Vapor Chambers and Electronic Devices

Abstract

The present application discloses a heat spreader and an electronic device, and relates to the technical field of electronic devices. The heat spreader includes a shell having a closed cavity, and a cooling medium and a capillary structure layer arranged in the closed cavity, the shell includes: a first bending portion, a first plate body and a second plate body, the second plate body, the capillary structure layer and the first plate body are stacked, a first channel for the cooling medium to flow is formed between the first plate body and the capillary structure layer, and a second channel for the cooling medium to flow is formed between the second plate body and the capillary structure layer; wherein at least one side of the first plate body and at least one side of the second plate body are connected by the first bending portion, the first plate body, the first bending portion and the second plate body are enclosed to form a closed cavity, a third channel is formed between the first bending portion and the capillary structure layer, and the third channel connects the first channel and the second channel.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to a heat spreader and an electronic equipment. Background Art

[0002] There are many kinds of heating elements in the electronic device. Since the heating elements are highly integrated and have high power, the electronic device generates serious heat. The electronic device in the related art is provided with a vapor chamber (VC) to improve the heat dissipation efficiency of the heating element. The vapor chamber includes a first plate body and a second plate body. The edges of the first plate body and the second plate body are stacked and sealed to form an edge sealing area. The edge sealing area is used to enclose a closed cavity, which is filled with a cooling medium and a capillary structure layer. The capillary structure layer extends to the edge sealing area, which will easily lead to the failure of the sealing of the stacked first plate body and the second plate body, resulting in the edge sealing area being unable to dissipate heat through the capillary structure layer. The heat dissipation efficiency of the edge sealing area is poor. Since the edge sealing area occupies the volume of the vapor chamber, the effective heat dissipation area of ​​the vapor chamber is reduced. Utility Model Content

[0003] The present application aims to provide a vapor chamber and an electronic device, which at least solve the technical problem that the edge sealing area reduces the effective heat dissipation area of ​​the vapor chamber.

[0004] In a first aspect, an embodiment of the present application provides a vapor chamber, the vapor chamber comprising a shell having a closed cavity, and a cooling medium and a capillary structure layer arranged in the closed cavity, the shell comprising:

[0005] A first bending portion, at least part of which is bent into an arc shape;

[0006] A first plate body and a second plate body, the second plate body, the capillary structure layer and the first plate body are stacked, a first channel for the flow of cooling medium is formed between the first plate body and the capillary structure layer, and a second channel for the flow of cooling medium is formed between the second plate body and the capillary structure layer; wherein, at least one side edge of the first plate body and at least one side edge of the second plate body are connected by a first bending portion, the first plate body, the first bending portion and the second plate body are enclosed to form a closed cavity, a third channel is formed between the first bending portion and the capillary structure layer, and the third channel connects the first channel and the second channel.

[0007] In a second aspect, an embodiment of the present application provides an electronic device, the electronic device comprising

[0008] An upper cover and a lower cover, the upper cover and the lower cover are combined to form a receiving cavity;

[0009] As for the heat spreader provided in the first aspect, part of the shell is clamped between the upper cover and the lower cover, and the first bent portion is suspended in the receiving cavity.

[0010] In an embodiment of the present application, at least one side edge of the first plate body and at least one side edge of the second plate body are connected through a first bending portion, so that there is no need to set a sealing area in the area where the first bending portion is located, and the cooling medium can flow between the first channel and the second channel through a third channel, so that the area where the first bending portion is located has better heat dissipation capacity, thereby increasing the effective heat dissipation area of ​​the heat spreader.

[0011] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0013] Figure 1 is a schematic diagram of the three-dimensional structure of an embodiment of a vapor chamber according to the present application;

[0014] Figure 2 is a schematic cross-sectional structure diagram of an embodiment of a vapor chamber according to the present application;

[0015] Figure 3 is one of the partial cross-sectional structural schematic diagrams of an embodiment of a vapor chamber according to the present application;

[0016] Figure 4 is a second schematic diagram of a partial cross-sectional structure of an embodiment of a vapor chamber according to the present application;

[0017] Figure 5 This is the third partial cross-sectional structural schematic diagram of the embodiment of the heat spreader according to the present application.

[0018] Description of Reference Numerals

[0019] 10. Heat spreader; 1. Shell; 11. First bending portion; 12. First plate; 121. First side; 122. Second side; 123. First main body; 124. First connecting portion; 13. Second plate; 131. Second main body; 132. Second connecting portion; 133. Fourth side; 14. Third plate; 141. Third main body; 142. Third connecting portion; 15. Second bending portion; 2. Sealed cavity; 21. First channel; 22. Second channel; 23. Third channel; 3. Capillary structure layer; 31. Capillary structure portion; 32. Capillary bending portion; 5. Thermal insulation glue;

[0020] X, first direction. DETAILED DESCRIPTION

[0021] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0022] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0023] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0024] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0025] Combine the following Figures 1 to 5 A vapor chamber and an electronic device according to embodiments of the present application are described.

[0026] like Figures 1 to 3As shown, a heat spreader 10 includes a shell 1 with a closed cavity, and a cooling medium and a capillary structure layer 3 arranged in the closed cavity. The shell 1 includes a first bending portion 11, a first plate body 12 and a second plate body 13. At least a portion of the first bending portion 11 is bent into an arc shape; the second plate body 13, the capillary structure layer 3 and the first plate body 12 are stacked, and a first channel 21 for the cooling medium to flow is formed between the first plate body 12 and the capillary structure layer 3, and a second channel 22 for the cooling medium to flow is formed between the second plate body 13 and the capillary structure layer 3;

[0027] Among them, at least one side of the first plate body 12 and at least one side of the second plate body 13 are connected through the first bending portion 11, the first plate body 12, the first bending portion 11 and the second plate body 13 are enclosed to form a closed cavity, and a third channel 23 is formed between the first bending portion 11 and the capillary structure layer 3, and the third channel 23 connects the first channel 21 and the second channel 22.

[0028] The closed cavity may be a vacuum cavity, and the cooling medium is filled into the closed cavity so that the cooling medium can flow in the closed cavity and switch between gas and liquid. The closed cavity may be evacuated to obtain a vacuum cavity, and then the cooling medium is injected into the vacuum cavity. The cooling medium is pure water, alcohol or other medium. Optionally, the cooling medium is pure water.

[0029] The heating element 20 can be placed on one side of the first plate 12 or the second plate 13. The area in the closed cavity corresponding to the heating element 20 is a heat absorption area for the cooling medium, and the area in the closed cavity not corresponding to the heating element 20 is a heat release area for the cooling medium. The cooling medium absorbs the heat emitted by the heating element 20 at the heat absorption area, and the cooling medium absorbs the heat and vaporizes. The heated cooling medium moves to the heat release area to release heat, and the cooled cooling medium liquefies and moves to the heat absorption area to absorb heat again.

[0030] The capillary structure layer 3 can be a mesh with a capillary structure. When the gasified cooling medium begins to liquefy and releases the heat energy accumulated in the absorption, the liquefied cooling medium will flow back to the heat absorption end through the capillary structure layer 3 and start absorbing heat again.

[0031] The first plate body 12 and the second plate body 13 can both be triangles, polygons, irregular shapes, etc. The first plate body 12 and the second plate body 13 are stacked along the first direction X, and the first direction X can be the thickness direction of the heat spreader 10. The first plate body 12 has at least one side, and the second plate body 13 has at least one side. The two sides can be sealed and connected by welding, bonding, etc., so that the first plate body 12, the second plate body 13 and the first bending portion 11 are enclosed to form a closed cavity. The first plate body 12 has at least another side, and the second plate body 13 has at least another side. The two sides can be sealed and connected by the first bending portion 11. The first plate body 12 and the capillary structure layer 3 are stacked so that a first channel 21 for the flow of cooling medium can be formed therebetween, and the second plate body 13 and the capillary structure layer 3 are stacked so that a second channel 22 for the flow of cooling medium can be formed therebetween. The first bending portion 11 extends from the first plate body 12 to the second plate body 13, so that the first bending portion 11 crosses one side of the capillary structure layer 3 and can form a third channel 23 with the capillary structure layer 3. The third channel 23 connects the first channel 21 and the second channel 22, so that the cooling medium in the first channel 21 and the cooling medium in the second channel 22 can flow through the third channel 23.

[0032] When the heat spreader 10 is used in an electronic device, one or more ends of the heat spreader 10 where the first bend 11 is not provided can be used to fix to the housing of the electronic device. At least one side of the first plate body 12 and at least one side of the second plate body 13 are connected through the first bend 11, so that there is no need to set an edge sealing area in the area where the first bend 11 is located. The cooling medium in the first channel 21 and the cooling medium in the second channel 22 can flow to each other through the third channel 23, so that the area of ​​the heat spreader 100 where the first bend 11 is provided has better heat dissipation capacity than the edge sealing area, thereby increasing the effective heat dissipation area of ​​the heat spreader 10. When the heat spreader 10 is used in an electronic device, the heating element 20 can be placed in the area where the first bend 11 is provided, thereby increasing the flexibility of the layout of the heating element 20 in the electronic device.

[0033] In the embodiment provided in the present application, by setting at least one side edge of the first plate body 12 and at least one side edge of the second plate body 13 to be connected through the first bending portion 11, there is no need to set a sealing area in the area where the first bending portion 11 is located, and the cooling medium can flow between the first channel 21 and the second channel 22 through the third channel 23, so that the area where the first bending portion 11 is located has better heat dissipation capacity, thereby increasing the effective heat dissipation area of ​​the heat spreader 10.

[0034] The first plate 12, the first bending portion 11, and the second plate 13 may be integrally formed. The first plate 12, the first bending portion 11, and the second plate 13 may be prepared by using a heat-conducting plate. The heat-conducting plate may be bent in an area corresponding to the first bending portion 11 to obtain the first plate 12, the first bending portion 11, and the second plate 13 connected in sequence, and the first plate 12 and the second plate 13 are arranged to be spaced relative to each other along the first direction X. The heat-conducting plate may be made of copper, aluminum, or other materials with high thermal conductivity.

[0035] In one embodiment, the first plate body 12 includes a first main body portion 123 and a first connecting portion 124 connected to each other; the second plate body 13 includes a second main body portion 131 and a second connecting portion 132 connected to each other;

[0036] The capillary structure layer 3 is disposed between the first main body portion 123 and the second main body portion 131 . The first bending portion 11 connects the first main body portion 123 and the second main body portion 131 . The first connecting portion 124 and the second connecting portion 132 are stacked and tightly connected.

[0037] For the convenience of description, the side of the first plate body 12 connected to the first bending portion 11 is referred to as the first side 121, the side of the first plate body 12 directly connected to the second plate body 13 is referred to as the second side 122, the side of the second plate body 13 connected to the first bending portion 11 is referred to as the third side, and the side of the second plate body 13 directly connected to the first plate body 12 is referred to as the fourth side 133.

[0038] The first connection portion 124 may be disposed around the outer periphery of the first body portion 123 excluding the first side 121, and the second connection portion 132 may be disposed around the outer periphery of the second body portion 131 excluding the third side. At least one of the second side 122 and the fourth side 133 may be used to be fixed to the housing of the electronic device.

[0039] Exemplarily, the heat-conducting plate is a rectangular structure or a rounded rectangular structure, and the heat-conducting plate is bent along the center line of the rectangular structure or the rounded rectangular structure to obtain a rectangular first plate body 12 and a second plate body 13, the first plate body 12 has a first side 121 and three second sides 122, the second plate body 13 has a third side and three fourth sides 133, the three second sides 122 and the three fourth sides 133 are pressed together one by one along the first direction X and then welded to obtain a shell 1 with a closed cavity.

[0040] The projection area of ​​the first main body 123 along the first direction X is larger than the projection area of ​​the first connection portion 124 along the first direction X, so as to increase the effective heat dissipation area in the first plate body 12. The projection area of ​​the second main body 131 along the first direction X is larger than the projection area of ​​the second connection portion 132 along the first direction X, so as to increase the effective heat dissipation area in the second plate body 13. At least one of the first connection portion 124 and the second connection portion 132 may be in the shape of a plate, so as to facilitate clamping and fixing to the housing of the electronic device through the plate-shaped first connection portion 124 and the second connection portion 132.

[0041] In some embodiments, the first connection portion 124 and the second connection portion 132 are stacked along the first direction X, the first main body portion 123 and the second main body portion 131 are stacked along the first direction X, and the cooling medium is used to flow along the first direction X in the third channel 23 .

[0042] The first connection part 124 and the second connection part 132 can be welded along the first direction X. By overlapping the first connection part 124 and the second connection part 132 along the first direction X, the contact area between the first connection part 124 and the second connection part 132 is increased, thereby avoiding cold welding to a certain extent and improving the airtightness of the closed cavity.

[0043] The cooling medium can flow in the first channel 21 and the second channel 22 along a plane perpendicular to the first direction X, thereby diffusing heat energy from the heat absorption end to the heat release end. The cooling medium flows in the third channel 23 along the first direction X to exchange the cooling medium between the first channel 21 and the second channel 22 to expand the heat dissipation area.

[0044] Please refer to Figure 4 In some embodiments, the housing 1 further includes at least one third plate 14, at least a portion of which is accommodated in the sealed cavity, and the third plate 14 is stacked between the first plate 12 and the second plate 13, so as to divide the sealed cavity into at least two communicating chambers;

[0045] The capillary structure layer 3 includes a plurality of capillary structure parts, which are stacked on opposite sides of the third plate body 14. A first channel 21 is formed between the first plate body 12 and the capillary structure part, a second channel 22 is formed between the second plate body 13 and the capillary structure part, and a third channel 23 connects adjacent chambers.

[0046] The third plate body 14 divides the closed cavity into a plurality of interconnected chambers, so that the cooling medium in each chamber can transfer heat from the heat absorbing end to the heat releasing end, and then flow back from the heat releasing end to the heat absorbing end, thereby increasing the heat transfer link of the cooling medium in the heat spreader 10 and improving the cooling effect of the heat spreader 10. The capillary structure portion can be stacked on opposite sides of the third plate body 14 along the first direction X, so that the cooling medium on opposite sides of the third plate body 14 has the ability to flow back.

[0047] When there is one third plate body 14, the third plate body 14 divides the sealed cavity into two chambers; when there are two third plate bodies 14, the third plate body 14 divides the sealed cavity into three chambers; when there are three third plate bodies 14, the third plate body 14 divides the sealed cavity into four chambers, and so on.

[0048] In some embodiments, the third plate 14 may be provided with through holes to achieve communication between adjacent chambers.

[0049] In some other embodiments, the end of the third plate body 14 close to the first bending portion 11 is spaced apart from the first bending portion 11 .

[0050] The end of the third plate body 14 close to the first bending portion 11 is spaced apart from the first bending portion 11, so that a gap is formed between the end of the third plate body 14 close to the first bending portion 11 and the first bending portion 11, and the gap is the third channel 23. The cooling medium can flow through the third channel 23, so that the cooling medium can flow between adjacent chambers, thereby increasing the heat transfer link of the cooling medium in the heat spreader 10 and improving the cooling effect of the area where the first bending portion 11 is located.

[0051] Exemplarily, the number of third plates 14 is one, a first chamber is formed between the first main body 123 and the third plate 14, a second chamber is formed between the second main body 131 and the third plate 14, the cooling medium absorbs heat from the heat absorption point of the corresponding heating element 20, a part of the heated cooling medium moves in the first chamber along the dotted line direction L1 to the heat release end, a part of the heated cooling medium moves to the second chamber through the third channel 23, and moves to the heat release end in the second chamber along the dotted line direction L2.

[0052] In some embodiments, the capillary structure layer 3 also includes a capillary bending portion 32, which connects the capillary structure portions 31 disposed on both sides of the third plate body 14, and the capillary bending portion 32 is located between the first bending portion 11 and the third plate body 14, and the portion between the capillary bending portion 32 and the third plate body 14 forms the third channel 23.

[0053] By providing a capillary bending portion 32 to connect the capillary structure portions 31 disposed on both sides of the third plate body 14, the cooling medium can flow between the capillary bending portion 32 and the first bending portion 11, and between the capillary bending portion 32 and the third plate body 14, thereby improving the heat dissipation capacity of the heat spreader 10.

[0054] In some embodiments, the third plate body 14 includes a third main body portion 141 and a third connecting portion 142 that are connected to each other. The third main body portion 141 is arranged between the first main body portion 123 and the second main body portion 131, and the third connecting portion 142 is arranged around a portion of the periphery of the third main body portion 141. The first connecting portion 124, the third connecting portion 142 and the second connecting portion 132 are stacked along the first direction X and are sealed and connected in sequence.

[0055] The third connecting portion 142 is provided to ensure that the structure of the third main body portion 141 in the sealed cavity is stable. The first connecting portion 124, the third connecting portion 142 and the second connecting portion 132 are stacked and sealed in sequence along the first direction X to improve the sealing of the sealed cavity.

[0056] In some embodiments, the housing 1 further includes a second bending portion 15 , at least a portion of the second bending portion 15 is bent into an arc shape, and the second bending portion 15 connects the third connecting portion 142 and the second connecting portion 132 .

[0057] The first plate body 12, the first bending portion 11, the second plate body 13, the second bending portion 15 and the third plate body 14 can be an integrally formed structure, which is formed by bending the heat-conducting plate, thereby improving the stability of the first plate body 12, the first bending portion 11, the second plate body 13, the second bending portion 15 and the third plate body 14.

[0058] For example: the heat-conducting plate is a rectangular structure, and the heat-conducting plate is bent along the area corresponding to the second bending zone of the rectangular structure to obtain a rectangular third plate body 14 and a second plate body 13, and the heat-conducting plate is bent along the area corresponding to the first bending zone of the rectangular structure or the rounded rectangular structure to obtain a rectangular first plate body 12, and the first connecting part 124, the third connecting part 142 and the second connecting part 132 are pressed together and welded to obtain a shell 1 with a closed cavity.

[0059] In some embodiments, the first plate body 12 includes at least one first side 121 and at least one second side 122; the second plate body 13 includes at least one third side and at least one fourth side 133; the first bending portion 11 connects the first side 121 and the third side, and the second side 122 and the fourth side 133 are tightly connected, and the heat spreader 100 also includes thermal insulation glue 5, which is sealed at the connection between the first side 121 and the second side 122, and at the connection between the third side and the fourth side 133.

[0060] The heat-insulating glue 5 has a good heat-insulating effect, reducing the heat energy conducted to the second side 122 and the fourth side 133, thereby preventing the second side 122 and the fourth side 133 from being conducted to components that do not need heat energy when they are used to connect with other components in the electronic device. The heat-insulating glue 5 can also improve the airtightness of the closed cavity. Optionally, the heat-insulating glue 5 can be UV glue.

[0061] In a second aspect, the present application further provides an electronic device, which includes an upper cover and a lower cover, and a heat spreader 10 as described above, wherein a portion of the shell is clamped between the upper cover and the lower cover, and a first bent portion 11 is suspended in the receiving cavity.

[0062] The second side 122 and the fourth side 133 may be stacked between the upper cover and the lower cover. The electronic device provided in the embodiment of the present application includes the aforementioned vapor chamber 10, and the electronic device has all the beneficial effects of the aforementioned vapor chamber 10, which will not be described here to avoid repetition.

[0063] The electronic device provided in the present application may be a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted device, a mobile Internet device (MID), an augmented reality / virtual reality device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc. It may also be a personal computer (PC), a television (TV), a teller machine or a self-service machine, etc., and the embodiments of the present application are not specifically limited.

[0064] A variety of heating elements 20 in the electronic device can be installed in the receiving cavity 40, and the heating element 20 can be a display module, a camera module, a sound module, etc. In the case where the electronic device is a mobile phone, the first direction X can be the thickness direction of the electronic device, and the heat spreader 10 can be arranged relative to the camera module, the display module, the battery and the processor along the first direction X.

[0065] In some embodiments, the camera module is arranged at the center of the heat spreader 10, and the processor is arranged on one side of the camera module close to the first bend 11. The projection of the processor on the heat spreader 10 along the first direction X can cover the first bend 11, that is, the processor can correspond to the edge of the heat spreader 10. In the case where the heat spreader 10 provided in this embodiment and the heat spreader 10 with edge sealing areas on all sides in the related art have the same effective heat dissipation area, the distance between the processor and the camera module arranged on the heat spreader 10 provided in the board application can be increased by 3.5mm, thereby improving the flexibility of the processor layout and avoiding the processor exceeding the edge of the heat spreader 10, resulting in heat dissipation failure.

[0066] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A heat sink, characterized in that: The heat spreader includes a shell having a sealed cavity, and a cooling medium and a capillary structure layer arranged in the sealed cavity, and the shell includes: A first bending portion, at least part of which is bent into an arc shape; A first plate body and a second plate body, wherein the second plate body, the capillary structure layer and the first plate body are stacked, a first channel for the cooling medium to flow is formed between the first plate body and the capillary structure layer, and a second channel for the cooling medium to flow is formed between the second plate body and the capillary structure layer; At least one side edge of the first plate body and at least one side edge of the second plate body are connected through the first bending portion, the first plate body, the first bending portion and the second plate body enclose the closed cavity, a third channel is formed between the first bending portion and the capillary structure layer, and the third channel connects the first channel and the second channel.

2. The vapor chamber according to claim 1, characterized in that: The first plate body includes a first main body portion and a first connecting portion connected to each other; the second plate body includes a second main body portion and a second connecting portion connected to each other; The capillary structure layer is disposed between the first main body portion and the second main body portion, the first bending portion connects the first main body portion and the second main body portion, and the first connecting portion and the second connecting portion are stacked and tightly connected.

3. The heat sink according to claim 2, characterized in that: The first connection portion and the second connection portion are stacked along a first direction, the first main body portion and the second main body portion are stacked along the first direction, and the cooling medium is used to flow in the third channel along the first direction.

4. The heat sink according to claim 2, characterized in that: The housing further comprises: at least one third plate, at least a portion of which is accommodated in the sealed cavity, and the third plate is stacked between the first plate and the second plate to divide the sealed cavity into at least two communicating chambers; The capillary structure layer includes a plurality of capillary structure parts, which are stacked on opposite sides of the third plate body, the first channel is formed between the first plate body and the capillary structure part, the second channel is formed between the second plate body and the capillary structure part, and the third channel communicates with adjacent chambers.

5. The vapor chamber according to claim 4, characterized in that: An end portion of the third plate body close to the first bending portion is spaced apart from the first bending portion.

6. The vapor chamber according to claim 5, characterized in that: The capillary structure layer includes a capillary bending portion, which connects the capillary structure portions disposed on both sides of the third plate body, and is located between the first bending portion and the third plate body, and forms part of the third channel between the capillary bending portion and the third plate body.

7. The vapor chamber according to claim 5, characterized in that: The third plate body includes a third main body portion and a third connecting portion connected to each other, the third main body portion is arranged between the first main body portion and the second main body portion, the third connecting portion is arranged around a portion of the outer circumference of the third main body portion, and the first connecting portion, the third connecting portion and the second connecting portion are stacked and tightly connected in sequence.

8. The vapor chamber according to claim 7, characterized in that: The housing further includes a second bending portion, at least a portion of the second bending portion is bent into an arc shape, and the second bending portion connects the third connecting portion and the second connecting portion.

9. The vapor chamber according to claim 1, characterized in that: The first plate body includes at least one first side and at least one second side, the second plate body includes at least one third side and at least one fourth side, the first bending portion is connected along the first side and the third side, and the second side and the fourth side are sealed; the heat sink also includes: The heat-insulating adhesive is sealed at the connection between the first side and the second side, and at the connection between the third side and the fourth side.

10. An electronic device, characterized in that: The electronic device comprises: An upper cover and a lower cover, wherein the upper cover and the lower cover are combined to form a receiving cavity; According to any one of claims 1 to 9, part of the shell is clamped between the upper cover and the lower cover, and the first bent portion is suspended in the receiving cavity.

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