Thinning device and thickness measuring mechanism

By using non-contact thickness gauge and lifting mechanism in the thickness measurement mechanism, the problem of inability to adapt to wafers of different thicknesses in the prior art is solved, and the height adjustable measurement function and high-precision measurement effect are achieved, reducing costs.

CN222749438UActive Publication Date: 2025-04-11JIANGSU JCA ELECTRONICS TECH CO LTD
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202420707896.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-08
Publication Date
2025-04-11
Estimated Expiration
2034-04-08

AI Technical Summary

Technical Problem

In the prior art, fixed measurement sensors cannot meet the wafer processing needs of different thicknesses, especially in the wafer thinning process, and the wafer thickness cannot be effectively measured and adjusted.

Method used

A thickness measuring mechanism including a non-contact thickness gauge and a lifting mechanism is designed. The lifting mechanism of the non-contact thickness gauge is driven by the lifting mechanism, and the height of the thickness gauge is adjusted according to actual needs to meet the wafer measurement needs of different thicknesses.

Benefits of technology

The function of adjusting the height of the thickness gauge according to actual needs is realized, meeting the wafer measurement needs of different thicknesses, improving measurement accuracy and flexibility. At the same time, the self-locking function is realized through a reducer with a large reduction ratio, avoiding the need for the motor to hold the brake and saving costs.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222749438U_ABST
    Figure CN222749438U_ABST
Patent Text Reader

Abstract

The utility model discloses a thinning device and a thickness measuring mechanism, the thinning device comprises a thickness measuring mechanism, the thickness measuring mechanism comprises a non-contact thickness gauge, the non-contact thickness gauge is connected with a sensor support, the sensor support is connected on a lifting mechanism which drives the sensor support to lift, the lifting mechanism comprises a lead screw, and the lead screw is connected with the non-contact thickness gauge. The lead screw is arranged on the fixing frame in a self-rotating mode, a movable nut of the lead screw is connected with a lifting block, the lifting block is connected with the sensor support, the upper end of the lead screw is connected with an output shaft of a speed reducer, and an input shaft of the speed reducer is connected with a driving piece. According to the utility model, the non-contact thickness gauge is arranged on the lifting mechanism, the lifting mechanism can drive the non-contact thickness gauge to lift, and the height of the non-contact thickness gauge can be adjusted according to actual needs so as to meet the requirement that a workpiece to be measured is in the optimal measurement range of the sensor.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the field of semiconductor device processing, in particular to a thinning device and a thickness measuring mechanism. Background Art

[0002] The thinning device is a device for thinning wafers.

[0003] During the wafer thinning process, a thickness measuring mechanism will be used to measure whether the thickness of the wafer meets the requirements.

[0004] The invention patent with the authorization announcement number CN115229591B discloses a contact thickness measurement system, which is difficult to use for a multi-sheet thinning process.

[0005] The invention patent application with application publication number CN117161942A discloses a non-contact thickness measurement system, in which the height of the position of the measuring sensor is fixed.

[0006] However, in actual processing, the thickness of the wafers to be processed often varies. Therefore, fixed measurement sensors cannot meet the processing needs of wafers of different thicknesses. Utility Model Content

[0007] The purpose of the utility model is to solve the above problems existing in the prior art and to provide a thinning device and a thickness measuring mechanism.

[0008] The purpose of the utility model is achieved through the following technical solutions:

[0009] The thinning device comprises a thickness measuring mechanism, wherein the thickness measuring mechanism comprises a non-contact thickness gauge, wherein the non-contact thickness gauge is connected to a sensor bracket, wherein the sensor bracket is connected to a lifting mechanism for driving the sensor bracket to rise and fall, wherein the lifting mechanism comprises a lead screw, wherein the lead screw is rotatably arranged on a fixed frame and a movable nut of the lead screw is connected to a lifting block, wherein the lifting block is connected to the sensor bracket, wherein the upper end of the lead screw is connected to an output shaft of a reducer, and an input shaft of the reducer is connected to a driving member.

[0010] Preferably, in the thinning device, the sensor bracket is of multiple types and each sensor bracket is adapted to a non-contact thickness gauge, and the sensor bracket is detachably arranged on the lifting block.

[0011] Preferably, in the thinning device, the sensor bracket is connected to the lifting block by magnetic attraction.

[0012] Preferably, in the thinning device, the lifting block is connected to two guide members on the fixed frame located on both sides of the lead screw.

[0013] Preferably, in the thinning device, the reduction ratio of the reducer is not less than 60.

[0014] Preferably, in the thinning device, the driving member is a manual operating member or a motor.

[0015] The thickness measuring mechanism comprises a non-contact thickness gauge, the non-contact thickness gauge is connected to a sensor bracket, the sensor bracket is connected to a lifting mechanism driving the sensor bracket to rise and fall, the lifting mechanism comprises a lead screw, the lead screw is rotatably arranged on a fixed frame, and the movable nut of the lead screw is connected to a lifting block, the lifting block is connected to the sensor bracket, the upper end of the lead screw is connected to the output shaft of a reducer, and the input shaft of the reducer is connected to a driving member.

[0016] Preferably, in the thickness measuring mechanism, the sensor brackets are of multiple types and each type of sensor bracket is adapted to a non-contact thickness gauge, and the sensor brackets are connected to the lifting block by magnetic attraction.

[0017] Preferably, in the thickness measuring mechanism, the lifting block is connected to two guide members on the fixed frame and located on both sides of the lead screw.

[0018] Preferably, in the thickness measuring mechanism, the reduction ratio of the reducer is not less than 60.

[0019] The advantages of the technical solution of the utility model are mainly reflected in:

[0020] The utility model arranges the non-contact thickness gauge on a lifting mechanism, can drive the non-contact thickness gauge to rise and fall through the lifting mechanism, and can adjust the height of the non-contact thickness gauge according to actual needs to ensure that the workpiece to be measured is within the optimal measuring range of the sensor.

[0021] The utility model can achieve micron-level control accuracy through the simple structure of the drive, reducer and screw rod. At the same time, the large reduction ratio of the reducer has a self-locking function, thereby eliminating the need for a motor brake, which is beneficial to cost saving and the overall structure occupies a small space.

[0022] The utility model performs dual guidance on the lifting block through two guide shafts, thereby increasing the stability and precision of the movement of the lifting block.

[0023] The utility model can conveniently meet the installation requirements of non-contact thickness gauges of different types and from different manufacturers by arranging a plurality of sensor brackets adapted to different non-contact thickness gauges, which is conducive to improving the flexibility of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a side view of the thickness measuring mechanism of the utility model;

[0025] Figure 2It is an end view of the thickness measuring mechanism of the utility model. DETAILED DESCRIPTION

[0026] The purpose, advantages and features of the present invention will be illustrated and explained through the non-limiting description of the following preferred embodiments. These embodiments are only typical examples of the application of the technical solution of the present invention, and any technical solution formed by equivalent replacement or equivalent transformation falls within the scope of protection claimed by the present invention.

[0027] In the description of the scheme, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0028] Example 1

[0029] The thinning device disclosed by the utility model is described below in conjunction with the accompanying drawings, which includes a thickness measuring mechanism, as shown in the attached drawings. Figure 1 , Attachment Figure 2 As shown, the thickness measuring mechanism includes a non-contact thickness gauge 100. The non-contact thickness gauge 100 may be a known non-contact thickness measuring sensor, which is not limited here.

[0030] The non-contact thickness gauge 100 is connected to the sensor bracket 200, and the sensor bracket 200 is connected to the lifting mechanism 300 that drives it to rise and fall. The lifting mechanism 300 includes a lead screw 310, and the lead screw 310 is rotatably arranged on a fixed frame 320 and the movable nut of the lead screw 310 is connected to the lifting block 330, and the lifting block is connected to the sensor bracket 200. The upper end of the lead screw 310 is connected to the output shaft of the reducer 340 through a coupling 360, and the input shaft of the reducer 340 is connected to the driving member 350.

[0031] The structure of the sensor bracket 200 can be designed as needed. Preferably, the sensor bracket 200 is of multiple types and each sensor bracket is compatible with a non-contact thickness gauge 100. The sensor bracket 200 is connected to the lifting block 330 by magnetic attraction. Correspondingly, a magnet is provided on the sensor bracket 200. The lifting block 330 is made of a material that can be adsorbed by a magnet. The sensor bracket 200 can be easily replaced by magnetic attraction. At the same time, the installation position of the sensor bracket 200 can be easily adjusted by magnetic attraction to meet the needs of subsequent equipment assembly.

[0032] In order to better limit the movement of the lifting block, a guide shaft is inserted into the lifting block, and the guide shafts are two and symmetrically distributed on both sides of the lead screw 310, and the guide shafts are fixed on the fixing frame 320. Of course, in other embodiments, the lifting block 330 can also be connected to the guide rail 400 fixed on the fixing frame 320 to guide the lifting block.

[0033] Furthermore, in order to avoid unmanned operation, the reduction ratio of the reducer is not less than 60. Preferably, the reduction ratio of the reducer is between 60-85. This can ensure locking when there is no operation and facilitate manual adjustment as much as possible.

[0034] The driving member 350 can be selected as needed. In one feasible manner, the driving member 350 can be a motor connected to the upper end of the screw of the lead screw 310, and the corresponding adjustment can be performed by manually controlling the start and stop of the motor. Of course, in other embodiments, the driving member 350 can be a manual operating member connected to the screw of the lead screw 310, and the manual operating member can be a round wheel coaxially connected to the screw, or an operating rod vertically plugged into the upper end of the screw.

[0035] When working, the driving member 350 is a manual operating member, for example. The operator rotates the manual operating member, thereby driving the screw of the lead screw 310 to rotate, and the movable nut of the lead screw 310 drives the lifting block 330 to move up and down, thereby driving the sensor bracket 200 and the non-contact thickness gauge 100 set on the sensor bracket 200 to move up and down, so that the non-contact thickness gauge 100 moves to a suitable detection height. When the manual operating member stops rotating, the reducer can play a self-locking role due to its large reduction ratio, thereby preventing the manual operating member from rotating due to equipment vibration.

[0036] Example 2

[0037] This embodiment discloses a thickness measuring mechanism, which can be used in addition to a thinning machine, and can also be used in other equipment that requires thickness measurement. Figure 1As shown, it includes a non-contact thickness gauge 100, the non-contact thickness gauge 100 is connected to a sensor bracket 200, the sensor bracket 200 is connected to a lifting mechanism 300 that drives it to rise and fall, the lifting mechanism 300 includes a lead screw 310, the lead screw 310 is rotatably arranged on a fixed frame 320 and the movable nut of the lead screw 310 is connected to a lifting block 330, the lifting block is connected to the sensor bracket 200, the upper end of the lead screw 310 is connected to the output shaft of a reducer 340, and the input shaft of the reducer 340 is connected to a driving member 350.

[0038] The non-contact thickness gauge 100 is connected to the sensor bracket 200, and the sensor bracket 200 is connected to the lifting mechanism 300 that drives it to rise and fall. The lifting mechanism 300 includes a lead screw 310, and the lead screw 310 is rotatably arranged on a fixed frame 320 and the movable nut of the lead screw 310 is connected to the lifting block 330, and the lifting block is connected to the sensor bracket 200. The upper end of the lead screw 310 is connected to the output shaft of the reducer 340, and the input shaft of the reducer 340 is connected to the driving member 350.

[0039] The structure of the sensor bracket 200 can be designed as needed. Preferably, the sensor bracket 200 is of multiple types and each sensor bracket is compatible with a non-contact thickness gauge 100. The sensor bracket 200 is connected to the lifting block 330 by magnetic attraction. Correspondingly, a magnet is provided on the sensor bracket 200. The lifting block 330 is made of a material that can be adsorbed by a magnet. The sensor bracket 200 can be easily replaced by magnetic attraction. At the same time, the installation position of the sensor bracket 200 can be easily adjusted by magnetic attraction to meet the needs of subsequent equipment assembly.

[0040] In order to better limit the movement of the lifting block, a guide shaft is inserted into the lifting block, and the guide shafts are two and symmetrically distributed on both sides of the lead screw 310, and the guide shafts are fixed on the fixing frame 320. Of course, in other embodiments, the lifting block 330 can also be connected to the guide rail 400 fixed on the fixing frame 320 to guide the lifting block.

[0041] Furthermore, in order to avoid unmanned operation, the reduction ratio of the reducer is not less than 60. Preferably, the reduction ratio of the reducer is between 60-85. This can ensure locking when there is no operation and facilitate manual adjustment as much as possible.

[0042] The driving member 350 can be selected as needed. In one feasible manner, the driving member 350 can be a motor connected to the upper end of the screw of the lead screw 310, and the corresponding adjustment can be performed by manually controlling the start and stop of the motor. Of course, in other embodiments, the driving member 350 can be a manual operating member connected to the screw of the lead screw 310, and the manual operating member can be a round wheel coaxially connected to the screw, or an operating rod vertically plugged into the upper end of the screw.

[0043] There are many implementation methods of the utility model, and all technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of the utility model.

Claims

1. A thinning device, comprising a thickness measuring mechanism, wherein the thickness measuring mechanism comprises a non-contact thickness gauge, characterized in that The non-contact thickness gauge is connected to a sensor bracket, and the sensor bracket is connected to a lifting mechanism that drives the sensor bracket to rise and fall. The lifting mechanism includes a lead screw, and the lead screw is rotatably arranged on a fixed frame and the movable nut of the lead screw is connected to a lifting block, and the lifting block is connected to the sensor bracket. The upper end of the lead screw is connected to the output shaft of the reducer, and the input shaft of the reducer is connected to the driving member.

2. The thinning device according to claim 1, characterized in that: The sensor brackets are of multiple types and each type of sensor bracket is adapted to a non-contact thickness gauge. The sensor brackets are detachably arranged on the lifting block.

3. The thinning device according to claim 2, characterized in that: The sensor bracket is connected to the lifting block by magnetic attraction.

4. The thinning device according to claim 1, characterized in that: The lifting block is connected to two guide members on the fixing frame and located at two sides of the lead screw.

5. The thinning device according to claim 1, characterized in that: The reduction ratio of the reducer is not less than 60.

6. The thinning device according to any one of claims 1 to 5, characterized in that: The driving member is a manual operating member or a motor.

7. A thickness measuring device, including a non-contact thickness gauge, characterized in that The non-contact thickness gauge is connected to a sensor bracket, and the sensor bracket is connected to a lifting mechanism that drives the sensor bracket to rise and fall. The lifting mechanism includes a lead screw, and the lead screw is rotatably arranged on a fixed frame and the movable nut of the lead screw is connected to a lifting block, and the lifting block is connected to the sensor bracket. The upper end of the lead screw is connected to the output shaft of the reducer, and the input shaft of the reducer is connected to the driving member.

8. The thickness measuring mechanism according to claim 7, characterized in that: There are multiple types of sensor brackets, each of which is compatible with a non-contact thickness gauge. The sensor brackets are connected to the lifting block by magnetic attraction.

9. The thickness measuring mechanism according to claim 7, characterized in that: The lifting block is connected to two guide members on the fixing frame and located at two sides of the lead screw.

10. The thickness measuring mechanism according to claim 7, characterized in that: The reduction ratio of the reducer is not less than 60.

Citation Information

Patent Citations

  • A thinning machine and control method thereof

    CN115229591B

  • Ultrathin silicon wafer thinning and polishing equipment and technology

    CN117161942A