Internal memory radiator

Abstract

The utility model relates to a memory radiator which comprises a top plate, a front radiating plate and a rear radiating plate, and the front radiating plate and the rear radiating plate are respectively and fixedly connected with the top plate through a fixing mechanism. The fixing mechanism comprises a positioning structure, a limiting structure and a connecting structure; the positioning structure comprises a long-strip-shaped plate, a positioning protruding block is arranged on the lower side of the middle of the long-strip-shaped plate, and positioning grooves are formed in the front heat dissipation plate and the rear heat dissipation plate. The limiting structure comprises a wedge-shaped limiting strip, the flat face of the wedge-shaped limiting strip faces the long-strip-shaped plate, and wedge-shaped limiting grooves are correspondingly formed in the front heat dissipation plate and the rear heat dissipation plate. The connecting structure comprises a connecting clamping strip, the side, close to the long-strip-shaped plate, of the connecting clamping strip is a dovetail-shaped edge, and connecting clamping grooves are correspondingly formed in plate bodies, located on the two sides of the positioning groove and close to one side of the top plate, of the front heat dissipation plate and the rear heat dissipation plate. The utility model has the beneficial effects that the threaded connection in the prior art is changed into the buckle type connection, the assembly process is simple and fast, the assembly speed is obviously improved, and the production benefit is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a memory radiator. Background Art

[0002] The function of the memory is to temporarily store the operation data in the CPU and exchange data with the hard disk. It is one of the essential hardware components of a computer. With the development of computers, the performance of machines has been continuously improved, and the power consumption has also been increasing. The drawback of improving performance is a significant increase in heat generation. Therefore, a memory radiator with high heat dissipation performance needs to be used in combination.

[0003] The patent with the patent number 201821633733.9 discloses a luminous memory module heat dissipation vest, which includes a luminous component and a heat dissipation component. The luminous component includes an LED light bar seat, on which an LED light bar is arranged. The LED light bar is electrically connected to the computer motherboard and powered by the computer motherboard. An LED light bar light guide cover is also arranged on the LED light bar seat. The LED light bar light guide cover and the LED light bar seat cooperate with each other to fix the LED light bar. The heat dissipation component includes a front panel, a rear panel and a heat dissipation copper sheet fixed on the luminous component. The front panel and the rear panel are respectively fixed on both sides of the luminous component and form a "冂"-shaped structure with the luminous component. The heat dissipation copper sheet is arranged between the front panel and the rear panel. Adhesive tapes are respectively arranged on the opposite sides of the front panel and the rear panel. The utility model adds a heat dissipation copper sheet to improve the heat dissipation performance, and at the same time improves the structures of the LED light bar seat and the LED light bar light guide cover, making the installation of the LED light bar more firm.

[0004] Those skilled in the art have found that although the prior art can discharge the heat of the memory chip and improve the heat dissipation efficiency, due to the complex structure, the assembly process is relatively complicated, which affects the production efficiency. Summary of the Utility Model

[0005] In view of the above problems existing in the prior art, the main purpose of the present utility model is to provide a memory radiator, which can be assembled conveniently and quickly, improve the production efficiency and increase the benefits.

[0006] To achieve the above purpose, the technical solution adopted by the present utility model is: a memory radiator, including a top plate, a front heat dissipation plate and a rear heat dissipation plate. The front heat dissipation plate and the rear heat dissipation plate are respectively fixedly connected to the top plate through a fixing mechanism. The fixing mechanism includes a positioning structure, a limiting structure and a connecting structure.

[0007] The positioning structure includes long strip plates arranged on both sides of the top plate along the length direction of the top plate. A positioning convex block is arranged on the lower side of the middle part of the long strip plate. Positioning grooves corresponding to the positioning convex blocks are arranged on the front heat dissipation plate and the rear heat dissipation plate.

[0008] The limiting structure includes wedge-shaped limiting strips arranged at the bottom of both sides of the top plate along the length direction of the top plate and slightly lower in height than the positioning structure, the straight surface of the wedge-shaped limiting strips faces the long strip plate, and the front heat dissipation plate and the rear heat dissipation plate are provided with wedge-shaped limiting grooves on one side close to the top plate;

[0009] The connection structure includes a connecting clip arranged between the long strip plate and the wedge-shaped limit strip and located on both sides of the positioning protrusion. The side of the connecting clip close to the long strip plate is a dovetail-shaped edge, and corresponding connecting clip grooves are provided on the plate bodies on both sides of the positioning groove and close to the top plate on the front heat dissipation plate and the rear heat dissipation plate.

[0010] Furthermore, the positioning protrusion is a geometric shape, and the height of its surface facing the front heat dissipation plate and the rear heat dissipation plate is consistent with the height of the long strip plate.

[0011] Preferably, the positioning protrusion is an isosceles trapezoid, the upper base of which is connected to the long strip plate, and the width of the lower base is smaller than that of the upper base.

[0012] Furthermore, the top plate is integrally injection-molded from a mixed material of transparent material and fluorescent powder.

[0013] Furthermore, the front heat sink and the rear heat sink are made of aluminum.

[0014] Furthermore, through or non-through heat dissipation grooves are provided on the outer surfaces of the front heat dissipation plate and the rear heat dissipation plate.

[0015] Furthermore, a clamping head for connecting and fixing the memory stick is provided at the bottom of the top plate.

[0016] Furthermore, the card head includes card blocks arranged at both ends of the bottom of the top plate, and the card blocks are provided with memory slots along the length direction of the top plate, and the memory sticks are fixedly connected to the top plate by being inserted into the memory slots.

[0017] Compared with the prior art, the beneficial effect of the utility model is that the threaded connection in the prior art is changed to a snap-on connection, the assembly process is simple and quick, the assembly speed is significantly improved, and the production efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is an overall schematic diagram of the utility model;

[0019] Figure 2 It is a schematic diagram of the fixing mechanism in the utility model;

[0020] Figure 3 It is a schematic diagram of the front heat sink and the rear heat sink in the utility model;

[0021] Figure 4 It is a three-dimensional diagram of the top plate in the utility model;

[0022] Figure 5 It is a side view of the top plate in the utility model.

[0023] Legend: 1. Top plate; 2. Front heat sink; 3. Rear heat sink; 4. Fixing mechanism; 401. Positioning structure; 4011. Long strip plate; 4012. Positioning protrusion; 4013. Positioning groove; 402. Limiting structure; 4021. Wedge-shaped limiting strip; 4022. Wedge-shaped limiting groove; 403. Connecting structure; 4031. Connecting card strip; 4032. Connecting card slot; 5. Card head; 501. Card block; 502. Memory slot. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments.

[0025] Example 1

[0026] like Figures 1 to 5 As shown, a memory heat sink includes a top plate 1, a front heat sink 2, and a rear heat sink 3. The front heat sink 2 and the rear heat sink 3 are respectively fixedly connected to the top plate 1 through a fixing mechanism 4; the fixing mechanism 4 includes a positioning structure 401, a limiting structure 402, and a connecting structure 403;

[0027] The positioning structure 401 is used to help the front heat sink 2 and the rear heat sink 3 to be quickly positioned on the top plate 1, the limiting structure 402 is used to prevent the front heat sink 2 and the rear heat sink 3 from sliding up and down during the positioning process, and the connecting structure 403 is used to connect and fix the front heat sink 2 and the rear heat sink 3 to the top plate 1.

[0028] The positioning structure 401 includes a long strip plate 4011 arranged on both sides of the top plate 1 along the length direction of the top plate 1, a positioning protrusion 4012 is arranged on the lower middle side of the long strip plate 4011, and a positioning groove 4013 is arranged on the front heat sink 2 and the rear heat sink 3 corresponding to the positioning protrusion 4012;

[0029] Through the cooperation of the top long strip plate 4011, the positioning protrusion 4012 and the positioning groove 4013, the front heat sink 2 and the rear heat sink 3 can be quickly attached to the side of the top plate 1, and the positioning is accurate;

[0030] The limiting structure 402 includes wedge-shaped limiting strips 4021 arranged at the bottom of both sides of the top plate 1 along the length direction of the top plate 1 and slightly lower than the positioning structure 401. The flat surface of the wedge-shaped limiting strips 4021 faces the long strip plate 4011. The front heat sink 2 and the rear heat sink 3 are provided with wedge-shaped limiting grooves 4022 on one side close to the top plate 1.

[0031] Through the cooperation between the wedge-shaped limiting strip 4021 and the wedge-shaped limiting groove 4022, after the front heat sink 2 and the rear heat sink 3 are attached to the top plate 1, since the flat surface of the wedge-shaped limiting strip 4021 faces the long strip plate 4011, the heat sink 2 and the rear heat sink 3 will not slide up and down, which is conducive to the installation and assembly;

[0032] The connection structure 403 includes a connection clip 4031 disposed between the long strip plate 4011 and the wedge-shaped limiting strip 4021 and located on both sides of the positioning protrusion 4013. The connection clip 4031 is disposed along the length direction of the top plate 1 and is parallel to the long strip plate 4011.

[0033] The side of the connecting clip 4031 close to the long strip plate 4011 is a dovetail-shaped edge, and the front heat sink 2 and the rear heat sink 3 are provided with connecting clip grooves 4032 on the plate bodies located on both sides of the positioning groove 4013 and close to the top plate 1;

[0034] By means of a snap connection between the connecting clip 4031 and the connecting slot 4032, since the connecting clip 4031 is designed as a single-sided dovetail shape, it can be quickly snapped into the connecting slot 4032 and is not easily slipped due to the limitation of the limiting structure 402; the snap connection between the connecting clip 4031 and the connecting slot 4032 realizes thread-free installation, and the assembly process is simple and quick, which significantly improves the assembly speed and improves the production efficiency.

[0035] The positioning protrusion 4013 is configured as an isosceles trapezoid, and the height of its surface facing the front heat sink 2 and the rear heat sink 3 is consistent with the height of the long strip plate 4011, its upper bottom is connected to the long strip plate 4011, and the width of the lower bottom is smaller than the upper bottom.

[0036] The top plate 1 is made of a transparent material and a fluorescent powder mixed material and is integrally injection-molded.

[0037] The front heat sink 2 and the rear heat sink 3 are aluminum plates.

[0038] Through heat dissipation grooves are arranged on the outer surfaces of the front heat dissipation plate 2 and the rear heat dissipation plate 3 .

[0039] A clamp 5 for connecting and fixing the memory stick is provided at the bottom of the top plate 1 .

[0040] The card head 5 includes card blocks 501 arranged at both ends of the bottom of the top plate 1 . The card blocks 501 are provided with memory slots 502 along the length direction of the top plate 1 . The memory stick is fixedly connected to the top plate 1 by being inserted into the memory slots 502 .

[0041] Example 2

[0042] As a preferred solution of the positioning protrusion 4013 in Embodiment 1, the positioning protrusion 4013 may also be designed as other geometric shapes such as a semicircle, a semi-ellipse, or a triangle.

[0043] The heat dissipation grooves provided on the outer surfaces of the front heat dissipation plate 2 and the rear heat dissipation plate 3 may also be non-through types.

[0044] Finally, it should be noted that the above-described embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A memory heat sink, comprising a top plate, a front heat sink, and a rear heat sink, characterized in that: The front heat sink and the rear heat sink are respectively fixedly connected to the top plate through a fixing mechanism; the fixing mechanism includes a positioning structure, a limiting structure, and a connecting structure; The positioning structure includes a long strip plate arranged on both sides of the top plate along the length direction of the top plate, a positioning convex block is arranged on the lower middle side of the long strip plate, and a positioning groove is arranged on the front heat dissipation plate and the rear heat dissipation plate corresponding to the positioning convex block; The limiting structure includes wedge-shaped limiting strips arranged at the bottom of both sides of the top plate along the length direction of the top plate and having a height lower than the positioning structure, the straight surface of the wedge-shaped limiting strips faces the long strip plate, and the front heat dissipation plate and the rear heat dissipation plate are provided with wedge-shaped limiting grooves on one side close to the top plate; The connection structure includes a connecting clip arranged between the long strip plate and the wedge-shaped limit strip and located on both sides of the positioning protrusion. The side of the connecting clip close to the long strip plate is a dovetail-shaped edge, and corresponding connecting clip grooves are provided on the plate bodies on both sides of the positioning groove and close to the top plate on the front heat dissipation plate and the rear heat dissipation plate.

2. The memory heat sink according to claim 1, characterized in that: The positioning protrusion is a geometric shape, and the height of its surface facing the front heat sink and the rear heat sink is consistent with the height of the long strip plate.

3. The memory heat sink according to claim 2, characterized in that: The positioning protrusion is an isosceles trapezoidal body, the upper base of which is connected to the long strip plate, and the width of the lower base is smaller than that of the upper base.

4. The memory heat sink according to claim 1, characterized in that: The top plate is made of a transparent material and a fluorescent powder mixed material, which is integrally injection-molded.

5. The memory heat sink according to claim 1, characterized in that: The front heat sink and the rear heat sink are made of aluminum.

6. The memory heat sink according to any one of claims 1 to 5, characterized in that: A clamping head for connecting and fixing the memory stick is provided at the bottom of the top plate.

7. The memory heat sink according to claim 6, characterized in that: The card head comprises card blocks arranged at two ends of the bottom of the top plate, the card blocks are provided with memory slots along the length direction of the top plate, and the memory bars are fixedly connected with the top plate by being inserted into the memory slots.

8. The memory heat sink according to any one of claims 1 to 5, characterized in that: Through or non-through heat dissipation grooves are arranged on the outer surfaces of the front heat dissipation plate and the rear heat dissipation plate.

9. The memory heat sink according to claim 7, characterized in that: Through or non-through heat dissipation grooves are arranged on the outer surfaces of the front heat dissipation plate and the rear heat dissipation plate.

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