Silicon wafer processing device

Abstract

The utility model discloses a silicon wafer processing device in the technical field, which comprises a silicon wafer processing device, one end of the silicon wafer processing device is provided with a silicon wafer cleaning tank, the other end of the silicon wafer processing device is provided with a guide adjusting mechanism, and the guide adjusting mechanism comprises a support base. The other end of the silicon wafer processing device is located at the top end of the supporting base and fixedly connected with a containing frame, the other end of the silicon wafer processing device is located between the containing frames and fixedly connected with a guide plate, and the other end of the silicon wafer processing device is located at the two ends of the guide plate and slidably connected with two side movable plates. By means of the guide adjusting mechanism, a large number of silicon wafers can be conveniently guided, the phenomenon that the silicon wafers are recombined in the transportation process, and then the processing effect of the device on the silicon wafers is affected is prevented, adjustment can be conducted in time when the silicon wafers of different sizes are processed, and the use range of the device is widened.

Description

Technical Field

[0001] The utility model relates to the technical field of a silicon wafer cleaning tank and a silicon wafer processing device, in particular to a silicon wafer processing device. Background Art

[0002] Conventional fossil fuels are becoming increasingly depleted. Among the existing sustainable energy sources, photovoltaics is undoubtedly the cleanest and most promising new energy source. Photovoltaic power generation devices, also known as solar cells, can directly convert solar energy into electrical energy. Their power generation principle is based on the photovoltaic effect of the semiconductor PN junction. The core of the photovoltaic power generation device is the battery cell. Currently, most of them are made of silicon wafers, and silicon wafer cleaning tanks and silicon wafer processing devices are required when silicon wafers are made. For this reason, this patent discloses a chain silicon wafer cleaning tank and silicon wafer processing device, application number 201921382922.8. By having a chain silicon wafer cleaning tank, the content of cleaning liquid attached to the silicon wafer after cleaning is reduced, and the phenomenon of liquid cross-linking in each process tank of the chain silicon wafer processing device is avoided, thereby ensuring the processing yield of the silicon wafer.

[0003] Although the above application has met the user's needs to a certain extent, there are still certain defects in the use process. The specific problems are as follows: since the device is not convenient for guiding multiple silicon wafers into the device during actual use, personnel need to manually adjust the positions of multiple silicon wafers to prevent multiple silicon wafers from overlapping, which reduces the efficiency of the device when processing silicon wafers. Based on this, the utility model designs a silicon wafer processing device to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide a silicon wafer processing device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a silicon wafer processing device, comprising a silicon wafer processing device, a silicon wafer cleaning tank is installed at one end of the silicon wafer processing device, a guide adjustment mechanism is installed at the other end of the silicon wafer processing device, the guide adjustment mechanism comprises a support base, the other end of the silicon wafer processing device is located at the top of the support base and is fixedly connected to a placement frame, the other end of the silicon wafer processing device is located between the placement frames and is fixedly connected to a guide plate, the other end of the silicon wafer processing device is located at both ends of the guide plate and is slidably connected to two side movable plates, which can facilitate the guidance of a large number of silicon wafers and can make timely adjustments when processing silicon wafers of different sizes;

[0006] A movable reflux mechanism is installed inside the silicon wafer cleaning tank, and the movable reflux mechanism can ensure that the water and silicon wafers inside the silicon wafer cleaning tank can be in active rotation while filtering the used water and then refluxing it.

[0007] Preferably, the guide adjustment mechanism further includes an inclined bottom plate, a vibration motor, a roller, a screw rod, upper and lower movable plates and an adjustment threaded rod;

[0008] An inclined bottom plate is fixedly installed on the top of the support base, one end of the inclined bottom plate is located at the bottom of the placement frame and is fixedly connected to a vibration motor, a roller is evenly connected to the inside of the guide plate for rotation, a screw rod is threadedly connected between the two movable plates on both sides, an upper and lower movable plates are movably connected between the two movable plates on both sides, and an adjusting threaded rod is rotatably connected to the top of the upper and lower movable plates.

[0009] Preferably, the movable reflux mechanism comprises an electric turntable, a stirring rod, a piston, a pipeline, a water collecting tank, a movable filter frame, a water pump and a drainage cover;

[0010] An electric turntable is evenly rotated inside the silicon wafer cleaning tank, a stirring rod is evenly fixed on the top of the electric turntable, pistons are symmetrically embedded and installed inside the silicon wafer cleaning tank, a pipe is embedded and installed at the bottom of the piston in the silicon wafer cleaning tank, a water collecting tank is clamped and connected between the two pipes, a movable filter frame is movably connected to one side of the water collecting tank, a water pump is placed at one end of the water collecting tank, and a drainage cover is connected to one end of the water pump through a water pipe.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] 1. Through the guiding and adjusting mechanism, it is convenient to guide a large number of silicon wafers, thereby preventing the silicon wafers from being overlapped during transportation, which in turn affects the effect of the device on the processing of the silicon wafers. In addition, it is possible to make timely adjustments when processing silicon wafers of different sizes, thereby increasing the scope of use of the device.

[0013] 2. Through the movable reflux mechanism, it is easy to ensure the fluidity between water and silicon wafers, so that the silicon wafers can be cleaned better, and the cleaned water can be filtered and then reintroduced into the device. On the one hand, it can timely save resources and reduce the time required for personnel to replace the water inside the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0015] Figure 1 It is a schematic diagram of the structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the guiding and adjusting mechanism of the utility model;

[0017] Figure 3 This is a schematic diagram of the installation structure of the upper and lower movable plates of the utility model;

[0018] Figure 4 It is a structural schematic diagram of the movable reflux mechanism of the utility model.

[0019] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0020] 1. Silicon wafer processing device; 2. Silicon wafer cleaning tank;

[0021] 3. Guide and adjust mechanism; 301. Support base; 302. Inclined bottom plate; 303. Placement frame; 304. Vibration motor; 305. Guide plate; 306. Roller; 307. Both side movable plates; 308. Screw; 309. Upper and lower movable plates; 310. Adjustment threaded rod;

[0022] 4. Movable reflux mechanism; 401. Electric turntable; 402. Stirring rod; 403. Piston; 404. Pipeline; 405. Water collecting tank; 406. Movable filter frame; 407. Water pump; 408. Drain cover. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-4 The utility model provides a technical solution: a silicon wafer processing device, including a silicon wafer processing device 1, a silicon wafer cleaning tank 2 is installed at one end of the silicon wafer processing device 1, and an adjustment guide mechanism 3 is installed at the other end of the silicon wafer processing device 1. The adjustment guide mechanism 3 includes a support base 301, and the other end of the silicon wafer processing device 1 is located at the top of the support base 301 and is fixedly connected with a placement frame 303. The placement frame 303 and the inclined bottom plate 302 are connected by a spring movable column to facilitate positioning of the placement frame 303. The other end of the silicon wafer processing device 1 is located between the placement frame 303 and is fixedly connected with a guide plate 305. The other end of the silicon wafer processing device 1 is located at both ends of the guide plate 305 and is slidably connected with two side movable plates 307;

[0025] The adjustment guide mechanism 3 also includes an inclined bottom plate 302, a vibration motor 304, a roller 306, a screw rod 308, upper and lower movable plates 309 and an adjustment threaded rod 310;

[0026] An inclined bottom plate 302 is fixedly installed on the top of the support base 301, and one end of the inclined bottom plate 302 is located at the bottom of the placement frame 303 and is fixedly connected to a vibration motor 304. The output end of the vibration motor 304 is in contact with the bottom of the placement frame 303, so that the placement frame 303 can be driven to move when the vibration motor 304 is running. The output end of the vibration motor 304 is electrically connected to the output end of the external power supply. The guide plate 305 is evenly rotated and connected to a roller 306. A screw rod 308 is threadedly connected between two movable plates 307 on both sides. The two screws 308 are driven by a double-headed motor to facilitate the rotation of the two screws 308. An upper and lower movable plates 309 are movably connected between the two movable plates 307 on both sides, and an adjusting threaded rod 310 is rotatably connected to the top of the upper and lower movable plates 309.

[0027] When in use, the support base 301 is moved to the required position, and then the silicon wafer is placed inside the placement frame 303, and then the vibration motor 304 on the top of the inclined bottom plate 302 is started to operate the vibration motor 304. When the vibration motor 304 operates, the placement frame 303 is driven to move, and the silicon wafer inside the placement frame 303 is moved to the surface of the guide plate 305 by shaking, and then moved to the surface of the roller 306 by the surface of the guide plate 305. The silicon wafer is introduced into the silicon wafer processing device 1 through the rotation of the roller 306, which can facilitate the guidance of a large number of silicon wafers, thereby preventing the silicon wafers from being transported. The phenomenon of overlap further affects the effect of the device on processing silicon wafers. The screw 308 is driven to rotate by a driving motor, and the screw 308 drives the movable plates 307 on both sides to move when the screw 308 rotates. After the movable plates 307 on both sides are moved to suitable positions along the surface of the guide plate 305, the adjusting threaded rod 310 is rotated to make the adjusting threaded rod 310 drive the upper and lower movable plates 309 to move to the required positions along the top of the two movable plates 307 on both sides. Then, the rotation of the adjusting threaded rod 310 is stopped, so that timely adjustments can be made when processing silicon wafers of different sizes, thereby improving the scope of use of the device.

[0028] A movable reflux mechanism 4 is installed inside the silicon wafer cleaning tank 2. The movable reflux mechanism 4 can ensure that the water and silicon wafers inside the silicon wafer cleaning tank 2 can be in active rotation while filtering the used water and then refluxing it.

[0029] The movable reflux mechanism 4 includes an electric turntable 401, a stirring rod 402, a piston 403, a pipeline 404, a water collecting box 405, a movable filter frame 406, a water pump 407 and a drainage cover 408;

[0030] An electric turntable 401 is connected to the inside of the silicon wafer cleaning tank 2 and rotates evenly. The output end of the electric turntable 401 is electrically connected to the output end of the external power supply. A stirring rod 402 is evenly fixedly installed on the top of the electric turntable 401. A piston 403 is symmetrically embedded and installed inside the silicon wafer cleaning tank 2. A pipe 404 is embedded and installed at the bottom of the piston 403 in the silicon wafer cleaning tank 2. A water collecting tank 405 is connected by clamping between the two pipes 404. One end of the water collecting tank 405 is in contact with the ground, which is convenient for positioning the position of the water collecting tank 405. A movable filter frame 406 is movably connected to one side of the water collecting tank 405. A water pump 407 is placed and connected to one end of the water collecting tank 405. The output end of the water pump 407 is electrically connected to the output end of the external power supply. One end of the water pump 407 is connected to a drainage cover 408 through a water pipe. The drainage cover 408 and the top of one end of the silicon wafer cleaning tank 2 are connected by a positioning piece, which is convenient for positioning the position of the drainage cover 408.

[0031] After the silicon wafer is processed by the silicon wafer processing device 1, the processed silicon wafer enters the silicon wafer cleaning tank 2 through the silicon wafer processing device 1, and the electric turntable 401 in the silicon wafer cleaning tank 2 is started to operate, and the electric turntable 401 drives the stirring rod 402 to rotate when the electric turntable 401 is running. The rotation of the stirring rod 402 can ensure the fluidity between water and the silicon wafer, so that the silicon wafer can be cleaned better. After the cleaning is completed, the piston 403 is disengaged from the silicon wafer cleaning tank 2, so that the silicon wafer cleaning tank 2 is The water inside the part flows into the pipe 404, and then flows into the water collecting tank 405 through the pipe 404, and then flows into the surface of the movable filter frame 406 through the water collecting tank 405. After the debris attached to the water is blocked by the movable filter frame 406, the water pump 407 is started to make the water pump 407 pump the filtered water in the water collecting tank 405 into the drain cover 408, and finally discharged through the drain cover 408. On the one hand, it can timely eliminate waste of resources and reduce the time required for personnel to replace the water inside the device.

[0032] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0033] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A silicon wafer processing device, comprising a silicon wafer processing device (1), wherein a silicon wafer cleaning tank (2) is installed at one end of the silicon wafer processing device (1), characterized in that: The other end of the silicon wafer processing device (1) is equipped with a guide adjustment mechanism (3); The guide adjustment mechanism (3) comprises a support base (301), the other end of the silicon wafer processing device (1) is located at the top of the support base (301) and is fixedly connected to a placement frame (303), the other end of the silicon wafer processing device (1) is located between the placement frames (303) and is fixedly connected to a guide plate (305), and the other end of the silicon wafer processing device (1) is located at both ends of the guide plate (305) and is slidably connected to two side movable plates (307); A movable reflux mechanism (4) is installed inside the silicon wafer cleaning tank (2), and the movable reflux mechanism (4) can ensure that the water and silicon wafers inside the silicon wafer cleaning tank (2) can be in active rotation while filtering the used water and then refluxing it.

2. A silicon wafer processing device according to claim 1, characterized in that: The guide adjustment mechanism (3) further comprises an inclined bottom plate (302), a vibration motor (304), a roller (306), a screw rod (308), upper and lower movable plates (309) and an adjustment threaded rod (310); An inclined bottom plate (302) is fixedly mounted on the top of the support base (301); one end of the inclined bottom plate (302) is located at the bottom of the placement frame (303) and is fixedly connected to a vibration motor (304); a roller (306) is evenly rotatably connected inside the guide plate (305); a screw rod (308) is threadedly connected between the two movable plates (307); an upper and lower movable plates (309) are movably connected between the two movable plates (307); and an adjusting threaded rod (310) is rotatably connected to the top of the upper and lower movable plates (309).

3. A silicon wafer processing device according to claim 2, characterized in that: The placement frame (303) and the inclined bottom plate (302) are connected via a spring movable column, and the output end of the vibration motor (304) and the bottom of the placement frame (303) are in contact with each other.

4. A silicon wafer processing device according to claim 2, characterized in that: The two screw rods (308) are driven by a double-headed motor.

5. The silicon wafer processing device according to claim 1, characterized in that: The movable reflux mechanism (4) comprises an electric turntable (401), a stirring rod (402), a piston (403), a pipeline (404), a water collecting tank (405), a movable filter frame (406), a water pump (407) and a drainage cover (408); An electric turntable (401) is evenly rotated and connected inside the silicon wafer cleaning tank (2), a stirring rod (402) is evenly fixedly installed on the top of the electric turntable (401), a piston (403) is symmetrically embedded and installed inside the silicon wafer cleaning tank (2), a pipe (404) is embedded and installed at the bottom of the piston (403) in the silicon wafer cleaning tank (2), a water collecting box (405) is clamped and connected between the two pipes (404), a movable filter frame (406) is movably connected to one side of the water collecting box (405), a water pump (407) is placed at one end of the water collecting box (405), and one end of the water pump (407) is connected to a drainage cover (408) through a water pipe.

6. A silicon wafer processing device according to claim 5, characterized in that: One end of the water collecting tank (405) is in contact with the ground, and the drainage cover (408) is connected to the top of one end of the silicon wafer cleaning tank (2) via a positioning piece.

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