Semiconductor refrigeration chip packaging structure and semiconductor refrigeration equipment

Abstract

The utility model discloses a semiconductor refrigeration chip packaging structure and a semiconductor refrigeration device. The semiconductor refrigeration chip packaging structure includes a sealing foam plate with a channel portion, a semiconductor refrigeration chip located in the channel portion, a cold end radiator and a hot end radiator, wherein the cooling plate of the cold end radiator and the heat dissipation plate of the hot end radiator are respectively attached to the semiconductor refrigeration chip from opposite sides of the semiconductor refrigeration chip; wherein a protective frame and a sealing member are provided in the channel portion, the protective frame is located on the circumferential outer side of the semiconductor refrigeration chip and there is a gap between the semiconductor and the semiconductor, and the sealing member is arranged in the gap and wraps the semiconductor refrigeration chip. The utility model can realize full wrapping of the semiconductor refrigeration chip and has the advantages of good sealing performance and high stability.

Description

Technical Field

[0001] The utility model relates to the field of refrigeration equipment, in particular to a semiconductor refrigeration sheet packaging structure and semiconductor refrigeration equipment. Background Art

[0002] For example, semiconductor refrigeration equipment such as semiconductor wine cabinets uses semiconductor refrigeration sheets to achieve refrigeration through high-efficiency annular double-layer heat pipe heat dissipation and conduction technology, as well as automatic voltage and current conversion control technology. It does not require refrigerant and mechanical moving parts, and solves the application problems of traditional compressor wine cabinets such as medium contamination and mechanical vibration.

[0003] At present, semiconductor cooling sheets in semiconductor cooling devices are usually assembled by direct fixing, wherein the heat conducting substrate is attached to the hot surface of the semiconductor cooling sheet, the semiconductor cooling sheet is fixed in the fixing hole of the heat insulating member, and the cold conducting substrate of the cold aluminum is inserted into the fixing hole and attached to the cooling surface of the semiconductor cooling sheet. However, the semiconductor cooling sheets in the prior art such as the above have the defect of poor sealing effect during application, and condensation water is more likely to occur during use.

[0004] In addition, in the prior art, during the assembly process of the semiconductor cooling sheet, the leads of the semiconductor cooling sheet are often pulled, resulting in the lead being pulled off or broken. Utility Model Content

[0005] In order to at least partially solve the deficiencies in the prior art, the main purpose of the utility model is to provide a semiconductor refrigeration sheet packaging structure and a semiconductor refrigeration device with good sealing effect.

[0006] In order to achieve the above-mentioned purpose, the first aspect of the utility model discloses a semiconductor refrigeration plate packaging structure of a semiconductor refrigeration device, including a sealing foam plate with a channel portion, a semiconductor refrigeration plate located in the channel portion, a cold-end radiator and a hot-end radiator, the cooling plate of the cold-end radiator and the heat dissipation plate of the hot-end radiator are respectively attached to the semiconductor refrigeration plate from opposite sides of the semiconductor refrigeration plate; wherein: a protective frame and a sealing component are provided in the channel portion, the protective frame is located on the circumferential outer side of the semiconductor refrigeration plate and there is a gap between the semiconductor and the semiconductor, and the sealing component is arranged in the gap and wraps the semiconductor refrigeration plate.

[0007] According to a specific implementation of the utility model, the sealing component is a silicone seal, an epoxy resin seal or a rubber seal.

[0008] According to a specific embodiment of the utility model, the semiconductor refrigeration plate includes a refrigeration plate body and leads, a sealing component is provided with a wire through hole, and the leads are connected to the refrigeration plate body in the circumferential direction and pass through the wire through hole to be led out.

[0009] According to a specific implementation of the utility model, the cold end radiator comprises a cold end aluminum body located outside the channel portion, and the front end surface of the protective frame contacts the cold end aluminum body to form a sealing fit.

[0010] Furthermore, the front edge of the protective frame has a concave groove formed by being recessed backwards, and the front edges of the two opposite side walls of the concave groove in a direction orthogonal to the front-to-back direction are in contact with the cold end aluminum body to form a secondary leak-proof sealing fit.

[0011] Furthermore, the concave groove is an annular groove formed by extending along the circumference of the protection frame.

[0012] According to a specific implementation of the utility model, a mounting frame is provided on the outer side of the sealing foam plate, and the mounting frame is tightly fitted and connected to the sealing foam plate.

[0013] Furthermore, a connection bracket and a sealing ring are provided at the connection between the sealing foam plate and the mounting frame. The sealing ring is installed on the connection bracket and contacts the mounting frame to form a sealing fit.

[0014] According to a specific embodiment of the utility model, the hot end radiator further includes a heat pipe, a fin radiator and a cooling fan. The heat pipe is connected to the heat sink for heat transfer and extends outward to the side of the heat sink. The fin radiator is arranged on the heat pipe, and the cooling fan is installed on the fin radiator.

[0015] The second aspect of the utility model provides a semiconductor refrigeration device having a semiconductor refrigeration sheet packaging structure of the semiconductor refrigeration device as described in any one of the above items.

[0016] The utility model has the following beneficial effects: a semiconductor refrigeration chip packaging structure and a semiconductor refrigeration device are provided, in which the cooling plate of the cold end radiator and the heat dissipation plate of the hot end radiator are respectively attached to the semiconductor refrigeration chip from opposite sides of the semiconductor refrigeration chip, and the protective frame and the sealing member are used to form a seal around the semiconductor refrigeration chip, so as to fully wrap the semiconductor refrigeration chip, thereby improving the sealing effect of the semiconductor refrigeration chip. In addition, the existence of the sealing member is also conducive to the stable connection between the components, so that the structural stability is better.

[0017] In order to more clearly illustrate the purpose, technical solutions and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural diagram of an embodiment of the semiconductor refrigeration device of the utility model;

[0019] Figure 2 It is a first stereogram of the semiconductor refrigeration chip packaging structure;

[0020] Figure 3 is the second three-dimensional view of the semiconductor refrigeration chip packaging structure;

[0021] Figure 4 is the exploded view of the semiconductor refrigeration chip packaging structure;

[0022] Figure 5 is the third three-dimensional view of the semiconductor refrigeration chip packaging structure;

[0023] Figure 6 is the three-dimensional sectional view of the semiconductor refrigeration chip packaging structure;

[0024] Figure 7 is Figure 6 the front projection view of;

[0025] Figure 8 is the structural diagram of the protective frame. Specific Embodiments

[0026] In the following description, many specific details are set forth in connection with the embodiments in order to fully understand the present invention. However, it should be understood that the following embodiments and detailed description are for illustrative purposes only and do not limit the scope of protection of the present invention.

[0027] As Figure 1 shown, the semiconductor refrigeration device of the embodiment is specifically a semiconductor wine cabinet, which includes a semiconductor refrigeration chip packaging structure 10 and an inner container 20. The semiconductor refrigeration chip packaging structure 10 is installed behind the inner container 20, preferably in the middle rear area of the inner container 20. In the embodiment, the design is mainly directed to the semiconductor refrigeration chip packaging structure 10, so other structures of the semiconductor refrigeration device will not be further introduced.

[0028] As Figure 2-7 shown, the semiconductor refrigeration chip packaging structure 10 includes a mounting frame 11, a sealing foam board 12, a semiconductor refrigeration chip 13, a cold-end radiator 14, an outer support plate 15, a hot-end radiator 16, and a protective frame 17. Among them, the mounting frame 11 is used to connect with the inner container 20 to form a mounting. Exemplarily, the cross-section of the mounting frame 11 is in a "C" shape, and a mounting groove 111 is formed thereon. The inner container 20 is provided with a carrier plate (not shown in the figure) adapted to the mounting groove 111, and the mounting groove 111 and the carrier plate are used to form a mating connection to mount the mounting frame 11 to the inner container 20.

[0029] The sealing foam plate 12 is arranged on the installation frame 11, and is provided with a channel portion 121, which is specifically a square structure to adapt to the shape of the semiconductor refrigeration plate 13; preferably, the sealing foam plate 12 and the installation frame 11 are tightly fitted and connected, wherein the outer peripheral wall of the sealing foam plate 12 is arranged to be inclined, and as the sealing foam plate 12 and the installation frame 11 are continuously installed, the sealing foam plate 12 will produce a certain amount of deformation and be more firmly installed on the installation frame 11.

[0030] Furthermore, a connection bracket 18 and a sealing ring 19 may be provided at the connection between the sealing foam plate 12 and the mounting frame 11. The sealing ring 19 is mounted on the connection bracket 18 and contacts the mounting frame 11 to form a sealing fit. The sealing ring 19 is specifically a waterproof sealing ring to prevent the wet and cold gas in the liner 20 from leaking out. Figure 6-7 The cross section of the connecting bracket 18 is preferably S-shaped, and it has two matching grooves, which are an outer matching groove 181 and an inner matching groove 182. The outer matching groove 181 is used to form a connection with the sealing foam plate 12, and the two are connected together by, for example, bonding, and the inner matching groove 182 is used to accommodate the sealing ring 19. Preferably, the sealing ring 19 is, for example, a rubber sealing ring. When the sealing foam plate 12 and the connecting bracket 18 are installed in place, the sealing ring 19 is deformed to form a stable seal.

[0031] The cold end heat sink 14 is specifically an aluminum heat sink, which includes a cold end aluminum body 141 and a protruding heat sink plate 142. The heat sink plate 142 is also specifically an aluminum plate, which is in contact with the cold end of the semiconductor cooling plate 13 through a first contact end (surface) 143; wherein the heat sink plate 142 extends from front to back into the channel portion 121.

[0032] The hot end radiator 16 includes a heat sink 161, a heat pipe 162, a fin radiator 163 and a cooling fan 164. The heat pipe 162 cooperates with the heat sink 161 for heat transfer and extends outward to the side of the heat sink 161. The fin radiator 163 is arranged on the heat pipe 162, and the cooling fan 164 is installed on the fin radiator 163. The heat sink 161 is used to fit the hot end of the semiconductor cooling sheet 13. It is installed on the outer bracket plate 15 and extends into the channel portion 121 from the back to the front. Among them, the outer bracket plate 15 is fixed relative to the mounting frame 11. For example, the outer bracket plate 15 is assembled with the cold end radiator 14 through a connecting piece (such as a bolt 151) that penetrates the sealing foam plate 12, and at the same time, the semiconductor cooling sheet 13 is pressed and fixed with a predetermined pressure; for example, it is connected to the inner tank 20 or the outer shell of the wine cabinet through the mounting plate.

[0033] In the embodiment, in order to accelerate the heat dissipation process of the hot end, the heat sink of the fin heat sink 163 in the hot end heat sink 16 is preferably a non-protruding structure, that is, it is composed of a number of spaced parallel heat sinks, which can increase the windward area and help improve the heat dissipation effect. Further, a horizontal heat dissipation air duct is formed between the heat sinks, and two air inlets located on the left and right sides of the fin heat sink 163 are provided on the corresponding shell of the semiconductor wine cabinet. The wind entering through the air inlet can directly flow through the horizontal heat dissipation air duct formed by the heat sink under the action of the heat dissipation fan 164, so as to quickly take away the heat and dissipate it.

[0034] The semiconductor refrigeration sheet 13 is located in the channel portion 121 and is respectively attached to the cooling plate 142 and the heat dissipation plate 161; the semiconductor refrigeration sheet 13 includes a refrigeration sheet body 131 and a lead 132, and the lead 132 is used to connect with an external wire; when the refrigeration sheet body 131 is working, its cold end releases cold into the inner tank 20 through the cold end radiator 14, and the hot end releases heat into the surrounding environment through the hot end radiator 16.

[0035] The protective frame 17 is, for example, a silicone frame, specifically a hard silicone frame, which is arranged in the channel portion 121 and located on the circumferential outer side of the semiconductor refrigeration sheet 13. In the front-to-back direction, the thickness of the protective frame 17 preferably exceeds the thickness of the semiconductor refrigeration sheet 13, specifically, for example, slightly exceeds the length of the channel portion 121, thereby covering the cooling plate 142 and the heat sink 161; wherein, there is a gap between the inner wall surface of the protective frame 17 and the cooling plate 142, the semiconductor refrigeration sheet 13 and the heat sink 161, and a sealing component 171 is provided in the gap, and the sealing component 171 is used to wrap the semiconductor refrigeration sheet 13 in the circumferential direction, thereby completing the comprehensive sealing of the semiconductor refrigeration sheet 13.

[0036] In the embodiment, the packaging material can be used to achieve full wrapping and sealing of the semiconductor cooling plate 13, thereby improving the sealing effect of the semiconductor cooling plate 13 and completely avoiding the condensation phenomenon at the semiconductor cooling plate 13. Further, the above-mentioned gap can also provide space for the lead 132, wherein the sealing member 171 is provided with a wire hole, the lead 132 is connected to the circumference of the semiconductor cooling plate 13 and is led out through the wire hole, and the sealing member 171 is used to fix the part of the lead 132 close to the cooling plate body 131, thereby preventing the lead 132 from detaching from the semiconductor cooling plate 13 during the assembly process. In the embodiment, the sealing member 171 is specifically formed by curing the packaging material in a fluid / semi-fluid state, and the packaging material is, for example, silicone, epoxy resin or rubber, that is, the sealing member 171 is specifically a silicone seal, an epoxy resin seal or a rubber seal, and the wire hole thereon is specifically formed during the curing process.

[0037] like Figure 6-8As shown, the cold end aluminum body 141 has a second contact end (surface) 144 that abuts against the front side of the sealing foam plate 12, and the front end surface of the protective frame 17 contacts the second contact end (surface) 144 to form a sealing fit. Further, the front side edge of the protective frame 17 has a concave groove 172 formed by being recessed backward, and the concave groove 172 is specifically an annular groove formed by extending along the circumference of the protective frame 17; in the direction orthogonal to the front and rear directions, the front edges of the two opposite side walls of the concave groove 172 are in contact with the second contact end (surface) 144 to form a secondary leak-proof sealing fit.

[0038] In an optional embodiment, the protective frame 17 may also have an inclined inner side surface, and the inclined inner side surface is used to drain the packaging material injected into the gap, thereby improving the uniformity of the packaging material filling and ultimately improving the sealing performance.

[0039] Please continue reading Figure 8 A plurality of notches 173 are provided at the rear edge of the protection frame 17 . The notches 173 are mainly used to add packaging materials into the gaps to form a sealing component. In addition, the leads 132 can also be led outward from the notches 173 .

[0040] Although the present invention is described above through embodiments, the above embodiments are only used to exemplarily describe the feasible implementation methods of the present invention, and are not used to limit the protection scope of the present invention. Any equivalent substitutions or changes made by those skilled in the art in accordance with the present invention should also be covered by the protection scope defined by the claims of the present invention.

Claims

1. A semiconductor refrigeration chip packaging structure of a semiconductor refrigeration device, comprising a sealing foam plate having a channel portion, a semiconductor refrigeration chip located in the channel portion, a cold end radiator and a hot end radiator, wherein the cooling plate of the cold end radiator and the heat dissipation plate of the hot end radiator are respectively attached to the semiconductor refrigeration chip from opposite sides of the semiconductor refrigeration chip; characterized in that: A protection frame and a sealing member are provided in the channel portion. The protection frame is located outside the semiconductor cooling sheet in the circumferential direction and has a gap with the semiconductor. The sealing member is arranged in the gap and wraps the semiconductor cooling sheet.

2. The semiconductor refrigeration chip packaging structure of the semiconductor refrigeration equipment according to claim 1, characterized in that: The sealing component is a silicone seal, an epoxy resin seal or a rubber seal.

3. The semiconductor refrigeration chip packaging structure of the semiconductor refrigeration equipment according to claim 1, characterized in that: The semiconductor refrigeration plate comprises a refrigeration plate body and a lead wire. The sealing component is provided with a wire through hole. The lead wire is connected to the refrigeration plate body in a circumferential direction and passes through the wire through hole to be led out.

4. The semiconductor refrigeration chip packaging structure of the semiconductor refrigeration equipment according to claim 1, characterized in that: The cold end heat sink comprises a cold end aluminum body located outside the channel portion, and the front end surface of the protection frame is in contact with the cold end aluminum body to form a sealing fit.

5. The semiconductor refrigeration chip packaging structure of the semiconductor refrigeration equipment according to claim 4, characterized in that: The front edge of the protection frame has a concave groove formed by being recessed backwards, and the front edges of the two opposite side walls of the concave groove in a direction orthogonal to the front-to-back direction are in contact with the cold end aluminum body to form a secondary leakproof sealing fit.

6. The semiconductor refrigeration chip packaging structure of the semiconductor refrigeration equipment according to claim 5, characterized in that: The concave groove is an annular groove extending along the circumference of the protection frame.

7. The semiconductor refrigeration chip packaging structure of the semiconductor refrigeration equipment according to claim 1, characterized in that: A mounting frame is arranged on the outer side of the sealing foam plate, and the mounting frame is tightly fitted and connected with the sealing foam plate.

8. The semiconductor refrigeration chip packaging structure of the semiconductor refrigeration equipment according to claim 7, characterized in that: A connection bracket and a sealing ring are provided at the connection between the sealing foam plate and the installation frame. The sealing ring is installed on the connection bracket and contacts the installation frame to form a sealing fit.

9. The semiconductor refrigeration chip packaging structure of the semiconductor refrigeration equipment according to claim 1, characterized in that: The hot end radiator further includes a heat pipe, a fin radiator and a cooling fan. The heat pipe is connected to the heat sink in a heat transfer manner and extends outward to the side of the heat sink. The fin radiator is arranged on the heat pipe, and the cooling fan is installed on the fin radiator.

10. A semiconductor refrigeration device having a semiconductor refrigeration chip packaging structure of a semiconductor refrigeration device according to any one of claims 1 to 9.

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