Wafer cleaning and transferring mechanical arm

Abstract

The utility model discloses a wafer cleaning transfer mechanical arm, which comprises a transfer mechanical arm main body, the transfer mechanical arm main body comprises a clamping plate, a connecting seat, a mechanical arm I, a mechanical arm II, a mechanical arm III and a rotating seat, the rotating seat is arranged on the upper surface of a fixed seat, the mechanical arm III is arranged at the end part of the rotating seat, and the clamping plate is arranged on the connecting seat. The second mechanical arm is arranged at the end of the third mechanical arm, and the first mechanical arm is arranged at the end of the second mechanical arm. By designing the reinforcing clamping mechanism, when the transfer mechanical arm main body is clamped and fixed during wafer cleaning, a wafer is placed on the surface of a cleaning table for supporting, clamping plates operate oppositely for clamping, the edge of the wafer is clamped in an arc-shaped groove, and the edge of the lower surface of the wafer is in contact with the surface of a bottom supporting plate for supporting; and the two micro air cylinders simultaneously move to drive the lower pressing plate and the anti-skid rubber plate to press downwards until the anti-skid rubber plate is tightly pressed to be in contact with the edge of the upper surface of the wafer, so that the wafer is conveniently clamped in a reinforced manner when being clamped and fixed.

Description

Technical Field

[0001] The utility model belongs to the technical field of transfer mechanical arms, and in particular relates to a wafer cleaning and transfer mechanical arm. Background Art

[0002] Wafer refers to the silicon chip used in the manufacture of silicon semiconductor integrated circuits. Because of its round shape, it is called a silicon wafer. When the wafer needs to be cleaned and transferred from one location to another during processing and production, the transfer operation of the transfer robot arm is usually improved. The existing transfer robot arm is a device used for transfer during wafer cleaning. The robot arm is convenient for reinforcing the clamping and fixing transfer operation when transferring the wafer. The transfer is more stable and not easy to loosen and fall, and the fixity of the transfer robot arm body in the wafer cleaning, clamping and transfer is improved;

[0003] The existing transfer robot arm directly clamps the wafer by the clamping plate when the wafer is cleaned, clamped and fixed and transferred to the cleaning location. The wafer has an annular structure, which makes it inconvenient to reinforce the clamping when clamping and fixing. This makes it easy to cause damage when the clamping force is large, and it is easy to be unstable during transfer and fall under force when the clamping force is weak, thereby affecting the fixation of the transfer robot arm during the wafer cleaning and transfer operation. For this reason, the utility model proposes a wafer cleaning transfer robot arm. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer cleaning and transfer robot arm to solve the problem raised in the above background technology that when the transfer robot arm is clamped and fixed for transferring the wafer to the cleaning location after cleaning, it is easy to be damaged when the clamping force is large, and when the clamping force is weak, it is easy to be unstable during transfer and fall under the force, thereby affecting the fixation of the transfer robot arm during the wafer cleaning and transfer operation.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer cleaning transfer robot arm, comprising a transfer robot arm body, the transfer robot arm body comprising a clamping plate, a connecting seat, a robot arm 1, a robot arm 2, a robot arm 3 and a rotating seat, the rotating seat is arranged on the upper surface of the fixed seat, the robot arm 3 is arranged at the end of the rotating seat, the robot arm 2 is arranged at the end of the robot arm 3, the robot arm 1 is arranged at the end of the robot arm 2, the connecting seat is installed at the bottom end of the robot arm 1 through a motor, the clamping plate is installed on both sides of the connecting seat through a main cylinder, and the transfer robot arm body is also provided with:

[0006] A reinforcement clamping mechanism, wherein the reinforcement clamping mechanism comprises a clamping support assembly and a downward pressing reinforcement assembly, wherein the clamping support assembly is arranged at the bottom end of the inner surface of the clamping plate, and the downward pressing reinforcement assembly is arranged at the inner top end of the clamping support assembly;

[0007] A buffer protection mechanism comprises a main protection component and an auxiliary protection component, wherein the main protection component is arranged on the outer surface of the robot arm, and the auxiliary protection component is arranged on the top of the main protection component.

[0008] Preferably, the clamping support assembly includes a bottom support plate integrally formed at the bottom end of the inner side of the splint, one side of the bottom support plate is located on the inner surface of the splint and has an arc-shaped integral plate integrally formed thereon, and an arc-shaped groove is formed at the connection between the lower surface of the arc-shaped integral plate and the upper surface of the bottom support plate.

[0009] Preferably, the bottom support plate is an arc-shaped structure, and the two bottom support plates are symmetrically arranged.

[0010] Preferably, the downward pressure reinforcement assembly includes two micro cylinders fixedly installed inside the arc-shaped integrated plate by screws, the bottom ends of the two micro cylinders are located inside the arc-shaped groove and a downward pressure plate is fixedly installed by screws, and the lower surface of the downward pressure plate is fixedly installed with an anti-slip rubber plate by screws.

[0011] Preferably, the surface of the anti-slip rubber plate is consistent with the lower surface structure of the lower pressing plate, and the lower pressing plate is connected to the arc-shaped integrated plate by driving the micro cylinder.

[0012] Preferably, the main protective assembly includes a protective body arranged on the outer surface of the mechanical arm, and a main buffer spring is fixedly installed at the connection between the inner surface of the protective body and the outer surface of the mechanical arm by screws.

[0013] Preferably, the auxiliary protection component includes a threaded protection cover rotatably connected to the top of the protection body, and an auxiliary buffer spring is fixedly installed on the lower surface of the threaded protection cover by screws, and the lower surface of the auxiliary buffer spring is in contact with the top of the robot arm.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] By designing a reinforced clamping mechanism, when the transfer robot arm body is clamping and fixing the wafer during cleaning, the wafer can be placed on the surface support of the cleaning table, and the clamps can rotate towards each other to clamp the edge of the wafer, clamping the edge of the wafer inside the arc groove, and the edge of the lower surface of the wafer contacts the surface support of the bottom support plate. The two micro cylinders move simultaneously again to drive the lower pressure plate and the anti-slip rubber plate to press down until the anti-slip rubber plate is pressed tightly against the edge of the upper surface of the wafer, which is convenient for reinforcing the clamping of the wafer when it is clamped and fixed, and is not easy to cause damage. It is not easy to loosen and fall during clamping and transfer, thereby improving the fixation of the transfer robot arm body during wafer cleaning, clamping and transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the utility model;

[0017] Figure 2 For this utility model Figure 1 The enlarged structural diagram of part A in the middle;

[0018] Figure 3 For this utility model Figure 2 The enlarged structural diagram of the middle C part;

[0019] Figure 4 For this utility model Figure 1 The enlarged structural diagram of part B in the middle;

[0020] Figure 5 It is a partial cross-sectional structural diagram of the protective body, threaded protective cover and mechanical arm of the utility model;

[0021] Figure 6 This is a schematic cross-sectional view of the auxiliary buffer spring and the threaded protective cover of the utility model;

[0022] Figure 7 It is a schematic diagram of the structure of the protective body, threaded protective cover and main buffer spring of the utility model;

[0023] In the figure: 100, transfer robot arm body; 101, clamping plate; 1011, arc-shaped integrated plate; 1012, micro cylinder; 1013, arc-shaped groove; 1014, bottom support plate; 1015, lower pressure plate; 1016, anti-slip rubber plate; 102, connecting seat; 103, robot arm one; 1031, protective body; 1032, threaded cover; 1033, main buffer spring; 1034, auxiliary buffer spring; 104, robot arm two; 105, robot arm three; 106, rotating seat; 107, fixed seat. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figures 1 to 7The utility model provides a technical solution: a wafer cleaning transfer robot arm, comprising a transfer robot arm body 100, the transfer robot arm body 100 comprises a clamping plate 101, a connecting seat 102, a robot arm 103, a robot arm 2 104, a robot arm 3 105 and a rotating seat 106, the rotating seat 106 is arranged on the upper surface of a fixed seat 107, the transfer robot arm body 100 is fixedly installed at the position of the wafer cleaning process through the fixed seat 107, the transfer robot arm body 100 is fixedly installed and used, the robot arm 3 105 is arranged at the end of the rotating seat 106, the robot arm 2 104 is arranged at the end of the robot arm 3 105, the robot arm 103 is arranged at the end of the rotating seat 106, the robot arm 103 is arranged at the end of the robot arm 103 ... 3 is arranged at the end of the second robot arm 104, the connecting seat 102 is installed at the bottom of the first robot arm 103 through a motor, and the clamping plates 101 are installed on both sides of the connecting seat 102 through a main cylinder. The transfer robot arm body 100 is powered on and rotated by the rotating seat 106. The third robot arm 105, the second robot arm 104 and the first robot arm 103 operate to rotate the clamping plates 101 to the position of wafer cleaning. The two sides of the clamping plates 101 are at the edge of the wafer. The movement of the main cylinder drives the two clamping plates 101 to move downward to clamp, fix, install and transfer the wafer, and facilitate the transfer operation of the transfer robot arm body 100 during wafer cleaning. The transfer robot arm body 100 is also provided with:

[0026] A reinforced clamping mechanism is provided, and the reinforced clamping mechanism includes a clamping support assembly and a downward pressing reinforcement assembly. The clamping support assembly is arranged at the bottom end of the inner surface of the clamping plate 101, and the downward pressing reinforcement assembly is arranged at the inner top end of the clamping support assembly. When the transfer robot arm main body 100 clamps and fixes the wafer for transfer and cleaning, the reinforced clamping mechanism can strengthen the fixed clamping and transfer of the wafer, which is not easy to cause damage and is not easy to loosen and fall during clamping and fixing transfer, thereby improving the fixation of the transfer robot arm main body 100 during wafer cleaning clamping and transfer.

[0027] In order to facilitate the clamping and support of the wafer by the clamping support assembly, in the present embodiment, preferably, the clamping support assembly includes a bottom support plate 1014 integrally formed at the bottom end of the inner side of the clamp plate 101, one side of the bottom support plate 1014 is located on the inner surface of the clamp plate 101 and is integrally formed with an arc-shaped integral plate 1011, and an arc-shaped groove 1013 is formed at the connection between the lower surface of the arc-shaped integral plate 1011 and the upper surface of the bottom support plate 1014, and when clamped by the clamp plate 101, the edge of the wafer is clamped inside the arc-shaped groove 1013, and the lower surface contacts the bottom support plate 1014 for support, so as to facilitate support, clamping and fixing, and the bottom support plate 1014 is an arc-shaped structure, and the two bottom support plates 1014 are symmetrically arranged, and when clamped and fixed, it is convenient to evenly support the edges at both ends of the wafer, so as to facilitate stable clamping and transfer of the wafer.

[0028] In order to facilitate the clamping and fixing of the wafer by the clamping plate 101 through the downward pressure reinforcement component, in this embodiment, preferably, the downward pressure reinforcement component includes two micro cylinders 1012 fixedly installed inside the arc-shaped integrated plate 1011 by screws, and the bottom ends of the two micro cylinders 1012 are located inside the arc groove 1013 and fixedly installed with a downward pressure plate 1015 by screws, and the downward pressure plate 1015 and the arc-shaped integrated plate 1011 are connected by the driving of the micro cylinder 1012. Next, after the wafer is clamped inside the arc groove 1013, the micro cylinder 1012 is operated to drive the lower pressure plate 1015 to press down and clamp the surface of the wafer for reinforcement. The lower surface of the lower pressure plate 1015 is fixed with an anti-slip rubber plate 1016 by screws. The surface of the anti-slip rubber plate 1016 is consistent with the lower surface structure of the lower pressure plate 1015. When the lower pressure plate 1015 is pressed down, the anti-slip rubber plate 1016 is driven to contact the surface of the wafer for downward pressure protection, which is convenient for use in tight compression protection.

[0029] A buffer protection mechanism includes a main protection component and an auxiliary protection component. The main protection component is arranged on the outer surface of the robot arm 103, and the auxiliary protection component is arranged on the top of the main protection component. When the transfer robot arm main body 100 transfers the wafer for cleaning, the transfer robot arm main body 100 operates so that the surface of the robot arm 103 is touched by the outside world. The buffer protection mechanism provides buffer protection for the outer surface of the robot arm 103, which is convenient for protection and improves the buffer protection effect of the transfer robot arm main body 100 on the end of the robot arm 103 when the wafer is cleaned.

[0030] In order to facilitate the buffering protection of the outer surface of the robot arm 103 through the main protective component, in this embodiment, preferably, the main protective component includes a protective body 1031 arranged on the outer surface of the robot arm 103, and a main buffer spring 1033 is fixedly installed at the connection between the inner surface of the protective body 1031 and the outer surface of the robot arm 103 by screws. When the outer surface of the robot arm 103 is impacted, the main buffer spring 1033 is deformed to buffer and protect the protective body 1031.

[0031] In order to facilitate the buffering protection of the top end of the robot arm 103 through the auxiliary protection structure and facilitate the disassembly of the threaded cover 1032 when the robot arm 103 is repaired, in the present embodiment, preferably, the auxiliary protection assembly includes a threaded cover 1032 rotatably connected to the top end of the protection body 1031, and the lower surface of the threaded cover 1032 is fixed with an auxiliary buffer spring 1034 by screws, and the lower surface of the auxiliary buffer spring 1034 is in contact with the top end of the robot arm 103, so that when the top end of the robot arm 103 is hit, the auxiliary buffer spring 1034 can be deformed to buffer the threaded cover 1032, and the threaded cover 1032 can provide buffering protection for the top end of the robot arm 103.

[0032] The model of the micro cylinder 1012 in the utility model is MAL16*50-CA.

[0033] The working principle and use process of the utility model are as follows: when the wafer cleaning and transfer robot arm is in use, the transfer robot arm body 100 is fixedly installed at the position of the wafer cleaning process through the fixing seat 107. When the transfer robot arm body 100 is fixedly installed and used, the transfer robot arm body 100 is powered on and operated, and the rotating seat 106 rotates, and the robot arm three 105, the robot arm two 104 and the robot arm one 103 operate to rotate the clamping plate 101 to the position of the wafer cleaning, and the two sides of the clamping plate 101 are at the edge of the wafer. The movement of the main cylinder drives the two clamping plates 101 to move downward to clamp the wafer, fix it and transfer it, and it is convenient for the transfer robot arm body 100 to transfer the wafer during cleaning;

[0034] Then, when the transfer robot arm body 100 is clamped and fixed during wafer cleaning, when the clamping plate 101 is running and clamping, the wafer is placed on the surface support of the cleaning table, and when the clamping plates 101 are running and clamping towards each other, the edge of the wafer is clamped inside the arc groove 1013, and the edge of the lower surface of the wafer contacts the surface support of the bottom support plate 1014, and the two micro cylinders 1012 are moved simultaneously again to drive the lower pressure plate 1015 and the anti-skid rubber plate 1016 to press down until the anti-skid rubber plate 1016 is pressed tightly against the edge of the upper surface of the wafer, so as to strengthen the clamping when the wafer is clamped and fixed, and it is not easy to cause damage, and it is not easy to loosen and fall during the clamping and fixed transfer, thereby improving the fixation of the transfer robot arm body 100 during the wafer cleaning clamping and transfer;

[0035] Finally, when the transfer robot arm body 100 is clamped and fixed, the transfer robot arm body 100 has a rotation radius. When an external object accidentally extends into the rotation radius, when the transfer robot arm body 100 transfers the wafer, the end of the robot arm 103 is touched by the external object, and the touch directly hits the surface of the protective body 1031 or the threaded cover 1032. When the surface of the protective body 1031 or the threaded cover 1032 is subjected to force, the main buffer spring 1033 and the auxiliary buffer spring 1034 are deformed to buffer, which is convenient for buffering the protective body 1031 and the threaded cover 1032 during buffering, and rebounding the objects impacted by the outside world, which is convenient for reducing the impact and not causing the surface of the robot arm 103 to be impacted and deformed and damaged, and is convenient for buffering protection during operation, thereby improving the buffering protection effect of the transfer robot arm body 100 on the end of the robot arm 103 when the wafer is cleaned, and when the robot arm 103 is damaged during use and repair, the threaded cover 1032 is disassembled to open the top of the robot arm 103 for internal inspection.

[0036] Although the embodiments of the present invention have been shown and described (see the above detailed description for details), it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer cleaning transfer robot arm, comprising a transfer robot arm body (100), wherein the transfer robot arm body (100) comprises a clamping plate (101), a connecting seat (102), a robot arm one (103), a robot arm two (104), a robot arm three (105) and a rotating seat (106), wherein the rotating seat (106) is arranged on the upper surface of a fixed seat (107), the robot arm three (105) is arranged at the end of the rotating seat (106), the robot arm two (104) is arranged at the end of the robot arm three (105), the robot arm one (103) is arranged at the end of the robot arm two (104), the connecting seat (102) is installed at the bottom end of the robot arm one (103) through a motor, and the clamping plate (101) is installed on both sides of the connecting seat (102) through a main cylinder, characterized in that: The transfer robot arm body (100) is also provided with: A reinforcement clamping mechanism, wherein the reinforcement clamping mechanism comprises a clamping support component and a downward pressing reinforcement component, wherein the clamping support component is arranged at the bottom end of the inner surface of the clamping plate (101), and the downward pressing reinforcement component is arranged at the inner top end of the clamping support component; A buffer protection mechanism comprises a main protection component and an auxiliary protection component, wherein the main protection component is arranged on the outer surface of the robot arm (103), and the auxiliary protection component is arranged on the top of the main protection component.

2. The wafer cleaning and transfer robot according to claim 1, characterized in that: The clamping support assembly comprises a bottom support plate (1014) integrally formed at the bottom end of the inner side of the clamp plate (101); one side of the bottom support plate (1014) is integrally formed with an arc-shaped integral plate (1011) located on the inner surface of the clamp plate (101); an arc-shaped groove (1013) is formed at the connection between the lower surface of the arc-shaped integral plate (1011) and the upper surface of the bottom support plate (1014).

3. The wafer cleaning and transfer robot arm according to claim 2, characterized in that: The bottom support plate (1014) is an arc-shaped structure, and the two bottom support plates (1014) are symmetrically arranged.

4. The wafer cleaning and transfer robot arm according to claim 2, characterized in that: The downward pressure reinforcement component comprises two micro cylinders (1012) fixedly installed inside the arc-shaped integrated plate (1011) by screws, the bottom ends of the two micro cylinders (1012) are located inside the arc-shaped groove (1013) and are fixedly installed with a downward pressure plate (1015) by screws, and the lower surface of the downward pressure plate (1015) is fixedly installed with an anti-slip rubber plate (1016) by screws.

5. The wafer cleaning and transfer robot arm according to claim 4, characterized in that: The surface of the anti-slip rubber plate (1016) matches the lower surface structure of the lower pressing plate (1015), and the lower pressing plate (1015) and the arc-shaped integrated plate (1011) are connected by driving via the micro cylinder (1012).

6. The wafer cleaning and transfer robot arm according to claim 1, characterized in that: The main protective assembly comprises a protective body (1031) arranged on the outer surface of the mechanical arm one (103), and a main buffer spring (1033) is fixedly installed at the connection between the inner surface of the protective body (1031) and the outer surface of the mechanical arm one (103) by screws.

7. The wafer cleaning and transfer robot arm according to claim 6, characterized in that: The auxiliary protection component includes a threaded protection cover (1032) rotatably connected to the top of the protection body (1031), and the lower surface of the threaded protection cover (1032) is fixed with an auxiliary buffer spring (1034) by screws, and the lower surface of the auxiliary buffer spring (1034) is in contact with the top of the robot arm (103).

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