Wafer appearance defect detection device

Abstract

The utility model relates to the technical field of wafer appearance detection, in particular to a wafer appearance defect detection device which comprises a base, an ultrasonic detection device is mounted on the left side of the base, a detection area is arranged at the right end of the ultrasonic detection device, and a wheel disc in contact with the detection area is arranged above the base. An ultrasonic probe is arranged at the top of the detection area, a driving mechanism for driving the ultrasonic probe to move is arranged above the detection area, a picking mechanism for picking up wafers is arranged on the right side of the wheel disc, and the picking mechanism comprises a movable column, a lifting column and a vacuum chuck. According to the utility model, ultrasonic waves are adopted to carry out non-contact detection, so that the detection effect can be ensured, the surface of the wafer is effectively prevented from being damaged, whether scratches exist on the surface of the wafer or not is detected, whether defects such as pores, layering or impurities exist in the wafer or not is detected, the detection effect on the wafer is improved, and the detection efficiency is improved. Therefore, the quality and reliability of the wafer are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer appearance detection, in particular to a wafer appearance defect detection device. Background Art

[0002] During the wafer manufacturing process, surface defects or abnormal features such as scratches, bumps, contamination, and particles may appear and affect the performance and reliability of the wafer. In order to ensure the quality and reliability of the wafer, detection equipment is usually required to detect the appearance defects of the wafer.

[0003] In the prior art, a Chinese patent with announcement number CN219915399U discloses a wafer inspection device, which adopts the scheme of "including: a wafer box, a storage space for placing multiple wafers in the wafer box, multiple wafers are arranged in parallel and at intervals in the storage space, and an opening connected to the storage space is provided on the wafer box; a material picking mechanism, including a connected material picking arm and a first moving component, the first moving component is used to drive the material picking arm to move so as to transfer any wafer in the wafer box through the opening to the outside of the wafer box; an inspection mechanism, including a camera, the camera is located on one side of the wafer box and is used to collect the surface image of the wafer on the material picking arm". This scheme can avoid the risk of fragmentation and contamination that may be caused by manual slicing, ensure product quality, and improve equipment utilization.

[0004] However, the above scheme still has some shortcomings. For example, by taking images for monitoring through the camera, only the appearance of the wafer and the side facing the camera can be inspected, and the inside of the wafer and the other side cannot be monitored, resulting in limited detection and inability to ensure wafer quality. In view of this, the utility model proposes a wafer appearance defect detection device. Summary of the invention

[0005] The purpose of the utility model is to provide a wafer appearance defect detection device, which can detect the surface and interior of the wafer at the same time, reduce friction with the wafer, and effectively avoid wafer damage, so as to solve the problem proposed in the above background technology that only the appearance of the wafer and the side facing the camera can be inspected, resulting in relatively limited inspection.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A wafer appearance defect detection device comprises a base, an ultrasonic detection device is installed on the left side of the base, a detection area is arranged at the right end of the ultrasonic detection device, and a wheel in contact with the detection area is arranged above the base;

[0008] An ultrasonic probe is arranged on the top of the detection area, a driving mechanism for driving the ultrasonic probe to move is arranged above the detection area, a picking mechanism for picking up wafers is arranged on the right side of the wheel, and the picking mechanism includes a movable column, a lifting column and a vacuum suction cup.

[0009] As a preferred technical solution, the driving mechanism includes sliding rods relatively distributed at the top of the detection area, a slider is slidably connected to the sliding rods, and the ultrasonic probe is installed at the bottom of the slider and is electrically connected to the ultrasonic detection device.

[0010] As a preferred technical solution, a threaded rod is provided between the two groups of sliding rods, the threaded rod is rotatably connected to the side wall of the ultrasonic detection device, the threaded rod passes through the slider and is threadedly connected to the slider, and a first motor coaxially transmitted with the threaded rod is installed inside the ultrasonic detection device.

[0011] As a preferred technical solution, the top of the wheel is provided with positioning grooves distributed in a circular array, and the leftmost positioning groove is located inside the detection area. The wheel is rotatably connected to the base via a rotating shaft, and a second motor for driving the wheel is installed inside the base.

[0012] As a preferred technical solution, a base is provided on the base and below the movable column, the bottom of the base is rotatably connected to the base through a rotating shaft, a sliding groove is provided on the movable column near the top, and a third motor is installed inside the base to drive the movable column to rotate.

[0013] As a preferred technical solution, the lifting column is located above the rightmost positioning slot, a movable plate is fixedly installed on the top of the lifting column, the movable plate is slidably connected to the slide slot, and an electric push rod is installed inside the movable column and below the movable plate.

[0014] As a preferred technical solution, the vacuum suction cup is arranged at the bottom end of the lifting column, the bottom of the vacuum suction cup is provided with a picking head distributed in a circular array, the top of the movable column is installed with a vacuum generator, and the vacuum generator and the vacuum suction cup are connected by a hose.

[0015] As a preferred technical solution, a camera is installed at the center of the bottom of the lifting column, and a lighting lamp is installed at the bottom of the lifting column and outside the camera.

[0016] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0017] 1. The utility model is provided with an ultrasonic detection device, a wheel and a driving mechanism, and adopts ultrasonic waves for contactless detection, which can effectively avoid damage to the surface of the wafer while ensuring the detection effect. While detecting whether there are scratches on the surface of the wafer, it can also detect whether there are defects such as pores, stratification or impurities inside the wafer, thereby improving the detection effect of the wafer, thereby improving the quality and reliability of the wafer.

[0018] 2. The utility model can pick up and transport wafers through the picking mechanism, through the cooperation of movable columns, lifting columns and vacuum suction cups, so that the wheel can transport the wafers to the inspection area for continuous inspection, avoid friction of the wafers during the picking process, avoid scratches on the surface of the wafers, and effectively improve the inspection efficiency of the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2 This is a schematic diagram of the structure of the ultrasonic detection device of the utility model;

[0022] Figure 3 This is a schematic diagram of the driving mechanism structure of the utility model;

[0023] Figure 4 This is a schematic diagram of the roulette structure of the utility model;

[0024] Figure 5 This is a schematic diagram of the structure of the picking mechanism of the utility model;

[0025] Figure 6 This is a schematic diagram of the structure of the vacuum suction cup of the utility model.

[0026] In the figure: 1. base; 2. ultrasonic detection device; 21. detection area; 22. ultrasonic probe; 23. sliding rod; 24. slider; 25. threaded rod; 26. first motor; 3. wheel; 31. positioning groove; 32. second motor; 4. movable column; 41. base; 42. slide groove; 43. third motor; 5. lifting column; 51. movable plate; 52. electric push rod; 6. vacuum suction cup; 61. picking head; 62. vacuum generator; 63. hose; 7. camera; 71. lighting lamp. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] According to the attached Figure 1-6 As shown, the embodiment of the utility model provides a wafer appearance defect detection device, including a base 1, an ultrasonic detection device 2 is installed on the left side of the base 1, a detection area 21 is arranged at the right end of the ultrasonic detection device 2, and a wheel 3 in contact with the detection area 21 is arranged above the base 1;

[0029] An ultrasonic probe 22 is arranged on the top of the detection area 21. The model of the ultrasonic probe 22 is MB2S. It has the characteristics of small performance parameter errors and can perform high-precision detection of wafer appearance defects. A driving mechanism for driving the ultrasonic probe 22 to move is arranged above the detection area 21. A picking mechanism for picking up the wafer is arranged on the right side of the wheel 3. The picking mechanism includes a movable column 4, a lifting column 5 and a vacuum suction cup 6.

[0030] When inspecting the wafer, the movable column 4, the lifting column 5 and the vacuum suction cup 6 cooperate with each other to pick up the wafer on the conveyor belt, place the wafer on the wheel 3, and convey the wafer to the inner side of the inspection area 21 through the wheel 3, so that the driving mechanism drives the ultrasonic probe 22 to detect defects of the wafer, determine whether there are scratches on the surface of the wafer, and detect whether there are defects such as pores, stratification or impurities inside the wafer. The ultrasonic detection device 2 uses ultrasonic waves for non-contact detection, which can effectively avoid damage to the surface of the wafer while ensuring the detection effect.

[0031] As a preferred embodiment of this embodiment, the driving mechanism includes slide bars 23 relatively distributed at the top of the detection area 21, a slider 24 is slidably connected to the slide bars 23, and the ultrasonic probe 22 is installed at the bottom of the slider 24 and is electrically connected to the ultrasonic detection device 2.

[0032] A threaded rod 25 is provided between the two sets of slide rods 23. The threaded rod 25 is rotatably connected to the side wall of the ultrasonic detection device 2. The threaded rod 25 passes through the slider 24 and is threadedly connected to the slider 24. A first motor 26 that is coaxially driven with the threaded rod 25 is installed inside the ultrasonic detection device 2.

[0033] When the first motor 26 rotates to drive the threaded rod 25 to rotate, the threaded rod 25 and the slider 24 move relative to each other, driving the slider 24 to slide along the slider 23 and causing the ultrasonic probe 22 to move along the slider 23 , thereby detecting the wafer inside the detection area 21 .

[0034] As a preferred embodiment of the present invention, the top of the roulette wheel 3 is provided with positioning grooves 31 distributed in a circular array, and the leftmost positioning groove 31 is located on the inner side of the detection area 21. The roulette wheel 3 is rotatably connected to the base 1 via a rotating shaft, and a second motor 32 for driving the roulette wheel 3 is installed inside the base 1.

[0035] The wafer to be inspected can be positioned through the positioning groove 31, which is convenient for the ultrasonic probe 22 to detect. The second motor 32 drives the wheel 3 to rotate, so that the wheel 3 can continuously transport the wafer to the inner side of the detection area 21, thereby improving the detection efficiency of the wafer.

[0036] As a preferred embodiment of the present invention, a base 41 is provided on the base 1 and below the movable column 4. The bottom of the base 1 is rotatably connected to the base 41 through a rotating shaft. A slide groove 42 is provided on the movable column 4 near the top. A third motor 43 for driving the movable column 4 to rotate is installed inside the base 41. When the third motor 43 drives the movable column 4 to rotate, it can drive the lifting column 5 and the vacuum suction cup 6 to rotate horizontally, so that the picking mechanism can place the wafer to be inspected into the positioning groove 31, or place the wafer that has been inspected in the positioning groove 31 onto the conveyor belt.

[0037] As a preferred embodiment of the present invention, the lifting column 5 is located above the rightmost positioning groove 31, and a movable plate 51 is fixedly installed on the top of the lifting column 5. The movable plate 51 is slidably connected to the slide groove 42, and an electric push rod 52 is installed inside the movable column 4 and below the movable plate 51. The operation of the electric push rod 52 can drive the lifting column 5 to move up and down, making it convenient for the vacuum suction cup 6 to pick up the wafer.

[0038] As a preferred embodiment of the present invention, the vacuum suction cup 6 is arranged at the bottom end of the lifting column 5, and a picking head 61 distributed in a circular array is provided at the bottom of the vacuum suction cup 6. A silicone pad is bonded and fixed to the bottom of the picking head 61 to protect the surface of the wafer and avoid damage to the wafer surface. A vacuum generator 62 is installed on the top of the movable column 4. The vacuum generator 62 is connected to the vacuum suction cup 6 through a hose 63. When the vacuum generator 62 is running, a vacuum negative pressure can be generated inside the vacuum suction cup 6 through the hose 63, so that the picking head 61 can vacuum adsorb the wafer, which is convenient for picking up the wafer.

[0039] As a preferred embodiment of the present invention, a camera 7 is installed at the bottom center of the lifting column 5, and a lighting lamp 71 is installed at the bottom of the lifting column 5 and outside the camera 7. When the lifting column 5 moves toward the wafer, the camera 7 can take an image of the wafer and perform a preliminary inspection of the appearance defects of the wafer. At the same time, it can assist the vacuum suction cup 6 to facilitate the vacuum suction cup 6 to pick up the wafer.

[0040] When the wafer appearance defect detection device of the utility model is used, first, the third motor 43 is operated to drive the movable column 4 to rotate, so that the movable column 4 drives the lifting column 5 and the vacuum suction cup 6 to rotate, and the camera 7 assists the vacuum suction cup 6 to move the vacuum suction cup 6 to the top of the wafer, and then the electric push rod 52 is operated to drive the vacuum suction cup 6 close to the wafer, and the vacuum generator 62 is operated to form a vacuum negative pressure inside the vacuum suction cup 6 through the hose 63, and the pickup head 61 picks up the wafer;

[0041] Furthermore, the picking mechanism places the picked-up wafer into the positioning groove 31, and the second motor 32 is turned on to drive the wheel 3 to rotate, so as to transport the wafer in the positioning groove 31 to the inner side of the detection area 21. After that, the first motor 26 is turned on to drive the threaded rod 25 to rotate, so that the slider 24 slides along the slide rod 23, and the ultrasonic probe 22 performs ultrasonic detection on the wafer to determine whether there are scratches on the surface of the wafer, and detect whether there are defects such as pores, stratification or impurities inside the wafer, so as to effectively avoid damage to the surface of the wafer while ensuring the detection effect.

[0042] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A wafer appearance defect detection device, comprising a base (1), characterized in that: An ultrasonic detection device (2) is installed on the left side of the base (1), a detection area (21) is provided at the right end of the ultrasonic detection device (2), and a wheel (3) in contact with the detection area (21) is provided above the base (1); An ultrasonic probe (22) is arranged on the top of the detection area (21), a driving mechanism for driving the ultrasonic probe (22) to move is arranged above the detection area (21), and a picking mechanism for picking up a wafer is arranged on the right side of the wheel (3), the picking mechanism comprising a movable column (4), a lifting column (5) and a vacuum suction cup (6).

2. The wafer appearance defect detection device according to claim 1, characterized in that: The driving mechanism comprises sliding rods (23) relatively distributed at the top of the detection area (21), a slider (24) being slidably connected to the sliding rods (23), and the ultrasonic probe (22) being mounted at the bottom of the slider (24) and electrically connected to the ultrasonic detection device (2).

3. The wafer appearance defect detection device according to claim 2, characterized in that: A threaded rod (25) is provided between the two groups of sliding rods (23), and the threaded rod (25) is rotatably connected to the side wall of the ultrasonic detection device (2). The threaded rod (25) passes through the slider (24) and is threadedly connected to the slider (24). A first motor (26) that is coaxially driven with the threaded rod (25) is installed inside the ultrasonic detection device (2).

4. The wafer appearance defect detection device according to claim 1, characterized in that: The top of the wheel disc (3) is provided with positioning grooves (31) distributed in a circular array, and the leftmost positioning groove (31) is located inside the detection area (21). The wheel disc (3) is rotatably connected to the base (1) via a rotating shaft, and a second motor (32) for driving the wheel disc (3) is installed inside the base (1).

5. The wafer appearance defect detection device according to claim 1, characterized in that: A base (41) is provided on the base (1) and below the movable column (4); the bottom of the base (1) is rotatably connected to the base (41) via a rotating shaft; a slide groove (42) is provided on the movable column (4) near the top; and a third motor (43) for driving the movable column (4) to rotate is installed inside the base (41).

6. The wafer appearance defect detection device according to claim 1, characterized in that: The lifting column (5) is located above the rightmost positioning groove (31), a movable plate (51) is fixedly installed on the top of the lifting column (5), the movable plate (51) is slidably connected to the slide groove (42), and an electric push rod (52) is installed inside the movable column (4) and below the movable plate (51).

7. The wafer appearance defect detection device according to claim 1, characterized in that: The vacuum suction cup (6) is arranged at the bottom end of the lifting column (5), and a pickup head (61) distributed in a ring array is arranged at the bottom of the vacuum suction cup (6). A vacuum generator (62) is installed at the top of the movable column (4), and the vacuum generator (62) is connected to the vacuum suction cup (6) through a hose (63).

8. The wafer appearance defect detection device according to claim 1, characterized in that: A camera (7) is installed at the center of the bottom of the lifting column (5), and an illumination lamp (71) is installed at the bottom of the lifting column (5) and outside the camera (7).

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