Position detection device and semiconductor processing equipment

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and discloses a position detection device and semiconductor processing equipment, the position detection device comprises a chamber, a transmitting assembly and a receiving assembly, a semiconductor device is arranged in the chamber and is provided with a reflecting part, the transmitting assembly is arranged on the side wall of the chamber and is used for transmitting detection light, and the receiving assembly is used for receiving the detection light. The reflecting part is used for reflecting the detection light, and the receiving assembly is arranged on the side wall of the cavity and used for receiving the detection light reflected by the reflecting part. The position detection device provided by the utility model can detect the position of the semiconductor device, prevents the semiconductor device from falling or being damaged due to position deviation, ensures the accuracy of the position of the semiconductor device, and improves the product yield.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a position detection device and semiconductor processing equipment. Background Art

[0002] This section merely provides background information related to the present disclosure and is not necessarily prior art.

[0003] During the manufacturing process of semiconductor devices, when the robot transports the wafer to the carrier plate in the process chamber of the processing equipment, the position of the wafer on the carrier plate may shift relative to the preset position due to some reasons. The shift of the wafer position may cause the wafer to fall or be damaged, resulting in problems such as reduced wafer yield. Utility Model Content

[0004] The purpose of the utility model is to at least solve the problem of wafer yield reduction caused by wafer position deviation, such as wafer falling or damage. This purpose is achieved through the following technical solutions:

[0005] The first aspect of the utility model provides a position detection device, comprising:

[0006] A chamber, wherein a semiconductor device is disposed in the chamber, and the semiconductor device has a reflecting portion;

[0007] An emitting component is arranged on a side wall of the chamber, the emitting component is used to emit detection light, and the reflecting part is used to reflect the detection light;

[0008] The receiving component is arranged on the side wall of the chamber and is arranged on the same side as the transmitting component. The receiving component is used to receive the detection light reflected by the reflecting part.

[0009] The position detection device of the utility model arranges a transmitting component and a receiving component on the side wall of a chamber. When performing semiconductor position detection, the transmitting component emits detection light to the semiconductor device, the semiconductor device transmits the detection light to the receiving component, and the receiving component receives the reflected detection light. The position of the semiconductor device can be detected to avoid the semiconductor device from falling or being damaged due to position deviation, thereby ensuring the accuracy of the semiconductor device position and improving the product yield.

[0010] In addition, the position detection device according to the utility model may also have the following additional technical features:

[0011] In some embodiments of the present invention, a through hole is provided on the side wall of the chamber, the transmitting component and the receiving component are arranged on the outer side wall of the chamber, and the through hole is used for allowing the detection light to pass through.

[0012] In some embodiments of the present invention, the transmitting component includes multiple transmitting elements, and the receiving component includes multiple receiving elements. The multiple receiving elements are arranged in a one-to-one correspondence with the multiple transmitting elements. The multiple transmitting elements are arranged at intervals on the outer wall of the chamber, and the multiple receiving elements are arranged at intervals on the outer wall of the chamber.

[0013] In some embodiments of the present invention, the cross-sectional shape of the chamber is circular, the plurality of emitting elements and the plurality of receiving elements are arranged on the outer peripheral surface of the chamber along the circumference of the chamber, and the plurality of emitting elements, the plurality of receiving elements and the edge of the semiconductor device are in the same plane.

[0014] In some embodiments of the present invention, the number of the emitting elements is three, two of which are arranged opposite to each other, and the other emitting element is arranged on the center line of the line connecting the two emitting elements.

[0015] In some embodiments of the present invention, each of the transmitting elements and the receiving element corresponding to the transmitting element are integrated into one body.

[0016] In some embodiments of the present invention, the position detection device further includes a controller, and the controller is electrically connected to the transmitting component and the receiving component respectively.

[0017] In some embodiments of the present invention, the position detection device further includes an adjustment component, which is disposed in the chamber and electrically connected to the controller, and the semiconductor device is disposed in the adjustment component, and the adjustment component is used to adjust the position of the semiconductor device.

[0018] In some embodiments of the present invention, the semiconductor device is a reflective semiconductor device or a transparent semiconductor device.

[0019] Another aspect of the present invention provides a semiconductor processing equipment, including a conveying device, a processing device and a position detection device as described in any one of the above items, wherein the conveying device is used to convey the semiconductor device to the chamber, and the processing device is used to process the semiconductor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] By reading the detailed description of the preferred embodiment below, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used for the purpose of illustrating the preferred embodiment and are not to be considered as limiting the present invention. Moreover, the same reference numerals are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0021] Figure 1The structure diagram of the position detection device according to the embodiment of the utility model is schematically shown;

[0022] Figure 2 Schematically shows a side view of a position detection device according to an embodiment of the utility model;

[0023] Figure 3 The schematic diagram of the structure of the semiconductor processing equipment according to the embodiment of the utility model is schematically shown.

[0024] The reference numerals are as follows:

[0025] 1. Chamber;

[0026] 20. Launching parts;

[0027] 30. Receiving documents;

[0028] 4. Semiconductor devices;

[0029] 5. Adjustment assembly; 50. Moving seat; 51. Lifting pin;

[0030] 6. Conveying device; 60. Loading assembly; 61. Transfer assembly;

[0031] 7. Processing equipment. DETAILED DESCRIPTION

[0032] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0033] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0034] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0035] For ease of description, spatial relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is turned over, then the elements described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." can include both above and below orientations.

[0036] like Figure 1 to Figure 2 As shown, according to an embodiment of the utility model, a position detection device is proposed, which includes a chamber 1, a transmitting component and a receiving component. The chamber 1 is a structure with an open top and closed on all sides. A semiconductor device 4 is arranged in the chamber 1. The semiconductor device 4 has a reflecting part. The transmitting component is arranged on the side wall of the chamber 1. The transmitting component is used to emit detection light. The reflecting part is used to reflect the detection light. The receiving component is arranged on the side wall of the chamber 1 and is arranged on the same side as the transmitting component. The receiving component is used to receive the detection light reflected back by the reflecting part.

[0037] The position detection device of the present invention arranges a transmitting component and a receiving component on the side wall of the chamber 1. When performing semiconductor position detection, the transmitting component emits detection light to the semiconductor device 4, the semiconductor device 4 transmits the detection light to the receiving component, and the receiving component receives the reflected detection light. The position of the semiconductor device 4 can be detected to avoid the semiconductor device 4 from falling or being damaged due to position displacement, thereby ensuring the accuracy of the position of the semiconductor device 4 and improving the product yield.

[0038] In some embodiments of the utility model, a through hole is provided on the side wall of the chamber 1, and the transmitting component and the receiving component are provided on the outer side wall of the chamber 1, and the through hole is used for the detection light to pass through. Specifically, the transmitting component includes a plurality of transmitting elements 20, and the receiving component includes a plurality of receiving elements 30. A through hole is provided on the side wall of the chamber 1, and the plurality of transmitting elements 20 are arranged at intervals on the outer side wall of the chamber 1, and the plurality of receiving elements 30 are arranged at intervals on the outer side wall of the chamber 1, and are arranged one by one corresponding to the plurality of transmitting elements 20. In this embodiment, each transmitting element 20 and the receiving element 30 corresponding to the transmitting element 20 are integrated into one, that is, a reflective photoelectric sensor is adopted, the transmitting element 20 and the receiving element 30 are installed in the same device, and the detection light emitted by the transmitting element 20 is reflected by the reflecting part of the semiconductor device 4, and the distance from the sensor to the reflecting part is measured by the reflection principle, that is, the distance from the above-mentioned reflective photoelectric sensor to the semiconductor device 4.

[0039] In some embodiments of the utility model, the cross-sectional shape of the chamber 1 is circular, and a plurality of emitting elements 20 and a plurality of receiving elements 30 are arranged on the outer peripheral surface of the chamber 1 along the circumference of the chamber 1, and the plurality of emitting elements 20 and the plurality of receiving elements 30 are in the same plane as the edge of the semiconductor device 4. Specifically, in the present embodiment, the semiconductor device 4 is a wafer, and the wafer is a reflective semiconductor device 4 or a transparent semiconductor device 4, which can reflect the detection light emitted by the reflector to the receiving element 30. A plurality of reflective photoelectric sensors are arranged on the outer peripheral surface of the chamber 1 along the circumference, and each reflective photoelectric sensor has the same height from the bottom of the chamber 1, and each reflective photoelectric sensor has the same height as the edge of the wafer, so that the detection light emitted by the reflective photoelectric sensor can be vertically projected to the edge of the wafer, thereby improving the detection accuracy.

[0040] In some embodiments of the present invention, the position detection device further comprises a controller, which is electrically connected to the transmitting component and the receiving component respectively. In this embodiment, there are three transmitting elements 20, two of which are arranged opposite to each other, and another transmitting element 20 is arranged on the center line of the line connecting the two transmitting elements 20. In this embodiment, there are three reflective photoelectric sensors, namely a first sensor, a second sensor and a third sensor, wherein the first sensor and the second sensor are symmetrically arranged, that is, the first sensor and the second sensor are respectively arranged at the left and right ends of the outer side of the chamber 1, and the third sensor is arranged between the first sensor and the second sensor, and the third sensor is arranged on the center line of the line connecting the first sensor and the second sensor, that is, the third sensor is arranged at the front end of the outer side of the chamber 1. By arranging reflective photoelectric sensors at the front end, the left end and the right end respectively, the three reflective photoelectric sensors transmit the optical path distances to the controller, the controller receives the three optical path distances, and compares the three optical path distances with the preset distances. If the optical path distances are the same as the preset distance values, it means that the position of the wafer is accurate. If the optical path distances are different from the preset distance values, the position of the wafer is offset and it is necessary to adjust its position to further improve the accuracy of wafer position detection, avoid falling or damage caused by wafer position offset, and improve product yield.

[0041] In other embodiments, the number of reflective photoelectric sensors may also be set to four, five, six, etc., which is not specifically limited here.

[0042] In some embodiments of the utility model, the position detection device further includes an adjustment component 5, the adjustment component 5 is arranged in the chamber 1 and electrically connected to the controller, the semiconductor device 4 is arranged on the adjustment component 5, and the adjustment component 5 is used to adjust the position of the semiconductor device 4. Specifically, the adjustment component 5 includes a moving seat 50 and a plurality of lifting pins 51 electrically connected to the controller, the moving seat 50 is arranged at the inner bottom of the chamber 1, the moving seat 50 can move in the chamber 1 along a first direction and a second direction, the first direction and the second direction are perpendicular to each other, the first direction and the second direction are substantially parallel to the horizontal plane, and the first direction coincides with the connection line of the first sensor and the second sensor, a plurality of lifting pins 51 are arranged on the moving seat 50, the wafer is arranged on the top of the lifting pins 51, and the plurality of lifting pins 51 can drive the wafer to move in the vertical direction to adjust the height of the wafer. In this embodiment, the number of the lifting pins 51 is three, and the three lifting pins 51 are arranged on the moving seat 50 at intervals around the circumference of the moving seat 50, and there are many ways to set it, for example, including but not limited to welding, riveting, bonding or setting it on the moving seat 50. The cross-sectional shape formed by the three lifting pins 51 is circular, and the diameter of the wafer is slightly larger than the diameter of the circle formed by the lifting pins 51, so that the wafer can be placed on the support surface at the top of the lifting pins 51 during the transfer process. Each lifting pin 51 is provided with a vacuum adsorption hole, and the vacuum adsorption hole is provided on the lifting pin 51 along the axial direction of the lifting pin 51. The vacuum adsorption hole can pass through the support surface to adsorb the wafer placed on the support surface. When performing wafer position detection, the controller receives the optical path distance of the detection light emitted and received by the transmitting component. The controller compares the optical path distance with the preset distance value. If the optical path distance is different from the preset distance value, the position of the semiconductor device 4 is offset, and the controller controls the moving seat 50 to move, thereby adjusting the position of the wafer to ensure the accuracy of the wafer position.

[0043] The more the lifting pins 51 are, the more dispersed the force acting on the wafer is, and the less likely the wafer is to be damaged during the adsorption process. Moreover, the uniform distribution of the lifting pins 51 is also helpful in avoiding damage to the wafer.

[0044] In other embodiments, the number of the lifting pins 51 may be set to four, five, six, etc., and in order to make the wafer more evenly stressed during the adsorption process, each lifting pin 51 is arranged at the same distance.

[0045] like Figure 3As shown, the second aspect of the utility model proposes a semiconductor processing equipment, which includes a conveying device 6, a processing device 7 and the above-mentioned position detection device. The conveying device 6 and the processing device 7 are respectively arranged on both sides of the chamber 1 and are electrically connected to the controller. The conveying device 6 is used to convey the semiconductor device 4 to the chamber 1. The conveying device 6 includes a loading component 60 and a transfer component 61. The loading component 60 loads the wafer into the transfer component 61, and the transfer component 61 transports the wafer into the chamber 1. The processing device 7 is used to process the semiconductor device 4. The processing equipment also includes an alarm device electrically connected to the controller. If the optical path distance is different from the preset distance value, the alarm device sends an alarm signal. Of course, the semiconductor processing equipment of this embodiment also has other structures and components that existing semiconductor processing equipment has. Since this embodiment does not involve these structures and components, they are not repeated here.

[0046] When processing the semiconductor device 4, the loading assembly 60 loads the wafer onto the transfer assembly 61, and the transfer assembly 61 transports the wafer to the lifting pin 51 in the chamber 1, turns on the three reflective photoelectric sensors, and confirms whether the detection light emitted by the three photoelectric sensors hits the wafer. If it does not hit the wafer, the height of the wafer is adjusted by the lifting pin 51 so that the wafer and the three photoelectric sensors are at the same height. Then the three photoelectric sensors transmit the optical path distances to the controller, which receives the three optical path distances and compares the three optical path distances with the preset distances. If the optical path distances are the same as the preset distance values, it means that the position of the wafer is accurate. If the optical path distances are different from the preset distance values, the alarm device sends an alarm signal to remind that the position of the wafer is offset and the position of the wafer needs to be adjusted. After the wafer position is accurate, the processing device 7 processes the wafer.

[0047] The above is only a preferred specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A position detection device, characterized in that: include: A chamber, wherein a semiconductor device is disposed in the chamber, and the semiconductor device has a reflecting portion; An emitting component is arranged on a side wall of the chamber, the emitting component is used to emit detection light, and the reflecting part is used to reflect the detection light; The receiving component is arranged on the side wall of the chamber and is arranged on the same side as the transmitting component. The receiving component is used to receive the detection light reflected by the reflecting part.

2. The position detection device according to claim 1, characterized in that: A through hole is arranged on the side wall of the chamber, the transmitting component and the receiving component are arranged on the outer side wall of the chamber, and the through hole is used for allowing the detection light to pass through.

3. The position detection device according to claim 2, characterized in that: The transmitting assembly includes a plurality of transmitting elements, and the receiving assembly includes a plurality of receiving elements. The plurality of receiving elements are arranged in one-to-one correspondence with the plurality of transmitting elements. The plurality of transmitting elements are arranged at intervals on the outer wall of the chamber, and the plurality of receiving elements are arranged at intervals on the outer wall of the chamber.

4. The position detection device according to claim 3, characterized in that: The cross-sectional shape of the chamber is circular, the plurality of emitting elements and the plurality of receiving elements are arranged on the outer peripheral surface of the chamber along the circumference of the chamber, and the plurality of emitting elements, the plurality of receiving elements and the edge of the semiconductor device are in the same plane.

5. The position detection device according to claim 3, characterized in that: The number of the emitting elements is three, two of which are arranged opposite to each other, and the other emitting element is arranged on the center line of the line connecting the two emitting elements.

6. The position detection device according to claim 3, characterized in that: Each of the transmitting elements and the receiving element corresponding to the transmitting element are integrated into one body.

7. The position detection device according to claim 1, characterized in that: The position detection device also includes a controller, which is electrically connected to the transmitting component and the receiving component respectively.

8. The position detection device according to claim 7, characterized in that: The position detection device further includes an adjusting component, which is disposed in the chamber and electrically connected to the controller. The semiconductor device is disposed in the adjusting component, and the adjusting component is used to adjust the position of the semiconductor device.

9. The position detection device according to claim 1, characterized in that: The semiconductor device is a reflective semiconductor device or a transparent semiconductor device.

10. A semiconductor processing equipment, characterized in that: include: A conveying device, a processing device, and a position detection device according to any one of claims 1 to 9, wherein the conveying device is used to convey the semiconductor device to the chamber, and the processing device is used to process the semiconductor device.

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