Wafer temporary storage device

Abstract

The utility model discloses a wafer temporary storage device, comprising a box body which is internally provided with a temporary storage cavity used for placing wafers; the liquid spraying mechanism is arranged in the box body, the liquid spraying mechanism is provided with a first spraying hole, and the first spraying hole is configured to face the wafer so as to be used for spraying the two side surfaces of the wafer in the thickness direction; and the driving assembly is used for driving the wafer to rotate. According to the wafer temporary storage device provided by the utility model, the liquid spraying mechanism is arranged in the box body, and the two side surfaces of the wafer in the thickness direction are sprayed by using the liquid spraying mechanism, so that most residual polishing liquid on the surface of the wafer can be washed away, and the residual polishing liquid on the wafer is also in a wet environment; therefore, the crystallization of the polishing solution on the surface of the wafer can be obviously reduced. Meanwhile, the wafer is driven to rotate through the driving assembly, the spraying range of the wafer can be further enlarged, and the washing effect on the residual polishing liquid on the surface of the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer temporary storage device. Background Art

[0002] After the wafer has gone through the chemical mechanical polishing process, there will be residual polishing liquid, particles and other contaminants on the surface. Currently, chemical mechanical polishing equipment on the market all adopts a dry-in-dry-out mode. After the polishing process is completed, the wafer needs to be transferred from the grinding area to the cleaning area for cleaning. The cleaning process usually includes multiple cleaning steps, and each step is designed differently according to different grinding processes, and the corresponding cleaning time is also different.

[0003] In order to improve the wafer transfer efficiency, a temporary storage station is usually set at the input end of the cleaning system to receive contaminated wafers transferred from the grinding area. When the first cleaning station is idle, the wafers in the temporary storage station are transferred in to start the cleaning process.

[0004] There is a certain amount of polishing liquid remaining on the surface of the wafer in the temporary storage station. While the wafer is waiting to be cleaned, it will dry out and produce crystals that are difficult to clean. The edge of the wafer is particularly serious. The hardness of the crystals is relatively high, which has a great impact on the life of the brush used for subsequent cleaning and can easily scratch the wafer surface. Utility Model Content

[0005] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a wafer temporary storage device, which can significantly reduce the crystallization of polishing liquid on the surface of the wafer, and can also increase the spray range of the wafer, improve the washing efficiency of the wafer, so that the wafer surface is always in a moisturizing state.

[0006] According to the utility model, the wafer temporary storage device includes: a box body, which has a temporary storage cavity for placing wafers; a liquid spraying mechanism, which is arranged in the box body, and has a first spray hole, which is configured to be set toward the wafer for spraying the two side surfaces of the wafer in the thickness direction; and a driving component, which is used to drive the wafer to rotate.

[0007] According to the wafer temporary storage device of the utility model, by arranging a liquid spraying mechanism in the box body, using the liquid spraying mechanism to spray the two side surfaces of the wafer in the thickness direction, most of the residual polishing liquid on the wafer surface can be washed away, so that the surface of the wafer is always in a moisturizing state, and the remaining residual polishing liquid on the wafer is also in a moist environment, thereby significantly reducing the crystallization of the polishing liquid on the wafer surface. At the same time, by driving the wafer to rotate through the driving component, the spray range of the wafer can be further increased, and the washing effect of the residual polishing liquid on the wafer surface can be improved, which is conducive to achieving the effect of moisturizing all surfaces of the wafer.

[0008] In some embodiments, the spray mechanism includes a spray rod assembly, which includes: a spray rod; a first nozzle, the first nozzle is arranged on the spray rod and connected to the spray rod, and the first spray hole is formed on the nozzle; a first liquid inlet pipe, one end of the first liquid inlet pipe is connected to the spray rod and the other end extends out of the box and is connected to an external liquid supply pipe.

[0009] In some embodiments, the spray rod assembly also includes: a mounting seat, the mounting seat is fixed on the inner wall of the box body, a mounting hole is formed on the mounting seat, the spray rod is passed through and fixed in the mounting hole, and the relative position of the spray rod and the mounting seat is adjustable in the circumferential direction of the mounting hole.

[0010] In some embodiments, an angle indicator mark is provided on the mounting seat, and the angle indicator mark is provided on the periphery of the mounting hole to indicate the relative mounting angle between the spray rod and the mounting hole.

[0011] In some embodiments, the spray rod assembly further includes: a first drive adjustment member, which is connected to the spray rod and is used to drive the spray rod to rotate in the mounting hole.

[0012] In some embodiments, the number of the spray bar assemblies is two, and the two spray bar assemblies are respectively disposed on opposite sides of the box body to spray the two side surfaces of the wafer respectively.

[0013] In some embodiments, the liquid spraying mechanism further includes a second liquid inlet pipe having a second spray hole disposed thereon. The second spray hole is disposed toward the periphery of the wafer, and an inlet end of the second liquid inlet pipe passes through the box body to connect to an external liquid supply pipe.

[0014] In some embodiments, the liquid spraying mechanism further includes: a second driving adjustment member, which is connected to the outlet end of the second liquid inlet pipe and is used to drive the outlet end of the second liquid inlet pipe to move so as to adjust the spraying angle of the second spray hole.

[0015] In some embodiments, the bottom wall of the box body is provided with a drain port, and in the direction toward the drain port, the bottom wall of the box body extends downwardly in an inclined manner, and the wafer temporary storage device further includes: a filter element, and the filter element is provided at the position of the drain port.

[0016] In some embodiments, the driving assembly includes: a driving wheel, which is rotatably disposed in the box, and a driving groove suitable for accommodating the edge of the wafer is formed on the circumferential surface of the driving wheel; a driving member, which is connected to the driving wheel and is used to drive the wafer to rotate through the driving wheel. The number of the driving wheels is at least one. When the number of the driving wheels is multiple, the multiple driving wheels are arranged at intervals along the circumference of the wafer, and the multiple driving wheels have the same rotation direction.

[0017] In some embodiments, the driving wheel is rotatable around a horizontally extending rotation axis, and the driving wheel is suitable for supporting and driving a lower edge of the wafer so that the wafer is vertically arranged in the temporary storage chamber.

[0018] In some embodiments, the driving assembly further includes a support member, wherein the support member is disposed in the box body, and the support member is provided with a support groove suitable for accommodating the lower edge of the wafer.

[0019] In some embodiments, the box body is provided with an exhaust port connected to the temporary storage chamber, and the wafer temporary storage device further includes: an exhaust pipe, which is arranged on the outer side of the box body, and the inlet end of the exhaust pipe is connected to the exhaust port position, and at least a portion of the exhaust pipe extends upward in the direction of the airflow in the exhaust pipe; and / or a guide member, which is arranged in the temporary storage chamber and connected to the exhaust port position, and the inner side of the guide member defines a guide channel, or the guide member cooperates with the inner wall of the temporary storage chamber to define a guide channel, and in the direction from the inlet end of the guide channel toward the exhaust port, at least a portion of the guide channel extends upward.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic diagram of a wafer temporary storage device according to an embodiment of the utility model at an angle;

[0022] Figure 2 yes Figure 1 A schematic diagram of another angle of the wafer temporary storage device shown in ;

[0023] Figure 3 is a schematic diagram of a wafer temporary storage device according to an embodiment of the utility model from another angle;

[0024] Figure 4 is a schematic diagram of a wafer temporary storage device according to an embodiment of the utility model from another angle;

[0025] Figure 5 is a cross-sectional view of a wafer temporary storage device according to an embodiment of the utility model;

[0026] Figure 6 is an exploded view of a wafer temporary storage device according to an embodiment of the utility model;

[0027] Figure 7 is an exploded view of a door assembly of a wafer temporary storage device according to an embodiment of the utility model;

[0028] Figure 8 It is a cross-sectional view of a door assembly of a wafer temporary storage device according to an embodiment of the utility model.

[0029] Reference numerals:

[0030] 100. Wafer temporary storage device;

[0031] 10. Box body; 101. Temporary storage chamber; 102. Liquid discharge port;

[0032] 11. Box body; 111. First inlet and outlet; 112. Return channel;

[0033] 12. Door assembly;

[0034] 121. door frame; 1211. second entrance and exit; 1212. receiving groove;

[0035] 122, door body; 1221, boss; 1222, water cut-off groove;

[0036] 123, driving mechanism; 1231, magnetic switch; 1232, speed regulating joint; 1233, cylinder;

[0037] 124, rolling element; 125, connecting seat; 126, water tray; 127, locking screw; 128, fastening screw;

[0038] 13. Transparent board;

[0039] 14. Sealing ring;

[0040] 20. Liquid spraying mechanism;

[0041] 21. Spray boom assembly;

[0042] 211, liquid spraying rod; 212, first nozzle; 213, first liquid inlet pipe; 214, mounting seat; 215, angle indication mark;

[0043] 216, first penetration joint; 217, first locking nut;

[0044] 22. second liquid inlet pipe; 23. second nozzle; 24. second through-cabin joint; 25. second locking nut;

[0045] 30. Filter element;

[0046] 40. Drive assembly;

[0047] 41. driving wheel; 42. supporting member; 43. driving member;

[0048] 50. Testing agency;

[0049] 60. Exhaust pipe; 70. Drain pipe; 80. Liquid level sensor; 90. Fixing seat;

[0050] 200. Wafer. DETAILED DESCRIPTION

[0051] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0052] Reference below Figure 1-Figure 8 A wafer temporary storage device 100 according to an embodiment of the present invention is described.

[0053] like Figure 1-Figure 3 As shown, the wafer temporary storage device 100 according to the embodiment of the utility model includes: a box body 10, a liquid spraying mechanism 20 and a driving component 40.

[0054] Specifically, the housing 10 has a temporary storage chamber 101 for placing the wafer 200; the liquid spraying mechanism 20 is disposed in the housing 10, and the liquid spraying mechanism 20 has a first spray hole, and the first spray hole is configured to be disposed toward the wafer 200, so as to spray the two side surfaces of the wafer 200 in the thickness direction. The first spray hole is configured to spray a water curtain of a preset shape, and the shape of the water curtain can be set according to actual needs, for example, the shape of the water curtain can be a straight line, a cone, a fan, etc.

[0055] For example, after processing (such as polishing), the wafer 200 can be placed in the temporary storage chamber 101. After the wafer 200 is placed in the temporary storage chamber 101, the box body 10 is closed, and the liquid spraying mechanism 20 can spray liquid (such as deionized water) toward the two side surfaces of the wafer 200 through the first spray hole to rinse the residual polishing liquid on the two side surfaces of the wafer 200. In this way, most of the residual polishing liquid on the surface of the wafer 200 can be rinsed away, so that the surface of the wafer is always in a moisturizing state, and the remaining polishing liquid on the wafer 200 is also in a humid environment, thereby significantly reducing the crystallization of the polishing liquid on the surface of the wafer 200, avoiding scratches on the wafer surface in subsequent processes.

[0056] The driving assembly 40 is used to drive the wafer 200 to rotate. During the spraying process, the driving assembly 40 drives the wafer to rotate, which can increase the spraying range of the first spray hole on the wafer and the spraying area on the wafer surface, which is conducive to spraying all surfaces of the wafer, improving the flushing effect of the residual polishing liquid on the wafer surface, and improving the all-round moisturizing effect on the wafer surface.

[0057] According to the wafer temporary storage device 100 of the embodiment of the utility model, by arranging a liquid spraying mechanism 20 in the box body 10, the liquid spraying mechanism 20 is used to spray the two side surfaces of the wafer 200 in the thickness direction, so that most of the residual polishing liquid on the surface of the wafer can be washed away, so that the surface of the wafer is always in a moisturizing state, and the remaining polishing liquid on the wafer is also in a moist environment, so that the crystallization of the polishing liquid on the surface of the wafer can be significantly reduced. At the same time, by driving the wafer to rotate through the driving component, the spraying range of the wafer can be further increased, the washing effect of the residual polishing liquid on the surface of the wafer is improved, and the all-round moisturizing effect on the surface of the wafer is improved.

[0058] According to some embodiments of the present invention, Figure 3 and Figure 4 As shown, the liquid spraying mechanism 20 includes a spray rod assembly 21, and the spray rod assembly 21 includes: a liquid spraying rod 211, a first nozzle 212 and a first liquid inlet pipe 213, the first nozzle 212 is arranged on the liquid spraying rod 211 and communicated with the liquid spraying rod 211, and a first spray hole is formed on the nozzle; one end of the first liquid inlet pipe 213 is connected to the liquid spraying rod 211 and the other end extends out of the box 10 and is connected to the external liquid supply pipe.

[0059] When the surface of the wafer 200 needs to be sprayed, the spray liquid provided from the outside enters the spray rod 211 through the first liquid inlet pipe 213 , then enters the first nozzle 212 , and is sprayed to both sides of the wafer through the first nozzle 212 .

[0060] The liquid spraying rod 211 may be a straight rod, for example, the liquid spraying rod 211 is a straight rod extending in the front-to-back direction, and a liquid spraying channel is defined in the liquid spraying rod 211 .

[0061] The first nozzle 212 includes a fixing ring and a nozzle part. The fixing ring is annular and is sleeved on the liquid spraying rod 211. The nozzle part is connected to the fixing ring and communicated with the liquid spraying rod 211. The first spray hole is formed on the nozzle part, and the relative position of the nozzle part in the circumferential direction of the liquid spraying rod 211 is adjustable to adjust the spray angle of the first spray hole toward the wafer. Furthermore, the first spray hole of the nozzle part can be conical or fan-shaped, thereby improving the spraying force and spraying range of the first spray hole, thereby further improving the rinsing effect and moisturizing effect on the wafer surface, which is conducive to achieving all-round spraying on the wafer surface.

[0062] When wafers 200 of different sizes are placed in the temporary storage chamber 101, the spray angle of the first nozzle can be adjusted according to the spraying requirements of the wafers 200 of different sizes. The spray angle of the first nozzle can also be adjusted in real time during the spraying process. In this way, the rinsing effect and moisturizing effect on the wafer surface can be further improved, which is conducive to achieving all-round spraying and moisturizing on the wafer surface, and improving the applicability of the wafer temporary storage device to wafers of different sizes.

[0063] Furthermore, a first through-cabin joint 216 is provided on the box body 10, and a first channel connecting the inside and outside of the box body 10 is defined on the inner side of the first through-cabin joint 216. The first liquid inlet pipe 213 passes through the first channel and extends into the temporary storage chamber 101. A first locking nut 217 is also sleeved on the first liquid inlet pipe 213. The first locking nut 217 is fastened to the first through-cabin joint 216 to fix the first liquid inlet pipe 213 to the first through-cabin joint 216.

[0064] In the above technical scheme, the spray rod assembly 21 includes a spray rod 211, a first nozzle 212 and a first liquid inlet pipe 213. The first nozzle 212 can be connected to the external spraying liquid through the spray rod 211 and the first liquid inlet pipe 213. In this way, the structure of the spray rod assembly 21 can be simplified, which is convenient for spraying the wafer. The first nozzle 212 is arranged on the spray rod 211. The extension direction of the spray rod 211 can be set according to actual spraying requirements, and the number and specific position of the first nozzle 212 can be arranged to improve the spraying effect on the surfaces of both sides of the wafer, which is conducive to moisturizing and flushing any position on the wafer surface.

[0065] In some embodiments of the present invention, Figure 4 As shown, the number of the first nozzles 212 is multiple, and the multiple nozzles are arranged at intervals along the length direction of the spray rod 211. The number of the first nozzles 212 can be one or more, for example, the number of the first nozzles 212 can be two, three, four, five, six, eight or ten or more. Further, three, four or five first nozzles 212 can be set on the spray rod 211. The multiple first nozzles 212 are arranged at intervals along the length direction of the spray rod 211.

[0066] In the above technical solution, by setting a plurality of first nozzles 212 spaced apart along the length direction of the spray rod 211, the spray range on the wafer surface can be increased, and the flushing and moisturizing effects of the residual polishing liquid on the wafer can be further improved, which is conducive to achieving all-round spraying and moisturizing of the wafer surface.

[0067] In some embodiments of the present invention, Figure 4As shown, the spray bar assembly 21 may further include: a mounting seat 214, the mounting seat 214 is fixed on the inner wall of the box body 10, a mounting hole is formed on the mounting seat 214, the spray bar 211 is passed through and fixed in the mounting hole, and the relative position of the spray bar 211 and the mounting seat 214 is adjustable in the circumferential direction of the mounting hole, which is used to adjust the mounting angle of the spray bar 211, and then adjust the spray angle of the first spray hole.

[0068] For example, the box body 10 has a left side panel and a right side panel arranged relatively in the left and right directions, the mounting seat 214 can be fixed on the left side panel and / or the right side panel of the box body 10, and a mounting hole is formed on the mounting seat 214 that passes through the mounting seat 214 in the front-to-back direction, and the spray rod 211 extends front-to-back and is inserted into the mounting hole.

[0069] Among them, the mounting seat 214 may include a fixed block and a pressing block, the fixed block is fixed on the box body 10, a first groove opening upward is formed on the fixed block, the first groove passes through the fixed block along the front-to-back direction, the pressing block is arranged on the upper side of the fixed block, the pressing block has a second groove opening downward, the second groove passes through the pressing block along the front-to-back direction, the pressing block and the fixed block are detachably connected, the first groove and the second groove together constitute a mounting hole, and the mounting angle of the spray rod 211 in the mounting hole is adjustable.

[0070] In the above technical solution, by providing the mounting seat 214, the liquid spraying rod 211 can be conveniently fixedly connected to the box body 10, the reliability of the fixing of the liquid spraying rod 211 can be improved, the fixing structure of the liquid spraying rod 211 can be simplified, and the spraying angle of the first nozzle 212 can be adjusted by adjusting the position of the liquid spraying rod 211 in the mounting hole, the spraying range of the first nozzle can be increased, and the washing efficiency of the polishing liquid on the wafer surface can be improved, and the polishing liquid residue can be reduced. At the same time, the washing effect and moisturizing effect on the wafer surface can be further improved, which is conducive to achieving all-round spraying and moisturizing on the wafer surface.

[0071] It should be noted that when the sizes of wafers are different, the installation angle of the spray rod 211 can be adjusted according to the spraying requirements of wafers of different sizes, or the installation angle of the spray rod can be adjusted in real time during the spraying process, so as to further improve the rinsing effect and moisturizing effect on the wafer surface and realize all-round spraying and moisturizing on the wafer surface.

[0072] In one embodiment of the present invention, Figure 4 As shown, an angle indicator mark 215 is provided on the mounting seat 214. The angle indicator mark 215 is provided on the periphery of the mounting hole to indicate the relative mounting angle between the spray rod 211 and the mounting hole.

[0073] For example, the angle indicator mark 215 may include a plurality of first scale lines evenly spaced along the circumference of the mounting hole, and the spray rod 211 is also provided with a plurality of second scale lines spaced along the circumference. The tightness between the clamp block and the fixed block is adjustable. When it is necessary to adjust the spray angle of the first nozzle 212, the clamp block can be loosened to allow the spray rod 211 to rotate in the mounting hole. By observing the relative positions of the first scale lines and the second scale lines, the spray rod 211 is rotated to a predetermined position to adjust the spray angle of the first nozzle 212.

[0074] In the above technical solution, by setting an angle indicator mark 215 around the mounting hole, the mounting angle of the spray rod 211 can be accurately adjusted, and then the spray angle of the first nozzle 212 can be accurately adjusted, which is conducive to achieving all-round spraying and moisturizing of the wafer surface.

[0075] In some embodiments of the present invention, the spray bar assembly 21 further includes: a first drive adjustment member, which is connected to the spray bar 211 and is used to drive the spray bar 211 to rotate in the mounting hole. In this way, the position of the spray bar 211 can be automatically adjusted, and then the spray angle of the first spray hole can be automatically adjusted, so as to achieve all-round spraying and moisturizing of the wafer surface.

[0076] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, there are two spray bar assemblies 21, and the two spray bar assemblies 21 are respectively arranged on opposite sides of the box body 10 to spray the two side surfaces of the wafer respectively.

[0077] Among them, the wafer can be placed upright in the temporary storage chamber 101, that is, the thickness direction of the wafer can be horizontal. For example, the thickness direction of the wafer can be along the left-right direction, and the two side surfaces of the wafer in the thickness direction are respectively facing the left and right sides. The box body 10 has a left side plate and a right side plate arranged relatively in the left-right direction, and the two spray bar assemblies 21 can be arranged on the left side plate and the right side plate of the box body 10 respectively. In this way, the spray bar assembly 21 arranged on the left side plate can spray liquid toward the left side surface of the wafer, and the spray bar assembly 21 arranged on the right side plate can spray liquid toward the right side surface of the wafer, so as to improve the flushing effect of the polishing liquid on the two side surfaces of the wafer.

[0078] In the above technical solution, by setting two spray rod assemblies 21 to spray the two side surfaces of the wafer in the thickness direction respectively, the spray range of the wafer can be increased, the flushing effect on the two side surfaces of the wafer can be improved, and the polishing liquid residue and crystallization can be further reduced.

[0079] According to some embodiments of the present invention, Figure 3As shown, the liquid spraying mechanism 20 may further include a second liquid inlet pipe 22, on which a second spray hole is provided, the second spray hole faces the periphery of the wafer, and the inlet end of the second liquid inlet pipe 22 passes through the housing 10 to be connected to an external liquid supply pipe. In this way, the external spraying liquid may first enter the second liquid inlet pipe, and then spray toward the periphery of the wafer through the second spray hole, thereby washing away the polishing liquid remaining at the periphery of the wafer, and making the polishing liquid remaining at the periphery of the wafer also in a wet environment, thereby reducing the crystallization of the polishing liquid at the periphery of the wafer.

[0080] The second spray hole is configured to spray a water curtain of a preset shape. The shape of the water curtain sprayed by the second spray hole can be set according to actual needs. For example, the shape of the water curtain can be linear, conical or fan-shaped.

[0081] The periphery of the wafer includes the peripheral side surface of the wafer and the portions of the two side surfaces of the wafer in the thickness direction close to the peripheral side surface.

[0082] When the wafer is placed in the temporary storage chamber, the second spray hole can be used to spray the two side surfaces of the wafer in the thickness direction, and the second spray hole can be used to spray the peripheral side of the wafer. In this way, the liquid spraying mechanism 20 can spray the two surfaces and the peripheral side of the wafer at the same time, so as to spray all surfaces of the wafer, improve the spraying and moisturizing effect on the wafer, and reduce the crystallization of the polishing liquid at all surface positions of the wafer. In other words, the first spray hole and the second spray hole cooperate with each other to achieve the flushing and moisturizing effect at any position on the wafer surface.

[0083] According to some embodiments of the utility model, the liquid spraying mechanism further includes: a second driving adjustment member, which is connected to the outlet end of the second liquid inlet pipe 22 and is used to drive the outlet end of the second liquid inlet pipe 22 to move so as to adjust the spray angle of the second spray hole. Thus, the spray angle of the second spray hole can be automatically adjusted to achieve all-round spraying and moisturizing of the wafer surface.

[0084] In one example, a second nozzle 23 is provided on the second liquid inlet pipe 22, the second nozzle 23 is connected to the second liquid inlet pipe 22, and the second nozzle 23 has a second spray hole arranged toward the periphery of the wafer. The second drive adjustment member can be connected to the second liquid inlet pipe to drive the outlet end of the second liquid inlet pipe to rotate, and the second drive adjustment member can also be connected to the second nozzle to drive the second nozzle to rotate to adjust the spray angle of the second spray hole.

[0085] When a wafer is placed in the temporary storage chamber 101 , the spray liquid provided from the outside can enter the second nozzle 23 through the second liquid inlet pipe 22 , and then be sprayed to the periphery of the wafer through the second spray hole.

[0086] When wafers 200 of different sizes are placed in the temporary storage chamber 101, the spray angle of the second nozzle can be adjusted according to the spraying requirements of the wafers 200 of different sizes. The spray angle of the second nozzle can also be adjusted in real time during the spraying process. In this way, the rinsing effect and moisturizing effect on the wafer surface can be further improved, which is conducive to achieving all-round spraying and moisturizing on the wafer surface.

[0087] In one example, a second through-cabin joint 24 is provided on the box body 10, and a second channel connecting the inside and outside of the box body 10 is defined on the inner side of the second through-cabin joint 24. The second liquid inlet pipe 22 passes through the second channel and extends into the temporary storage chamber 101. A second locking nut 25 is also sleeved on the second liquid inlet pipe 22. The second locking nut 25 is fastened to the second through-cabin joint 24 to fix the second liquid inlet pipe 22 to the second through-cabin joint 24.

[0088] In the above technical solution, by setting the second liquid inlet pipe 22 and the second nozzle 23, the peripheral side surface and peripheral edge surface of the wafer can be sprayed through the second spray hole of the second nozzle 23, thereby washing away the residual polishing liquid at the peripheral edge of the wafer, and making the remaining polishing liquid at the peripheral edge of the wafer also in a wet environment, thereby reducing the crystallization of the polishing liquid at the peripheral edge of the wafer.

[0089] According to some embodiments of the present invention, a liquid discharge port 102 is disposed on the bottom wall of the box body 10 , and the bottom wall of the box body 10 extends downwardly in a slanting direction toward the liquid discharge port 102 .

[0090] Furthermore, the bottom surface of the temporary storage cavity 101 is an inclined surface extending downwardly toward the drain port 102, and the angle between the bottom wall of the box body 10 and the horizontal plane can be greater than or equal to 1° and less than or equal to 5°. For example, the angle between the bottom surface of the temporary storage cavity 101 and the horizontal plane can be 1°, 2°, 3°, 4° or 5°, etc.

[0091] In the above technical solution, by making the bottom wall of the box body 10 extend downwardly in the direction of the drain port 102, the liquid at the bottom of the box body 10 can flow toward the drain port 102 under the action of gravity, which is convenient for completely draining the liquid in the box body 10 and reducing the residual liquid in the box body 10.

[0092] In some embodiments of the present invention, Figure 3 As shown, the wafer temporary storage device 100 may further include: a filter 30, which is disposed at the drain port 102. Further, the wafer temporary storage device 100 may further include: a drain pipe 70, which is disposed outside the box 10 and connected to the periphery of the drain port 102.

[0093] In the above technical solution, by providing the filter element 30 , the filter element 30 can filter the liquid flowing out of the drain port 102 , thereby preventing wafer fragments from entering the drain pipe 70 connected to the drain port 102 and avoiding clogging of the drain pipe 70 .

[0094] In some embodiments of the utility model, the driving assembly 40 may include: a driving wheel 41 and a driving member 43. The driving wheel 41 is rotatably disposed in the box body 10, and a driving groove suitable for accommodating the edge of the wafer is formed on the circumferential surface of the driving wheel 41; the driving member 43 is connected to the driving wheel 41 and is used to drive the wafer to rotate through the driving wheel 41.

[0095] The driving groove extends in a ring shape along the circumference of the driving wheel 41, and the driving member 43 can be a driving motor. When a wafer is placed in the temporary storage chamber 101, the edge of the wafer extends into the driving groove and contacts the side wall or bottom wall of the driving groove. When the driving member 43 drives the driving wheel 41 to rotate, the edge of the wafer can always be located in the driving groove, and the wafer is driven to rotate as the driving wheel 41 rotates. Among them, the wafer can rotate around its own central axis.

[0096] When the wafer rotates, for the same first nozzle, it can spray to different positions of the wafer when the wafer rotates to different angles. In this way, the spray range of the first nozzle on the wafer can be increased, and the flushing effect of the residual polishing liquid on the wafer surface can be improved. For the second nozzle, when the wafer rotates to different angles, the second nozzle can spray to different positions of the wafer. In this way, the spray range of the second nozzle on the wafer can be increased, and the flushing effect and moisturizing effect of the residual polishing liquid on the wafer surface can be improved, so as to achieve spraying and moisturizing at any position on the wafer surface.

[0097] When the driving wheel 41 drives the wafer to rotate, the rotation speed of the wafer can be greater than or equal to 3 rpm and less than or equal to 10 rpm. For example, the rotation speed of the wafer can be 3 rpm, 4 rpm, 5 rpm, 6 rpm, 7 rpm, 8 rpm, 9 rpm, or 10 rpm.

[0098] In an embodiment of the present invention, there are multiple driving wheels 41 , and the multiple driving wheels 41 are arranged at intervals along the circumference of the wafer, and the multiple driving wheels 41 rotate in the same direction.

[0099] For example, the number of driving wheels 41 can be two, three, four, five or more. By providing multiple driving wheels 41, the force acting on the wafer at the position of a single driving wheel 41 can be reduced, the uniformity of the force on the driving wheel 41 in the circumferential direction can be improved, and the probability of damage to the wafer when in contact with the driving wheel 41 can be reduced.

[0100] The rotation direction of the multiple driving wheels 41 can be clockwise or counterclockwise, and there is no limitation on this. The multiple driving wheels 41 have the same rotation direction, so that the wafer is subjected to the same force when rotating, ensuring that the multiple driving wheels 41 can cooperate with each other to drive the wafer to rotate.

[0101] There can be one driving member 43, which can be connected to multiple driving wheels 41 to simultaneously drive the multiple driving wheels 41 to rotate. There can also be multiple driving members 43, which can correspond to and be connected to multiple driving wheels 41 one by one, and each driving member 43 is used to drive the corresponding driving wheel 41 to rotate.

[0102] In the above technical solution, by setting a plurality of drive wheels 41 arranged at intervals and making the rotation directions of the plurality of drive wheels 41 the same, the wafer can be driven to rotate by the cooperation of the plurality of drive wheels 41, thereby reducing the force acting on the wafer at the position of a single drive wheel 41 and reducing the probability of damage to the wafer when it contacts the drive wheel 41.

[0103] In one embodiment of the present invention, the driving wheel 41 is rotatable around a horizontally extending rotation axis, and the driving wheel 41 is arranged at the lower side of the wafer to support the wafer.

[0104] For example, the driving wheel 41 is disposed on the lower side of the wafer, and the driving wheel 41 can rotate around a rotation axis extending in the left-right direction. When the wafer is placed in the temporary storage chamber 101, the wafer is arranged vertically, and the lower edge of the wafer can extend into the driving groove of the driving wheel 41. When the driving wheel 41 is stationary, the driving wheel 41 can support the wafer through the driving groove, and when the driving wheel 41 rotates, it can support the wafer and drive the wafer to rotate.

[0105] In the above technical solution, by arranging the driving wheel 41 under the wafer, the wafer can be easily supported and driven to rotate.

[0106] In one embodiment of the present invention, Figure 3 As shown, the driving assembly 40 further includes a support member 42 , which is disposed in the box 10 and located at the lower side of the wafer. The support member 42 is provided with a support groove suitable for accommodating the edge of the wafer.

[0107] Specifically, the support member 42 may be a support wheel, and a support groove is provided on the outer circumferential surface of the support wheel, and the support groove extends in a ring shape along the circumference of the support member 42. When the wafer is placed in the temporary storage cavity 101, the edge of the wafer extends into the support groove. The number of support wheels may be one or more, and when the number of support wheels is more than one, the multiple support wheels are arranged at intervals along the circumferential direction of the wafer. In this way, the support stability of the wafer can be further improved.

[0108] For example, the driving assembly 40 includes two driving wheels 41 and a supporting wheel. The two driving wheels 41 and the supporting wheel are both arranged on the lower side of the wafer. The two driving wheels 41 are arranged at intervals in the front-to-back direction. The supporting wheel is arranged between the two driving wheels 41, and the position of the supporting wheel in the up-down direction is lower than the two driving wheels 41. When the wafer is placed in the temporary storage chamber 101, the lower edge of the wafer is respectively supported in the driving grooves of the two driving wheels 41 and the supporting grooves of the supporting wheel.

[0109] In the above technical solution, a support member 42 is provided to support the edge of the wafer. The support member 42 can limit the swing of the wafer during the rotation process and improve the stability of the wafer rotation.

[0110] In one embodiment of the utility model, the box body 10 is provided with an exhaust port connected to the temporary storage chamber 101. By providing the exhaust port, the gas in the temporary storage chamber 101 can be easily discharged, the pressure balance in the temporary storage chamber 101 can be maintained, and the accumulation of volatile chemical gases in the temporary storage chamber 101 can be avoided.

[0111] In one example, the wafer temporary storage device 100 may further include: an exhaust pipe 60, which is arranged outside the box 10, and the inlet end of the exhaust pipe 60 is connected to the exhaust port, and at least part of the exhaust pipe 60 extends upward along the flow direction of the airflow in the exhaust pipe 60. The inlet end of the exhaust pipe 60 is sealed and connected to the periphery of the exhaust port.

[0112] In this way, when the airflow flows upward along the exhaust pipe 60, the water mist in the air can flow downward under the action of gravity and flow back into the temporary storage chamber 101, and the gas in the air can flow upward and be smoothly discharged to the outside. In this way, the liquid in the temporary storage chamber 101 can be prevented from being discharged from the exhaust pipe 60 along with the gas.

[0113] In the above technical solution, by providing the exhaust pipe 60 , the gas in the temporary storage chamber 101 can be easily discharged, the pressure in the temporary storage chamber 101 can be kept balanced, and the accumulation of volatile chemical gases in the temporary storage chamber 101 can be avoided.

[0114] In one example, the wafer temporary storage device 100 may further include a guide member, which is arranged in the temporary storage chamber and connected to the exhaust port, wherein the inner side of the guide member defines a guide channel, and in the direction from the inlet end of the guide channel toward the exhaust port, at least a portion of the guide channel extends upward. In other examples, the guide member cooperates with the inner wall of the temporary storage chamber to define a guide channel, and in the direction from the inlet end of the guide channel toward the exhaust port, at least a portion of the guide channel extends upward.

[0115] In this way, when the airflow flows upward along the guide channel to the exhaust port, the water mist in the air can flow downward under the action of gravity and flow back into the temporary storage chamber 101, and the gas in the air can flow upward and be smoothly discharged to the outside. In this way, the liquid in the temporary storage chamber 101 can be prevented from being discharged from the exhaust pipe 60 along with the gas.

[0116] According to some embodiments of the present invention, Figure 6 and Figure 7 As shown, the box body 10 may include a box body 11 and a door assembly 12, wherein the box body 11 defines a temporary storage cavity 101, and the box body 11 is disposed in a first direction (eg Figure 6 in the front-to-back direction) on one side (e.g. Figure 6 A first entrance and exit 111 communicating with the temporary storage chamber 101 is formed on the front side of the box body 11 as shown in FIG. 1 , and a door assembly 12 is connected to the box body 11 for opening and closing the first entrance and exit 111 .

[0117] When a wafer needs to be placed, the first entrance 111 can be opened through the door assembly 12, so that the wafer passes through the first entrance 111 and is placed in the temporary storage chamber 101, and then the door assembly 12 is closed to seal the first entrance 111. At this time, the liquid spraying mechanism 20 can spray liquid on the wafer. When the wafer needs to be taken out, the liquid spraying mechanism 20 is stopped, the door assembly 12 is opened to open the first entrance 111, and the wafer is taken out.

[0118] In the above technical solution, by providing the door assembly 12, the first entrance 111 can be conveniently opened and closed, which is beneficial to sealing the temporary storage chamber 101 when washing the wafers, reducing liquid leakage, and facilitating the removal of wafers from the storage box.

[0119] According to some embodiments of the present invention, the wafer temporary storage device 100 includes a leak-proof structure, which is disposed on the box body 11 and / or the door assembly 12 , and is configured to guide the liquid in the gap between the door assembly 12 and the box body 11 back to the temporary storage chamber 101 .

[0120] That is to say, the anti-leakage structure may be provided only on the box body 11 , or only on the door assembly 12 , or may be provided on both the box body 11 and the door assembly 12 .

[0121] It should be noted that when the liquid spraying mechanism 20 is spraying the wafer 200, the liquid will splash onto the inner wall of the temporary storage chamber 101 and the door assembly 12. Under the action of gravity, the liquid splashed onto the inner surface of the door assembly 12 will flow downward and enter the gap between the door assembly 12 and the box body 11. When the liquid gathers, it may leak from the gap to the outside of the box body 10.

[0122] In this embodiment, a leak-proof structure is provided. When liquid enters the gap between the box body 11 and the door assembly 12, the leak-proof structure can guide the liquid and return it to the temporary storage chamber 101, so as to prevent the liquid from accumulating in the gap. The liquid can be effectively prevented from penetrating to the outside of the box body 10 through the gap, thereby improving the sealing and leak-proof performance of the box body and facilitating the subsequent centralized collection and treatment of the liquid in the box body.

[0123] In some embodiments of the present invention, Figure 6 and Figure 7 As shown, the door assembly 12 may include: a door frame 121 and a door body 122 , the door frame 121 is fixedly and sealedly connected to the box body 11 , and the door body 122 is movably disposed on the door frame 121 to open and close the first entrance 111 .

[0124] The door body 122 may be rotatably disposed on the door frame 121 to open and close the first entrance 111 , and the door body 122 may also be movably disposed on the door frame 121 to open and close the first entrance 111 .

[0125] Further, the door frame 121 and the box body 11 can be connected by fasteners, the door frame 121 can be provided with a plurality of first connection holes, the box body 11 can be provided with a plurality of second connection holes, the plurality of first connection holes and the plurality of second connection holes correspond to each other one by one, and are arranged at intervals along the circumference of the first entrance 111, and the door frame 121 is fixed to the box body 11 by fasteners passing through the first connection holes and the second connection holes. Further, a sealing ring 14 is further provided between the door frame 121 and the box body 11, and the sealing ring 14 extends in an annular shape along the circumference of the door frame 121 and the circumference of the first entrance 111, and in the first direction, the sealing ring 14 seals and abuts between the door frame 121 and the box body 11.

[0126] In the above technical solution, the door frame 121 can be conveniently fixedly connected to the box body 11, simplifying the connection structure between the box body 11 and the door assembly 12. By movably setting the door body 122 on the door frame 121, the first entrance 111 can be conveniently opened and closed.

[0127] In one embodiment of the present invention, Figure 7 As shown, the door assembly 12 may further include a driving mechanism 123 connected to the door body 122 for driving the door body 122 relative to the door frame 121 along a second direction (eg Figure 7 The second direction moves between an open position and a closed position (in a left-right direction), and the second direction is perpendicular to the first direction.

[0128] The driving mechanism 123 may be a driving motor or a driving cylinder 1233. In the open position, the door body 122 and the first entrance 111 are completely staggered in the left-right direction, so that the first entrance 111 is exposed, which is convenient for taking and placing wafers. In the closed position, the door body 122 and the first entrance 111 are opposite in the front-back direction, so as to completely block the first entrance 111 and prevent the liquid in the temporary storage chamber 101 from leaking out from the first entrance 111.

[0129] In the above technical solution, by providing a driving mechanism 123 for driving the door body 122 to move, the door body 122 can be automatically opened and closed, thereby realizing automatic control of the wafer temporary storage device 100 .

[0130] In one embodiment of the present invention, Figure 6 As shown, the door body 122 is arranged on the side of the door frame 121 facing the box body 11, and a second entrance and exit 1211 is formed on the door frame 121. When the door body 122 is in the open position, the first entrance and exit 111 and the second entrance and exit 1211 are opposite and connected. When the door body 122 is in the closed position, the door body 122 blocks the first entrance and exit 111 and the second entrance and exit 1211.

[0131] In the above technical solution, by arranging the door body 122 between the door frame 121 and the box body 11, when the door body 122 is in the closed position for closing the first entrance and exit 111, the door body 122 can be stopped between the door frame 121 and the box body 11, thereby improving the sealing performance and reducing the probability of liquid leakage in the temporary storage chamber 101.

[0132] In one embodiment of the present invention, Figure 8 Combined with Figure 6 As shown, a recessed receiving groove 1212 is provided on one side of the door frame 121 facing the box body 11 , the door body 122 is disposed in the receiving groove 1212 , and the second entrance 1211 is formed on the bottom wall of the receiving groove 1212 .

[0133] The door body 122 is arranged in the receiving groove 1212. The two side walls of the receiving groove 1212 in the left and right directions can limit the movement of the door body 122 in the left and right directions, and limit the moving distance of the door body 122 in the left and right directions. At the same time, the door body 122 is arranged in the receiving groove 1212 of the door frame 121, which can reduce the thickness of the door assembly 12 in the front-to-back direction and reduce the space occupied. The second entrance 1211 is formed in the receiving groove 1212, which can facilitate the door body 122 to completely block the first entrance 111 and the second entrance 1211 when in the closed position.

[0134] In the above technical solution, by arranging the door body 122 in the receiving groove 1212 of the door frame 121, the receiving groove 1212 can limit the door body 122 and can also reduce the thickness of the door assembly 12 and reduce space occupancy.

[0135] In one embodiment of the present invention, Figure 7 and Figure 8 As shown, the door assembly 12 may further include: at least one rolling member 124, which is rotatably provided on the door body 122 around an axis extending along a third direction, and the rolling member 124 is respectively rollingly engaged with the periphery of the first entrance and exit 111 and the bottom wall of the accommodating groove 1212, and the third direction is perpendicular to the first direction and the second direction.

[0136] The door assembly 12 may include one, two, three, four or more rollers 124 .

[0137] In the above technical solution, by setting a rolling member 124, when the door body 122 moves in the left and right directions relative to the door frame 121, the rolling member 124 can respectively roll with the door frame 121 and the box body 11, and can roll in the left and right directions relative to the door frame 121 and the box body 11, so as to guide the movement of the door body 122 and improve the stability of the door body 122 during the opening and closing process.

[0138] In one embodiment of the present invention, referring to Figure 7 As shown, the rolling element 124 can be a bearing, and the door body 122 is in the third direction (for example Figure 7 The end surface of one end (for example, in the up-down direction shown in FIG. Figure 7 A boss 1221 is formed on the lower end surface of the door body 122 shown in the figure, and the inner ring of the bearing is fixed on the boss 1221.

[0139] For example, two bosses 1221 are provided on the lower end surface of the door body 122, and the two bosses 1221 are arranged at intervals on the left and right. The rolling member 124 is a bearing, and the inner ring of the bearing is fixed to the door body 122 by a locking screw 127 and a fastening screw 128. Specifically, the locking screw 127 passes through the inner ring of the bearing and extends into the locking hole on the door body 122. A fastening hole that is connected to and perpendicular to the locking hole is also formed on the door body 122. The locking screw passes through the locking hole and is connected to the locking screw 127, thereby fixing the bearing to the door body 122 and improving the reliability of the fixation of the bearing and the door body 122.

[0140] In the above technical solution, by providing the boss 1221, the boss 1221 can separate the bearing from the lower end surface of the door body 122, thereby preventing the bearing from interfering with the lower end surface of the door body 122 during rotation, and ensuring that the bearing can rotate smoothly.

[0141] According to some embodiments of the present invention, the door assembly 12 further includes: a magnetic switch 1231, the number of the magnetic switches 1231 is two, and the two magnetic switches 1231 are respectively configured to be triggered when the door body 122 is in the open position and the closed position. That is, one of the magnetic switches 1231 is triggered when the door body 122 is in the open position, and the other magnetic switch 1231 is triggered when the door body 122 is in the closed position.

[0142] For example, when the door body 122 is in the open position, one of the magnetic switches 1231 can receive a signal and can feed the signal back to the control system of the wafer temporary storage device, and the control system can confirm that the door body 122 is in the open position at this time. When the door body 122 is in the closed position, another magnetic switch 1231 can receive a signal and can feed the signal back to the control system, and the control system can confirm that the door body 122 is in the closed position. In this way, the position of the door body 122 can be easily monitored, and the structure is simple.

[0143] In one embodiment of the present invention, Figure 6 As shown, the driving mechanism 123 is arranged on the side of the door frame 121 away from the box body 11, and the door assembly 12 also includes: a connecting seat 125, one end of the connecting seat 125 is connected to the driving mechanism 123, and the other end passes through the second entrance 1211 and is connected to the door body 122.

[0144] In the above technical solution, by arranging the connection seat 125, when the driving mechanism 123 is started, the driving mechanism 123 can drive the connection seat 125 to move left and right, and drive the door body 122 to move left and right through the connection seat 125. Thus, the connection between the driving mechanism 123 and the door body 122 can be easily achieved. In addition, by arranging the driving mechanism 123 on the side of the door frame 121 away from the box body 11, it can be avoided that the driving mechanism 123 occupies the space on the side of the door frame 121 facing the box body 11, and the structural layout is more reasonable.

[0145] In one embodiment of the present invention, Figure 6 As shown, the door assembly 12 may further include a water receiving tray 126 , which is disposed on a side of the door frame 121 away from the box body 11 and arranged below the second inlet and outlet 1211 .

[0146] Furthermore, the water receiving tray 126 and the door frame 121 are detachably connected. For example, the water receiving tray 126 and the door frame 121 can be connected by fasteners, wherein a seal can be provided at the connection position between the water receiving tray 126 and the door frame 121 to seal the gap between the water receiving tray 126 and the door frame 121.

[0147] In the above technical solution, the water tray 126 can receive the liquid dripping when the wafer is placed in or taken out of the temporary storage cavity 101, preventing the liquid from dripping onto the ground outside the box 10, thereby ensuring the cleanliness and hygiene around the wafer temporary storage device 100.

[0148] In one embodiment of the present invention, referring to Figure 7 The anti-leakage structure includes a water cut-off groove 1222, which is formed on both side walls of the door body 122 in the second direction. The water cut-off groove 1222 extends along the third direction and passes through both ends of the door body 122 in the third direction.

[0149] In the above technical scheme, by setting the water stop groove 1222, when the liquid in the temporary storage chamber 101 splashes onto the door body 122 and flows from the surface of the door body 122 facing the temporary storage chamber 101 to the left and right sides of the door body 122, in the direction from the inside of the door body 122 to the outside of the door body 122, that is, in the direction from the back to the front, the liquid flows forward into the water stop groove 1222 and flows downward along the water stop groove 1222, and does not flow to the front side of the water stop groove 1222. In this way, the liquid can be prevented from flowing from the left and right sides of the door body 122 to the front side of the door body 122, thereby reducing the probability of liquid leakage from the side of the door body 122.

[0150] In one embodiment of the present invention, referring to Figure 6 As shown, the anti-leakage structure includes a reflux channel 112 formed on the box body 11 and connected to the temporary storage chamber 101. The reflux channel 112 is arranged at the lower side of the first inlet and outlet 111 and penetrates the box body 11 along the first direction.

[0151] Among them, the reflux channel 112 is arranged on the inner side of the sealing ring 14 between the door frame 121 and the box body 11, that is, between the sealing ring 14 and the lower edge of the first inlet and outlet 111. When the water in the temporary storage chamber 101 splashes onto the inner surface of the door body 122, the water will flow downward under the action of gravity and flow to the position of the sealing ring 14 located on the lower side of the door body 122, and gather at the position of the sealing ring 14. At this time, since the reflux channel 112 is arranged on the upper side of the sealing ring 14, the gathered liquid can flow back to the temporary storage chamber 101 through the reflux channel 112, thereby avoiding the large amount of liquid gathering at the position of the sealing ring 14 located on the lower side of the first inlet and outlet 111, avoiding the failure of the sealing ring 14, and ensuring the sealing performance.

[0152] In the above technical solution, by arranging a reflux channel 112 on the lower edge of the first inlet and outlet 111, the liquid that converges to the lower side of the first inlet and outlet 111 can be refluxed into the temporary storage chamber 101 through the reflux channel 112, thereby preventing the liquid dripping from the door body 122 from gathering at the position of the sealing ring 14, thereby ensuring the sealing reliability of the sealing ring 14.

[0153] In one embodiment of the utility model, the reflux channel 112 extends along the second direction, and in the second direction, the width of the reflux channel 112 is greater than the width of the first inlet and outlet 111. In other words, both ends of the reflux channel 112 in the second direction extend beyond both ends of the first inlet and outlet 111 in the second direction. Thus, the coverage length of the reflux channel 112 in the second direction can be increased, which is conducive to allowing more liquid in the gap between the box body 11 and the door body 122 to flow back into the temporary storage chamber 101 through the reflux channel 112.

[0154] In one embodiment of the utility model, the box body 10 also includes: a transparent plate 13, a detection port is formed on the box body 11, and the transparent plate 13 covers the detection port. The wafer temporary storage device 100 also includes: a detection mechanism 50, which is arranged at the detection port position and is located on the outside of the box body 10, and is used to detect whether there are wafers in the temporary storage cavity 101. The detection mechanism 50 is communicatively connected with the liquid spraying mechanism 20.

[0155] A sealing ring may be provided between the transparent plate 13 and the periphery of the detection port. The sealing ring extends in a ring shape along the circumference of the detection port and is used to seal the gap between the transparent plate 13 and the periphery of the detection port.

[0156] The detection mechanism 50 may include a sensor, which includes a transmitting end and a receiving end. The transmitting end is used to send a signal, such as emitting visible light or laser light, and the receiving end is used to receive the signal sent by the transmitting end. The transmitting end and the receiving end can be arranged on opposite sides of the box 10, and are respectively located on opposite sides of the wafer. When there is a wafer in the temporary storage chamber 101, the receiving end cannot receive the signal due to the blocking effect of the wafer. When there is no wafer in the temporary storage chamber 101, the receiving end can receive the signal.

[0157] In other embodiments, the sensor of the detection mechanism 50 may be a reflective sensor. In this case, only one detection port and one transparent plate 13 need to be provided on the box body 10 .

[0158] In the above technical solution, by providing the detection mechanism 50 , it is convenient to detect whether there is a wafer in the temporary storage chamber 101 , and convenient to control the start and stop of the liquid spray mechanism 20 according to whether there is a wafer in the temporary storage chamber 101 .

[0159] In some embodiments of the present invention, the wafer temporary storage device 100 further includes: a liquid level sensor 80 , which is used to detect the liquid level in the temporary storage chamber 101 , and the liquid level sensor 80 is communicatively connected to the liquid spraying mechanism 20 .

[0160] When the liquid level sensor 80 detects that the liquid level in the temporary storage chamber 101 is higher than the preset height, the liquid level sensor 80 transmits a signal to the controller, and the controller can control the liquid spraying mechanism 20 to stop spraying the liquid. The preset height is lower than the lower edge of the first inlet and outlet 111 of the box body 11 to prevent the liquid in the temporary storage chamber 101 from leaking from the first inlet and outlet 111. Further, the preset height can be 5mm-10mm lower than the lower edge of the first inlet and outlet 111, thereby increasing the liquid storage capacity in the temporary storage chamber 101 while preventing the liquid from overflowing from the first inlet and outlet 111.

[0161] For example, the liquid level sensor 80 may be disposed on a side where the liquid discharge port 102 is located, and the liquid level sensor 80 may be arranged at a position 5 mm to 15 mm below the lower edge of the first inlet and outlet 111 .

[0162] In the above technical solution, by providing the liquid level sensor 80 , the amount of liquid in the temporary storage chamber 101 can be detected in real time to prevent the liquid in the temporary storage chamber 101 from overflowing from the first inlet and outlet 111 .

[0163] According to the wafer cleaning method of the wafer temporary storage device 100 of the embodiment of the utility model, the wafer cleaning method includes: S1, confirming that there are wafers stored in the temporary storage chamber 101, and confirming that the door body 122 is in the closed position; S2, driving the wafer to rotate, and starting the liquid spraying mechanism 20 to spray the wafer; S4, confirming that the instruction to remove the wafer is received, stopping the rotation of the wafer, and stopping the liquid spraying mechanism 20.

[0164] For example, the detection mechanism 50 can be used to detect whether there are wafers in the temporary storage chamber 101. When wafers are placed in the temporary storage chamber 101, it can be detected whether the door body 122 is in a closed position to determine the sealing performance of the box body 10 to prevent the liquid in the temporary storage chamber 101 from leaking or splashing.

[0165] After confirming that there is a wafer in the temporary storage chamber 101 and the door body 122 is closed, in order to prevent the residual polishing liquid on the wafer from drying and crystallizing, the wafer is driven to rotate. For example, the wafer can be driven to rotate by the driving component 40, and the spray mechanism 20 is started at the same time. The spray mechanism 20 can be used to spray the two side surfaces of the wafer in the thickness direction, as well as the peripheral edge and peripheral side of the wafer to keep the wafer moist, and rinse and remove the polishing liquid on the wafer to reduce the crystallization of the polishing liquid on the wafer surface.

[0166] When the wafer temporary storage device 100 receives an instruction to take out the wafer, for example, when the wafer can proceed to the next cleaning step, a take-out instruction can be sent to the wafer temporary storage device 100. At this time, the driving component 40 is stopped to stop the rotation of the wafer to facilitate the removal of the wafer and avoid damage to the wafer when taking it out. At the same time, the built-in liquid spraying mechanism 20 can prevent the liquid from splashing out of the outside of the temporary storage chamber 101.

[0167] According to the wafer cleaning method of the embodiment of the utility model, it is first confirmed that the wafer is prevented from being in the temporary storage chamber 101 and that the door body 122 is closed, and then the liquid spraying mechanism 20 is started to spray the wafer and drive the wafer to rotate until a removal instruction is received, and then the rotation and spraying of the wafer are stopped. In this way, during the entire temporary storage process of the wafer, the wafer is always sprayed, and the polishing liquid on the wafer can be rinsed and removed to keep the wafer moist, which can significantly reduce or avoid the crystallization of the polishing liquid on the wafer surface.

[0168] According to some embodiments of the present invention, step S1 includes: S11, detecting whether there is a wafer in the temporary storage chamber 101; if not, executing S12, if yes, executing S13; S12, confirming that the door body 122 is open and placing the wafer; S13, closing the door body 122.

[0169] That is to say, first check whether there is a wafer in the temporary storage chamber 101. When there is no wafer in the temporary storage chamber 101, confirm whether an instruction to put in the wafer is received. After receiving the instruction to put in, drive the door body 122 to open, put the wafer into the temporary storage chamber 101, and then close the door body 122. At this time, step S2 can be executed, that is, drive the wafer to rotate and start the liquid spraying mechanism 20 to spray the wafer.

[0170] When there are wafers in the temporary storage chamber 101, it is detected whether the door body 122 is closed. If the door body 122 is open, the door body 122 is driven to close, and then step S2 is executed (driving the wafer to rotate and starting the liquid spraying mechanism 20 to spray the wafer); if the door body 122 is closed, step S2 is directly executed (driving the wafer to rotate and starting the liquid spraying mechanism 20 to spray the wafer).

[0171] In the above technical solution, by detecting whether there is a wafer in the temporary storage chamber 101, if there is no wafer, the wafer is placed according to the instruction, and if there is a wafer, the door body 122 is closed and then the wafer is sprayed. In this way, it can be ensured that the wafer is driven to rotate under the premise that there is a wafer in the temporary storage chamber 101.

[0172] According to some embodiments of the present invention, after step S2, the wafer cleaning method further includes: detecting the liquid level in the temporary storage chamber 101, and stopping spraying the wafer if the liquid level is greater than or equal to a preset height.

[0173] In the above technical solution, it is possible to prevent the liquid level in the temporary storage chamber 101 from being too high, and to prevent the liquid in the temporary storage chamber 101 from overflowing.

[0174] According to some embodiments of the present invention, the wafer cleaning method may further include: detecting the wafer state, and issuing an alarm if the wafer is damaged, thereby preventing the damaged wafer from being subjected to subsequent processes.

[0175] The following will refer to Figure 1-Figure 8 A wafer temporary storage device 100 according to a specific embodiment of the present invention is described.

[0176] Reference Figure 1 The wafer temporary storage device 100 includes: a box body 10, a liquid spraying mechanism 20, a filter element 30, a driving assembly 40, a detection mechanism 50, an exhaust pipe 60, a liquid drain pipe 70 and a liquid level sensor 80.

[0177] Specifically, Figure 1 As shown, the box body 10 is in a rectangular parallelepiped shape, and a temporary storage chamber 101 is defined in the box body 10. The bottom wall of the temporary storage chamber 101 is processed into an inclined surface with a slope of 1° to 5° to completely drain the liquid. A drainage port 102 is opened at the lower end of the inclined surface, and a drainage pipe 70 is installed at the bottom of the drainage port 102 for connecting with the equipment drainage pipe 70. The filter 30 is arranged at the drainage port 102 to prevent wafer fragments from entering the drainage pipe and causing blockage.

[0178] An exhaust port is provided at the upper part of the box 10, and an exhaust pipe 60 is installed at the exhaust port to extract the gas volatilized by the chemical liquid in the box 10. The exhaust pipe 60 is arranged upward to prevent the liquid in the box 10 from entering the exhaust pipe 60 connected to the exhaust pipe 60. Furthermore, a protective cover is provided on the inner wall of the temporary storage chamber 101, and the protective cover is provided at the exhaust port, and the opening of the protective cover faces downward, thereby preventing the liquid in the temporary storage chamber 101 from being sucked into the exhaust pipe 60.

[0179] The two opposite side panels of the box body 10 are provided with detection ports, which are closed by a transparent plate 13. A sealing ring is used to seal the transparent plate 13 and the box body 10 to prevent liquid from leaking out. The detection mechanism 50 is arranged at the detection port, and the transparent plate 13 can facilitate the penetration of the sensing medium (visible light or laser, etc.) of the sensor of the detection mechanism 50. The transmitting end of the sensor sends a signal (visible light or laser). If there is no wafer, the receiving end can receive the signal (visible light, laser). If there is a wafer, the receiving end cannot receive the signal and feeds back the result to the controller. The detection mechanism 50 can also use a reflective sensor, and accordingly only one detection port and a transparent plate 13 are required.

[0180] The box body 10 includes a box body 11 and a door assembly 12. A first inlet 111 is provided on the front side of the box body 11. The door assembly 12 is provided at the first inlet 111 and is used to open and close the first inlet 111. The door assembly 12 is connected to the box body 11 with screws, and a sealing ring 14 is used to seal the door assembly 12 and the box body 11 to prevent the liquid in the box body 11 from leaking out of the box.

[0181] The door assembly 12 includes: a door frame 121, a door body 122, a driving mechanism 123, a magnetic switch 1231, a speed regulating joint 1232, a connecting seat 125, a rolling element 124, a locking screw 127 and a fastening screw 128. A receiving groove 1212 is processed inside the door frame 121 for installing the door body 122 and providing a moving space for the door body 122. A second entrance 1211 is formed on the door frame 121, and the size of the second entrance 1211 is similar to that of the first entrance 111 on the box body 11.

[0182] The driving mechanism 123 is a slide cylinder 1233, which is installed on the top of the outer side of the door frame 121. The door body 122 is connected to the slide cylinder 1233 through the connecting seat 125. The slide cylinder 1233 has two air inlets, which are connected to the control air circuit through the speed regulating joint 1232. After the different air inlets are ventilated, the cylinder 1233 moves to the left or right, driving the door panel to move left and right. The speed regulating joint 1232 can be adjusted to adjust the door opening and closing speed. Two magnetic switches 1231 are installed on the cylinder 1233. The magnetic switches 1231 can connect signals when the door panel is in the open position and the closed position, and feedback to the controller.

[0183] The area of ​​the door body 122 is larger than the area of ​​the second inlet and outlet 1211 on the door frame 121, and the left and right sides of the door body 122 are processed with water-blocking grooves 1222 to prevent the liquid from flowing to the outer surface of the door panel along the side. When the door body 122 moves to the rightmost position and is in a closed position, it can block the liquid sprayed from the first nozzle 212 and the second nozzle 23 within the range of the first inlet and outlet 111 of the box body 11, and the liquid can flow along the door body 122 and downward into the bottom of the door frame 121. The left and right side surfaces of the door body 122 are closely attached to the side surfaces of the receiving groove 1212, preventing the water from splashing outside the second inlet and outlet 1211 of the door frame 121, and flowing back into the box body 11 through the reflux channel 112 on the lower side of the first inlet and outlet 111 on the front side of the box body 11.

[0184] The bottom of the door body 122 is provided with a rolling element 124, which is a bearing made of ceramic. The ceramic bearing can prevent liquid corrosion. The bearing can roll freely in the left and right moving direction of the door body 122. The outer diameter of the bearing is equal to the spacing between the bottom wall of the receiving groove 1212 of the box body 11 and the door frame 121, ensuring that the lower part of the door body 122 will not shake forward and backward when moving left and right.

[0185] The bearing is fixed to the bottom of the door body 122 by a locking screw 127. The bearing mounting surface at the bottom of the door body 122 is processed with a circular boss 1221 to prevent the outer ring of the bearing from contacting and interfering with the door panel. The locking screw 127 is fixed from the side by a fastening screw 128 to prevent loosening.

[0186] A water collecting tray 126 is arranged outside the door frame 121 , and a sealing gasket is used to seal the water collecting tray 126 and the door frame 121 . The water collecting tray 126 drains the liquid dripping before the wafer enters the second entrance 1211 of the door frame 121 into the drainage system to prevent the liquid from dripping onto the floor outside the box 10 .

[0187] The driving assembly 40 is arranged on the box 10, and the driving assembly 40 includes two driving wheels 41, two driving members 43 and a supporting member 42. The supporting member 42 is a supporting wheel, and a driving groove slightly wider than the thickness of the wafer is provided on the driving wheel 41 for vertically placing the wafer. The two driving wheels 41 rotate in the same direction, driving the wafer to rotate clockwise or counterclockwise at a certain speed (usually 3 to 10 revolutions per minute), and the supporting wheels can limit the wafer from swinging left and right and forward and backward during the rotation process.

[0188] The liquid spraying mechanism 20 includes: two spray bar assemblies 21, a second liquid inlet pipe 22 and a second nozzle 23. The two spray bar assemblies 21 are respectively mounted on the left and right side panels of the box body 10. Each spray bar assembly 21 includes a first liquid inlet pipe 213, a first locking nut 217, a liquid spray bar 211, a mounting seat 214, and a first nozzle 212. The first nozzle 212 is mounted on the liquid spray bar 211. The number of the first nozzles 212 can be set to 3 to 5 as required. The shape of the first spray hole of the first nozzle 212 can be selected to be conical or fan-shaped.

[0189] The first liquid inlet pipe 213 enters the housing 10 through the first through-chamber joint 216 and is connected to the liquid spraying rod 211 and is locked and sealed by the first locking nut 217. The liquid spraying rod 211 is fixed to the housing 10 by the mounting seat 214, and the mounting seat 214 is engraved with a scale line as an angle indicator 215, which is used to adjust the liquid spraying angle of the liquid spraying rod 211 to ensure that all parts of the wafer can be evenly rinsed.

[0190] The second nozzle 23 is arranged on the peripheral side of the wafer, and the second nozzle 23 sprays liquid to rinse the edge of the wafer. One or more second nozzles 23 can be arranged on one side or both sides of the wafer as needed. The second liquid inlet pipe 22 enters the box 10 through the second through-chamber joint 24 and is connected to the second nozzle 23. The flushing angle of the second nozzle 23 can be adjusted as needed. Among them, the second nozzle 23 can use a megasonic cleaning nozzle to further improve the cleaning effect on the edge of the wafer.

[0191] A liquid level sensor 80 is provided on one side of the liquid discharge port 102 of the box body 10. The liquid level sensor 80 is mounted on the fixing seat 90. The position of the liquid level sensor 80 is 5 to 15 mm lower than the lower edge of the second inlet and outlet 1211 of the door frame 121 to prevent liquid from overflowing. When the liquid level in the temporary storage chamber 101 is higher than the position of the liquid level sensor 80, the liquid level sensor 80 feeds back a signal to the controller, and the liquid spraying rod 211 and the second nozzle 23 stop supplying liquid.

[0192] The wafer cleaning method of the wafer temporary storage device 100 according to the above embodiment of the present invention is described below.

[0193] Receive a wafer placement signal from a wafer clamping mechanism indicating that a wafer needs to be placed;

[0194] Detecting whether there is a wafer in the temporary storage chamber 101;

[0195] If not, open the door 122, confirm that the door 122 is in the open position, and put the wafer in;

[0196] Confirm that the detection mechanism 50 has detected the wafer, the mechanical arm of the wafer clamping mechanism is retracted, and the door 122 is closed;

[0197] Confirm that the door body 122 is in the closed position, issue a cleaning command, the first nozzle 212 on the liquid spraying rod 211 sprays liquid, the driving wheel 41 rotates, the second nozzle 23 sprays liquid, and the exhaust pipe 60 starts exhausting, wherein the exhaust can be in a working state all the time. In addition, the wafer is in a cleaning state in the temporary storage box before receiving the instruction to take out the wafer, and the detection mechanism 50 is also in a detection state. If the wafer is broken, an alarm is immediately issued; the liquid level sensor 80 can detect the liquid level in the temporary storage chamber 101 in real time, and when the liquid level is too high, stop spraying;

[0198] After confirming that a wafer removal signal from the wafer cleaning device is received, the liquid spraying rod 211, the driving wheel 41, and the second nozzle 23 stop working;

[0199] Then, the door body 122 is opened, and it is detected and confirmed that the door body 122 is in the open position;

[0200] The mechanical arm of the wafer clamping mechanism extends into the temporary storage chamber 101 , takes out the wafer, detects and confirms that there is no wafer in the temporary storage chamber 101 , and closes the door 122 .

[0201] According to the wafer temporary storage device 100 of the embodiment of the utility model, deionized water is continuously sprayed to the front and back sides of the wafer through the spray rod 211 to rinse off most of the residual polishing liquid on the surface of the wafer, and the remaining residual polishing liquid is in a moist environment, and the amount of crystallization is greatly reduced; deionized water is continuously sprayed to the edge of the wafer through the second nozzle 23 arranged on the circumferential side of the wafer to rinse off most of the residual polishing liquid on the edge of the wafer, and the remaining residual polishing liquid is in a moist environment, and the amount of crystallization is greatly reduced; and during the rinsing process, the wafer is driven by the driving wheel 41 to rotate at a uniform speed, and all edge parts can be evenly rinsed.

[0202] In addition, by setting the first entrance 111 on the front side of the box body 11, the common cylindrical coordinate robot (wafer clamping mechanism) arranged on one side of the wafer temporary storage device 100 can enter the polished wafer from the side into the box body 10 and place it vertically on the driving wheel 41 and the supporting wheel of the driving assembly 40. The door body 122 set at the position of the first entrance 111 on the side of the box body 11 is opened when the wafer needs to be placed, providing a channel for the robot to enter the box body 10. After the wafer is placed, the door body 122 is closed to ensure that the liquid will not splash out from the first entrance 111 and the second entrance 1211 on the side when spraying liquid.

[0203] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0204] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0205] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0206] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0207] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A wafer temporary storage device, characterized in that: include: A box body, wherein the box body has a temporary storage cavity for placing wafers; A liquid spraying mechanism, the liquid spraying mechanism is arranged in the box, the liquid spraying mechanism has a first spraying hole, and the first spraying hole is configured to be arranged toward the wafer so as to spray the two side surfaces of the wafer in the thickness direction; A driving component is used to drive the wafer to rotate.

2. The wafer temporary storage device according to claim 1, characterized in that: The liquid spraying mechanism comprises a spray bar assembly, and the spray bar assembly comprises: Spray rod; a first nozzle, the first nozzle is disposed on the spray rod and communicated with the spray rod, the first spray hole is formed on the nozzle; A first liquid inlet pipe, one end of which is connected to the liquid spraying rod and the other end of which extends out of the box body and is connected to an external liquid supply pipe.

3. The wafer temporary storage device according to claim 2, characterized in that: The spray rod assembly also includes: a mounting seat, which is fixed on the inner wall of the box body, and a mounting hole is formed on the mounting seat. The spray rod is inserted into and fixed in the mounting hole, and the relative position of the spray rod and the mounting seat is adjustable in the circumferential direction of the mounting hole.

4. The wafer temporary storage device according to claim 3, characterized in that: The mounting seat is provided with an angle indicating mark, and the angle indicating mark is arranged at the periphery of the mounting hole, and is used to indicate the relative mounting angle between the spray rod and the mounting hole.

5. The wafer temporary storage device according to claim 3, characterized in that: The spray rod assembly further includes a first drive adjustment member, which is connected to the spray rod and is used to drive the spray rod to rotate in the mounting hole.

6. The wafer temporary storage device according to claim 2, characterized in that: There are two spray bar assemblies, which are respectively arranged on opposite sides of the box body to spray the two side surfaces of the wafer respectively.

7. The wafer temporary storage device according to claim 1, characterized in that: The liquid spraying mechanism further comprises a second liquid inlet pipe, on which a second spray hole is arranged, the second spray hole is arranged toward the periphery of the wafer, and an inlet end of the second liquid inlet pipe passes through the box body to be connected to an external liquid supply pipe.

8. The wafer temporary storage device according to claim 7, characterized in that: The liquid spraying mechanism further includes: a second driving adjustment member, which is connected to the outlet end of the second liquid inlet pipe and is used to drive the outlet end of the second liquid inlet pipe to move so as to adjust the spraying angle of the second spray hole.

9. The wafer temporary storage device according to claim 1, characterized in that: The bottom wall of the box body is provided with a drain port, and in the direction toward the drain port, the bottom wall of the box body extends downwardly and obliquely. The wafer temporary storage device further comprises: a filter element, and the filter element is arranged at the position of the drain port.

10. The wafer temporary storage device according to any one of claims 1 to 9, characterized in that: The drive assembly comprises: A driving wheel, the driving wheel is rotatably disposed in the box, and a driving groove suitable for accommodating the edge of the wafer is formed on the circumferential surface of the driving wheel; a driving member, the driving member being connected to the driving wheel and being used for driving the wafer to rotate through the driving wheel, The number of the driving wheels is at least one. When the number of the driving wheels is multiple, the multiple driving wheels are arranged at intervals along the circumference of the wafer, and the multiple driving wheels have the same rotation direction.

11. The wafer temporary storage device according to claim 10, characterized in that: The driving wheel is rotatable around a horizontally extending rotation axis, and the driving wheel is suitable for supporting and driving the lower edge of the wafer so that the wafer is vertically arranged in the temporary storage chamber.

12. The wafer temporary storage device according to claim 11, characterized in that: The driving assembly also includes a support member, which is disposed in the box body and is provided with a support groove suitable for accommodating the lower edge of the wafer.

13. The wafer temporary storage device according to any one of claims 1 to 9, characterized in that: The box body is provided with an exhaust port connected to the temporary storage chamber, and the wafer temporary storage device further includes: An exhaust pipe, wherein the exhaust pipe is arranged outside the box, the inlet end of the exhaust pipe is connected to the exhaust port, and at least a portion of the exhaust pipe extends upward in the direction of the airflow in the exhaust pipe; and / or A guide member, wherein the guide member is arranged in the temporary storage chamber and connected to the exhaust port, the inner side of the guide member defines a guide channel, or the guide member cooperates with the inner wall of the temporary storage chamber to define the guide channel, and in the direction from the inlet end of the guide channel toward the exhaust port, at least a portion of the guide channel extends upward.

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