Heat dissipation assembly of PQC password card and PQC password card integrated assembly
By using post-quantum cryptography technology and efficient heat dissipation components in PQC cryptography cards, the problem of fragility in traditional cryptography technology when facing quantum computers is solved, the resistance to quantum computer cracking is achieved, and the normal operation and information security of PQC cryptography cards are ensured.
Patent Information
- Application Number
- CN202421237839.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-31
- Publication Date
- 2025-04-11
- Estimated Expiration
- 2034-05-31
AI Technical Summary
Traditional cryptographic technology becomes fragile when facing quantum computers and cannot resist the cracking of quantum computers, resulting in the threat of information security.
Using post-quantum cryptography (PQC) technology, effective heat dissipation is achieved by designing a PQC cryptography card with integrated electronic devices and a heat dissipation fan with a heat dissipation channel in its heat dissipation components.
Through effective heat dissipation methods, we ensure that the PQC password card can operate normally during work, avoid performance degradation or failure caused by heat accumulation, and thus improve the resistance to information security.
Smart Images
Figure CN222750747U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of quantum computers, in particular to a heat dissipation component of a PQC password card and a PQC password card integrated component. Background Art
[0002] Information security is a comprehensive and interdisciplinary scientific field, which widely involves many disciplines such as mathematics, cryptography, computer, communication, control, artificial intelligence, security engineering, humanities, etc. It is a hot subject area that has developed rapidly in recent years. With the development of information technology, people are facing the severe test of information security while enjoying the huge benefits brought by information resources. The security problem of information is becoming increasingly prominent, and various security applications based on cryptographic principles are becoming more and more extensive. Data encryption has penetrated into every corner of information application. So far, cryptographic technology is the most effective way to achieve information security and is the core technology of information security. Through data encryption, people can effectively ensure that the content on the communication line is not leaked, and can also verify the integrity of the transmitted information.
[0003] However, with the rapid development of quantum computer technology, traditional cryptographic technology will no longer be unbreakable, and quantum computers can easily crack traditional passwords. In order to cope with this crisis, a new research direction has emerged in cryptography: Post-Quantum Cryptography (PQC). As the name suggests, the password used after quantum computers is a password that can resist being cracked by quantum computers. Usually, this PQC password card that can effectively resist being cracked by quantum computers is a PCB board with integrated electronic devices. When the PQC password card is working, the electronic devices in it will generate a lot of heat, so in order to ensure the normal operation of the PQC password card, it needs to be effectively cooled.
[0004] It should be noted that the information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Utility Model Content
[0005] The utility model aims to provide a heat dissipation component of a PQC password card and a PQC password card integrated component with good heat dissipation effect.
[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0007] The utility model provides a heat dissipation component of a PQC password card, the PQC password card includes a PCB board and a plurality of electronic devices integrated on the PCB board, the heat dissipation component includes a heat conducting member provided with a heat dissipation channel and a heat dissipation fan;
[0008] Among them, several electronic devices include several first devices that need heat dissipation and at least one second device that does not need heat dissipation; one side of the heat conductor is arranged in close contact with each of the first devices and is spaced apart from each of the second devices; the heat dissipation fan is arranged on the other side of the heat conductor, and is used to blow away the heat conducted from the first device to the surface of the heat conductor along the heat dissipation channel.
[0009] The heat dissipation component of the PQC password card as described above, further, the heat conducting member comprises:
[0010] a substrate, one side of which is arranged in contact with each of the first devices and spaced from each of the second devices;
[0011] A plurality of parallel and spaced heat dissipation fins are vertically arranged on the other side of the substrate, and the heat dissipation channel is formed between any two adjacent heat dissipation fins. The heat dissipation fan is arranged on the other side of the substrate to dissipate the heat conducted from the first device to the surface of the heat conductor along the heat dissipation channel.
[0012] As described above, the heat dissipation assembly of the PQC password card, further, the heat conductive member also includes a plurality of heat conductive bosses arranged on one side of the substrate, and the largest end faces of a plurality of the first components are completely attached to the plurality of heat conductive bosses in a one-to-one correspondence.
[0013] The heat dissipation assembly of the PQC password card as described above, further, a thermally conductive silicone pad is provided between the thermally conductive boss and the first component.
[0014] As described above, the heat dissipation assembly of the PQC password card, further, the substrate is fixed to the PCB board by a heat-conducting column perpendicular to the PCB board, and the height of the heat-conducting column is greater than the height of the second device so that the second device is spaced apart from the substrate.
[0015] The heat dissipation assembly of the PQC password card as described above, further, the heat dissipation assembly also includes a protective cover arranged on the heat-conducting member, and the protective cover is provided with an inlet for the heat dissipation fan to take in air and an outlet for the heat dissipation channel to discharge air.
[0016] As described above, the heat dissipation assembly of the PQC password card, further, the heat dissipation fan is embedded in the other side of the heat conductive member, and the air outlet of the heat dissipation fan is arranged in a gap with the entrance of the heat dissipation channel.
[0017] The heat dissipation assembly of the PQC password card as described above, further, the heat dissipation fans are arranged in plurality;
[0018] And / or, the fan comprises a centrifugal fan;
[0019] And / or, the heat dissipation fins are in the shape of long sheets, S-shaped, wavy or broken lines;
[0020] And / or, the heat dissipation fin is provided with a plurality of protrusions or depressions;
[0021] And / or, the heat conducting member is made of aluminum alloy, copper and copper alloy.
[0022] On the other hand, the utility model provides a PQC password card integrated component, including a PQC password card and the above-mentioned heat dissipation component, wherein the heat dissipation component is used to dissipate heat for the PQC password card.
[0023] The PQC password card integrated component as described above, further, the PCB board is provided with a first area for arranging the first device and a second area for arranging the second device, and the first area and the second area are arranged at intervals along the length direction of the PCB board;
[0024] The heat dissipation fan is arranged in a third area on the heat conductive member directly opposite to the second area, and an air outlet of the heat dissipation fan faces a fourth area on the heat conductive member directly opposite to the first area.
[0025] The beneficial effects of the utility model are:
[0026] The heat dissipation component of the present application includes a heat conductive member provided with a heat dissipation channel and a heat dissipation fan. One side of the heat conductive member is arranged in contact with each first device and is arranged at an interval with each second device. This ensures that the heat of the first device that needs to dissipate heat is conducted to the heat conductive member, and at the same time, the heat generated by the first device will not interfere with the second device. Then, the heat conducted to the surface of the heat conductive member is blown away along the heat dissipation channel by the heat dissipation fan, thereby achieving the purpose of dissipating heat of several first devices at the same time to enable the normal operation of the PQC password card.
[0027] The PQC password card integrated component provided by the present invention includes the heat dissipation component of the PQC password card described above, and therefore has the same beneficial effects, which will not be described in detail herein. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 A schematic diagram of the front structure of the heat dissipation assembly of the PQC password card provided by the embodiment of the utility model;
[0029] Figure 2 A schematic diagram of the back structure of the heat dissipation component of the PQC password card provided by the embodiment of the utility model;
[0030] Figure 3 A schematic diagram of the structure of the PQC password card integrated component provided by the embodiment of the utility model;
[0031] Figure 4 A structural schematic diagram of the explosion state of the PQC password card integrated component provided by an embodiment of the utility model.
[0032] In the accompanying drawings: 10, PCB board; 20, electronic device; 30, heat conducting member; 31, substrate; 32, heat dissipating fin; 33, heat conducting boss; 34, heat conducting column; 40, heat dissipating fan. DETAILED DESCRIPTION
[0033] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and cannot be interpreted as limitations on the present application.
[0034] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.
[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0036] Figure 1 A schematic diagram of the front structure of the heat dissipation assembly of the PQC password card provided by the embodiment of the utility model; Figure 2 The back structure diagram of the heat dissipation component of the PQC password card provided by the embodiment of the utility model; Figure 1 and Figure 2As shown, this embodiment discloses a heat dissipation component of a PQC password card, the PQC password card includes a PCB board 10 and a plurality of electronic devices 20 integrated on the PCB board 10, the heat dissipation component includes a heat conducting member 30 provided with a heat dissipation channel and a heat dissipation fan 40; wherein the plurality of electronic devices 20 include a plurality of first devices that need heat dissipation and at least one second device that does not need heat dissipation; one side of the heat conducting member 30 is arranged in contact with each of the first devices and is arranged at intervals with each of the second devices; the heat dissipation fan 40 is arranged on the other side of the heat conducting member 30, and is used to blow away the heat conducted from the first device to the surface of the heat conducting member 30 along the heat dissipation channel.
[0037] The heat dissipation assembly of this embodiment includes a heat conductive member 30 provided with a heat dissipation channel and a heat dissipation fan 40. One side of the heat conductive member 30 is arranged in contact with each first device and is arranged at a distance from each second device, thereby ensuring that the heat of the first device that needs to be dissipated is conducted to the heat conductive member 30, and the heat generated by the first device will not interfere with the second device. Then, the heat conducted to the surface of the heat conductive member 30 is blown away along the heat dissipation channel by the heat dissipation fan 40, thereby achieving the purpose of dissipating heat of several first devices at the same time to enable the normal operation of the PQC password card.
[0038] In this embodiment, the first component requiring heat dissipation refers to a heat-generating component that generates a certain amount of heat when working; the second component not requiring heat dissipation refers to a non-heat-generating component that generates less heat when working and can be ignored.
[0039] In this embodiment, the material of the heat conducting member 30 is not specifically limited. In order to improve the heat conducting effect, the material of the heat conducting member 30 is aluminum alloy, copper or copper alloy.
[0040] In this embodiment, the structure of the heat conductor 30 is not specifically limited. In some implementations of this embodiment, the heat conductor 30 includes: a substrate 31, one side of the substrate 31 is arranged in contact with each of the first devices and is spaced apart from each of the second devices; a plurality of parallel and spaced heat dissipation fins 32 are vertically arranged on the other side of the substrate 31, and the heat dissipation channel is formed between any two adjacent heat dissipation fins 32; the heat dissipation fan 40 is arranged on the other side of the substrate 31, and is used to blow away the heat conducted from the first device to the surface of the heat conductor 30 along the heat dissipation channel.
[0041] By arranging the substrate 31 in close contact with each first device and arranging it with a gap between each second device, the heat on several first devices is transferred to the heat conducting member 30, and the heat generated by the first device will not interfere with the second device; by arranging a plurality of parallel and spaced heat dissipation fins 32 on the substrate 31, a plurality of parallel and spaced heat dissipation channels are formed on the heat conducting member 30, thereby increasing the heat dissipation area and improving the heat dissipation effect.
[0042] In this embodiment, the shape of the heat dissipation fins 32 is not specifically limited, and can be a long sheet shape. In order to increase the heat dissipation area, the heat dissipation fins 32 can be S-shaped, wavy, or folded. In order to further increase the heat dissipation area and improve the heat dissipation effect, the heat dissipation fins 32 are provided with a plurality of protrusions or depressions.
[0043] In this embodiment, the type of the heat dissipation fan 40 is not specifically limited. In order to improve the heat dissipation effect, the heat dissipation fan 40 is a centrifugal fan.
[0044] In the present embodiment, the number of the cooling fans 40 is not specifically limited and can be one. In order to improve the cooling effect, a plurality of cooling fans 40 can also be arranged. The arrangement of the plurality of cooling fans 40 is not specifically limited. For example, two cooling fans 40 are arranged on the heat conductor 30, and the air outlets of the two cooling fans 40 are arranged in the same direction and the air outlet of one of the cooling fans 40 faces a part of the plurality of cooling channels, and the air outlet of the other cooling fan 40 faces the remaining part of the plurality of cooling channels.
[0045] In order to improve the heat conduction effect of the heat conductor 30, in some implementations of the present embodiment, the heat conductor 30 also includes a plurality of heat-conducting bosses 33 arranged on one side of the substrate 31, and the largest end faces of a plurality of the first components are completely attached to the plurality of heat-conducting bosses 33 in a one-to-one correspondence; by providing the heat-conducting bosses 33, it is ensured that the heat of the first components is efficiently conducted to the substrate 31, thereby improving the heat dissipation effect.
[0046] It should be noted that: in this embodiment, the maximum end faces of the plurality of first components are completely attached to the plurality of heat-conducting bosses 33 in a one-to-one correspondence. Here, it is necessary to ensure that the size of the bonding surface between the heat-conducting boss 33 and the first component is greater than or equal to the maximum end face size of the first component. The shape of the heat-conducting boss 33 is not specifically limited, and the above conditions can be met. For example, Figure 2 As shown, there are basically three rectangular heat-conducting bosses 33, which can be arranged in a fit with the three first devices. In addition, since the heights of several first devices are different, in order to ensure the uniformity of the height of the components after installation so as to facilitate the insertion of the integrated components into the chassis slots, heat-conducting bosses 33 of different heights can be set to match the first devices of different heights.
[0047] In order to further improve the heat conduction effect of the heat conducting member 30 , in some implementations of this embodiment, a thermally conductive silicone pad is provided between the thermally conductive boss 33 and the first component.
[0048] By arranging a thermally conductive silicone pad between the thermally conductive boss 33 and the first device, not only the heat transfer efficiency generated by the first device is improved, but also, since a large amount of heat generated by the first device during operation may cause a temperature difference between the first device and the thermally conductive boss 33, thereby generating thermal stress, the thermally conductive silicone pad can help alleviate such thermal stress and improve the stability and reliability of the first device.
[0049] In order to further improve the heat conduction effect of the heat-conducting member 30, in some implementations of this embodiment, the substrate 31 is fixed to the PCB board 10 through a heat-conducting column 34 perpendicular to the PCB board 10, and the height of the heat-conducting column 34 is greater than the height of the second device so that the second device is arranged at a distance from the substrate 31. The heat-conducting column 34 in this implementation not only realizes the spacing arrangement of the second device and the substrate, but also can conduct the heat on the PCB board 10 to the substrate 31 through the heat-conducting column 34, thereby improving the overall heat dissipation effect of the PQC password card.
[0050] In the present embodiment, the shape of the thermally conductive column 34 is not specifically limited, and it can be a cylindrical body or a square cylinder. The connection method between the thermally conductive column 34 and the substrate 31 is not specifically limited, and the thermally conductive column 34 can be directly integrally formed with the substrate 31, or can be welded to the substrate 31. The connection method between the thermally conductive column 34 and the PCB board 10 is also not specifically limited. For example, a threaded hole is provided in the center of the thermally conductive column 34, and a mounting hole is provided on the PCB board 10. Screws are passed through the mounting hole and the threaded hole to realize a detachable connection between the thermally conductive column 34 and the PCB board 10.
[0051] In order to further improve the heat conduction effect of the heat conductor 30, in some implementations of the present embodiment, the heat dissipation assembly also includes a protective cover arranged on the heat conductor 30, and the protective cover is provided with an inlet for the cooling fan 40 to take in air and an outlet for the cooling channel to discharge air; by providing the protective cover, not only can the heat be blown out along the cooling channel more efficiently, thereby improving the heat dissipation effect, but it also has a dust-proof effect.
[0052] In order to further improve the overall heat dissipation effect of the heat dissipation assembly, in some implementations of the present embodiment, the heat dissipation fan 40 is embedded in the other side of the heat conductor 30, and the air outlet of the heat dissipation fan 40 is arranged in a gap with the entrance of the heat dissipation channel; by embedding the heat dissipation fan 40 in the other side of the heat conductor 30, not only the integration of the entire heat dissipation assembly is improved, but also the distance between the air outlet of the heat dissipation fan 40 and the entrance of the heat dissipation channel is shortened, thereby ensuring that the wind blown by the fan can more efficiently dissipate the heat conducted from the PQC password card to the heat dissipation channel, thereby improving the heat dissipation effect.
[0053] Figure 3 A schematic diagram of the structure of the PQC password card integrated component provided by the embodiment of the utility model; Figure 4 The schematic diagram of the structure of the PQC password card integrated component explosion state provided by the embodiment of the utility model is as follows Figure 3 and Figure 4 As shown: Based on the same application concept, the embodiment of the present application also proposes a PQC password card integrated component, including a PQC password card and the above-mentioned heat dissipation component, and the heat dissipation component is used to dissipate heat for the PQC password card. The PQC password card integrated component of the present application includes the above-mentioned heat dissipation component, and therefore has the same beneficial effects as the above-mentioned heat dissipation component, which will not be repeated here.
[0054] Usually, in order to ensure the integration of the PQC password card integrated component and to save costs, the heat dissipation component adopts a solution of arranging a heat dissipation fan 40. When only one heat dissipation fan 40 is arranged, how to ensure the best heat dissipation effect becomes very important. Based on this, in some implementations of the present embodiment, the PCB board 10 is provided with a first area for arranging the first device and a second area for arranging the second device, and the first area and the second area are arranged at intervals along the length direction of the PCB board 10; the heat dissipation fan 40 is arranged in the third area on the heat conductive member 30 opposite to the second area, and the air outlet of the heat dissipation fan 40 faces the fourth area on the heat conductive member 30 opposite to the first area.
[0055] Through the above scheme, the first device and the second device are separately arranged in the first area and the second area of the PCB board 10, the cooling fan 40 is arranged in the third area on the heat conductor 30 opposite to the second area, and the air outlet of the cooling fan 40 is toward the fourth area on the heat conductor 30 opposite to the first area, so that the heat conducted from the first devices to the fourth area can be efficiently dissipated, thereby improving the heat dissipation effect.
[0056] In the description of this specification, the description with reference to the terms "some embodiments" or "examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.
[0057] The above are only preferred embodiments of the present invention and do not limit the present invention in any way. Any technician in the relevant technical field, without departing from the scope of the technical solution of the present invention, may make any equivalent replacement or modification to the technical solution and technical content disclosed in the present invention, which shall be deemed as the content of the technical solution of the present invention and still fall within the protection scope of the present invention.
Claims
1. A heat dissipation assembly of a PQC password card, the PQC password card comprising a PCB board and a plurality of electronic devices integrated on the PCB board, characterized in that: The heat dissipation assembly includes a heat conducting member provided with a heat dissipation channel and a heat dissipation fan; Among them, several electronic devices include several first devices that need heat dissipation and at least one second device that does not need heat dissipation; one side of the heat conductor is arranged in close contact with each of the first devices and is spaced apart from each of the second devices; the heat dissipation fan is arranged on the other side of the heat conductor, and is used to blow away the heat conducted from the first device to the surface of the heat conductor along the heat dissipation channel.
2. The heat dissipation assembly of the PQC password card according to claim 1, characterized in that: The heat conducting member comprises: a substrate, one side of which is arranged in contact with each of the first devices and spaced from each of the second devices; A plurality of parallel and spaced heat dissipation fins are vertically arranged on the other side of the substrate, and the heat dissipation channel is formed between any two adjacent heat dissipation fins. The heat dissipation fan is arranged on the other side of the substrate to dissipate the heat conducted from the first device to the surface of the heat conductor along the heat dissipation channel.
3. The heat dissipation assembly of the PQC password card according to claim 2, characterized in that: The heat conducting member further comprises a plurality of heat conducting bosses arranged on one side of the substrate, and the largest end faces of a plurality of the first components are completely attached to the plurality of heat conducting bosses in a one-to-one correspondence.
4. The heat dissipation assembly of the PQC password card according to claim 3, characterized in that: A thermally conductive silicone pad is provided between the thermally conductive boss and the first component.
5. The heat dissipation assembly of the PQC password card according to claim 2, characterized in that: The substrate is fixed on the PCB board via a heat-conducting column perpendicular to the PCB board, and the height of the heat-conducting column is greater than the height of the second component so that the second component is spaced apart from the substrate.
6. The heat dissipation assembly of the PQC password card according to any one of claims 1 to 5, characterized in that: The heat dissipation assembly also includes a protective cover which is covered on the heat-conducting member. The protective cover is provided with an inlet for the heat dissipation fan to take in air and an outlet for the heat dissipation channel to discharge air.
7. The heat dissipation assembly of the PQC password card according to claim 1, characterized in that: The heat dissipation fan is embedded in the other side of the heat conducting member, and an air outlet of the heat dissipation fan is arranged in a gap with an inlet of the heat dissipation channel.
8. The heat dissipation assembly of the PQC password card according to claim 2, characterized in that: The heat dissipation fans are arranged in plurality; And / or, the fan comprises a centrifugal fan; And / or, the heat dissipation fins are in the shape of long sheets, S-shaped, wavy or broken lines; And / or, the heat dissipation fin is provided with a plurality of protrusions or depressions; And / or, the heat conducting member is made of aluminum alloy, copper and copper alloy.
9. A PQC password card integrated component, characterized in that: It comprises a PQC password card and a heat dissipation component as described in any one of claims 1 to 8, wherein the heat dissipation component is used to dissipate heat for the PQC password card.
10. The PQC password card integrated component according to claim 9, characterized in that: The PCB board is provided with a first area for arranging the first device and a second area for arranging the second device, and the first area and the second area are arranged at intervals along the length direction of the PCB board; The heat dissipation fan is arranged in a third area on the heat conductive member directly opposite to the second area, and an air outlet of the heat dissipation fan faces a fourth area on the heat conductive member directly opposite to the first area.