Chip packaging structure

Abstract

The utility model discloses a chip packaging structure, which belongs to the technical field of semiconductor devices. A chip packaging structure includes a chip and a shell, wherein two electrodes are installed through the side wall of the shell, a welding column is arranged between the electrode and the chip, a relay block is installed between the two electrodes, a bottom plate is installed at the bottom end of the relay block, and a glue potting block is filled between the shell and the bottom plate. Through the optimization of the overall structure, the two electrode ends are pressed against the relay block position, and the relay block cooperates with the shell to assist the electrode in installation and positioning, ensuring that the installation gap between the two electrodes is controllable, and the relay block is made of a good thermal conductor material, which can approach the electrode and the chip to absorb the working heat of the chip and transfer it to the bottom plate position. The bottom plate is completely exposed to the external air, and heat exchange can be performed to dissipate heat and cool the chip position, thereby playing a role in temperature control.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor devices, and more specifically to a chip packaging structure. Background Art

[0002] LED is the abbreviation of light-emitting diode, which is widely used in luminous lighting. When producing LED components, there are two types: continuous packaging and independent packaging. Continuous packaging can form light strips, which are suitable for low-brightness lighting, and independent packaged chips are designed to adapt to high-brightness scenes.

[0003] The existing independently packaged LED chips generate a lot of heat when working. After being packaged with glue, the heat is transferred to the electrodes through multiple solder joints for dissipation, resulting in high temperatures at the welding points between the chip and the electrode, and between the electrode and the power supply line. It is easy to have a false connection in a vibration environment. In view of this, we propose a chip packaging structure. Utility Model Content

[0004] 1. Technical solution

[0005] A chip packaging structure comprises a chip and a shell, wherein two electrodes are installed through the side wall of the shell, a welding column is arranged between the electrode and the chip, a relay block is installed between the two electrodes, a bottom plate is installed at the bottom end of the relay block, and a glue potting block is filled between the shell and the bottom plate.

[0006] Preferably, a lens is installed on the side of the chip facing away from the bottom plate, and a positioning groove 1 is formed on the side of the electrode close to the lens.

[0007] Preferably, the electrode comprises a substrate, and a lug is formed on one end of the substrate located outside the shell and extending away from the bottom plate.

[0008] Preferably, the bottom surface of the supporting ear is designed to be lower than the bottom surface of the bottom plate, and the bottom plate is suspended by the supporting ear.

[0009] Preferably, the substrate includes a base corresponding to the welding column, and the relay block includes a main body, and a notch is opened in the middle of the main body to match the base.

[0010] Preferably, a protrusion is installed at the bottom end of the base plate, and a second positioning groove cooperating with the protrusion is provided at the edge of the main body.

[0011] Preferably, the lower portion of the base plate is arranged to be an inclined bottom surface, and the top edge of the main body is provided with an inclined top surface which is in contact with the inclined bottom surface.

[0012] 2. Beneficial effects:

[0013] By optimizing the overall structure, the ends of the two electrodes are pressed against the relay block. The relay block cooperates with the outer shell to assist in the installation and positioning of the electrodes, ensuring that the installation gap between the two electrodes is controllable. The relay block is made of a good thermal conductor material and can be close to the electrode and chip to absorb the working heat of the chip and transfer it to the bottom plate. The bottom plate is completely exposed to the external air, and heat exchange can be performed to dissipate heat and cool the chip position, thereby playing a role in temperature control. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional schematic diagram of the utility model;

[0015] Figure 2 It is a cross-sectional schematic diagram of another angle of the present invention;

[0016] Figure 3 It is a schematic diagram of the disassembly of the local structure of the utility model;

[0017] Figure 4 It is a schematic diagram of the disassembly of part of the structure of the utility model.

[0018] Description of the numbers in the figure:

[0019] Lens 1; glue potting block 2; shell 3; electrode 4; substrate 41; base 42; bump 43; positioning groove 1 44; inclined bottom surface 45; ear 5; chip 6; welding column 7; bottom plate 8; relay block 9; main body 91; end block 92; positioning groove 2 93; notch 94; inclined top surface 95. DETAILED DESCRIPTION

[0020] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0021] This embodiment provides a chip packaging structure. Figure 1, including a chip 6 and a shell 3, the chip 6 is a high-power LED chip, which is used for energizing and emitting light. The shell 3 adopts a square structure that is through-through from top to bottom. The shell 3 can be used as a protective shell to protect the chip 6, and two electrodes 4 are installed through the side wall of the shell 3. The vertical side wall of the shell 3 is provided with a through hole, and the electrode 4 is inserted into the shell 3 through the through hole. At this time, a relay block 9 is installed between the two electrodes 4, and the ends of the two electrodes 4 are pressed against the position of the relay block 9. The relay block 9 cooperates with the shell 3 to assist in the installation and positioning of the electrode 4, ensuring that the installation gap between the two electrodes 4 is controllable, and the relay block 9 is made of insulating material, which can avoid short circuit between the electrodes 4, and facilitate the subsequent top installation of the chip 6. After the electrode 4 is installed, the chip 6 is placed from top to bottom on the electrode 4 located on the shell 3 On the upper inner side, at this time, a certain amount of solder is pre-set on the top surface of the electrode 4 to form a solder joint, and after the chip 6 is placed, it is heated and cooled, so that the solder can be melted and then cooled to form a solder column 7 between the electrode 4 and the chip 6, thereby realizing electrical welding of the chip 6 and the electrode 4. Finally, a transparent sealant is poured into the outer shell 3, and cooled between the outer shell 3 and the bottom plate 8 to form a transparent glue potting block 2, which fixes and seals the position of the electrode 4 and the chip 6 to improve the stability of use. In addition, a bottom plate 8 is installed at the bottom end of the relay block 9. When in use, the relay block 9 is made of a good thermal conductor material, which can be close to the electrode 4 and the chip 6 to absorb the working heat of the chip 6 and transfer it to the bottom plate 8. The bottom plate is completely exposed to the external air, and heat exchange can be performed to dissipate heat and cool the chip 6 position, thereby playing a role in temperature control.

[0022] Reference Figure 2 A lens 1 is installed on the side of the chip 6 facing away from the bottom plate 8. The middle part of the lens 1 is hemispherical and bulges away from the chip 6. It can refract the light emitted by the chip 6 to change the direction of the light. The light transmittance of the lens 1 is greater than that of the glue potting block 2, which can ensure that the light emitted by the chip 6 can be transmitted in its entirety, avoiding the light from being unable to be emitted and converted into heat due to multiple refractions in the housing 3, further reducing the heat generated at the position of the chip 6. At the same time, a positioning groove 44 is provided on the side of the electrode 4 close to the lens 1. After the electrode 4 is installed, the spacing between the two positioning grooves 44 is consistent, which has a positioning effect, facilitates the placement of the lens 1, and ensures that the lens 1 is directly opposite to the chip 6, ensuring that the light can be emitted smoothly. At the same time, before installation, an interface agent can be applied to the bottom surface of the positioning groove 44 to ensure that the lens 1 can be stably adhered between the two electrodes 4 to form a stable whole, avoiding displacement during subsequent pouring of the sealant.

[0023] Reference Figure 3The electrode 4 includes a substrate 41. The substrate 41 is made of copper-aluminum alloy and has electrical conductivity and strong ductility. During production, the substrate 41 is located at one end of the outer side of the shell 3 and extends to the side away from the bottom plate 8 to form a support ear 5. The support ear 5 is subsequently used to connect with the solder joint of the circuit board. Because the support ear 5 is arranged away from the bottom plate 8, the bottom plate 8 as a heat sink can be prevented from approaching or directly contacting the solder joint, avoiding the heat of the bottom plate 8 to affect the bonding firmness of the solder joint, preventing the solder joint from being falsely connected or loosened due to heat, and improving the mutual stability of installation and heat dissipation.

[0024] Reference Figure 2 The bottom surface of the ear 5 is designed to be lower than the bottom surface of the bottom plate 8. After the device is soldered to the circuit board, because the ear 5 is in direct contact with the circuit board, at this time, the bottom plate 8 is suspended by the ear 5, which can ensure that air can pass through the bottom surface of the bottom plate 8. Under normal use, the heat dissipation of the bottom plate 8 is guaranteed to be smooth.

[0025] Reference Figure 3 The substrate 41 includes a base 42 corresponding to the welding column 7. The base 42 adopts a semi-cylindrical structure, which can increase the surface area and flatness corresponding to the substrate 41 and the welding column 7, ensure the smooth and firm welding of the substrate 41 and the chip 6, and ensure the stability of the electrical connection. The relay block 9 includes a main body 91. The main body 91 adopts a rectangular structure, and a notch 94 is opened in the middle of the main body 91 to match the base 42. While accommodating the base 42, the two substrates 41 can be aligned left and right, which is convenient for positioning the substrate 41 to ensure that the base 42 is stably aligned with the conductive contacts of the chip 6 during subsequent welding with the chip 6.

[0026] Reference Figure 3 A bump 43 is installed at the bottom end of the substrate 41. The bump 43 extends downward and has a thickness equal to that of the main body 91. When installing the substrate 41 and the main body 91, a second positioning groove 93 cooperating with the bump 43 is provided at the edge of the main body 91. The main body 91 is installed from bottom to top, which can ensure that the bump 43 is inserted into the second positioning groove 93 to perform front and rear positioning of the substrate 41, further improve the accuracy and convenience of aligning the substrate 41, and increase the contact area between the substrate 41 and the main body 91, so that the heat generated at the welding position of the substrate 41 and the chip 6 can also be quickly transferred to the main body 91, thereby improving the heat dissipation efficiency of the substrate 41 and ensuring stable heat dissipation at the welding position of the substrate 41 and the chip 6.

[0027] Reference Figure 4 The lower part of the substrate 41 is arranged as an inclined bottom surface 45, and the inclined bottom surface 45 is inclined downward, which can leave installation space for the chip 6 and the lens 1 and reduce the overall thickness. The top edge of the main body 91 is provided with an inclined top surface 95 which is in contact with the inclined bottom surface 45. By the inclined top surface 95 being in contact with the inclined bottom surface 45, the effective contact area between the substrate 41 and the main body 91 is further increased, and the heat conduction and heat dissipation effect is improved.

[0028] Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A chip packaging structure, comprising a chip (6) and a housing (3), characterized in that: Two electrodes (4) are installed through the side wall of the shell (3); a welding column (7) is provided between the electrode (4) and the chip (6); a relay block (9) is installed between the two electrodes (4); a bottom plate (8) is installed at the bottom end of the relay block (9); and a glue potting block (2) is filled between the shell (3) and the bottom plate (8).

2. The chip packaging structure according to claim 1, characterized in that: A lens (1) is installed on the side of the chip (6) facing away from the bottom plate (8), and a positioning groove (44) is provided on the side of the electrode (4) close to the lens (1).

3. The chip packaging structure according to claim 2, characterized in that: The electrode (4) comprises a substrate (41), and the substrate (41) is located at one end outside the housing (3) and extends toward a side away from the bottom plate (8) to form a support ear (5).

4. The chip packaging structure according to claim 3, characterized in that: The bottom surface of the supporting ear (5) is designed to be lower than the bottom surface of the bottom plate (8), and the bottom plate (8) is suspended by the supporting ear (5).

5. The chip packaging structure according to claim 4, characterized in that: The substrate (41) comprises a base (42) corresponding to the welding column (7), and the relay block (9) comprises a main body (91). A notch (94) matching the base (42) is provided in the middle of the main body (91).

6. The chip packaging structure according to claim 5, characterized in that: A protrusion (43) is installed at the bottom end of the base plate (41), and a second positioning groove (93) cooperating with the protrusion (43) is arranged at the edge of the main body (91).

7. The chip packaging structure according to claim 6, characterized in that: The lower part of the base plate (41) is arranged to form an inclined bottom surface (45), and the top edge of the main body (91) is provided with an inclined top surface (95) which is in contact with the inclined bottom surface (45).

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