Module high-temperature test calibrator

Abstract

The utility model provides a module high-temperature test calibrator, and belongs to the technical field of pressure sensor chip detection. The module high-temperature test calibrator comprises a table body, a three-axis mechanical movement mechanism is installed on the top of the table body, a detection unit is installed on the three-axis mechanical movement mechanism, and a heating mechanism is installed on the top of the table body. The three-axis mechanical movement mechanism is installed on the table body, the detection unit is installed on the three-axis mechanical movement mechanism, and therefore the three-axis mechanical movement mechanism can drive the detection unit to move on the X axis, the Y axis and the Z axis so as to achieve the purpose that the detection unit can detect a pressure sensor chip conveniently; the pressure sensor chip module placement carrier is placed on the heating mechanism, so that the pressure sensor chip is heated, the state change of the pressure sensor chip in normal-temperature and high-temperature environments is detected, and meanwhile, the detection efficiency and accuracy can be improved.

Description

Technical Field

[0001] The present application relates to the field of pressure sensor chip detection, and more specifically, to a module high temperature test calibrator. Background Art

[0002] The pressure sensor chip needs to go through a testing process during its production. Since the operating voltage of the pressure sensor chip will change under different temperature environments, it is particularly important to control the operating voltage of the pressure sensor chip in a safe environment.

[0003] When testing the voltage of the pressure sensor chip module at room temperature and high temperature, the voltage changes with temperature. At present, the detection is mainly carried out manually at room temperature and high temperature, that is, manually controlling the test probe to detect the voltage status of the pressure sensor chip module at different temperatures, which will increase the risk of the test process to a certain extent and affect the detection efficiency to a certain extent. For this reason, we propose a module high temperature test calibrator. Utility Model Content

[0004] In order to make up for the above shortcomings, the present application provides a module high temperature test calibrator, which aims to improve the problem of low detection efficiency of manual detection methods.

[0005] An embodiment of the present application provides a module high temperature test calibrator, including a table, a three-axis mechanical motion mechanism is installed on the top of the table, a detection unit is installed on the three-axis mechanical motion mechanism, a heating mechanism is installed on the top of the table, and a pressure sensor chip module placement carrier is installed on the heating mechanism.

[0006] In a specific implementation, the three-axis mechanical motion mechanism includes an X-axis mechanical module installed on the top of the platform, a Y-axis mechanical module is installed on the X-axis mechanical module, and a Z-axis slide cylinder is installed on the Y-axis mechanical module.

[0007] In a specific embodiment, the X-axis mechanical module includes a transverse guide rail, a first motor is installed on the side wall of one end of the transverse guide rail, the driving shaft of the first motor is connected to a first threaded rod, the first threaded rod is threadedly sleeved with a first movable seat slidably sleeved on the transverse guide rail, and the Y-axis mechanical module is installed on the first movable seat.

[0008] In a specific embodiment, the Y-axis mechanical module includes a longitudinal guide rail installed on the first movable seat, a second motor is installed on the side wall of one end of the longitudinal guide rail, the driving shaft of the second motor is connected to a second threaded rod, a second threaded rod is threadedly sleeved with a second movable seat slidably sleeved on the longitudinal guide rail, and the Z-axis slide cylinder is installed on the second movable seat.

[0009] In a specific implementation, the detection unit includes a mounting frame, which is connected to the output shaft of the Z-axis slide cylinder and has a test probe mounted thereon.

[0010] In a specific implementation, the pressure sensor chip module placement carrier includes a carrier plate placed on the top of the heating mechanism, and a plurality of positioning grooves are formed on the carrier plate.

[0011] In a specific embodiment, a display screen is also installed on the top of the platform.

[0012] In a specific implementation manner, a defective product storage box is also installed on the top of the platform.

[0013] The beneficial effects of the present application are as follows: a three-axis mechanical motion mechanism is installed on the platform, and a detection unit is installed on the three-axis mechanical motion mechanism, so that the three-axis mechanical motion mechanism can drive the detection unit to move on the X-axis, Y-axis and Z-axis, so as to facilitate the detection unit to detect the pressure sensor chip, and a heating mechanism is installed on the top of the platform, and a pressure sensor chip module is placed on the heating mechanism. The carrier is used to heat the pressure sensor chip to detect the state changes of the pressure sensor chip under normal temperature and high temperature environments, and at the same time, the efficiency and accuracy of detection can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the implementation methods of the present application, the drawings required for use in the implementation methods will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 It is a schematic diagram of the main structure of the module high temperature test calibrator provided in the embodiment of the present application;

[0016] Figure 2 A schematic diagram of the structure of a three-axis mechanical motion mechanism in a module high temperature test calibrator provided in an embodiment of the present application;

[0017] Figure 3 A schematic diagram of the X-axis mechanical module structure in the module high temperature test calibrator provided in the embodiment of the present application;

[0018] Figure 4 A schematic diagram of the Y-axis mechanical module structure in the module high temperature test calibrator provided in the embodiment of the present application;

[0019] Figure 5 A schematic diagram of the structure of a detection unit in a module high temperature test calibrator provided in an embodiment of the present application;

[0020] Figure 6 for Figure 3 A partial enlarged view of the middle A;

[0021] Figure 7 for Figure 5 A partial enlarged view of point B in the middle.

[0022] In the figure: 10-body; 110-defective product storage box; 20-three-axis mechanical motion mechanism; 210-X-axis mechanical module; 2110-lateral guide rail; 2120-first motor; 2130-first threaded rod; 2140-first moving seat; 220-Y-axis mechanical module; 2210-longitudinal guide rail; 2220-second motor; 2230-second threaded rod; 2240-second moving seat; 230-Z-axis slide cylinder; 30-detection unit; 310-mounting frame; 320-test probe; 40-heating mechanism; 50-pressure sensor chip module placement carrier; 510-carrying plate; 520-positioning groove. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0024] See also Figure 1-7 The present application provides a module high temperature test calibrator, including a platform 10, a three-axis mechanical motion mechanism 20 is installed on the top of the platform 10, a detection unit 30 is installed on the three-axis mechanical motion mechanism 20, a heating mechanism 40 is installed on the top of the platform 10, a pressure sensor chip module placement carrier 50 is installed on the heating mechanism 40, and a display screen is also installed on the top of the platform 10. Specifically, the specific structure of the heating mechanism 40 is the existing technology. The pressure sensor chip module placement carrier 50 is placed on the pressure sensor chip module placement carrier 50, and then the sensor chip is placed on the pressure sensor chip module placement carrier 50, which can achieve the purpose of heating the sensor chip, thereby driving the detection unit 30 to move through the three-axis mechanical motion mechanism 20 to detect the sensor chip.

[0025] See also Figure 2 The three-axis mechanical motion mechanism 20 includes an X-axis mechanical module 210 installed on the top of the table 10, a Y-axis mechanical module 220 is installed on the X-axis mechanical module 210, and a Z-axis slide cylinder 230 is installed on the Y-axis mechanical module 220. Specifically, the detection unit 30 is installed on the Z-axis slide cylinder 230, so that the Z-axis slide cylinder 230 drives the detection unit 30 to move up and down, and the movement of the X-axis mechanical module 210, the Y-axis mechanical module 220 and the Z-axis slide cylinder 230 is controlled by the PLC controller.

[0026] See also Figure 3The X-axis mechanical module 210 includes a transverse guide rail 2110, and a first motor 2120 is installed on the side wall of one end of the transverse guide rail 2110. The driving shaft of the first motor 2120 is connected to a first threaded rod 2130. The first threaded rod 2130 is threadedly sleeved with a first movable seat 2140 that is slidably sleeved on the transverse guide rail 2110. The Y-axis mechanical module 220 is installed on the first movable seat 2140. When set, a first sliding groove is opened on the top of the transverse guide rail 2110, and the first threaded rod 2130 is located in the first sliding groove. At the same time, the first movable seat 2140 is slidably set in the first sliding groove to realize the movement of the first movable seat 2140 along the first sliding groove.

[0027] See also Figure 4 The Y-axis mechanical module 220 includes a longitudinal guide rail 2210 installed on the first moving seat 2140, a second motor 2220 is installed on the side wall of one end of the longitudinal guide rail 2210, a second threaded rod 2230 is connected to the driving shaft of the second motor 2220, a second threaded rod 2230 is threadedly sleeved with a second moving seat 2240 slidably sleeved on the longitudinal guide rail 2210, a Z-axis slide cylinder 230 is installed on the second moving seat 2240, further, a second slide groove is opened at the top of the longitudinal guide rail 2210, the second threaded rod 2230 is located in the second slide groove, and the second moving seat 2240 is slidably set in the second slide groove, so that the second moving seat 2240 moves longitudinally.

[0028] See also Figure 7 The detection unit 30 includes a mounting frame 310, which is connected to the output shaft of the Z-axis slide cylinder 230 and has a test probe 320 mounted thereon. It should be noted that a plurality of test probes 320 are provided to achieve the purpose of simultaneously detecting a plurality of pressure sensor chips. The Z-axis slide cylinder 230 drives the mounting frame 310 to move up and down to drive the test probe 320 to move up and down.

[0029] See also Figure 6 The pressure sensor chip module placement carrier 50 includes a carrier plate 510 placed on the top of the heating mechanism 40, and a plurality of positioning grooves 520 are opened on the carrier plate 510. A defective product storage box 110 is also installed on the top of the platform 10. It should be noted that four limit blocks are installed on the top of the heating mechanism 40, and the carrier plate 510 is placed between the four limit blocks to limit the carrier plate 510 by the four limit blocks. Furthermore, the defective product storage box 110 is specifically a drawer, and a plurality of through holes are opened on the top of the drawer to place unqualified pressure sensor chips in the drawer through the through holes.

[0030] The working principle of this module high temperature test calibrator is as follows: the carrier plate 510 is placed on the heating mechanism 40, and then the pressure sensor chip can be placed in the positioning groove 520 on the carrier plate 510, and the pressure sensor chip can be heated by the heating mechanism 40, and then the test probe 320 can be driven to move by the first motor 2120, the second motor 2220 and the Z-axis slide cylinder 230. Specifically, the first motor 2120 drives the first threaded rod 2130 to rotate to drive the first moving seat 2140 on the transverse guide rail 2110 to move, and the second motor 2220 drives the second threaded rod 2230 to rotate to drive the second moving seat 2240 to move on the longitudinal guide rail 2210, so as to adjust the test probe 320 to correspond to the pressure sensor chip, and then the Z-axis slide cylinder 230 drives the mounting frame 310 downward, so that the mounting frame 310 drives the test probe 320 to move downward, so as to detect the voltage conversion status of the pressure sensor chip at different temperatures.

[0031] It should be noted that the specific models and specifications of the first motor 2120, the second motor 2220, the Z-axis slide cylinder 230, the test probe 320 and the heating mechanism 40 need to be selected and determined according to the actual specifications of the device. The specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0032] The power supply and principles of the first motor 2120, the second motor 2220, the Z-axis slide cylinder 230, the test probe 320 and the heating mechanism 40 are clear to those skilled in the art and are not described in detail herein.

[0033] The above description is only an embodiment of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

Claims

1. Module high temperature test calibrator, characterized in that, The invention comprises a platform (10), a three-axis mechanical motion mechanism (20) is installed on the top of the platform (10), a detection unit (30) is installed on the three-axis mechanical motion mechanism (20), a heating mechanism (40) is installed on the top of the platform (10), and a pressure sensor chip module placement carrier (50) is installed on the heating mechanism (40).

2. The module high temperature test calibrator according to claim 1, characterized in that: The three-axis mechanical motion mechanism (20) comprises an X-axis mechanical module (210) installed on the top of the platform (10), a Y-axis mechanical module (220) installed on the X-axis mechanical module (210), and a Z-axis sliding table cylinder (230) installed on the Y-axis mechanical module (220).

3. The module high temperature test calibrator according to claim 2, characterized in that: The X-axis mechanical module (210) includes a transverse guide rail (2110), a first motor (2120) is installed on a side wall at one end of the transverse guide rail (2110), a driving shaft of the first motor (2120) is connected to a first threaded rod (2130), a first movable seat (2140) is threadedly sleeved on the first threaded rod (2130) and slidably sleeved on the transverse guide rail (2110), and the Y-axis mechanical module (220) is installed on the first movable seat (2140).

4. The module high temperature test calibrator according to claim 3, characterized in that: The Y-axis mechanical module (220) includes a longitudinal guide rail (2210) installed on the first movable seat (2140), a second motor (2220) is installed on the side wall of one end of the longitudinal guide rail (2210), the driving shaft of the second motor (2220) is connected to a second threaded rod (2230), a second movable seat (2240) slidably mounted on the longitudinal guide rail (2210) is threadedly sleeved on the second threaded rod (2230), and the Z-axis slide cylinder (230) is installed on the second movable seat (2240).

5. The module high temperature test calibrator according to claim 2, characterized in that: The detection unit (30) comprises a mounting frame (310), the mounting frame (310) is connected to the output shaft of the Z-axis slide cylinder (230), and a test probe (320) is also mounted on the mounting frame (310).

6. The module high temperature test calibrator according to claim 1, characterized in that: The pressure sensor chip module placement carrier (50) comprises a carrier plate (510) placed on the top of the heating mechanism (40), and a plurality of positioning grooves (520) are provided on the carrier plate (510).

7. The module high temperature test calibrator according to claim 1, characterized in that: A display screen is also installed on the top of the platform (10).

8. The module high temperature test calibrator according to claim 1, characterized in that: A defective product storage box (110) is also installed on the top of the platform (10).

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