Wafer transfer device

Abstract

The utility model belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to a wafer transfer device, which comprises a first module, a second module and a third module, the first module comprises a first sucker and a first movable assembly, and the first movable assembly drives the first sucker to move transversely; the second module is arranged above the first module, the second module comprises a second suction cup, a second movable assembly, a third movable assembly and a fourth movable assembly, the second movable assembly, the third movable assembly and the fourth movable assembly are all arranged beside the second suction cup, and the second movable assembly drives the second suction cup to move vertically; the third movable assembly drives the second sucker to move transversely, and the fourth movable assembly drives the second sucker to move longitudinally. According to the utility model, through the above arrangement, the second sucker can move in the vertical, transverse and longitudinal dimensions, and the flexibility of wafer transfer is improved. And meanwhile, the first module is arranged to be matched with the second module, the transferring range is further expanded, and the flexibility is higher.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor manufacturing equipment, and in particular relates to a wafer transfer device. Background Art

[0002] In the semiconductor chip manufacturing process, it is necessary to tear off the grinding protection film on the front of the wafer after the grinding and thinning process, and bond the wafer and the support ring together by cutting the film to protect the wafer in the process flow, assist in positioning during wafer processing, and support during wafer transmission. In the traditional method, these two processes are completed by separate equipment. In this case, the wafer must be loaded through a multi-layer storage container and then transported between separate equipment. However, with the continuous development of the semiconductor industry, the thickness of the wafer is getting smaller and smaller, and the diameter tends to become larger and larger. Ultra-thin wafers may drop in the center and deform due to their own weight in the transport storage container, making it difficult to automatically remove them from the transport storage container.

[0003] Chinese patent application publication number CN114695191A discloses a belt mounter, on which a wafer transfer mechanism is arranged, and the wafer transfer mechanism includes a suction pad, a suction pad moving mechanism and a suction pad up and down moving mechanism, which vacuum absorbs the wafer through the suction pad, and drives the suction pad to move longitudinally through the suction pad moving mechanism, and the suction pad up and down driving mechanism drives the suction pad to move vertically. Although it can realize the transfer of wafers between devices to a certain extent, the flexibility is low. Therefore, it is necessary to improve the existing technology to solve the above problems. Utility Model Content

[0004] The utility model aims to provide a wafer transfer device, aiming to solve the technical problem of low flexibility of wafer transfer equipment in the prior art.

[0005] To achieve the above-mentioned purpose, the present invention provides a wafer transfer device, comprising:

[0006] A first module, the first module comprising a first suction cup and a first movable component, the first movable component drives the first suction cup to move horizontally;

[0007] The second module is arranged above the first module, the second module includes a second suction cup, a second movable component, a third movable component and a fourth movable component, the second movable component, the third movable component and the fourth movable component are all arranged on the side of the second suction cup, the second movable component drives the second suction cup to move vertically, the third movable component drives the second suction cup to move horizontally, and the fourth movable component drives the second suction cup to move longitudinally.

[0008] As a preferred embodiment, the second suction cup includes a disc surface, a bracket, a buffer spring and a suction cup driving mechanism; the disc surface is provided with a plurality of second suction holes for adsorbing wafers; the bracket is arranged above the disc surface; the buffer spring connects the disc surface and the bracket; the suction cup driving mechanism drives the bracket to move vertically so that the disc surface absorbs the wafer.

[0009] As a preferred embodiment, the first movable component includes a base, a guide rail, a movable skateboard and a skateboard driving mechanism; the guide rail is arranged on the surface of the base; the movable skateboard can be arranged on the guide rail for transverse movement; the skateboard driving mechanism is arranged on the base and drives the movable skateboard to move transversely.

[0010] As a preferred solution, a limit member and a limit sensor are also provided on the base; the limit member is located in the forward direction of the movable skateboard so that the movable skateboard can move laterally within a limited range; the limit sensor is arranged on the side of the limit member.

[0011] As a preferred solution, the lower end of the second movable component is connected to the second suction cup, and drives the second suction cup to move vertically; the third movable component is connected to the upper end of the second movable component, and drives the second movable component to move horizontally; the fourth movable component is connected to the side of the third movable component, and drives the third movable component to move longitudinally.

[0012] As a preferred solution, the second module further includes a movable arm, which is arranged transversely, one end of the movable arm is connected to the lower end of the second movable component, and the other end of the movable arm is connected to the second suction cup.

[0013] As a preferred solution, a plurality of positioning holes are arranged at intervals on the movable arm, and the positioning holes are vertically arranged and arranged along the extension direction of the movable arm.

[0014] As a preferred solution, the fourth movable component includes two screw rods, two slides and two longitudinal driving mechanisms; the two screw rods are arranged side by side and in parallel; the two slides are respectively arranged on the two screw rods, and the two ends of the third movable component are respectively connected to the two slides; the two longitudinal driving mechanisms drive the two screw rods to rotate so that the two slides move synchronously.

[0015] The above one or more technical solutions in the wafer transfer device provided by the embodiment of the utility model have at least one of the following technical effects:

[0016] The utility model provides a second movable component, a third movable component and a fourth movable component, so that the second suction cup can move in three dimensions, namely vertically, horizontally and longitudinally, thereby improving the flexibility of wafer transfer. At the same time, by providing the first movable component and the first suction cup to cooperate with the second module, the range of transfer is further expanded, and the flexibility is higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] Figure 1 A schematic diagram of the overall structure of a wafer transfer device provided in an embodiment of the utility model;

[0019] Figure 2 A schematic diagram of the structure of the wafer transfer device in use state provided by an embodiment of the utility model;

[0020] Figure 3 A schematic diagram of the structure of the first module provided in an embodiment of the utility model;

[0021] Figure 4 A partial structural diagram of a second module provided in an embodiment of the utility model;

[0022] Figure 5 A schematic structural diagram of a second suction cup provided in an embodiment of the utility model.

[0023] Among them, the reference numerals in the figure are:

[0024] 100-first module; 101-first air suction hole; 110-first suction cup; 120-first movable member; 121-base; 122-guide rail; 123-movable slide; 124-slide drive mechanism; 125-limiting member; 126-limiting sensor;

[0025] 200-second module; 201-second air suction hole; 202-positioning hole; 210-second suction cup; 211-disc surface; 212-bracket; 213-buffer spring; 214-suction cup drive mechanism; 220-second movable component; 230-third movable component; 240-fourth movable component; 241-screw rod; 242-slide seat; 243-longitudinal drive mechanism; 250-movable arm. DETAILED DESCRIPTION

[0026] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0027] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0029] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0030] In one embodiment of the present invention, Figure 1-Figure 5 As shown, a wafer transfer device is provided, including a first module 100 and a second module 200 , wherein the second module 200 is disposed above the first module 100 .

[0031] like Figure 3 As shown, the first module 100 includes a first suction cup 110 and a first movable component 120 , and the first movable component 120 drives the first suction cup 110 to move horizontally.

[0032] Specifically, the surface of the first suction cup 110 is provided with a plurality of first suction holes 101 for vacuum adsorption of wafers. The first movable assembly 120 includes a base 121, a guide rail 122, a movable slide 123 and a slide driving mechanism 124. The guide rail 122 is provided on the surface of the base 121, and the movable slide 123 can be laterally movable on the guide rail 122; the slide driving mechanism 124 is provided on the base 121 and drives the movable slide 123 to move laterally.

[0033] Furthermore, a limit member 125 and a limit sensor 126 are also provided on the base 121. The limit member 125 is located in the forward direction of the moving slide 123 so that the moving slide 123 can move laterally within a limited range; the limit sensor 126 is provided on the side of the limit member 125. In this embodiment, there are two limit members 125 and two limit sensors 126, and the two limit members 125 and the two limit sensors 126 are provided at both ends of the moving direction of the moving slide 123.

[0034] The second module 200 includes a second suction cup 210, a second movable assembly 220, a third movable assembly 230 and a fourth movable assembly 240, wherein the second movable assembly 220, the third movable assembly 230 and the fourth movable assembly 240 are all arranged beside the second suction cup 210. The second movable assembly 220 drives the second suction cup 210 to move vertically, the third movable assembly 230 drives the second suction cup 210 to move horizontally, and the fourth movable assembly 240 drives the second suction cup 230 to move longitudinally.

[0035] Specifically, Figure 5 As shown, the second suction cup 210 includes a disk surface 211, a bracket 212, a buffer spring 213 and a suction cup driving mechanism 214. The disk surface 211 is provided with a plurality of second suction holes 201 for sucking wafers. The bracket 212 is arranged above the disk surface 211. The buffer spring 213 connects the disk surface 211 and the bracket 212, and is used to provide a buffer when the disk surface 211 abuts against the wafer for leveling to prevent damage to the wafer. The suction cup driving mechanism 214 drives the bracket 212 to move vertically so that the disk surface 211 sucks the wafer.

[0036] Specifically, the lower end of the second movable component 220 is connected to the second suction cup 210, and drives the second suction cup 210 to move vertically. The third movable component 230 is connected to the upper end of the second movable component 220, and drives the second movable component 220 to move horizontally; the fourth movable component 240 is connected to the side of the third movable component 230, and drives the third movable component 230 to move longitudinally.

[0037] The fourth movable assembly 240 includes two screw rods 241, two slides 242 and two longitudinal drive mechanisms 243. The two screw rods 241 are arranged in parallel. The two slides 242 are respectively arranged on the two screw rods 242. The two ends of the third movable assembly 230 are respectively connected to the two slides 242 to enhance the stability and accuracy of the third movable assembly 230 during movement. The two longitudinal drive mechanisms 243 drive the two screw rods 241 to rotate so that the two slides 242 move synchronously.

[0038] Furthermore, the second module 200 further includes a moving arm 250, which is disposed horizontally, one end of which is connected to the lower end of the second movable component 220, and the other end of which is connected to the second suction cup 210. By providing the moving arm 250, the second module 200 can expand the wafer transfer range, which is not limited to the range directly below the second module 200. In this embodiment, a plurality of positioning holes 202 are disposed at intervals on the moving arm 250, and the positioning holes 202 are disposed vertically and arranged along the extension direction of the moving arm 250.

[0039] In this embodiment, the skateboard driving mechanism 124 is a cylinder, the second driving assembly 220 is driven by a motor, the third driving assembly 230 is driven by a motor, the longitudinal driving mechanism 243 is a motor, and the suction cup driving mechanism 214 is a cylinder. The above is only a preferred solution, as long as a similar driving effect can be achieved, including but not limited to using a motor, a cylinder, a hydraulic cylinder and other driving solutions.

[0040] When this embodiment is used, the wafer is first sucked onto the first suction cup 110 through an external device, and the first movable component 120 drives the first suction cup 110 to move horizontally, so that the wafer moves to the bottom of the second module 200. The second movable component 220, the third movable component 230 and the fourth movable component 240 cooperate with each other, so that the second suction cup 210 moves to the top of the first suction cup 110. The suction cup driving mechanism 214 drives the bracket 212 to press down, so that the disk surface 211 flattens the wafer surface and sucks the wafer, and the second movable component 220, the third movable component 230 and the fourth movable component 240 cooperate with each other to move the wafer to other stations for processing.

[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer transfer device, characterized in that: include: A first module, the first module comprising a first suction cup and a first movable component, the first movable component drives the first suction cup to move horizontally; The second module is arranged above the first module, the second module includes a second suction cup, a second movable component, a third movable component and a fourth movable component, the second movable component, the third movable component and the fourth movable component are all arranged on the side of the second suction cup, the second movable component drives the second suction cup to move vertically, the third movable component drives the second suction cup to move horizontally, and the fourth movable component drives the second suction cup to move longitudinally.

2. The wafer transfer device according to claim 1, characterized in that: The second suction cup includes a disc surface, a bracket, a buffer spring and a suction cup driving mechanism; the disc surface is provided with a plurality of second suction holes for adsorbing wafers; the bracket is arranged above the disc surface; the buffer spring connects the disc surface and the bracket; the suction cup driving mechanism drives the bracket to move vertically so that the disc surface absorbs the wafer.

3. The wafer transfer device according to claim 1, characterized in that: The first movable component includes a base, a guide rail, a movable skateboard and a skateboard driving mechanism; the guide rail is arranged on the surface of the base; the movable skateboard can be arranged on the guide rail for transverse movement; the skateboard driving mechanism is arranged on the base and drives the movable skateboard to move transversely.

4. The wafer transfer device according to claim 3, characterized in that: A limit member and a limit sensor are also provided on the base; the limit member is located in the forward direction of the movable slide plate so that the movable slide plate can move laterally within a limited range; the limit sensor is provided on the side of the limit member.

5. The wafer transfer device according to any one of claims 1 to 4, characterized in that: The lower end of the second movable component is connected to the second suction cup and drives the second suction cup to move vertically; the third movable component is connected to the upper end of the second movable component and drives the second movable component to move horizontally; the fourth movable component is connected to the side of the third movable component and drives the third movable component to move longitudinally.

6. The wafer transfer device according to claim 5, characterized in that: The second module also includes a moving arm, which is arranged horizontally, one end of the moving arm is connected to the lower end of the second movable component, and the other end of the moving arm is connected to the second suction cup.

7. The wafer transfer device according to claim 6, characterized in that: A plurality of positioning holes are arranged at intervals on the moving arm, and the positioning holes are vertically arranged and arranged along the extending direction of the moving arm.

8. The wafer transfer device according to claim 5, characterized in that: The fourth movable component includes two screw rods, two slides and two longitudinal driving mechanisms; the two screw rods are arranged side by side and in parallel; the two slides are respectively arranged on the two screw rods, and the two ends of the third movable component are respectively connected to the two slides; the two longitudinal driving mechanisms drive the two screw rods to rotate so that the two slides move synchronously.

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