixing member comprises an L-shaped bracket, one branch of the L-shaped bracket is provided with a fixing hole for fixed connection with the scanning frame, and the other branch of the L-shaped bracket is provided with a connecting hole for corresponding connection with the sensor.

8. The ion implanter according to claim 7, characterized in that: The L-shaped bracket is made of nickel-plated iron plate.

9. The ion implanter according to claim 7, characterized in that: Two L-shaped brackets are provided.

10. The ion implanter according to any one of claims 1 to 9, characterized in that: The conveying assembly includes a conveying arm and a driving motor for driving the conveying arm to move, and the control system is connected to the driving motor.

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