A die bonding machine for semiconductor devices

Abstract

The utility model relates to the field of wafer bonding machines, and in particular to a wafer bonding machine for semiconductor devices, comprising a base, a protective box installed on the top outer wall of the base, and a box door hinged on one side outer wall of the protective box, a wafer bonding machine installed on the inner wall of the protective box, and an air inlet hole is opened at one end of the two side outer walls of the base, an air inlet assembly is installed in the air inlet hole, and a ventilation structure is installed on one side outer wall of the protective box; the ventilation structure includes a box body installed on the outer wall of the protective box and a partition plate welded on the inner wall of the box body. The utility model detects the interior of the protective box through a temperature sensor and a smoke sensor, and after the fan is started, the air inside the protective box is extracted, and the air enters the other end of the box body through the through hole on the partition plate, the circulation pipe is closed and the exhaust pipe is started, and the air is discharged from the exhaust pipe after being purified by the purification filter material, so as to facilitate the purification of the exhausted gas.

Description

A die bonding machine for semiconductor devices Technical Field

[0001] The utility model relates to the technical field of chip bonding machines, in particular to a chip bonding machine for semiconductor devices. Background Art

[0002] Semiconductors are materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are materials whose electrical conductivity can be controlled, ranging from that of insulators to conductors;

[0003] The die bonding machine is an electronic component processing device that can bond and fix the parts of electronic components. During the chip packaging process, the semiconductor die is placed on the workpiece to be processed for welding and bonding.

[0004] During the bonding process, the bonding machine and materials are exposed to the outside for a long time and are easily damaged by dust and debris, which increases production costs and cannot ensure storage safety. Summary of the invention

[0005] The utility model aims to solve the above-mentioned problems and shortcomings and proposes a chip bonding machine for semiconductor devices: dust, impurities, humidity and gas in the air are filtered and adsorbed through the dustproof net, filter cotton, activated carbon plate and moisture-absorbing cotton in the air intake pipe to prevent impurities in the gas from entering the interior and affecting the operation, facilitate air intake, improve the protection ability of the operation, prevent dust from affecting the operation, solve the problem of dust affecting the operation due to exposure, and reduce the loss of dust in the morning production.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A wafer bonding machine for semiconductor devices comprises a base, a protective box is installed on the top outer wall of the base, and a box door is hinged on one side outer wall of the protective box, a wafer bonding machine is installed on the inner wall of the protective box, and air inlet holes are opened at one end of the two side outer walls of the base, air inlet components are installed in the air inlet holes, and a ventilation structure is installed on one side outer wall of the protective box; the ventilation structure comprises a box body installed on the outer wall of the protective box, a partition plate welded to the inner wall of the box body, an inspection plate installed on the outer wall of the box body at the top of the partition plate, sliding bars installed on the inner wall of the box body and the outer wall of the partition plate, and a purification filter material inserted in the sliding bar.

[0008] Preferably, a fan is installed at the bottom of the inner wall of the box body, and the input end of the fan is connected to the interior of the protective box. A connecting hole is opened at the center of the partition plate, and the outer walls on both sides of the box body are located at the purification filter material and are respectively connected to a circulation pipe and an exhaust pipe.

[0009] Preferably, the outer wall of one end of the circulation pipe is connected to the inner wall of the protection box, and electric valves are installed in both the circulation pipe and the exhaust pipe.

[0010] Preferably, a storage groove is provided on the outer wall of one end of the base close to the box door, and a drawer is slidably connected in the storage groove, a controller is installed on one outer wall of the protection box, and a temperature sensor and a smoke sensor are respectively installed on the inner wall of the protection box, and the smoke sensor and the temperature sensor are connected to the signal input end of the controller through a signal line;

[0011] According to the above scheme: the interior of the protective box is detected by a temperature sensor and a smoke sensor, the air inside the protective box is extracted after the fan is started, and the air enters the other end of the box body through the through hole on the partition plate, the electric valve on the circulation pipe is closed and the electric valve in the exhaust pipe is started, and the air is purified by the purification filter material and discharged from the exhaust pipe, so as to facilitate the purification of the exhaust gas.

[0012] Preferably, the air intake assembly includes an air intake pipe installed in the air intake hole, air outlet holes equidistantly arranged at one end of the air intake pipe located inside the protective box, a solenoid valve installed on the inner wall of one end of the air intake pipe, and filter cotton, activated carbon plate and moisture-absorbing cotton installed on the inner wall of one end of the air intake pipe.

[0013] Preferably, the inner walls of one end of the air inlet pipe and one end of the exhaust pipe are both sleeved with dustproof nets, and the cross-section of the air inlet pipe is an "L"-shaped structure;

[0014] According to the above scheme: dust, impurities, humidity and gas in the air are filtered and adsorbed through the dustproof net, filter cotton, activated carbon plate and moisture-absorbing cotton in the air intake pipe to prevent impurities in the gas from entering the interior and affecting the operation, facilitate air intake, improve the protection ability of the operation, and prevent the impact of dust.

[0015] Preferably, the solenoid valve, the fan and the electric valve are connected to a controller via wires, and the controller is connected to a power source via wires.

[0016] The beneficial effects of the utility model are:

[0017] 1. Use the temperature sensor and smoke sensor to detect the inside of the protective box. After the fan is started, the air inside the protective box is extracted. The air enters the other end of the box through the hole on the partition plate. Close the electric valve on the circulation pipe and start the electric valve in the exhaust pipe. The air is purified by the purification filter material and then discharged from the exhaust pipe, which is convenient for purifying the discharged gas.

[0018] 2. The dust, impurities, humidity and gas in the air are filtered and adsorbed through the dust-proof net, filter cotton, activated carbon plate and moisture-absorbing cotton in the air intake pipe to prevent impurities in the gas from entering the interior and affecting the operation, facilitate air intake, improve the protection ability of the operation, and prevent the impact of dust. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] FIG1 is a schematic diagram of the internal structure of a semiconductor device die bonding machine proposed by the present invention;

[0020] FIG2 is a schematic diagram of the overall structure of a semiconductor device die bonding machine proposed by the present invention;

[0021] FIG3 is a schematic diagram of a cross-sectional structure of a box body of a semiconductor device die bonding machine proposed by the present invention;

[0022] FIG. 4 is a schematic diagram of the air inlet structure of a semiconductor device die bonding machine according to the present invention.

[0023] In the figure: 1 base, 2 protection box, 3 box door, 4 board gluing machine, 5 air intake assembly, 6 ventilation structure, 7 drawer, 8 controller, 9 air intake pipe, 10 air outlet, 11 solenoid valve, 12 filter cotton, 13 activated carbon plate, 14 moisture-absorbing cotton, 15 box body, 16 partition plate, 17 purification filter material, 18 circulation pipe, 19 exhaust pipe, 20 electric valve, 21 dust net. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0025] Embodiment 1:

[0026] 1-2 and 4, a semiconductor device die bonding machine includes a base 1, a protective box 2 is installed on the top outer wall of the base 1, and a box door 3 is hinged on one side outer wall of the protective box 2, a board bonding machine 4 is installed on the inner wall of the protective box 2, and air inlet holes are opened at one end of the two side outer walls of the base 1, an air inlet assembly 5 is installed in the air inlet hole, and a ventilation structure 6 is installed on one side outer wall of the protective box 2;

[0027] The air intake assembly 5 includes an air intake pipe 9 installed in the air intake hole, an air outlet hole 10 equidistantly provided at one end of the air intake pipe 9 located inside the protective box 2, a solenoid valve 11 installed on the inner wall of one end of the air intake pipe 9, and a filter cotton 12, an activated carbon plate 13 and a moisture-absorbing cotton 14 installed on the inner wall of one end of the air intake pipe 9. The dustproof net 21, the filter cotton 12, the activated carbon plate 13 and the moisture-absorbing cotton 14 in the air intake pipe 9 filter and absorb dust, impurities, humidity and gas in the air to prevent impurities in the gas from entering the interior and affecting the operation;

[0028] One end of the air inlet pipe 9 and the inner wall of one end of the air outlet pipe 19 are both sleeved with a dustproof net 21, and the cross section of the air inlet pipe 9 is an "L"-shaped structure. The electric valve 20 on the circulation pipe 18 is closed and the electric valve 20 in the exhaust pipe 19 is started. The air containing smoke and dust is purified by the purification filter material 17 and then discharged from the exhaust pipe 19;

[0029] The solenoid valve 11, the fan and the electric valve 20 are connected to the controller 8 through wires, and the controller 8 is connected to the power supply through wires.

[0030] Embodiment 2:

[0031] 1-3, the ventilation structure 6 includes a box body 15 installed on the outer wall of the protective box 2, a partition plate 16 welded to the inner wall of the box body 15, an inspection plate installed on the outer wall of the box body 15 located on the top of the partition plate 16, a sliding bar installed on the inner wall of the box body 15 and the outer wall of the partition plate 16, and a purification filter material 17 inserted in the sliding bar, and different filter materials are replaced according to the extension of the Hu.

[0032] A fan is installed at the bottom of the inner wall of the box body 15, and the input end of the fan is connected to the inside of the protection box 2. A connecting hole is opened at the center of the partition plate 16, and the outer walls of both sides of the box body 15 are located at the purification filter material 17 and are respectively connected to the circulation pipe 18 and the exhaust pipe 19, which exhausts the heat generated by the fan itself.

[0033] The outer wall of one end of the circulation pipe 18 is connected to the inner wall of the protection box 2, and the circulation pipe 18 and the exhaust pipe 19 are both equipped with electric valves 20. The gas extracted by the fan in the protection box 2 re-enters the interior of the protection box 2 through the circulation pipe 18, and the purification filter material 17 purifies and filters the repeatedly entering gas, so as to facilitate the filtration and purification of the exhausted gas and the circulating gas;

[0034] A storage groove is provided on the outer wall of one end of the base 1 near the box door 3, and a drawer 7 is slidably connected in the storage groove. A controller 8 is installed on the outer wall of one side of the protection box 2, and a temperature sensor and a smoke sensor are respectively installed on the inner wall of the protection box 2. The smoke sensor and the temperature sensor are connected to the signal input end of the controller 8 through a signal line. The temperature sensor and the smoke sensor detect the interior of the protection box 2. The drawer 7 in the storage groove is convenient for collecting tools.

[0035] Working principle: When in use, open the box door 3 in the protection box 2, place the semiconductor to be glued to the board inside the protection box 2, and use the glue machine 4 to glue the semiconductor. The glue machine 4 will generate heat and some smoke during operation. The temperature sensor and the smoke sensor detect the inside of the protection box 2, and start the fan through the controller 8. After the fan is started, the air inside the protection box 2 is extracted and transported to the box body 15. The air containing smoke enters the other end of the box body 15 through the through hole on the partition plate 16. The electric valve 20 on the circulation pipe 18 is closed and the electric valve 20 in the exhaust pipe 19 is started. The air containing smoke is purified by the purification filter material 17 and then discharged from the exhaust pipe 19. The air is discharged through the air pipe 19. At the same time as the fan is exhausting air, the inside of the protective box 2 needs to be supplemented with gas. At this time, the outside air enters the protective box 2 through the air inlet pipe 9. The dustproof net 21, filter cotton 12, activated carbon plate 13 and moisture-absorbing cotton 14 in the air inlet pipe 9 filter and adsorb dust, impurities, humidity and gas in the air to prevent impurities in the gas from entering the interior and affecting the operation. When the internal gas circulation of the protective box 2 is required, the solenoid valve 11 closes the air inlet pipe 9, the electric valve 20 closes the exhaust pipe 19 and opens the circulation pipe 18. The fan extracts the gas in the protective box 2 and re-enters the protective box 2 through the circulation pipe 18. The purification filter material 17 purifies and filters the gas that enters repeatedly.

[0036] The exemplary implementation of the utility model is described in detail with reference to the examples, however, it is understood by those skilled in the art that, without departing from the concept of the utility model, various modifications and alterations may be made to the above-mentioned specific embodiments, and various combinations of the various technical features and structures proposed in the utility model may be made without exceeding the scope of protection of the utility model, which is determined by the attached claims. The foregoing description of the specific exemplary implementation of the utility model is not intended to limit the utility model to the precise form disclosed, and it is obvious that many changes and variations can be made according to the above teachings. The purpose of selecting and describing the exemplary embodiments is to explain the specific principles of the utility model and its practical application, so that those skilled in the art can realize and utilize various different exemplary implementations of the utility model and various different choices and changes. The scope of the utility model is intended to be defined by the claims and their equivalents.

Claims

1. A die bonding machine for semiconductor devices, comprising a base (1), characterized in that: A protective box (2) is installed on the top outer wall of the base (1), and a box door (3) is hinged on one side outer wall of the protective box (2), a board gluing machine (4) is installed on the inner wall of the protective box (2), and an air inlet hole is opened at one end of the outer walls on both sides of the base (1), an air inlet assembly (5) is installed in the air inlet hole, and a ventilation structure (6) is installed on one side outer wall of the protective box (2); the ventilation structure (6) comprises a box body (15) installed on the outer wall of the protective box (2), a partition plate (16) welded to the inner wall of the box body (15), an inspection plate installed on the outer wall of the box body (15) and located on the top outer wall of the partition plate (16), a sliding bar installed on the inner wall of the box body (15) and the outer wall of the partition plate (16), and a purification filter material (17) inserted in the sliding bar.

2. A semiconductor device die bonding machine according to claim 1, characterized in that: A fan is installed at the bottom of the inner wall of the box body (15), and the input end of the fan is connected to the interior of the protection box (2). A connecting hole is opened at the center of the partition plate (16), and the outer walls on both sides of the box body (15) are located at the purification filter material (17) and are respectively connected to a circulation pipe (18) and an exhaust pipe (19).

3. A semiconductor device die bonding machine according to claim 2, characterized in that: The outer wall of one end of the circulation pipe (18) is in communication with the inner wall of the protection box (2), and electric valves (20) are installed in both the circulation pipe (18) and the exhaust pipe (19).

4. A semiconductor device die bonding machine according to claim 1, characterized in that: The outer wall of one end of the base (1) close to the box door (3) is provided with a storage groove, and a drawer (7) is slidably connected in the storage groove. A controller (8) is installed on one outer wall of the protection box (2), and a temperature sensor and a smoke sensor are respectively installed on the inner wall of the protection box (2). The smoke sensor and the temperature sensor are connected to the signal input end of the controller (8) via a signal line.

5. The semiconductor device die bonding machine according to claim 1, characterized in that: The air intake assembly (5) comprises an air intake pipe (9) installed in the air intake hole, air outlet holes (10) equidistantly arranged at one end of the air intake pipe (9) located inside the protection box (2), a solenoid valve (11) installed on the inner wall of one end of the air intake pipe (9), and filter cotton (12), an activated carbon plate (13) and moisture-absorbing cotton (14) installed on the inner wall of one end of the air intake pipe (9).

6. A semiconductor device die bonding machine according to claim 5, characterized in that: The inner walls of one end of the air inlet pipe (9) and one end of the air outlet pipe (19) are both sleeved with dustproof nets (21), and the cross-section of the air inlet pipe (9) is an "L"-shaped structure.

7. A semiconductor device die bonding machine according to claim 5, characterized in that: The solenoid valve (11), the fan and the electric valve (20) are connected to the controller (8) via wires, and the controller (8) is connected to a power source via wires.

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