Back glue film pasting supporting device and back glue film pasting machine

Abstract

The utility model relates to a back glue film pasting supporting device which comprises a machine base, a supporting table mechanism and a film pasting workbench structure. The supporting table mechanism comprises a first vacuum attachment disc mechanism, a second vacuum attachment disc mechanism, movable supporting plates and a guide rail frame, the guide rail frame is arranged on the upper end face of the machine base, the movable supporting plates are erected at the two ends of the guide rail frame respectively, and the first vacuum attachment disc mechanism and the second vacuum attachment disc mechanism are arranged on the movable supporting plates respectively. The film pasting workbench structure is arranged between the guide rail frames, and the lower end of the film pasting workbench structure is fixed to the machine base. According to the device provided by the utility model, during film pasting, a wafer is conveyed to a position right below the film pasting workbench structure by utilizing the first vacuum attachment disc mechanism, and the first vacuum attachment disc mechanism ascends to enable the upper surface of the wafer to be flush with the upper surface of the film pasting workbench structure; and under the attachment action of the second vacuum attachment disc mechanism, the bottom film of the wafer subjected to film pasting is stripped, the film pasting workbench structure is moved away, the next round of film pasting is carried out, and the working efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging equipment, in particular to a back-adhesive film sticking support device and a back-adhesive film sticking machine. Background Art

[0002] Backside Coating Tape is mainly used in the WLCSP (Wafer-Level Chip-Scale Package) process as a special non-substrate film to protect and reinforce the back of the wafer, suppress light and reduce adverse effects on the circuit surface. It consists of three layers: base film (isolation protective film), back film and cover film (isolation protective film). After the wafer is ground and before cutting, the back film is attached to the back of the wafer to improve the wafer strength and reduce the occurrence of fragments during cutting. Laser product identification can be performed directly on the wafer surface after the film is attached.

[0003] In the prior art, the adhesive film is pasted by first peeling off the cover film of the adhesive film, then sending the bottom film and the adhesive film to the wafer film pasting station, cutting the adhesive film into the pasting area and the residual area through the cutting mechanism, then peeling off the residual area of ​​the adhesive film through the peeling mechanism, and then pasting the pasting area of ​​the adhesive film on the wafer. However, in the process of gradually pressing the adhesive film to the surface of the wafer, manual assistance is required for loading and unloading. At the same time, the adhesive film is easy to be pasted with the wafer before vacuuming, resulting in gas residue. The residual gas cannot be completely squeezed out during vacuuming and pressurization, and the adhesive film cannot be tightly fitted to the back of the wafer. Small bubbles are formed on the back of the wafer, which may lead to the risk of edge collapse and residual adhesive in the product, affecting the quality of cutting. Summary of the invention

[0004] In order to overcome the shortcomings and deficiencies in the prior art, the purpose of the utility model is to provide a support device for adhesive-backed film laminating, wherein the support device for adhesive-backed film laminating is provided with a first vacuum attachment plate mechanism and a second vacuum attachment plate mechanism which can slide along the guide rail frame on the guide rail frame. When laminating, the wafer is first placed on the first vacuum attachment plate mechanism with a heating function, and the wafer is transported to the bottom of the film laminating workbench structure by driving the first driving module to move horizontally. The attachment plate of the first vacuum attachment plate mechanism moves upward to the inlet of the film laminating workbench structure, and the base film and the adhesive-backed film are attached to the surface of the wafer. After the wafer is laminating, wait for the first vacuum attachment plate mechanism to move horizontally, and then the wafer is laminating. The attachment plate mechanism leaves the film laminating workbench structure, and is driven by the second driving module to move the second vacuum attachment plate mechanism horizontally to the bottom of the film laminating workbench structure, and utilizes the vacuum attachment effect to peel off the bottom film of the wafer that has completed the film laminating and move it away from the bottom of the film laminating workbench structure to complete one film laminating and enter the next round of film laminating; furthermore, the first vacuum attachment plate mechanism can make the upper surface of wafers of different thicknesses flush with the upper surface of the film laminating workbench structure, so that the protective layer can be completely attached to the wafer surface to avoid the bubble problem in the film laminating process. At the same time, it can also shorten the preparation time between two film laminating cycles to improve work efficiency.

[0005] Another purpose of the utility model is to provide a self-adhesive film laminating machine, which adopts a self-adhesive film laminating support device, which greatly improves the working efficiency during the self-adhesive film laminating process and can also effectively avoid the bubble problem that occurs during the film laminating process.

[0006] The purpose of the utility model is achieved through the following technical scheme: a self-adhesive film supporting device, comprising a machine base, and a support platform mechanism and a film pasting workbench structure arranged at the machine base; the support platform mechanism comprises a first vacuum attachment plate mechanism with a heating function, a second vacuum attachment plate mechanism without a heating function, a group of movable support plates and a group of guide rail frames, the two guide rail frames are arranged in parallel on the upper end surface of the machine base, the two movable support plates are respectively mounted on the two ends of the guide rail frames, and the movable support plates can slide along the guide rail frames, the first vacuum attachment plate mechanism is arranged on the movable support plate, and the second vacuum attachment plate mechanism is arranged on the other movable support plate, the film pasting workbench structure is arranged between the two guide rail frames, and the first vacuum attachment plate mechanism and the second vacuum attachment plate mechanism are respectively located on both sides of the film pasting workbench structure along the extension direction of the guide rail frames, and the lower end of the film pasting workbench structure is fixed in the machine base.

[0007] Furthermore, a first driving module and a second driving module are respectively provided on the inner side of the guide rail frame, the first driving module is used to drive the first vacuum attachment plate mechanism to move along the guide rail frame, and the second driving module is used to drive the second vacuum attachment plate mechanism to move along the guide rail frame; the first driving module and the second driving module both adopt linear driving modules.

[0008] Furthermore, the first vacuum attachment plate mechanism and the second vacuum attachment plate mechanism each include an attachment plate, an attachment plate base, a movable plate, a longitudinal drive motor, a lifting motor, a set of slide rails and at least two sets of linear bearings, the upper end surface of the attachment plate base is concavely provided with an annular vacuum channel, the upper end surface of the attachment plate base is also provided with a positioning pin, the lower end of the attachment plate is provided with a positioning hole corresponding to the positioning pin, the attachment plate is arranged on the upper end surface of the attachment plate base, the positioning pin is embedded in the positioning hole, the two slide rails are arranged in parallel on the upper end surface of the movable support plate, the movable plate is slidably arranged on the slide rails, and the linear bearings penetrate The movable plate is passed through and fixed to the movable plate, and the upper end of the linear bearing is fixed to the lower end surface of the attachment plate base. The movable support plate is provided with a fine-tuning hole corresponding to the linear bearing and the lifting motor. The lower end of the linear bearing passes through the fine-tuning hole. The upper end of the lifting motor passes through the fine-tuning hole and is fixed to the movable plate, and the power output end of the lifting motor is connected to the lower end surface of the attachment plate base. The longitudinal drive motor is arranged on the movable support plate and is located on one side of the slide rail. The power output end of the longitudinal drive motor is connected to the movable plate, and the longitudinal drive motor can drive the movable plate to move along the slide rail.

[0009] Furthermore, a vacuum switch is also provided on the upper end surface of the movable support plate.

[0010] Furthermore, a plurality of sensors are provided on the lower end surface of the attachment plate base, and the sensors are evenly arranged on the lower end surface of the attachment plate base.

[0011] Furthermore, the film pasting workbench structure includes a film pasting platform, a first mounting base plate, a second mounting base plate, a first lifting mechanism, a second lifting mechanism and a group of fixed seats, the film pasting platform is provided with a feeding port corresponding to the attachment disk, the first mounting base plate is fixed in the machine base, the first lifting mechanism is fixed to the upper end surface of the first mounting base plate, the second lifting mechanism is arranged at the power output end of the first lifting mechanism, the second mounting base plate is arranged at the power output end of the second lifting mechanism, the film pasting platform is mounted above the guide rail frame, and the lower end portion of the film pasting platform frame is fixed to the upper end surface of the second mounting base plate, and the fixed seats are respectively arranged on both sides of the guide rail frame for limiting the film pasting platform.

[0012] Furthermore, a plurality of support shafts are provided on the lower end surface of the film sticking platform, and the lower ends of the support shafts pass through the fixing seat and are fixed to the second mounting base plate.

[0013] Furthermore, the first lifting mechanism includes a lifting frame and a first cylinder, the first cylinder is fixed to the upper end surface of the first mounting base plate, the lifting frame is located on one side of the first cylinder, the power output end of the first cylinder can drive the lifting frame to move in the vertical direction, and the second lifting mechanism is fixed to the upper end of the lifting frame.

[0014] Furthermore, the second lifting mechanism includes a fixed frame and a second cylinder, the second cylinder is fixed to the upper end surface of the lifting frame and fixed inside the fixed frame, the power output end of the second cylinder is fixed to the second mounting base plate, and the second cylinder can drive the second mounting base plate to move in the vertical direction.

[0015] The utility model also provides a back-adhesive film pasting machine, and a back-adhesive film pasting supporting device is installed on the machine base.

[0016] The beneficial effects of the utility model are as follows: the adhesive film support device of the utility model is provided with a first vacuum attachment plate mechanism and a second vacuum attachment plate mechanism which can slide along the guide rail frame on the guide rail frame. When attaching the film, the wafer is first placed on the first vacuum attachment plate mechanism with a heating function, and the wafer is transported to the bottom of the film attaching workbench structure by driving the first driving module to move horizontally. The attachment plate of the first vacuum attachment plate mechanism moves upward to the inlet of the film attaching workbench structure, and the base film and the adhesive film are attached to the surface of the wafer. After the wafer is attached, the first vacuum attachment plate mechanism leaves the film attaching workbench structure. The second driving module drives the second vacuum attachment plate mechanism to move horizontally to the bottom of the film laminating workbench structure, and utilizes the vacuum attachment effect to peel off the bottom film of the wafer that has completed the film laminating and move it away from under the film laminating workbench structure to complete one film laminating and enter the next round of film laminating; furthermore, the first vacuum attachment plate mechanism can make the upper surface of wafers of different thicknesses flush with the upper surface of the film laminating workbench structure, so that the protective layer can be completely attached to the wafer surface to avoid the problem of bubbles in the film laminating process. At the same time, it can also shorten the preparation time between two film laminating cycles to improve work efficiency.

[0017] The utility model discloses a self-adhesive film laminating machine, which greatly improves the working efficiency during the process of self-adhesive film laminating and can also effectively avoid the problem of bubbles occurring during the process of film laminating. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional structural schematic diagram of the device of the utility model;

[0019] Figure 2 It is a structural schematic diagram of the support platform mechanism of the utility model;

[0020] Figure 3 It is a structural schematic diagram of the first vacuum attachment disk mechanism of the utility model;

[0021] Figure 4 It is an exploded schematic diagram of the first vacuum attachment plate mechanism of the utility model;

[0022] Figure 5 It is a structural schematic diagram of the film sticking workbench structure of the utility model;

[0023] Figure 6 It is a structural schematic diagram of the film sticking workbench structure of the utility model from another perspective.

[0024] The accompanying drawings are marked as: 2-support table mechanism, 21-first vacuum attachment plate mechanism, 211-attachment plate, 212-attachment plate base, 213-annular vacuum channel, 214-positioning pin, 215-movable plate, 216-longitudinal drive motor, 217-lifting motor, 218-slide rail 219-linear bearing, 22-second vacuum attachment plate mechanism, 221-vacuum switch, 222-sensor, 23-movable support plate, 24-guide rail frame, 25-first drive module, 26-second drive module, 3-film pasting workbench structure, 31-film pasting platform, 311-feeding port, 32-first mounting base plate, 33-second mounting base plate, 34-first lifting mechanism, 341-lifting frame, 342-first cylinder, 35-second lifting mechanism, 351-fixed frame, 352-second cylinder, 36-fixed seat and 37-support shaft. DETAILED DESCRIPTION

[0025] In order to facilitate the understanding of those skilled in the art, the following embodiments and attached Figure 1-6 To further illustrate the present invention, the contents mentioned in the implementation modes are not intended to limit the present invention.

[0026] It should be noted that when an element is referred to as being “fixed to” or “disposed on” another element, it may be directly on the other element or indirectly on the other element.

[0027] When an element is referred to as being “connected to” another element, it can be directly connected to the other element or indirectly connected to the other element.

[0028] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0030] In the description of the present application, “plurality” means two or more than two, unless otherwise clearly and specifically defined.

[0031] See Figure 1-6 , a back-adhesive film support device comprises a machine base, and a support platform mechanism 2 and a film pasting workbench structure 3 arranged at the machine base; the support platform mechanism 2 comprises a first vacuum attachment plate mechanism 21 with a heating function, a second vacuum attachment plate mechanism 22 without a heating function, a group of movable support plates 23 and a group of guide rail frames 24, two of the guide rail frames 24 are arranged in parallel on the upper end surface of the machine base, two of the movable support plates 23 are respectively mounted on the two ends of the guide rail frames 24, and the movable support plates 23 can slide along the guide rail frames 24, the first vacuum attachment plate mechanism 21 is arranged on the movable support plate 23, the second vacuum attachment plate mechanism 22 is arranged on the other movable support plate 23, and the film pasting workbench structure 3 is arranged between the two guide rail frames 24, and the first vacuum attachment plate mechanism 21 and the second vacuum attachment plate mechanism 22 are arranged along The extension direction of the guide frame 24 is respectively located on both sides of the film pasting workbench structure 3, and the lower end of the film pasting workbench structure 3 is fixed in the machine base; the inner side of the guide frame 24 is respectively provided with a first driving module 25 and a second driving module 26, the first driving module 25 is used to drive the first vacuum attachment plate mechanism 21 to move along the guide frame 24, and can drive the first vacuum attachment plate mechanism 21 to move along the guide frame 24 to the bottom of the film pasting workbench structure 3 according to the film pasting requirements, and can drive the first vacuum attachment plate mechanism 21 to reset after the film pasting is completed, and the second driving module 26 is used to drive the second vacuum attachment plate mechanism 22 to move along the guide frame 24 to the bottom of the film pasting workbench structure 3 to adsorb and peel off the bottom film of the wafer with the film pasted, and then reset under the drive of the second driving module 26 to realize material unloading; the first driving module 25 and the second driving module 26 both adopt linear driving modules.

[0032] In this embodiment, the first vacuum attachment plate mechanism 21 and the second vacuum attachment plate mechanism 22 each include an attachment plate 211, an attachment plate base 212, a movable plate 215, a longitudinal drive motor 216, a lifting motor 217, a set of slide rails 218 and at least two sets of linear bearings 219. The upper end surface of the attachment plate base 212 is provided with an annular vacuum channel 213 and a positioning pin 214, and the attachment plate 211 is fixed by vacuum negative pressure and the positioning pin 214. The lower end of the attachment plate 211 is provided with a positioning hole (not shown) corresponding to the positioning pin 214. The attachment plate 211 is provided with a positioning hole 213 and a positioning pin 214. The positioning pin 214 is placed on the upper end surface of the attachment plate base 212, and the positioning pin 214 is embedded in the positioning hole. The two slide rails 218 are arranged in parallel on the upper end surface of the movable support plate 23. The movable plate 215 is slidably arranged on the slide rails 218. The linear bearing 219 passes through the movable plate 215 and is fixed to the movable plate 215. The upper end of the linear bearing 219 is fixed to the lower end surface of the attachment plate base 212. The movable support plate 23 is provided with a fine-tuning hole (not shown) corresponding to the linear bearing 219 and the lifting motor 217. The lower end of the linear bearing 219 The upper end of the lifting motor 217 passes through the fine-tuning hole and is fixed to the movable plate 215, and the power output end of the lifting motor 217 is connected to the lower end surface of the attachment plate base 212, and the longitudinal drive motor 216 is arranged on the mobile support plate 23 and is located on one side of the slide rail 218. The power output end of the longitudinal drive motor 216 is connected to the movable plate 215, and the longitudinal drive motor 216 can drive the movable plate 215 to move along the slide rail 218 (the size or position of the attachment plate 211 is identified by the sensor 222). The longitudinal driving motor 216 can be used to drive the movable plate 215 to move relative to the movable support plate 23 to calibrate the position of the attachment plate 211); the vacuum switch 221 is arranged on the upper end surface of the movable support plate 23, and a plurality of sensors 222 are arranged on the lower end surface of the attachment plate base 212. The sensors 222 are evenly arranged on the lower end surface of the attachment plate base 212. The size of the attachment plate 211 is identified by the sensor 222. When the attachment plate 211 needs to be replaced, the vacuum negative pressure is turned on / off by the vacuum switch 221, which facilitates the replacement of the attachment plate 211.

[0033] The adhesive film support device of this embodiment is provided with a first vacuum attachment plate mechanism 21 and a second vacuum attachment plate mechanism 22 which can slide along the guide rail frame 24 on the guide rail frame 24. When attaching the film, the wafer is first placed on the attachment plate 211 of the first vacuum attachment plate mechanism 21 with a heating function. The first driving module 25 drives the first vacuum attachment plate mechanism 21 to move horizontally to transport the wafer to the bottom of the film attaching workbench structure 3. The attachment plate 211 of the first vacuum attachment plate mechanism 21 moves upward to the feeding port 311 of the film attaching workbench structure 3 under the driving action of the lifting motor 217, and the base film and the adhesive film are attached to the surface of the wafer. After the wafer is attached, wait for the first vacuum attachment plate mechanism 21 to leave the film attaching workbench. Structure 3, drives the second vacuum attachment plate mechanism 22 to move horizontally to the bottom of the film sticking workbench structure 3 through the second driving module 26, and utilizes the vacuum attachment effect to peel off the bottom film of the wafer that has completed film sticking and move it away from the bottom of the film sticking workbench structure 3 to complete one film sticking and enter the next round of film sticking; furthermore, the lifting motor 217 can drive the attachment plate 211 and the attachment plate base 212 of the first vacuum attachment plate mechanism 21 to move in the vertical direction, so that the upper surface of wafers of different thicknesses can be flush with the upper surface of the film sticking workbench structure 3, so that the protective layer can be completely attached to the wafer surface, so as to avoid the bubble problem in the film sticking process, and at the same time, it can also shorten the preparation time between two film sticking cycles to improve the operation efficiency.

[0034] In this embodiment, the film pasting workbench structure 3 includes a film pasting platform 31, a first mounting base plate 32, a second mounting base plate 33, a first lifting mechanism 34, a second lifting mechanism 35 and a group of fixed seats 36. The film pasting platform 31 is provided with a material inlet 311 corresponding to the attachment plate 211. The first mounting base plate 32 is fixed in the machine base. The first lifting mechanism 34 is fixed to the upper end surface of the first mounting base plate 32. The second lifting mechanism 35 is arranged at the power output end of the first lifting mechanism 34 and can drive the second lifting mechanism 35 to move upward in the vertical direction. The second mounting base plate 33 is arranged at the power output end of the second lifting mechanism 35 and can drive the second mounting base plate 33 to move upward in the vertical direction as a whole. The lower end surface of the film pasting platform 31 is provided with a plurality of support shafts 37. The lower end of the support shaft 37 passes through the fixed seat 36 and is fixed to the second mounting base plate 33. The film pasting platform 31 is mounted above the guide rail frame 24. The fixed seats 36 are respectively located on both sides of the guide rail frame 24 for limiting the film pasting platform 31.

[0035] In the present embodiment, when laminating, the wafer is transported to the bottom of the laminating platform 31 by the first vacuum attachment plate mechanism 21, and then the attachment plate 211 carrying the wafer and the attachment plate base 212 are synchronously raised to the feed port 311 by the longitudinal drive motor 216 to keep the upper surface of the wafer flush with the upper surface of the laminating platform 31. When laminating the wafer or peeling off the bottom film, the laminating platform 31 rises to assist the film pressing roller / peeling roller of the adhesive laminating machine to evenly contact the wafer surface; and the first lifting mechanism 34 and the second lifting mechanism 35 are set to provide two return strokes to adapt to different product requirements.

[0036] In this embodiment, the first lifting mechanism 34 includes a lifting frame 341 and a first cylinder 342. The first cylinder 342 is fixed to the upper end surface of the first mounting base plate 32. The lifting frame 341 is located on one side of the first cylinder 342. The power output end of the first cylinder 342 can drive the lifting frame 341 to move in the vertical direction. The second lifting mechanism 35 is fixed to the upper end of the lifting frame 341. When the lifting frame 341 is driven to move, the second lifting mechanism 35 can be driven to move together.

[0037] In this embodiment, the second lifting mechanism 35 includes a fixed frame 351 and a second cylinder 352. The second cylinder 352 is fixed to the upper end surface of the lifting frame 341 and fixed in the fixed frame 351. The power output end of the second cylinder 352 is fixed to the second mounting base plate 33, and the second cylinder 352 can drive the second mounting base plate 33 to move in the vertical direction. The first lifting mechanism 34 and the second lifting mechanism 35 are arranged to provide two return strokes to adapt to different product requirements, thereby improving the practicability of the device and greatly improving the film pasting efficiency and quality.

[0038] See Figure 6 A self-adhesive film laminating machine, wherein a self-adhesive film laminating support device is installed on the machine base. The self-adhesive film laminating machine using the self-adhesive film laminating support device greatly improves the operating efficiency during the self-adhesive film laminating process, and can also effectively avoid the bubble problem that occurs during the film laminating process.

[0039] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present invention is within the protection scope of the present invention.

Claims

1. A self-adhesive film support device, comprising a base, characterized in that: The cam frame is provided with a plurality of movable support plates, and the movable support plates are provided with a plurality of movable support plates at the plurality of movable support plates.

2. The adhesive film support device according to claim 1, characterized in that: The first vacuum attachment plate mechanism and the second vacuum attachment plate mechanism each include an attachment plate, an attachment plate base, a movable plate, a longitudinal drive motor, a lifting motor, a set of slide rails and at least two sets of linear bearings, the upper end surface of the attachment plate base is concavely provided with an annular vacuum channel, the upper end surface of the attachment plate base is also provided with a positioning pin, the lower end of the attachment plate is provided with a positioning hole corresponding to the positioning pin, the attachment plate is arranged on the upper end surface of the attachment plate base, the positioning pin is embedded in the positioning hole, the two slide rails are arranged in parallel on the upper end surface of the movable support plate, the movable plate is slidably arranged on the slide rails, and the linear bearings penetrate the The movable plate is fixed to the movable plate, and the upper end of the linear bearing is fixed to the lower end surface of the attachment plate base. The movable support plate is provided with a fine-tuning hole corresponding to the linear bearing and the lifting motor. The lower end of the linear bearing passes through the fine-tuning hole. The upper end of the lifting motor passes through the fine-tuning hole and is fixed to the movable plate, and the power output end of the lifting motor is connected to the lower end surface of the attachment plate base. The longitudinal drive motor is arranged on the movable support plate and is located on one side of the slide rail. The power output end of the longitudinal drive motor is connected to the movable plate, and the longitudinal drive motor can drive the movable plate to move along the slide rail.

3. The adhesive film support device according to claim 2, characterized in that: The upper end surface of the movable support plate is also provided with a vacuum switch.

4. The adhesive film support device according to claim 2, characterized in that: The lower end surface of the attachment plate base is also provided with a plurality of sensors, and the sensors are evenly arranged on the lower end surface of the attachment plate base.

5. The adhesive film support device according to claim 1, characterized in that: A first driving module and a second driving module are respectively provided on the inner side of the guide rail frame. The first driving module is used to drive the first vacuum attachment plate mechanism to move along the guide rail frame, and the second driving module is used to drive the second vacuum attachment plate mechanism to move along the guide rail frame.

6. The adhesive film support device according to claim 2, characterized in that: The film pasting workbench structure includes a film pasting platform, a first mounting base plate, a second mounting base plate, a first lifting mechanism, a second lifting mechanism and a group of fixed seats. The film pasting platform is provided with a material inlet corresponding to the attachment disk. The first mounting base plate is fixed in the machine base, the first lifting mechanism is fixed to the upper end surface of the first mounting base plate, the second lifting mechanism is arranged at the power output end of the first lifting mechanism, and the second mounting base plate is arranged at the power output end of the second lifting mechanism. The film pasting platform is mounted above the guide rail frame, and the lower end of the film pasting platform frame is fixed to the upper end surface of the second mounting base plate. The fixed seats are respectively arranged on both sides of the guide rail frame for limiting the film pasting platform.

7. The adhesive film support device according to claim 6, characterized in that: A plurality of support shafts are disposed on the lower end surface of the film sticking platform, and the lower ends of the support shafts penetrate through the fixing seat and are fixed to the second mounting base plate.

8. The adhesive film support device according to claim 6, characterized in that: The first lifting mechanism includes a lifting frame and a first cylinder. The first cylinder is fixed to the upper end surface of the first mounting base plate. The lifting frame is located on one side of the first cylinder. The power output end of the first cylinder can drive the lifting frame to move in the vertical direction. The second lifting mechanism is fixed to the upper end of the lifting frame.

9. The adhesive film support device according to claim 8, characterized in that: The second lifting mechanism includes a fixed frame and a second cylinder, the second cylinder is fixed to the upper end surface of the lifting frame and fixed in the fixed frame, the power output end of the second cylinder is fixed to the second mounting base plate, and the second cylinder can drive the second mounting base plate to move in the vertical direction.

10. A self-adhesive film laminating machine, characterized in that: The machine base is equipped with the adhesive film support device described in any one of claims 1 to 9.

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