Annealing equipment

Abstract

The utility model discloses annealing equipment, which is used for carrying out annealing treatment on a wafer and comprises a furnace body and a heating cabin body which is arranged at the side part of the furnace body and is independent from the furnace body, the heating cabin comprises a fixing frame arranged on the side portion of the furnace body, a plurality of heating pipe sets arranged in the fixing frame and two fixing pieces arranged at the two ends of the heating pipe sets respectively, the surfaces of the sides, opposite to the heating pipe sets, of the fixing pieces make contact with the inner side wall of the fixing frame, and a partition plate is arranged at the joint of the furnace body and the heating cabin. The furnace body is isolated from the heating cabin body; wherein the air pressure in the heating cabin body is the same as that in the furnace body. According to the utility model, the air pressure balance of the space where the wafer is located is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of heat treatment, in particular to an annealing device. Background Art

[0002] In the manufacture of semiconductor devices, the wafer needs to be heat treated to eliminate defects inside the wafer and optimize the grain boundary structure and crystal quality. Annealing is a common wafer heat treatment method. Annealing furnace is a common equipment used for annealing wafers. By heating the wafer and keeping it warm under certain conditions, the lattice structure can be changed, impurities and stress can be eliminated, and the electrical properties and structural integrity of the wafer can be improved.

[0003] The basic structure of a wafer annealing furnace usually consists of a heating chamber, a control system, a feeding device and a discharging device. The heating chamber is used to uniformly heat and keep the wafer warm, and the heating temperature, time, atmosphere and other parameters are controlled by the control system to achieve the desired annealing effect for the wafer. The air pressure during the wafer annealing process needs to be controlled within a certain range to ensure that the wafer is heated evenly and to avoid problems such as oxidation and contamination. Different wafer materials have different requirements for air pressure. For example, for silicon wafers, annealing is generally required in a vacuum or nitrogen atmosphere, while for silicon nitride wafers, annealing is required in a nitrogen atmosphere. Therefore, it is necessary to ensure the balance of air pressure inside the heating chamber. However, the existing wafer annealing furnaces have unbalanced air pressure due to the large internal space. At the same time, in the existing wafer annealing furnace, heating is generally achieved by setting up heating tubes, and the heating tubes usually pass through the top of the wafer annealing furnace horizontally. Therefore, when manufacturing the heating cavity, it is necessary to pre-open mounting holes for the heating tubes to pass through, and they are opened separately according to different needs. The number of layers, number, and arrangement of heating tubes in different wafer annealing furnaces are all different, which results in cumbersome and inconvenient processing and high cost.

[0004] In view of this, it is necessary to improve the wafer annealing furnace in the prior art to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to disclose the problem of pressure imbalance in the existing wafer annealing furnace due to the large internal space, and the problem of complicated and inconvenient processing and high cost due to the need to open installation holes in advance according to different needs because the heating tube runs horizontally through the wafer annealing furnace.

[0006] To achieve the above object, the utility model provides an annealing device for annealing a wafer, the annealing device comprising:

[0007] A furnace body and a heating chamber body which is arranged on the side of the furnace body and is independent of the furnace body;

[0008] The heating chamber comprises: a fixing frame arranged at the side of the furnace body, a plurality of heating tube groups arranged inside the fixing frame, and two fixing members respectively arranged at both ends of the heating tube groups, the surface of the fixing member facing away from the heating tube group is in contact with the inner side wall of the fixing frame, and a partition is arranged at the joint of the furnace body and the heating chamber body to isolate the furnace body from the heating chamber body;

[0009] Wherein, the air pressure inside the heating chamber is the same as the air pressure inside the furnace body.

[0010] As a further improvement of the present invention, the furnace body comprises: a main body with a hollow cavity and two plates respectively arranged at the top and bottom of the main body, and a support frame for carrying wafers is arranged inside the main body.

[0011] As a further improvement of the present invention, the heating chamber is arranged at the top and / or the bottom of the furnace body, and a mounting opening for accommodating the partition is provided in the middle of the plate body;

[0012] When the partition is accommodated in the installation opening, the partition is used to isolate the internal space of the heating chamber from the internal space of the main body.

[0013] As a further improvement of the present invention, the annealing equipment also includes: a first sealing ring arranged between the heating chamber body and the partition, the heating chamber body has a first sealing groove for accommodating the first sealing ring, the first sealing ring is accommodated in the first sealing groove and forms contact with the partition.

[0014] As a further improvement of the present invention, the annealing equipment also includes: a second sealing ring arranged between the body and the partition, the body has a second sealing groove for accommodating the second sealing ring, the second sealing ring is accommodated in the second sealing groove and forms contact with the partition.

[0015] As a further improvement of the utility model, the fixing frame comprises: an upper deck, a side deck and a lower deck arranged vertically from top to bottom in sequence, and a heating cavity is formed by the upper deck, the side deck, the lower deck and the partition;

[0016] The first sealing groove is opened on the side of the lower cabin plate facing the partition plate, and a plurality of the heating tube groups are arranged in sequence in the horizontal or vertical direction to form a layer of heating tube groups arranged in the heating cavity. A third sealing ring is arranged at the junction of the side plate and the lower cabin plate, and a fourth sealing ring is arranged at the junction of the lower cabin plate and the plate body.

[0017] As a further improvement of the present invention, the side panels are configured as multiple layers, and are arranged in sequence along the vertical direction. A fifth sealing ring is provided at the junction of two adjacent side panels. The heating tube group is configured as multiple layers, and two adjacent layers of heating tube groups are arranged in sequence along the horizontal direction and the vertical direction, respectively.

[0018] As a further improvement of the present invention, the heating tube group comprises: a tube body and a protective tube sleeved on the outside of the tube body, the end of the tube body extends outward to form a tube core, and a pipeline connected to the tube body is formed on the outside of the tube core, the fixing piece is sleeved on the outside of the end of the protective tube and forms an opening for the pipeline to extend out, and the upper cabin plate is provided with a strip opening for the pipeline to extend out of the heating cabin;

[0019] Wherein, the air pressure inside the protection tube is different from the air pressure in the heating cavity.

[0020] As a further improvement of the utility model, the fixing member includes: a fixing block sleeved on the outside of the protective tube and two fixing columns respectively embedded in the fixing block on both sides in the vertical direction to form two fixing columns for jointly clamping the tube core, and the opening is opened on the side of the fixing block.

[0021] As a further improvement of the utility model, the inner side of the fixing block is recessed inwardly to form a sixth sealing groove, and the fixing member further includes: a sixth sealing ring arranged in the sixth sealing groove and in contact with the protection tube.

[0022] Compared with the prior art, the beneficial effects of the utility model are:

[0023] In the present application, the heating chamber body arranged on the side of the furnace body is independent of the furnace body. The furnace body is used to place wafers, and the heating chamber body is used to place the heating tube group. A partition is arranged between the heating chamber body and the furnace body. Heat is released by the heating tube group and transferred to the furnace body through the partition to anneal the wafers. As a result, the space where the wafers are located and the space where the heating tube group are located are independent of each other, so as to reduce the space used for annealing the wafers, thereby ensuring the air pressure balance of the hollow cavity (that is, the space where the wafers are located), thereby ensuring the final annealing effect of the wafers, and solving the problem that the existing wafer annealing furnace has a large internal space The reason for this is that there is a problem of unbalanced air pressure; at the same time, the heating tube group is arranged inside the fixing frame, and two fixing members are respectively arranged at the two ends of the heating tube group, and the surface of the fixing member facing away from the heating tube group is in contact with the inner side wall of the fixing frame, so that the two fixing members are respectively in contact with the inner side walls on both sides of the fixing frame, so that the heating tube group can be stably installed inside the fixing frame, and the fixing frame can be installed without opening a mounting hole, thereby solving the problem of complicated and inconvenient processing and high cost in the existing wafer annealing furnace because the heating tube horizontally penetrates the wafer annealing furnace and the mounting holes need to be opened in advance according to different needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A three-dimensional diagram of an annealing device shown in the utility model at a viewing angle;

[0025] Figure 2 A cross-sectional view of an annealing device shown in the utility model;

[0026] Figure 3 A stereoscopic view of an annealing device shown in the present invention, in which a heating chamber on the top of the furnace is omitted and shown in a certain viewing angle;

[0027] Figure 4 A three-dimensional view of a heating chamber disposed on the top of the furnace body at a certain viewing angle;

[0028] Figure 5 A three-dimensional diagram of a heating chamber disposed on the top of the furnace body from another viewing angle;

[0029] Figure 6 is a cross-sectional view of an annealing device under an embodiment;

[0030] Figure 7 A three-dimensional view of a heating tube assembly and two fixing members disposed at both ends of the heating tube assembly at a certain viewing angle;

[0031] Figure 8 A three-dimensional diagram of a heating tube assembly at a viewing angle;

[0032] Fig. 9 A three-dimensional view of a portion of the heating tube assembly and a portion of a fixing member disposed at one end of the heating tube assembly at a certain viewing angle;

[0033] Fig.10 A stereogram of a fixed block at one viewing angle;

[0034] Fig.11 It is a stereoscopic image of the fixed block at another viewing angle. DETAILED DESCRIPTION

[0035] The present invention is described in detail below in conjunction with the various embodiments shown in the accompanying drawings, but it should be noted that these embodiments are not limitations of the present invention, and any equivalent transformations or substitutions in functions, methods, or structures made by ordinary technicians in the field based on these embodiments are all within the scope of protection of the present invention.

[0036] It should be understood that, in the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present technical solution and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present technical solution.

[0037] It should be noted that “horizontal” refers to Figure 1 The direction along the X-axis shown in FIG. 1 is the direction along the X-axis. The longitudinal direction is the direction along the Figure 1 The Y-axis is shown in the vertical direction. Figure 1 The direction of the Z axis shown in .

[0038] Please refer to Figures 1 to 11 As shown, the utility model shows a specific implementation of an annealing device 100, which is used to anneal the wafer 30, and specifically the heating chamber 10 included in the annealing device 100 heats the wafer 30 to a certain temperature and keeps it warm, so as to change the lattice structure of the wafer 30, eliminate impurities and stress, and improve the electrical properties and structural integrity of the wafer 30.

[0039] Ginseng Figure 1 As shown, the annealing equipment 100 includes: a furnace body 20 and a heating chamber body (i.e., a heating chamber body 10 and / or a heating chamber body 80) disposed on the side of the furnace body 20 and independent of the furnace body 20; wherein, independent of each other means that the internal space of the furnace body 20 and the internal space of the heating chamber body (i.e., the heating chamber body 10 and the heating chamber body 80) are isolated and sealed from each other, the interior of the furnace body 20 is used to place the wafer 30, and the interior of the heating chamber body (i.e., the heating chamber body 10 and the heating chamber body 80) is used to place the heating chamber body for heating the wafer 30. A heating tube group (for example, a heating tube group 12 placed in the heating chamber 10), based on which the space where the wafer 30 is located is independent of the space where the heating tube group is located (that is, the wafer 30 and the heating tube group are respectively located in two independent spaces), thereby reducing the space used for annealing the wafer 30, thereby ensuring the air pressure balance in the hollow cavity A1, and further ensuring the final annealing effect of the wafer 30, and solving the problem of air pressure imbalance in the existing wafer annealing furnace due to the large internal space.

[0040] It should be noted that the heating chamber can be configured as one or two, and the heating chamber is arranged at the top and / or the bottom of the furnace body 20. When only one heating chamber 10 or heating chamber 80 is configured, the heating chamber 10 or heating chamber 80 can be arranged at the top or the bottom of the furnace body 20; when two heating chambers (i.e., the heating chamber 10 and the heating chamber 80) are configured, the heating chamber 10 and the heating chamber 80 can be arranged at the top and the bottom of the furnace body 20, respectively, so that the wafer 30 is heated at both vertical sides of the furnace body 20 at the same time to ensure the heating speed and heating uniformity of the wafer 30. A partition 40 is provided at the joint of the heating chamber body 10 and the furnace body 20, and a partition 50 is provided at the joint of the heating chamber body 80 and the furnace body 20, thereby the heating chamber body 10 and the heating chamber body 80 respectively isolate the internal space of the two heating chamber bodies 10 from the internal space of the furnace body 20 through the partition 40 and the partition 50, and at the same time, heat is transferred to the furnace body 20 through the partition 40 and the partition 50 respectively, so as to heat the wafer 30.

[0041] Whether the heating chamber 10 is only disposed on the top of the furnace body 20, or the heating chamber 80 is only disposed on the bottom of the furnace body 20, or the heating chamber 10 and the heating chamber 80 are respectively disposed on the top of the furnace body 20 and the bottom of the furnace body 20, they are all used to heat the wafer 30, and the structures of the heating chamber 10 and the heating chamber 80 are similar. Therefore, in the following description, only the heating chamber 10 disposed on the top of the furnace body 20 is used for exemplary description.

[0042] In addition, the heating chamber 10, the heating chamber 80 and the furnace body 20 can be regarded as independent entities. The heating chamber 10 is used to place the heating tube group 12, and the heating chamber 80 is also used to place the heating tube group (not shown). The furnace body is only used to place the wafer 30. The partition 40 arranged between the heating chamber 10 and the furnace body 20 realizes that the internal space of the heating chamber 10 (that is, the heating chamber A2 described below) and the internal space of the furnace body 20 (that is, the hollow cavity A1) are independent of each other, and the partition 50 arranged between the heating chamber 80 and the furnace body 20 realizes that the internal space of the heating chamber 80 (that is, the heating chamber A3 described below) and the internal space of the furnace body 20 (that is, the hollow cavity A1) are independent of each other, thereby reducing the hollow cavity where the wafer 30 is located. The purpose of reducing the size of the hollow cavity A1 where the wafer 30 is located is to ensure the balance of the air pressure in the hollow cavity A1, thereby ensuring the final annealing effect of the wafer 30, and solving the problem of air pressure imbalance in the existing wafer annealing furnace due to the large internal space. This embodiment does not make any specific limitation on this. Based on this, the heat is dissipated by the heating tube group 12 arranged in the heating chamber 10 and transferred to the heating cavity A2, and then the heat in the heating cavity A2 is transferred to the hollow cavity A1 through the partition 40, thereby heating the wafer 30 placed in the hollow cavity A1. The heating tube group in the heating chamber 80 is similar to the aforementioned heating tube group 12 and will not be repeated here.

[0043] Specifically, refer to Figure 2 and Figure 4 As shown, the heating chamber body 10 includes: a fixing frame 11 arranged at the side of the furnace body 20, a plurality of heating tube groups 12 arranged inside the fixing frame 11, and two fixing members 13 respectively arranged at the ends of both ends of the heating tube group 12, and the surface of the fixing member 13 facing away from the heating tube group 12 is in contact with the inner side wall of the fixing frame 11, so that the two fixing members 13 are respectively in contact with the inner side walls on both sides of the fixing frame 11, so that the heating tube group 12 is stably installed inside the fixing frame 11, and the fixing frame 11 can be installed without opening a mounting hole, thereby solving the problem of complicated and inconvenient processing and high cost in the existing wafer annealing furnace because the heating tube horizontally penetrates the wafer annealing furnace and the mounting holes need to be opened in advance according to different requirements.

[0044] Among them, the air pressure inside the heating chamber 10 (i.e., the air pressure corresponding to the heating cavity A2), the air pressure inside the heating chamber 80 (i.e., the air pressure corresponding to the heating cavity A3) is the same as the air pressure inside the furnace body 20 (i.e., the air pressure corresponding to the intermediate cavity A1). Since different wafer materials have different requirements for air pressure, and for example, silicon wafers generally need to be annealed in a vacuum or nitrogen atmosphere, while silicon nitride wafers need to be annealed in a nitrogen atmosphere, the air pressure inside the hollow cavity A1 needs to be specially treated. The partition 40 is arranged between the hollow cavity A1 and the heating cavity A2, so if only the hollow cavity A1 is specially treated, there will be a difference in air pressure between the hollow cavity A1 and the heating cavity A2, that is, there will be a difference in air pressure on both sides of the partition 40, which can easily cause damage to the partition 40. Therefore, in order to protect the partition 40, the air pressure on both sides of the partition 40 is set to be the same. For example, if the hollow cavity A1 is evacuated, the heating cavity A2 is also evacuated, and the pressure is kept consistent at the same time to ensure the air pressure balance. Similarly, in order to protect the partition 50, the air pressure on both sides of the partition 60 is set to be the same.

[0045] Specifically, Figure 1 and Figure 2 As shown, the furnace body 20 includes: a main body 21 with a hollow cavity A1 and two plates (i.e., a first plate 22 and a second plate 23) respectively arranged at the top and the bottom of the main body 21, and a support frame 211 for carrying the wafer 30 is arranged inside the main body 21. A feed port 212 for the wafer 30 to be taken in is provided on the side of the main body 21, and a discharge port 213 for the wafer 30 to be taken out is provided on the side of the main body 21 relative to the feed port 212. The wafer 30 is placed on the support frame 211 through the feed port 212, and the wafer 30 is heated and kept warm by the heating chamber 10 to anneal the wafer 30, and the annealed wafer 30 is taken out through the discharge port 213. It should be noted that in the present application, the main body 21, the first plate 22 and the second plate 23 can be regarded as a whole, or as separate bodies and connected by welding, and this embodiment does not specifically limit this.

[0046] Ginseng Figure 2As shown, the middle position of the plate body (i.e., the first plate body 22 and the second plate body 23) is provided with an installation opening (i.e., the first installation opening 221 and the second installation opening 231) for accommodating the partition (i.e., the partition 40 and the partition 50); when the partition is accommodated in the installation opening, the partition separates the internal space of the heating chamber 10 from the internal space of the main body 21 (i.e., the hollow cavity A1). Specifically, the middle position of the first plate body 22 is provided with a first installation opening 221 for accommodating the partition 40; when the partition 40 is accommodated in the first installation opening 221, the partition 40 separates the internal space of the heating chamber 10 from the internal space of the main body 21, that is, the vertical sides of the partition 40 are the heating cavity A2 and the hollow cavity A1 respectively, and the partition 40 and the fixing frame 11 enclose a sealed heating cavity A2; similarly, the middle position of the second plate body 23 is provided with a partition 50 The second mounting port 231 is arranged in the partition 50. When the partition 50 accommodates the second mounting port 231, the partition 50 isolates the internal space of the heating chamber 80 from the internal space of the main body 21, that is, the vertical sides of the partition 50 are the heating cavity A3 and the hollow cavity A1 respectively, and the partition 50 and the fixing frame 11 enclose a sealed heating cavity A3. Based on this, the main body 21, the first plate body 22, the second plate body 23, the partition 40 and the partition 50 enclose a sealed hollow cavity A1.

[0047] Ginseng Figure 2 and Figure 3 As shown, in order to ensure the sealing of the partition 40 to isolate the heating cavity A2 from the hollow cavity A1, the annealing equipment 100 includes: a first sealing ring 60 arranged between the heating chamber 10 and the partition 40, the heating chamber 10 is provided with a first sealing groove 14 for accommodating the first sealing ring 60, the first sealing ring 60 is accommodated in the first sealing groove 14 and forms contact with the partition 40, thereby realizing the isolation and sealing between the heating cavity A2 and the hollow cavity A1 through the first sealing ring 60 on the side of the partition 40 facing the heating chamber 10. In order to further ensure the sealing of the partition 40 to isolate the heating cavity A2 from the hollow cavity A1, refer to Figure 2 As shown, the annealing equipment 100 also includes: a second sealing ring 70 disposed between the body 21 and the partition 40, the body 21 is provided with a second sealing groove 214 for accommodating the second sealing ring 70, the second sealing ring 70 is accommodated in the second sealing groove 214 and forms contact with the partition 40, thereby realizing the isolation and sealing between the heating cavity A2 and the hollow cavity A1 through the second sealing ring 70 on the side of the partition 40 facing the body 21. It should be noted that in the present application, the first sealing ring 60 or the second sealing ring 70 can be disposed only on one side of the partition 40, or the first sealing ring 60 and the second sealing ring 70 can be disposed on both sides of the partition 40 at the same time, so as to further ensure the isolation and sealing between the heating cavity A2 and the hollow cavity A1, and this embodiment does not limit this.

[0048] Ginseng Figure 4 and Figure 5 As shown, the fixing frame 11 includes: an upper cabin plate 15, a side plate 16 and a lower cabin plate 17 which are arranged vertically from top to bottom in sequence, the lower cabin body 17 is supported by the partition plate 40, and the upper cabin plate 15, the side plate 16, the lower cabin plate 17 and the partition plate 40 enclose a heating cavity A2. The first sealing groove 14 is opened on the side of the lower cabin plate 17 facing the partition plate 40, and a plurality of heating tube groups 12 are arranged in sequence in the horizontal direction or the vertical direction to form a layer of heating tube groups 12 arranged in the heating cavity A2, thereby heating and keeping warm the wafers 30 inside the furnace body 20 through the layered heating tube groups 12. In order to ensure the sealing of the heating cavity A2 formed inside the heating chamber 10, the upper chamber plate 15 and the side plate 16 can be an integral structure, or a split structure and connected by welding or the like. A third sealing ring 181 is provided at the joint of the side plate 16 and the lower chamber plate 17, and a fourth sealing ring 182 is provided at the joint of the lower chamber plate 17 and the plate body (i.e., the first plate body 22). At the same time, a first sealing ring 60 is provided at the joint of the lower chamber plate 17 and the partition 40. Thus, a heating cavity A2 that is independent of and sealed from the hollow cavity A1 is formed by the upper chamber plate 15, the side plate 16, the lower chamber plate 17 and the partition 40.

[0049] It should be noted that in the present application, multiple layers of heating tube groups 12 can be arranged in one heating chamber 10, and two adjacent layers of heating tube groups 12 are arranged in sequence in the horizontal direction and the vertical direction, respectively. In this case, the side panels 16 are configured in multiple numbers and are arranged in sequence in the vertical direction, and a fifth sealing ring is provided at the joint of two adjacent side panels 16. Figure 6 Taking the annealing device 100a as an example, two layers of heating tube groups 12 are arranged in the heating chamber 10, and two layers of heating tube groups are arranged in the heating chamber 80. The two layers of heating tube groups 12 are arranged in sequence vertically, and the heating tube groups 12 are arranged in a vertical direction. Figure 6In the perspective shown, the first layer of heating tube assemblies 12 are arranged vertically and arranged in sequence in the horizontal direction from top to bottom, and the second layer of heating tube assemblies 12 are arranged in the horizontal direction and arranged in sequence in the vertical direction. There are three side panels 16, which are arranged in sequence in the vertical direction, namely, side panel 16a, side panel 16b and side panel 16c from top to bottom. The side plate 16a and the upper cabin plate 15 can be an integral structure, or a split structure and connected by welding or the like. A fifth sealing ring 183 is provided at the joint of the side plate 16a and the side plate 16b, a fifth sealing ring 184 is provided at the joint of the side plate 16b and the side plate 16c, a third sealing ring 185 is provided at the joint of the side plate 16c and the lower cabin plate 17, and a first sealing ring 60 is provided at the joint of the lower cabin plate 17 and the partition plate 40, thereby forming a heating cavity A2 which is independent of and sealed from the hollow cavity A1 by the upper cabin plate 15, the side plate 16, the lower cabin plate 17 and the partition plate 40. In short, the number of layers of the heating tube group 12 can be set according to actual needs, and when the heating tube group 12 is set, the number of side plates 16 is also set accordingly, thereby realizing modular setting of the number of layers of the heating tube group 12 inside the heating cabin 10 and / or the heating cabin 80.

[0050] Ginseng Figures 7 to 11 As shown, the heating tube assembly 12 includes: a tube body 123 and a protective tube 124 sleeved on the outside of the tube body 123, the end of the tube body 123 extends outward to form a tube core 122, and a pipeline 121 connected to the tube body 123 is formed on the outside of the tube core 122, and the fixing member 13 is sleeved on the outside of the end of the protective tube 124 to form an opening 1313 for the pipeline 121 to extend out. Among them, the tube body 123 refers to the component in the heating tube assembly 12 that heats and releases heat radiation; the tube core 122 is configured as two and is respectively arranged at the two ends of the tube body 123, and is a component connecting the tube body 123 and the pipeline 121; the pipeline 121 is also configured as two, and is a component that transmits external electrical energy to the tube body 123; the protective tube 124 is sleeved on the outside of the tube body 123 to protect the tube body 123. Since the air pressure of the heating chamber A2 is the same as the air pressure of the hollow chamber A1, and the pipeline 121 needs to be connected to an external power supply, the upper cabin plate 15 opens a strip opening 151 for the pipeline 121 to extend out of the heating chamber 10, so that the pipeline 121 is connected to the external power supply through the strip opening 151 to transmit electrical energy to the tube body 123. At this time, the pipeline 121, the tube core 122 and the tube body 123 are all exposed to the atmospheric environment, and the protective tube 124 is sleeved on the outside of the tube body 123. Therefore, the air pressure inside the protective tube 124 is different from the air pressure outside the protective tube 124 (that is, the air pressure of the heating chamber A2).

[0051] Specifically, the fixing member 13 includes: a fixing block 131 sleeved on the outer side of the end of the protection tube 124 and two fixing columns (i.e., a first fixing column 132 and a second fixing column 133) respectively embedded in the fixing block 131 on both sides to form a common clamping tube core 122, and an opening 1313 is opened on the side of the fixing block 131. The distance between the tube core 122 and the furnace body 20 is adjusted by adjusting the depth of the fixing column embedded in the fixing block 131, and then the degree of heat radiation of the tube body 123 to the furnace body 20 is adjusted to ensure the uniformity of heating the wafer 30, and finally solve the problem that the position of the heating tube in the existing wafer annealing furnace is fixed after installation and the position of the heating tube cannot be adjusted again, resulting in uneven heating of the wafer by the heat radiation of the lamp tube due to the distance.

[0052] The specific adjustment method for the depth of the fixed column embedded in the fixed block 131 can be achieved by using a thread. Specifically, the fixed block 131 is provided with a screw interface (i.e., the first screw interface 1311 and the second screw interface 1312) with an internal thread (not shown) formed on the inner wall, and the outer wall of the fixed column (i.e., the first fixed column 132 and the second fixed column 133) is formed with an external thread (not shown) adapted to the internal thread (not shown). The first fixed column 132 is screwed to the first screw interface 1311, and the second fixed column 133 is screwed to the second screw interface 1312. The first fixed column 132 and the second fixed column 133 jointly clamp the tube core 122, and then by adjusting the screwing degree of the first fixed column 132 screwed into the first screw interface 1311 and adjusting the screwing degree of the second fixed column 133 screwed into the second screw interface 1312, the vertical position of the tube core 122 jointly clamped by the first fixed column 132 and the second fixed column 133 is adjusted, thereby achieving the purpose of adjusting the distance between the tube body 123 and the furnace body 20.

[0053] The inner side of the fixing block 131 is recessed inward to form a sixth sealing groove 1314, and the fixing member 13 also includes: a sixth sealing ring 186 disposed in the sixth sealing groove 1314 and in contact with the protection tube 124. The sixth sealing ring 186 is accommodated in the sixth sealing groove 1314, and when the fixing block 131 is sleeved on the outside of the protection tube 124, the sixth sealing ring 186 is in contact with the outer wall of the protection tube 124, thereby achieving the sealing of the end of the protection tube 124, so as to achieve the purpose of isolating the internal air pressure of the protection tube 124 from the external air pressure. When the fixing block 131 is sleeved on the outside of the protection tube 124, the sixth sealing ring 186 is dissolved in the sixth sealing groove 1314, reducing the squeezing of the sixth sealing ring 186 on the protection tube 124, so as to solve the problem that the heating tube will be broken under the squeezing action of the sealing ring when installing the heating tube in the existing wafer annealing furnace due to the need to set a sealing ring at the junction of the heating cavity and the quartz tube.

[0054] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the utility model. They are not intended to limit the protection scope of the utility model. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the utility model should be included in the protection scope of the utility model.

[0055] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An annealing device for annealing a wafer, characterized in that: The annealing equipment comprises: A furnace body and a heating chamber body which is arranged on the side of the furnace body and is independent of the furnace body; The heating chamber comprises: a fixing frame arranged at the side of the furnace body, a plurality of heating tube groups arranged inside the fixing frame, and two fixing members respectively arranged at both ends of the heating tube groups, the surface of the fixing member facing away from the heating tube group is in contact with the inner side wall of the fixing frame, and a partition is arranged at the joint of the furnace body and the heating chamber body to isolate the furnace body from the heating chamber body; Wherein, the air pressure inside the heating chamber is the same as the air pressure inside the furnace body.

2. The annealing equipment according to claim 1, characterized in that: The furnace body comprises: a main body with a hollow cavity and two plates respectively arranged at the top and the bottom of the main body. A support frame for carrying wafers is arranged inside the main body.

3. The annealing equipment according to claim 2, characterized in that: The heating chamber is arranged at the top and / or the bottom of the furnace body, and a mounting opening for accommodating the partition is provided in the middle of the plate body; When the partition is accommodated in the installation opening, the partition is used to isolate the internal space of the heating chamber from the internal space of the main body.

4. The annealing equipment according to claim 3, characterized in that: The annealing equipment further includes: a first sealing ring disposed between the heating chamber body and the partition, the heating chamber body defines a first sealing groove for accommodating the first sealing ring, the first sealing ring is accommodated in the first sealing groove and contacts the partition.

5. The annealing equipment according to claim 3, characterized in that: The annealing equipment further includes: a second sealing ring disposed between the body and the partition, the body defines a second sealing groove for accommodating the second sealing ring, the second sealing ring is accommodated in the second sealing groove and contacts the partition.

6. The annealing equipment according to claim 4, characterized in that: The fixing frame comprises: an upper deck, a side deck and a lower deck arranged vertically from top to bottom in sequence, and a heating cavity is formed by the upper deck, the side deck, the lower deck and the partition; The first sealing groove is opened on the side of the lower cabin plate facing the partition plate, and a plurality of the heating tube groups are arranged in sequence in the horizontal or vertical direction to form a layer of heating tube groups arranged in the heating cavity. A third sealing ring is arranged at the junction of the side plate and the lower cabin plate, and a fourth sealing ring is arranged at the junction of the lower cabin plate and the plate body.

7. The annealing equipment according to claim 6, characterized in that: The side panels are configured in multiple layers and are arranged in sequence in the vertical direction. A fifth sealing ring is provided at the joint of two adjacent side panels. The heating tube group is configured in multiple layers, and two adjacent layers of heating tube groups are arranged in sequence in the horizontal direction and the vertical direction respectively.

8. The annealing equipment according to claim 6, characterized in that: The heating tube group comprises: a tube body and a protective tube sleeved on the outside of the tube body, the end of the tube body extends outward to form a tube core, and a pipeline connected to the tube body is formed on the outside of the tube core, the fixing piece is sleeved on the outside of the end of the protective tube and forms an opening for the pipeline to extend out, and the upper cabin plate is provided with a strip opening for the pipeline to extend out of the heating cabin body; Wherein, the air pressure inside the protection tube is different from the air pressure in the heating cavity.

9. The annealing equipment according to claim 8, characterized in that: The fixing member comprises: a fixing block sleeved on the outside of the protection tube and two fixing columns respectively embedded in the fixing block on both sides in the vertical direction and forming two fixing columns for clamping the tube core together, and the opening is opened on the side of the fixing block.

10. The annealing equipment according to claim 9, characterized in that: The inner side of the fixing block is inwardly recessed to form a sixth sealing groove, and the fixing member further includes: a sixth sealing ring disposed in the sixth sealing groove and in contact with the protection tube.

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