Wafer transfer device

Abstract

The utility model provides a wafer transfer device, which comprises a working table on which a first driving assembly and a second driving assembly are arranged; the adsorption assembly comprises a supporting seat and a vacuum adsorption part used for adsorbing a wafer; the first driving assembly is in driving connection with the supporting seat; the vacuum adsorption part is rotationally arranged on the supporting seat; the conveying assembly comprises a lifting seat and a material taking device used for taking out the wafers; the second driving assembly is in driving connection with the lifting base, and the second direction is perpendicular to the first direction; and the pushing assembly is arranged on the workbench. A wafer is fixedly adsorbed through a vacuum adsorption part, a first driving assembly drives a supporting base to move in the first direction till a material taking device on a lifting base can take out the wafer and jack up the wafer, and then a second driving assembly drives the lifting base to move in the second direction till the wafer is at the same height as a pushing assembly and a target storage position in a material receiving area. And the wafer is accurately pushed to the target storage position through the pushing assembly.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor equipment, and more specifically, relates to a wafer transfer device. Background Art

[0002] Wafers are the basic materials for manufacturing various types of semiconductor chips. They are used to make the circuit patterns and functional components of the chip on the surface of the wafer. Then, through a series of process steps, integrated circuit chips are manufactured, which are widely used in various electronic products.

[0003] Some current wafer transfer devices only use robotic arms to transfer multiple wafers to the storage area, which can easily cause deviations in the storage position and height of the wafers, resulting in the inability to accurately transport the wafers to the receiving area, affecting the overall production efficiency. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a wafer transfer device to solve the technical problem in the prior art that wafers are difficult to accurately transport to a receiving area.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted in the embodiment of the present application is to provide a wafer transfer device, which includes:

[0006] A wafer transfer device, comprising:

[0007] A workbench, wherein a first drive assembly and a second drive assembly are arranged on the workbench;

[0008] The adsorption assembly includes a support seat and a vacuum adsorption part for adsorbing the wafer; the first driving assembly is drivingly connected to the support seat, and is used to drive the support seat to move along a first direction; the vacuum adsorption part is rotatably arranged on the support seat;

[0009] A conveying assembly, the conveying assembly comprising a lifting seat and a material picker for taking out wafers; the second driving assembly is drivingly connected to the lifting seat, and is used to drive the lifting seat to move along a second direction, and the second direction is perpendicular to the first direction;

[0010] A pushing component is arranged on the workbench and is used for pushing the wafer taken out from the material picker to the material receiving area.

[0011] Optionally, the material picker includes two sliding seats and two material picking parts respectively arranged on each of the sliding seats. A third driving component is arranged on the top of the lifting seat. The third driving component is connected to the driving of each of the sliding seats and is used to drive each of the material picking parts to move along a third direction. The third direction is arranged perpendicular to the second direction.

[0012] Optionally, the third driving assembly includes a third driver and a third guide rail disposed on the lifting seat and parallel to the third direction; each of the sliding seats is movably disposed on the third guide rail, and the third driver is drivingly connected to each of the sliding seats.

[0013] Optionally, each of the material taking parts is a guide bar, and each of the guide bars is symmetrically arranged; each of the guide bars is provided with a track for guiding the wafer into the material receiving area.

[0014] Optionally, a rotating seat and a fourth driving assembly for driving the rotating seat to rotate in a circumferential direction are provided on the support seat, and the vacuum adsorption part is detachably provided on the top of the rotating seat.

[0015] Optionally, a limit assembly is provided on the support seat to limit the rotation range of the rotating seat.

[0016] Optionally, the limiting assembly includes an abutment portion provided on the rotating seat and a cam follower provided on the supporting seat;

[0017] When the rotating seat rotates until the abutting portion abuts against the cam follower, the rotating seat is positioned.

[0018] Optionally, the first driving assembly includes a first driver and a first guide rail disposed on the workbench and parallel to the first direction; the second driving assembly includes a second driver and a second guide rail disposed on the workbench and parallel to the second direction;

[0019] The support seat is movably arranged on the first guide rail, and the first driver is drivingly connected to the support seat; the lifting seat is movably arranged on the second guide rail, and the second driver is drivingly connected to the lifting seat.

[0020] Optionally, the adsorption assembly further includes a heater disposed in the vacuum adsorption portion, for heating the vacuum adsorption portion that adsorbs the wafer, so as to soften the protective adhesive film on the wafer.

[0021] Optionally, the pushing assembly includes a fifth driving assembly, a pushing seat and a pushing block arranged on the pushing seat; the fifth driving assembly is drivingly connected to the pushing seat to drive the pushing seat to move to push the wafer into the material receiving area through the pushing block.

[0022] The wafer transfer device provided in the embodiment of the present application has at least the following beneficial effects:

[0023] The wafer is fixedly adsorbed by the vacuum adsorption part, and the first driving component drives the supporting base to move along the first direction until the material remover on the lifting base can take out the wafer and lift it up. Subsequently, the second driving component drives the lifting base to move along the second direction until the wafer is at the same height as the pushing component and the target storage position in the material receiving area, and the wafer is accurately pushed to the target storage position by the pushing component. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0025] Figure 1 A three-dimensional diagram of a wafer transfer device in some embodiments of the present application;

[0026] Figure 2 A three-dimensional diagram of an adsorption component in some embodiments of the present application;

[0027] Figure 3 A three-dimensional diagram of a rotating seat and a fourth driving assembly in some embodiments of the present application;

[0028] Figure 4 A three-dimensional diagram of a position limiting assembly in some embodiments of the present application;

[0029] Figure 5 A perspective view of a conveying assembly in some embodiments of the present application;

[0030] Figure 6 This is a stereoscopic diagram of a pushing component in some embodiments of the present application.

[0031] Numbers in the figure

[0032] 1. Workbench; 11. First drive assembly; 111. First driver; 112. First guide rail; 12. Second drive assembly; 121. Second driver; 122. Second guide rail; 2. Adsorption assembly; 21. Support seat; 211. Rotating seat; 212. Fourth drive assembly; 2121. Driving wheel; 2122. Driven wheel; 2123. Transmission belt; 22. Vacuum adsorption part; 3. Conveying assembly; 31. Lifting seat; 32. Material picker; 321. Sliding seat; 322. Material picker; 3221. Track; 33. Third drive assembly; 331. Third driver; 332. Third guide rail; 4. Push assembly; 41. Push seat; 411. Push block; 42. Fifth drive assembly; 5. Limit assembly; 51. Abutment part; 52. Cam follower; 53. Guide rail. DETAILED DESCRIPTION

[0033] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0034] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0035] It should be noted that when an element is referred to as being “fixed to” or “disposed on” another element, it may be directly on the other element or indirectly on the other element.

[0036] When an element is referred to as being “connected to” another element, it can be directly connected to the other element or indirectly connected to the other element.

[0037] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0039] In the description of the present application, “plurality” means two or more than two, unless otherwise clearly and specifically defined.

[0040] In order to solve the technical problem that it is difficult to accurately transport wafers to the receiving area, which affects the overall production efficiency; for this purpose, please refer to Figures 1 to 6 , the wafer transfer device provided in the embodiment of the present application is now described.

[0041] refer to Figure 1 As shown, the wafer transfer device of the present application includes a workbench 1 and an adsorption component 2, a conveying component 3 and a pushing component 4 arranged on the workbench 1.

[0042] A first driving assembly 11 and a second driving assembly 12 are also provided on the workbench 1 ; specifically, the first driving assembly 11 is provided on the top of the workbench 1 , and the second driving assembly 12 is provided on the side of the workbench 1 .

[0043] The adsorption assembly 2 includes a support seat 21 and a vacuum adsorption portion 22 for adsorbing wafers; the first driving assembly 11 is drivingly connected to the support seat 21 to drive the support seat 21 to move along a first direction; the vacuum adsorption portion 22 is rotatably disposed on the support seat 21.

[0044] Specifically, the vacuum adsorption part 22 is used to fix and adsorb the wafer to prevent the wafer from shaking during the film tearing or labeling process. In this process, in order to meet the position and angle requirements of the film tearing or labeling of the wafer, the vacuum adsorption part 22 can be controlled to rotate to different angles along the circumferential direction, and then the vacuum adsorption device is fixed so that the tearing mechanism or the labeling mechanism can perform film tearing or labeling on the wafer. After the film tearing and labeling are completed, the first driving component 11 drives the support seat 21 to move along the first direction so that the vacuum adsorption device adsorbed on the wafer moves close to the conveying component 3, and then the vacuum adsorption device releases the wafer so that the conveying component 3 can lift the wafer. In this way, the first driving component 11 drives the support seat 21 to move back and forth along the first direction so that multiple wafers can be pushed into the receiving area.

[0045] It can be understood that the first direction of the embodiment of the utility model is the moving direction of the support seat 21 approaching or moving away from the conveying component 3.

[0046] It should be noted that since the vacuum pump is connected to the vacuum adsorption part 22 through the exhaust pipe, when the vacuum adsorption part 22 is attached to the wafer, the air between the vacuum adsorption part 22 and the wafer is extracted by the vacuum pump to make its pressure lower than the external atmospheric pressure, thereby forming a vacuum adsorption area. Due to the pressure difference between the vacuum adsorption area and the external atmospheric pressure, an adsorption force is generated, thereby achieving fixed adsorption of the wafer; conversely, when releasing the wafer, gas is injected into the vacuum environment to increase its pressure to make it basically the same as the external atmospheric pressure. Since the tendency of gas molecules to move to the low-pressure area is reduced, the adsorption force is reduced, thereby achieving the release of the wafer.

[0047] refer to Figure 5 As shown, the conveying assembly 3 includes a lifting seat 31 and a material picker 32 for taking out wafers; the second driving assembly 12 is drivingly connected to the lifting seat 31, and is used to drive the lifting seat 31 to move along the second direction, and the second direction is perpendicular to the first direction.

[0048] Specifically, when the vacuum adsorption part 22 moves close to the conveying component 3, the second driving component 12 is controlled to drive the lifting seat 31 to move along the second direction until the material picker 32 arranged on the lifting seat 31 can lift the wafer to make the wafer leave the vacuum adsorption part 22; then, the second driving component 12 is controlled to drive the lifting seat 31 to move along the second direction until the wafer is close to the material receiving area; this arrangement avoids the situation where the wafer has deviations in the storage position and height.

[0049] In some optional embodiments, the position of the material receiving area of ​​the embodiment of the utility model is higher than the top surface of the workbench 1 or lower than the top surface of the workbench 1; for example, if the position of the material receiving area is lower than the top surface of the workbench 1, when the material picker 32 takes out the wafer and lifts it up, the second drive component 12 drives the lifting seat 31 to move down until the wafer is close to the material receiving area.

[0050] It can be understood that the second direction of the embodiment of the utility model is the moving direction along which the lifting seat 31 rises or falls.

[0051] The push assembly 4 is disposed on the workbench 1, and is used to push the wafer taken out from the material picker 32 to the receiving area. Specifically, when the lifting platform 31 moves downward until the wafer is close to the receiving area, since the wafer is at the same height as the push assembly 4 and the target storage position in the receiving area, the push assembly 4 can push the wafer to the receiving area, so that the wafer can be accurately stored in the target storage position.

[0052] refer to Figure 6 As shown, specifically, the pushing assembly 4 of the embodiment of the utility model includes a fifth driving assembly 42, a pushing seat 41 and a pushing block 411 arranged on the pushing seat 41; the fifth driving assembly 42 is drivingly connected to the pushing seat 41, and is used to drive the pushing seat 41 to move to push the wafer into the material receiving area through the pushing block 411.

[0053] Specifically, when the material picker 32 takes out the wafer and moves it through the lifting seat 31 to the same height as the wafer, the pushing seat 41 and the target storage position in the receiving area, at this time, the second drive assembly 12 drives the pushing seat 41 to move along the direction of the receiving area until the wafer is pushed to the target storage position by the pushing block 411.

[0054] It can be understood that the fifth drive component 42 of the embodiment of the utility model includes a rodless cylinder and a piston connected to the pushing seat 41; there are multiple chambers inside the rodless cylinder. When the rodless cylinder is working, high-pressure gas is introduced into one of the chambers, and low-pressure gas is discharged from other chambers, so that the air pressure is balanced between the chambers. After the air pressure is balanced between the chambers, the elastic force on the piston balances the air pressure, so that the piston maintains stable linear motion without external interference, so as to drive the pushing seat 41 to move along the direction of the material receiving area.

[0055] In a specific embodiment, the first driving component 11 includes a first driver 111 and a first guide rail 112 arranged on the workbench 1 and parallel to the first direction; the second driving component 12 includes a second driver 121 and a second guide rail 122 arranged on the workbench 1 and parallel to the second direction; the support seat 21 is movably arranged on the first guide rail 112, and the first driver 111 is drivingly connected to the support seat 21; the lifting seat 31 is movably arranged on the second guide rail 122, and the second driver 121 is drivingly connected to the lifting seat 31.

[0056] Specifically, by moving the support base 21 to be set on the first guide rail 112 and moving the lifting base 31 to be set on the second guide rail 122, the first driver 111 drives the support base 21 and the second driver 121 drives the lifting base 31 to move along the target path, preventing the support base 21 and the lifting base 31 from deviating from the first direction and the second direction respectively, and improving the smoothness of the support base 21 and the lifting base 31 during movement.

[0057] It should be noted that the first guide rail 112 and the second guide rail 122 of the embodiment of the utility model are respectively provided with one or more than two, which is not specifically limited.

[0058] To sum up the above, the wafer is fixedly adsorbed by the vacuum adsorption part 22, and the first driving component 11 drives the supporting seat 21 to move along the first direction until the material remover 32 on the lifting seat 31 can take out the wafer and lift it up. Subsequently, the second driving component 12 drives the lifting seat 31 to move along the second direction until the wafer and the pushing component 4 and the target storage position in the material receiving area are at the same height, and the wafer is accurately pushed to the target storage position by the pushing component 4.

[0059] In order to fix the wafer and prevent it from shaking before it is pushed to the receiving area, refer to Figure 5 As shown, in a specific embodiment, the material picker 32 includes two sliding seats 321 and two material picking parts 322 respectively arranged on each sliding seat 321, and a third driving component 33 is arranged on the top of the lifting seat 31. The third driving component 33 is drivingly connected to each sliding seat 321 and is used to drive each material picking part 322 to move along a third direction, and the third direction is arranged perpendicular to the second direction.

[0060] It can be understood that the third direction of the embodiment of the present invention is the moving direction of the two sliding seats 321 moving closer to or away from each other.

[0061] Specifically, when the vacuum absorber adsorbed on the wafer moves close to the conveying component 3 (material picker 32), the two sliding seats 321 are driven to move in the direction of approaching or moving away from each other by the third driving component 33 until the distance between the two sliding seats 321 can be used to lift the top of the wafer at the same time by the two material pickers 32. Subsequently, the lifting seat 31, during the process of rising or falling, synchronously drives the wafer to rise or fall until the wafer is pushed to the target storage position in the receiving area by the pushing component 4.

[0062] It should be noted that the distance between the two sliding seats 321 can be set specifically according to the outer diameter of the wafer, that is, by controlling the distance between the two sliding seats 321, the spacing distance between the opposite sides of the two pickers 32 can be slightly larger than the outer diameter of the wafer, thereby ensuring that the two pickers 32 can lift the top of the wafer (not clamped on the wafer).

[0063] refer to Figure 5 As shown, in a further embodiment, the third driving assembly 33 includes a third driver 331 and a third guide rail 332 arranged on the lifting seat 31 and parallel to the third direction; each sliding seat 321 is movably arranged on the third guide rail 332, and the third driver 331 is drivingly connected to each sliding seat 321.

[0064] Specifically, since the two sliding seats 321 are both movably arranged on the third guide rail 332, each sliding seat 321 can move along the target path, ensuring the smoothness of the third driver 331 when driving each sliding seat 321 to move, and avoiding the two sliding seats 321 from being unstable during movement.

[0065] It should be noted that the third guide rails 332 of the embodiment of the utility model are provided with one or more than two, which is not specifically limited.

[0066] In some optional embodiments, the third driver 331 can drive the two sliding seats 321 to move simultaneously in the direction of approaching or moving away, or the third driver 331 drives the first sliding seat 321 to move in the direction of the second sliding seat 321, and the second sliding seat 321 is fixed. The specific implementation method is not limited.

[0067] It can be understood that the first driver 111, the second driver 121 and the third driver 331 of the embodiment of the utility model all include a cylinder barrel, a piston, a piston rod connected to the sliding seat 321 and a seal; when the air source is turned on, the compressed air enters the cylinder barrel through the air inlet, the pressure in the cylinder barrel increases, and the piston moves outward. During the air intake process, a high-pressure air chamber is formed on the rear side of the piston, so that the piston is subjected to a thrust to push it toward one end of the piston rod, thereby realizing mechanical movement. Conversely, during the air discharge process, when the air source stops supplying air or the exhaust valve is opened, the compressed air inside the cylinder is discharged through the air outlet, the pressure in the cylinder barrel decreases, and the piston moves inward under the force of the external load.

[0068] refer to Figure 5 As shown, in a further embodiment, each material taking portion 322 is a guide bar, and each guide bar is symmetrically arranged; each guide bar is provided with a track 3221 for guiding the wafer to the material receiving area.

[0069] Specifically, when the vacuum absorber adsorbed on the wafer moves close to the conveying component 3, the two sliding seats 321 move close to each other until the wafer is lifted up through the bottom surface of the track 3221 on the guide bar, and then the lifting seat 31 is lifted and moved until the extension direction of the two tracks 3221 is at the same height as the target storage position in the receiving area; when the pushing component 4 pushes the wafer, since the two tracks 3221 are arranged in parallel, the wafer can be smoothly transported to the target storage position under the guiding action of the two tracks 3221.

[0070] refer to Figure 2 As shown, in a specific embodiment, a rotating seat 211 and a fourth driving assembly 212 for driving the rotating seat 211 to rotate circumferentially are disposed on the supporting seat 21 , and the vacuum adsorption portion 22 is detachably disposed on the top of the rotating seat 211 .

[0071] Specifically, when the vacuum suction part 22 fixes and absorbs the wafer, the fourth driving component 212 drives the rotating seat 211 to rotate circumferentially, so that the wafer absorbed by the vacuum suction part 22 can be rotated to different angles in the circumferential direction, thereby meeting various film tearing or labeling requirements on the wafer in terms of position and angle.

[0072] refer to Figure 3As shown, it can be understood that the fourth driving component 212 of the embodiment of the utility model includes a motor, a driving wheel 2121, a driven wheel 2122 and a transmission belt 2123; the driving wheel 2121 is sleeved on the output shaft of the motor, and the inner side of the transmission belt is simultaneously wound around the outer sides of the driving wheel 2121 and the driven wheel 2122, and the driven wheel 2122 is arranged on the rotating seat 211; the driving wheel 2121 is driven to rotate by the output shaft of the motor, and the driven wheel 2122 is rotated under the action of the transmission belt 2123, thereby driving the rotating seat 211 to rotate in the circumferential direction.

[0073] As time goes by, the vacuum adsorption disk is gradually damaged due to excessive use or long-term exposure to the air (the vacuum adsorption disk comes into contact with pollutants (such as dust, oil, etc.) affecting the adsorption capacity). Therefore, the vacuum adsorption part 22 of the embodiment of the utility model can be disassembled and removed from the top of the rotating seat 211, so as to facilitate the replacement of the new vacuum adsorption part 22.

[0074] It is understandable that, in some optional embodiments, the vacuum adsorption portion 22 is detachably mounted on the top of the rotating seat 211 by means of snaps or threads, and the specific method is not limited.

[0075] refer to Figure 2 As shown, in a specific embodiment, a limiting component 5 is provided on the support seat 21 to limit the rotation range of the rotating seat 211 .

[0076] Specifically, in order to limit the range of circumferential rotation of the rotating seat 211 and prevent the angle error of the wafer from causing confusion when tearing the film or labeling, when the wafer is driven to rotate to the target angle, the rotating seat 211 is fixed through the action of the limit assembly 5 to prevent the rotating seat 211 from continuing to rotate circumferentially.

[0077] refer to Figure 4 As shown, specifically, the limiting assembly 5 includes an abutting portion 51 disposed on the rotating seat 211 and a cam follower 52 disposed on the supporting seat 21; when the rotating seat 211 rotates until the abutting portion 51 abuts against the cam follower 52, the rotating seat 211 is positioned.

[0078] Specifically, the abutment portion 51 is arranged on the rotating seat 211. When the rotating seat 211 rotates in the circumferential direction, the abutment portion 51 is synchronously driven to rotate in the rotation direction of the rotating seat 211. Since part of the cam follower 52 is located in the rotating circular trajectory of the abutment portion 51, when the abutment portion 51 rotates in the circumferential direction to a certain range, it can abut against the cam follower 52. Under the obstruction of the cam follower 52, the rotating seat 211 is prevented from continuing to rotate. Such an arrangement can fix the wafer at the current angle, and at the same time, the positioning accuracy of the rotating seat 211 is improved through the effect of the abutment portion 51 being blocked by the cam follower 52.

[0079] It should be noted that a guide rail 53 is provided on the support seat 21, and the bottom of the cam follower 52 is movably provided on the guide rail 53; thereby, the position of the cam follower 52 can be adjusted according to different angle requirements so that the rotating seat 211 can be fixed at different angles.

[0080] In a specific embodiment, the adsorption assembly 2 further includes a heater disposed in the vacuum adsorption portion 22 for heating the vacuum adsorption portion 22 that adsorbs the wafer, so as to soften the protective film on the wafer.

[0081] Specifically, since a layer of protective adhesive film is attached to the surface of the wafer, when the vacuum absorber is fixedly adsorbed on the wafer, the vacuum adsorption part 22 is heated by the heater. At this time, the protective soft glue on the wafer is gradually transferred to the entire protective soft glue under the influence of high temperature, making it gradually soft, so that the entire protective soft glue on the wafer can be peeled off; at the same time, it can also increase the thermal contact area between the wafer and the vacuum absorber, further enhancing the adsorption force on the wafer.

[0082] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A wafer transfer device, characterized in that: The wafer transfer device comprises: A workbench, wherein a first drive assembly and a second drive assembly are arranged on the workbench; The adsorption assembly includes a support seat and a vacuum adsorption part for adsorbing the wafer; the first driving assembly is drivingly connected to the support seat, and is used to drive the support seat to move along a first direction; the vacuum adsorption part is rotatably arranged on the support seat; A conveying assembly, the conveying assembly comprising a lifting seat and a material picker for taking out wafers; the second driving assembly is drivingly connected to the lifting seat, and is used to drive the lifting seat to move along a second direction, and the second direction is perpendicular to the first direction; A pushing component is arranged on the workbench and is used for pushing the wafer on the material picker to the material receiving area.

2. The wafer transfer device according to claim 1, characterized in that: The material picker includes two sliding seats and two material picking parts respectively arranged on each of the sliding seats. A third driving component is arranged on the top of the lifting seat. The third driving component is drivingly connected to each of the sliding seats and is used to drive each of the material picking parts to move along a third direction. The third direction is arranged perpendicular to the second direction.

3. The wafer transfer device according to claim 2, characterized in that: The third driving assembly includes a third driver and a third guide rail disposed on the lifting seat and parallel to the third direction; each of the sliding seats is movably disposed on the third guide rail, and the third driver is drivingly connected to each of the sliding seats.

4. The wafer transfer device according to claim 2, characterized in that: Each of the material taking parts is a guide bar, and each of the guide bars is symmetrically arranged; each of the guide bars is provided with a track for guiding the wafer to the material receiving area.

5. The wafer transfer device according to any one of claims 1 to 4, characterized in that: The support seat is provided with a rotating seat and a fourth driving assembly for driving the rotating seat to rotate in a circumferential direction, and the vacuum adsorption part is detachably arranged on the top of the rotating seat.

6. The wafer transfer device according to claim 5, characterized in that: A limiting component is arranged on the support seat to limit the rotation range of the rotating seat.

7. The wafer transfer device according to claim 6, characterized in that: The limiting assembly includes an abutment portion disposed on the rotating seat and a cam follower disposed on the supporting seat; When the rotating seat rotates until the abutting portion abuts against the cam follower, the rotating seat is positioned.

8. The wafer transfer device according to any one of claims 1 to 4, characterized in that: The first driving assembly includes a first driver and a first guide rail disposed on the workbench and parallel to the first direction; the second driving assembly includes a second driver and a second guide rail disposed on the workbench and parallel to the second direction; The support seat is movably arranged on the first guide rail, and the first driver is drivingly connected to the support seat; the lifting seat is movably arranged on the second guide rail, and the second driver is drivingly connected to the lifting seat.

9. The wafer transfer device according to any one of claims 1 to 4, characterized in that: The adsorption assembly also includes a heater disposed in the vacuum adsorption portion, which is used to heat the vacuum adsorption portion that adsorbs the wafer so as to soften the protective adhesive film on the wafer.

10. The wafer transfer device according to any one of claims 1 to 4, characterized in that: The pushing assembly includes a fifth driving assembly, a pushing seat and a pushing block arranged on the pushing seat; the fifth driving assembly is drivingly connected to the pushing seat and is used to drive the pushing seat to move to push the wafer into the receiving area through the pushing block.

Images