Electronic equipment and fan assembly

Abstract

The utility model provides electronic equipment and a fan assembly, the electronic equipment comprises a circuit board and the fan assembly, the circuit board is provided with an avoiding space, the fan assembly comprises a shell, a cover body and a fan body, the shell is divided into a first part and a second part, the orthographic projection of the first part is located in the avoiding space, and the orthographic projection of the second part is located on the circuit board; the first part and the cover body define a main body part, the second part and the cover body define a containing part, the circuit board seals the containing part on the opposite side of the cover body, the main body part is communicated with the containing part, and the fan body is arranged in the main body part. Through the arrangement, the containing part of the fan assembly extends to the area where the circuit board is located, the fan assembly and the circuit board are overlapped in the thickness direction, the overall size of the fan assembly is increased, and the performance and the heat dissipation capacity of the fan assembly are effectively improved.

Description

Technical Field

[0001] The present application relates to the field of electronic equipment, and in particular to an electronic equipment and a fan assembly. Background Art

[0002] When electronic devices such as laptops are working, the system hardware will generate heat. In order to enhance the heat dissipation effect, laptops are generally equipped with fan components.

[0003] Limited by the size of key components such as the battery and circuit board inside the laptop, there is usually only a small area left for the fan assembly. How to improve the performance of the fan assembly and enhance the heat dissipation capacity has become a bottleneck in the industry. Utility Model Content

[0004] In view of this, the present application provides an electronic device and a fan assembly, which are used to improve the heat dissipation capability of the electronic device.

[0005] Specifically, the following technical solutions are included:

[0006] In a first aspect, an embodiment of the present application provides an electronic device, the electronic device comprising a circuit board and a fan assembly, the circuit board having a first surface and a second surface, the first surface and the second surface being away from each other along a thickness direction of the circuit board, the circuit board being provided with an escape space, the fan assembly comprising a housing, a cover, and a fan body;

[0007] The cover body is disposed on the shell;

[0008] The shell is divided into a first part and a second part, the orthographic projection of the first part is located in the avoidance space, the orthographic projection of the second part is located on the circuit board, the first part and the cover body are arranged to form a main body, the second part and the cover body are arranged to form a receiving part, the circuit board closes the receiving part on the opposite side of the cover body, the main body and the receiving part are communicated, and the fan body is arranged in the main body.

[0009] In an optional embodiment, the fan body and the circuit board are staggered in the thickness direction of the circuit board, and a side surface of the fan body facing away from the cover body is located on the same side as the second surface, and the electronic device also includes a protrusion, which is protruding on the second surface.

[0010] In an optional embodiment, an orthographic projection of the protrusion on the second surface is at least partially covered by an orthographic projection of an edge of the shell on the first surface.

[0011] In an optional embodiment, the protrusion is a flexible seal.

[0012] In a second aspect, an embodiment of the present application provides a fan assembly, the fan assembly comprising a housing, a cover, and a fan body;

[0013] The cover body is disposed on the shell;

[0014] The space enclosed by the shell and the cover body constitutes a main body and a receiving portion that are communicated with each other, and the fan body is arranged in the main body.

[0015] In an optional embodiment, the shell includes a first side wall and a reinforcement plate, the first side wall constitutes a side edge of the shell, and the reinforcement plate is connected to one end of the first side wall.

[0016] In an optional embodiment, the shell further includes a second side wall, the second side wall is used to separate the main body and the accommodating portion, and the second side wall is spaced apart from the cover body.

[0017] In an optional embodiment, the first end of the first side wall is connected to the first end of the second side wall, the second end of the first side wall is spaced apart from the second end of the second side wall, and the second side wall, the first side wall and the cover body are surrounded to form the accommodating portion.

[0018] In an optional embodiment, the shell further includes reinforcing ribs, and the reinforcing ribs are respectively connected to the second end of the first side wall and the second end of the second side wall.

[0019] In an optional embodiment, the shell further includes a mounting plate and a support column, wherein the support column is protruding from the mounting plate, and the support column is used to support the cover body.

[0020] In an optional embodiment, the cover is connected to the shell by heat melting.

[0021] In an optional embodiment, at least a portion of the edge of the cover body is provided with a reinforcement flange.

[0022] The beneficial effects of the technical solution provided in the embodiment of the present application include at least: by dividing the shell into a first part and a second part, and the orthographic projection of the second part is located on the circuit board, the accommodating portion of the fan assembly is extended to the area where the circuit board is located, the fan assembly overlaps with the circuit board in the thickness direction, the overall size of the fan assembly is increased, and the performance and heat dissipation capacity of the fan assembly are effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a structural schematic diagram of a fan assembly of an electronic device in the prior art;

[0025] Figure 2 A schematic diagram of the structure of a circuit board provided in an embodiment of the present application;

[0026] Figure 3 A schematic diagram of the structure of an electronic device provided by some embodiments of the present application after a cover is hidden;

[0027] Figure 4 Schematic diagrams comparing a fan assembly in the prior art and a fan assembly provided in an embodiment of the present application, wherein FIG (a) is a schematic diagram of the structure of a fan assembly in the prior art, and FIG (b) is a schematic diagram of the structure of a housing of a fan assembly provided in an embodiment of the present application, and the cover is hidden;

[0028] Figure 5 A schematic diagram of a three-dimensional assembly of a fan assembly and a circuit board on a first side provided in some embodiments of the present application, wherein a cover is hidden;

[0029] Figure 6 A schematic diagram of a three-dimensional assembly of a fan assembly and a circuit board on a second side provided in some embodiments of the present application;

[0030] Figure 7 A schematic diagram of a three-dimensional assembly of a fan assembly and a circuit board provided in some embodiments of the present application, wherein the cover is hidden;

[0031] Figure 8 A three-dimensional schematic diagram of a fan assembly provided in an embodiment of the present application.

[0032] The reference numerals in the figures represent respectively:

[0033] 100-circuit board; 101-main board; 102-sub-board; 100a-first surface; 100b-second surface; 100c-avoidance space; 200-chip; 300-heat sink; 400-heat sink; 500-fan;

[0034] 1-shell; 101-first part; 102-second part; 11-main body; 12-first side wall; 13-reinforcement plate; 14-second side wall; 15-accommodating part; 16-reinforcement rib; 17-support column; 18-mounting plate; 2-cover; 21-reinforcement flange; 3-fan body; 4-raised part; 5-locking ear; 6-hot melting point.

[0035] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] The directional nouns involved in the embodiments of the present application, such as "upper", "lower", "side", etc., are generally based on the relative relationship of the directions shown in the figures, and these directional nouns are used only to more clearly describe the relationship between structures, and are not intended to describe absolute directions. When the product is placed in different postures, the direction may change, for example, "upper" and "lower" may be interchangeable.

[0038] Unless otherwise defined, all technical terms used in the embodiments of the present application have the same meanings as those generally understood by those of ordinary skill in the art. Some technical terms appearing in the embodiments of the present application are explained below.

[0039] In order to make the technical solutions and advantages of the present application more clear, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0040] When electronic devices such as laptops are working, the system hardware will generate heat. In order to enhance the heat dissipation effect, laptops are generally equipped with fan components.

[0041] For example Figure 1 As shown, in a traditional laptop computer, the chip 200 on the motherboard 101 acts as a heat source and generates heat when the laptop computer is working. The heat is transferred to the heat sink 400 through the heat spreader 300. The cold air generated by the fan 500 passes through the heat sink 400 and takes away the energy of the heat sink 400, thereby ensuring that the laptop computer is at a reasonable temperature.

[0042] However, due to the size of key components such as the battery and circuit board 100 inside the laptop, the space reserved for the fan assembly in the laptop is usually only a small area, such as Figure 1 As shown, one of the fan assemblies is located in the "U"-shaped space on the main board 101, and the other fan assembly is located in the "U"-shaped space between the main board 101 and the small board 102. The performance of the fan assembly is limited by the size of the "U"-shaped space and is difficult to be improved.

[0043] In order to solve the above technical problems, an embodiment of the present application provides an electronic device, which includes but is not limited to a laptop computer, a desktop computer, a printer, a fax machine, a vehicle-mounted instrument, and the like.

[0044] The electronic device includes a circuit board 100 and a fan assembly. The circuit board 100 has a first surface 100a and a second surface 100b. The first surface 100a and the second surface 100b are opposite to each other along the thickness direction of the circuit board 100. The circuit board 100 is provided with an avoidance space 100c.

[0045] Exemplarily, the circuit board 100 includes a main board 101 and a small board 102. Figure 2 and Figure 3 As shown, a "U"-shaped avoidance space 100c is opened on the main board 101, and a "U"-shaped avoidance space 100c is also formed between the main board 101 and the small board 102. The two fan assemblies are respectively arranged in the two avoidance spaces 100c, and the two fan assemblies are symmetrically arranged along the left-right direction.

[0046] The fan assembly comprises a casing 1, a cover 2 and a fan body 3. The cover 2 is disposed on the casing 1.

[0047] The housing 1 is divided into a first part 101 and a second part 102, the orthographic projection of the first part 101 is located in the avoidance space 100c, the orthographic projection of the second part 102 is located on the circuit board 100, the first part 101 and the cover body 2 are surrounded to form a main body 11, the second part 102 and the cover body 2 are surrounded to form a receiving portion 15, the circuit board 100 closes the receiving portion 15 on the opposite side of the cover body 2, the main body 11 and the receiving portion 15 are connected, and the fan body 3 is arranged in the main body 11. It can be understood that the above-mentioned "orthographic projection" is a projection obtained by projecting with a projection line parallel to the thickness direction of the circuit board 100.

[0048] Specifically, the first portion 101 is at least partially located in the avoidance space 100c, and the contour shape of the first portion 101 is adapted to the shape of the avoidance space 100c, for example, the first portion 101 and the avoidance space 100c are both "U"-shaped.

[0049] The cover 2 covers one side of the shell 1 , and the airflow generated when the fan body 3 rotates can flow in the space surrounded by the cover 2 and the shell 1 , that is, the airflow generated when the fan body 3 rotates can flow in the main body 11 and the accommodating portion 15 .

[0050] For example, Figure 3 As shown, the housing 1 includes a first side wall 12, which constitutes a side edge of the housing 1, and is located outside the avoidance space 100c and vertically arranged on the first surface 100a, and the orthographic projection of the second portion 102 on the first surface 100a is at least partially located on the circuit board 100, while in traditional electronic devices, the fan assembly is only located in the avoidance space 100c, and the fan assembly and the circuit board 100 do not overlap in the thickness direction. Therefore, as Figure 4 As shown, while the area of ​​the avoidance space 100c of the circuit board 100 remains unchanged, the fan assembly in the embodiment of the present application has a second part 102 and a accommodating portion 15 compared to the fan assembly in the prior art, has a larger size and wind sweeping area, and thus has a stronger heat dissipation capability.

[0051] Exemplarily, the accommodating portion 15 is used to accommodate short components of the electronic device, and the height of the short components is lower than the height of the fan body 3, so that the airflow generated by the fan body 3 can flow through the accommodating portion 15 without being blocked by the components. Optionally, the short components are components in the electronic device with a height less than or equal to 1 mm.

[0052] For example, Figure 3 and Figure 5 As shown, the first side wall 12 is arc-shaped, and the first side wall 12 smoothly extends from one end of the housing 1 to the other end.

[0053] For example, Figure 3 As shown, the housing 1 is provided with a locking ear 5 , and the locking ear 5 is provided with a through hole, through which fasteners such as screws and bolts are inserted into the circuit board 100 to achieve the connection between the housing 1 and the circuit board 100 .

[0054] like Figure 3 As shown, the fan assembly also includes a heat sink 400 and a heat spreader 300. The heat spreader 300 is thermally connected to the chip 200 on the mainboard 101, and the heat spreader 300 is connected to the heat sink 400. The heat sink 400 is arranged on the air outlet side of the fan body 3. The heat generated by the chip 200 is transferred to the heat sink 400 through the heat spreader 300. The cold air generated by the fan body 3 passes through the heat sink 400 and takes away the energy of the heat sink 400, thereby ensuring that the electronic equipment is at a reasonable temperature.

[0055] The electronic device provided in the embodiment of the present application divides the shell 1 into a first part 101 and a second part 102, and the orthographic projection of the second part 102 is located on the circuit board 100, so that the accommodating portion 15 of the fan assembly extends to the area where the circuit board 100 is located, the fan assembly overlaps with the circuit board 100 in the thickness direction, the overall size of the fan assembly is increased, and the performance and heat dissipation capacity of the fan assembly are effectively improved.

[0056] In a further embodiment, the fan body 3 and the circuit board 100 are staggered in the thickness direction of the circuit board 100, and a side surface of the fan body 3 facing away from the cover body 2 is located on the same side as the second surface 100b, and the electronic device also includes a protrusion 4, which is protruding on the second surface 100b.

[0057] like Figure 5 As shown, since the fan body 3 and the circuit board 100 are staggered in the thickness direction of the circuit board 100, the fan body 3 sinks relative to the circuit board 100, and the airflow generated by the fan body 3 can pass through the gap between the housing 1 and the circuit board 100 in the thickness direction and flow on both sides of the circuit board 100 in the thickness direction. By providing the raised portion 4 to simulate the contour of the fan assembly, the raised portion 4 can cooperate with the keyboard and other components under the circuit board 100 to form a cavity, so that the airflow generated by the fan body 3 flows in the cavity, increasing the wind sweeping area and improving the heat dissipation efficiency of the fan assembly.

[0058] Furthermore, the orthographic projection of the protrusion 4 on the second surface 100 b is at least partially covered by the orthographic projection of the edge of the housing 1 on the first surface 100 a .

[0059] Exemplarily, the orthographic projection of the protrusion 4 on the second surface 100b is at least partially covered by the orthographic projection of the first side wall 12 on the first surface 100a, and the shape of the protrusion 4 is the same as the shape of the first side wall 12, for example Figure 6 As shown, the protrusion 4 is in an arc-shaped strip shape, and the protrusion 4 and the first side wall 12 are correspondingly arranged on the upper and lower sides of the circuit board 100 .

[0060] Through this arrangement, the shape and position of the protrusion 4 are respectively arranged to correspond to the shape and position of the first side wall 12 , so that the gas flow spaces on the upper and lower sides of the circuit board 100 are adapted.

[0061] In a specific embodiment, the protrusion 4 is a flexible seal. For example, the protrusion 4 is made of rubber, silicone and other materials, which has certain flexibility and elasticity, and improves the sealing performance of the cavity formed by the protrusion 4 and the components below the circuit board 100.

[0062] like Figure 7 and Figure 8As shown, an embodiment of the present application further provides a fan assembly, which is suitable for installation in electronic equipment, including but not limited to laptop computers, desktop computers, printers, fax machines, vehicle-mounted instruments, etc.

[0063] The fan assembly comprises a casing 1, a cover 2 and a fan body 3. The cover 2 is disposed on the casing 1.

[0064] The space enclosed by the casing 1 and the cover 2 forms a main body 11 and a receiving portion 15 which are communicated with each other, and the fan body 3 is disposed in the main body 11 .

[0065] Exemplarily, the electronic device includes a circuit board 100 and a fan assembly, the circuit board 100 has a first surface 100a and a second surface 100b, the first surface 100a and the second surface 100b are opposite to each other along the thickness direction of the circuit board 100, the circuit board 100 is provided with an escape space 100c, the shell 1 is divided into a first part 101 and a second part 102, the orthographic projection of the first part 101 is located in the escape space 100c, the orthographic projection of the second part 102 is located on the circuit board 100, the first part 101 and the cover body 2 are arranged to form a main body 11, and the second part 102, the circuit board 100 and the cover body 2 are arranged to form a receiving portion 15.

[0066] Exemplarily, the accommodating portion 15 is used to accommodate short components of the electronic device, and the height of the short components is lower than the height of the fan body 3, so that the airflow generated by the fan body 3 can flow through the accommodating portion 15 without being blocked by the components. Optionally, the short components are components in the electronic device with a height less than or equal to 1 mm.

[0067] like Figure 3 As shown, the fan assembly also includes a heat sink 400 and a heat spreader 300. The heat spreader 300 is thermally connected to the chip 200 on the mainboard 101, and the heat spreader 300 is connected to the heat sink 400. The heat sink 400 is arranged on the air outlet side of the fan body 3. The heat generated by the chip 200 is transferred to the heat sink 400 through the heat spreader 300. The cold air generated by the fan body 3 passes through the heat sink 400 and takes away the energy of the heat sink 400, thereby ensuring that the electronic equipment is at a reasonable temperature.

[0068] The fan assembly provided in the embodiment of the present application, by providing an accommodating portion, enables the fan assembly to extend to the area where the circuit board 100 is located through the accommodating portion 15, so that the fan assembly overlaps with the circuit board 100 in the thickness direction, the overall size of the fan assembly is increased, and the performance and heat dissipation capacity of the fan assembly are effectively improved.

[0069] In a further embodiment, the housing 1 includes a first side wall 12 and a reinforcement plate 13 , the first side wall 12 constitutes a side edge of the housing 1 , and the reinforcement plate 13 is connected to one end of the first side wall 12 .

[0070] like Figure 5 and Figure 7 As shown, the first side wall 12 constitutes the inner edge of the shell, the first side walls 12 of the two fan assemblies are arranged opposite to each other, the reinforcement plate 13 is triangular and parallel to the first surface 100a and the second surface 100b, and the reinforcement plate 13 is connected to the inner wall of the first side wall 12.

[0071] In this embodiment, the reinforcing plate 13 is provided to fix and strengthen the first side wall 12 , thereby preventing one end of the first side wall 12 from breaking.

[0072] In one embodiment, the housing 1 further includes a second side wall 14 , which is used to separate the main body 11 and the accommodating portion 15 , and the second side wall 14 is spaced apart from the cover 2 .

[0073] like Figure 7 As shown, the second side wall 14 is adjacent to the first side wall 12, and the second side wall 14 is in an arc-shaped strip. The bending curvature of the second side wall 14 fits the shape of the avoidance space 100c, so that it just abuts against the inner wall of the avoidance space 100c, which facilitates the positioning and installation of the shell 1.

[0074] The second side wall 14 is spaced apart from the cover body 2 to achieve communication between the main body 11 and the accommodating portion 15. The airflow generated by the fan body 3 can flow in the main body 11 and the accommodating portion 15, thereby increasing the flow path and swept area of ​​the airflow.

[0075] Furthermore, the first end of the first side wall 12 is connected to the first end of the second side wall 14 , the second end of the first side wall 12 is spaced apart from the second end of the second side wall 14 , and the second side wall 14 , the first side wall 12 and the cover body 2 are surrounded to form a receiving portion 15 .

[0076] The first end of the first side wall 12 is directly or indirectly connected to the first end of the second side wall 14 .

[0077] In one embodiment, the housing 1 further includes a reinforcing rib 16 , and the reinforcing rib 16 is connected to the second end of the first side wall 12 and the second end of the second side wall 14 , respectively.

[0078] like Figure 7 As shown, the reinforcing rib 16 is strip-shaped, a first end of the reinforcing rib 16 is connected to the second end of the first side wall 12 , and a second end of the reinforcing rib 16 is connected to the second end of the second side wall 14 .

[0079] In this embodiment, the reinforcing ribs 16 are provided to limit and strengthen the first side wall 12 and the second side wall 14 , thereby preventing the first side wall 12 and the second side wall 14 from being broken.

[0080] Optionally, the first end of the second side wall 14 is connected to the reinforcement plate 13, and the reinforcement plate 13 is overlapped on the second side wall 14. The reinforcement plate 13 fixes and strengthens the first side wall 12 and the second side wall 14 to prevent the connection between the first side wall 12 and the second side wall 14 from breaking.

[0081] Optionally, no other components are placed in the area where the reinforcing plate 13 and the reinforcing rib 16 are located, so as not to affect the reinforcing effect of the reinforcing plate 13 and the reinforcing rib 16 .

[0082] The housing 1 further includes a mounting plate 18 and a support column 17 . The support column 17 is protruded from the mounting plate 18 and is used to support the cover 2 .

[0083] Specifically, the mounting plate 18 is located in the avoidance space 100c. Figure 7 As shown, the fan body 3 is installed on the mounting plate 18, the support column 17 is protruding relative to the upper surface of the mounting plate 18, the support column 17 is in contact with the cover body 2, and the support column 17 supports and limits the cover body 2 to prevent the cover body 2 from collapsing.

[0084] In one embodiment, the cover 2 is connected to the shell 1 by heat melting.

[0085] like Figure 8 As shown, the cover body 2 and the shell body 1 are provided with six thermal melting points 6, which improve the connection strength between the cover body 2 and the shell body 1.

[0086] In one embodiment, at least a portion of the edge of the cover body 2 is provided with a reinforcement flange 21 .

[0087] like Figure 8 As shown, two edges of the cover body 2 are provided with reinforcing flanges 21 , so that the two edges of the cover body 2 form a double-layer structure, thereby improving the structural strength of the cover body 2 .

[0088] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0089] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the present application disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only.

[0090] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. An electronic device, characterized in that: The electronic device comprises a circuit board (100) and a fan assembly, the circuit board (100) having a first surface (100a) and a second surface (100b), the first surface (100a) and the second surface (100b) being mutually divergent along the thickness direction of the circuit board (100), the circuit board (100) being provided with an escape space (100c), and the fan assembly comprising a housing (1), a cover (2) and a fan body (3); The cover body (2) is covered on the shell (1); The shell (1) is divided into a first part (101) and a second part (102); the orthographic projection of the first part (101) is located in the avoidance space (100c), and the orthographic projection of the second part (102) is located on the circuit board (100); the first part (101) and the cover body (2) are arranged to form a main body (11); the second part (102) and the cover body (2) are arranged to form a receiving portion (15); the circuit board (100) closes the receiving portion (15) on the opposite side of the cover body (2); the main body (11) and the receiving portion (15) are connected; and the fan body (3) is arranged in the main body (11).

2. The electronic device according to claim 1, characterized in that: The fan body (3) and the circuit board (100) are staggered in the thickness direction of the circuit board (100), and a side surface of the fan body (3) facing away from the cover body (2) is located on the same side as the second surface (100b), and the electronic device further comprises a protrusion (4), and the protrusion (4) is protruding on the second surface (100b).

3. The electronic device according to claim 2, characterized in that: The orthographic projection of the protrusion (4) on the second surface (100b) is at least partially covered by the orthographic projection of the edge of the shell (1) on the first surface (100a).

4. The electronic device according to claim 2, characterized in that: The raised portion (4) is a flexible sealing member.

5. A fan assembly, characterized in that: The fan assembly comprises a housing (1), a cover (2) and a fan body (3); The cover body (2) is covered on the shell (1); The space enclosed by the shell (1) and the cover (2) forms a main body (11) and a receiving portion (15) that are interconnected, and the fan body (3) is arranged in the main body (11).

6. The fan assembly according to claim 5, characterized in that: The shell (1) comprises a first side wall (12) and a reinforcement plate (13); the first side wall (12) constitutes a side edge of the shell (1); and the reinforcement plate (13) is connected to one end of the first side wall (12).

7. The fan assembly according to claim 6, characterized in that The shell (1) further comprises a second side wall (14), wherein the second side wall (14) is used to separate the main body (11) and the accommodating portion (15), and the second side wall (14) is spaced apart from the cover body (2).

8. The fan assembly according to claim 7, characterized in that The first end of the first side wall (12) is connected to the first end of the second side wall (14), the second end of the first side wall (12) is spaced apart from the second end of the second side wall (14), and the second side wall (14), the first side wall (12) and the cover body (2) are arranged to form the accommodating portion (15).

9. The fan assembly according to claim 7, characterized in that: The shell (1) further comprises reinforcing ribs (16), wherein the reinforcing ribs (16) are respectively connected to the second end of the first side wall (12) and the second end of the second side wall (14).

10. The fan assembly according to claim 5, characterized in that The housing (1) further comprises a mounting plate (18) and a support column (17), wherein the support column (17) is protruding from the mounting plate (18), and the support column (17) is used to support the cover body (2).

11. The fan assembly according to claim 5, characterized in that The cover body (2) is connected to the shell body (1) by thermal melting.

12. The fan assembly according to claim 5, characterized in that At least part of the edge of the cover body (2) is provided with a reinforcement flange (21).

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