Chip position correction device

Abstract

The utility model discloses a chip position correction device, relates to the technical field of intelligent card production packaging equipment, and can realize correction positioning of chips with position and angle deviation. A chip position correcting device comprises a fixing plate, a driving device and a correcting assembly. And the driving device is arranged on the fixed plate. And the correction assembly is arranged on the driving device. The driving device can drive the correction assembly to correct the position of the chip. The driving assembly can drive the correction assembly to act, clamp an intelligent card chip and complete position and angle correction of the chip, when the mechanical arm comes to take the chip, the suction cup sucks the surface of the chip, the driving device can drive the correction assembly to be opened, and the mechanical arm can easily take away the chip with the corrected position, so that the chip is accurately packaged on the intelligent card, and the production efficiency is improved. And the quality of the packaging position of the product is well ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of smart card production and packaging equipment, in particular to a chip position correction device. Background Art

[0002] In the prior art, some packaging machines need to take out individual chips from the tray and package them into smart cards. Because the slots for storing chips on the tray are larger than the chips, there is a certain amount of positional deviation when the equipment takes out the chips. When the chips are packaged on the smart card, there are quality problems such as chip sealing deviation and angle deviation, resulting in unqualified product quality. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art and to provide a chip position correction device capable of realizing the correction positioning of chips with position and angle offsets.

[0004] According to a first aspect of the utility model, a chip position correction device is provided, comprising a fixing plate; a driving device disposed on the fixing plate; a correction component disposed on the driving device, wherein the driving device can drive the correction component to correct the chip position.

[0005] A chip position correction device according to an embodiment of the utility model has at least the following beneficial effects: A chip position correction device includes a fixed plate, a driving device and a correction component. The driving device is arranged on the fixed plate. The correction component is arranged on the driving device. The driving device can drive the correction component to correct the chip position. The driving component can drive the correction component to move, clamp the smart card chip, and complete the position and angle correction of the chip. When the robot comes to take the chip, the suction cup sucks the surface of the chip, and the driving device will drive the correction component to open, so that the robot can easily take away the chip after the position correction, so as to accurately package it on the smart card, and the position quality of the product packaging is well guaranteed.

[0006] According to a chip position correction device described in the utility model, the correction component includes a first correction block and a second correction block, the first correction block and the second correction block are both connected to the driving device, and the driving device can drive the first correction block and the second correction block to move closer to or away from each other.

[0007] According to a chip position correction device described in the utility model, a first chip placement half groove is provided on the first correction block, and a second chip correction half groove is provided on the second correction block. The first chip placement half groove and the second chip correction half groove cooperate to accommodate the chip.

[0008] According to a chip position correction device described in the utility model, the correction component also includes an adjustment mechanism, the adjustment mechanism is arranged on the first correction block and / or the second correction block, and the adjustment mechanism is used to adjust the minimum distance between the first correction block and the second correction block.

[0009] According to a chip position correction device described in the utility model, the adjustment mechanism includes a first adjusting screw and a first locking nut, the first adjusting screw is threaded in the first correction block, the first locking nut is threaded on the first adjusting screw, and the first locking nut is used to lock the first adjusting screw.

[0010] According to a chip position correction device described in the utility model, the adjustment mechanism also includes a second adjusting screw and a second locking nut, the second adjusting screw is threaded in the second correction block, the second locking nut is threaded on the second adjusting screw, and the second locking nut is used to lock the second adjusting screw.

[0011] According to a chip position correction device described in the utility model, both the first chip placement half groove and the second chip correction half groove are provided with hollow positions, and the hollow positions are used to accommodate the wafers on the chips.

[0012] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0014] Figure 1 This is a schematic diagram of the structure of a preferred embodiment of the utility model;

[0015] Figure 2 This is a schematic diagram of the installation of the driving device of a preferred embodiment of the utility model;

[0016] Figure 3 It is a structural schematic diagram of a correction component of a preferred embodiment of the utility model. DETAILED DESCRIPTION

[0017] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0018] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0019] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0020] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0021] Reference Figures 1 to 3 A chip position correction device includes a fixing plate 10, a driving device 20 and a correction component 30. The driving device 20 is disposed on the fixing plate 10. The correction component 30 is disposed on the driving device 20. The driving device 20 can drive the correction component 30 to correct the chip position.

[0022] It can be understood that the driving device 20 can drive the correction component 30 to operate, clamp the smart card chip, and complete the position and angle correction of the chip. When the robot comes to take the chip, the suction cup sticks to the surface of the chip, and the driving device drives the correction component 30 to open. The robot can easily take away the chip after the position correction, so as to accurately package it on the smart card, and the position quality of the product packaging is well guaranteed.

[0023] Reference Figures 1 to 3 The correction assembly 30 includes a first correction block 31 and a second correction block 32. The first correction block 31 and the second correction block 32 are both connected to the driving device 20. The driving device 20 can drive the first correction block 31 and the second correction block 32 to move closer to or farther from each other.

[0024] It is worth noting that, in the embodiment of the present invention, the driving device 20 is a bidirectional cylinder, which can simultaneously drive two components to move closer to or away from each other.

[0025] It is worth noting that in some other embodiments of the present invention, the driving device 20 may also be two synchronously acting air cylinders, oil cylinders, linear motors, etc.

[0026] It can be understood that in some embodiments of the utility model, the first correction block 31 is set at the output end of the driving device 20 through a fastener, and the second correction block 32 is set at the output end of the driving device 20 through a fastener. Under the drive of the driving device 20, the first correction block 31 and the second correction block 32 are close to or away from each other to complete the clamping and correction action of the smart card chip.

[0027] Reference Figures 1 to 3 The first correction block 31 is provided with a first chip placement half groove 311. The second correction block 32 is provided with a second chip correction half groove 321. The first chip placement half groove 311 and the second chip correction half groove 321 cooperate to accommodate the chip.

[0028] It is worth noting that in the embodiment of the present invention, the shapes of the first chip placement half groove 311 and the second chip correction half groove 321 are both isosceles right triangles. The first chip placement half groove 311 and the second chip correction half groove 321 can respectively clamp the two diagonals of the smart card chip, thereby completing the positioning of the chip.

[0029] Reference Figures 1 to 3 The correction assembly 30 further includes an adjustment mechanism 33. The adjustment mechanism 33 is disposed on the first correction block 31 and / or the second correction block 32. The adjustment mechanism 33 is used to adjust the minimum distance between the first correction block 31 and the second correction block 32.

[0030] Reference Figures 1 to 3 The adjusting mechanism 33 includes a first adjusting screw 331 and a first locking nut 332. The first adjusting screw 331 is screwed in the first correction block 31. The first locking nut 332 is screwed on the first adjusting screw 331. The first locking nut 332 is used to lock the first adjusting screw 331.

[0031] It can be understood that the minimum distance between the first correction block 31 and the second correction block 32 can be adjusted by the adjustment mechanism 33 to be suitable for smart card chips of different specifications.

[0032] Reference Figures 1 to 3 The adjusting mechanism 33 further includes a second adjusting screw 333 and a second locking nut 334. The second adjusting screw 333 is screwed in the second correction block 32. The second locking nut 334 is screwed on the second adjusting screw 333. The second locking nut 334 is used to lock the second adjusting screw 333.

[0033] It is worth noting that in the embodiment of the present invention, the first adjusting screw 331 is screwed into the first correction block 31 and then passes through the other side of the first correction block 31, and then the first adjusting screw 331 is locked by the first locking nut 332. The second adjusting screw 333 is screwed into the second correction block 32 and then passes through the other side of the second correction block 32, and then the second adjusting screw 333 is locked by the second locking nut 334.

[0034] The minimum distance between the first correction block 31 and the second correction block 32 can be adjusted by adjusting the length of the first adjusting screw 331 screwed into the first correction block 31 and the length of the second adjusting screw 333 screwed into the second correction block 32 .

[0035] Reference Figures 1 to 3 The first chip placement half groove 311 and the second chip correction half groove 321 are both provided with hollow positions 312. The hollow positions 312 are used to accommodate the wafer on the chip.

[0036] It is worth mentioning that the hollow position 312 allows the protruding wafer at the bottom of the chip to not be squeezed or damaged by contact when the chip is placed in the chip placement slot.

[0037] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A chip position correction device, characterized in that: include: A fixing plate (10); A driving device (20) is arranged on the fixing plate (10); A correction component (30) is arranged on the driving device (20), and the driving device (20) is capable of driving the correction component (30) to correct the chip position; The correction component (30) comprises a first correction block (31) and a second correction block (32), wherein the first correction block (31) and the second correction block (32) are both connected to the driving device (20), and the driving device (20) can drive the first correction block (31) and the second correction block (32) to move closer to or farther from each other.

2. A chip position correction device according to claim 1, characterized in that: The first correction block (31) is provided with a first chip placement half groove (311), and the second correction block (32) is provided with a second chip correction half groove (321), and the first chip placement half groove (311) and the second chip correction half groove (321) cooperate to accommodate a chip.

3. The chip position correction device according to claim 1, characterized in that: The correction component (30) further comprises an adjustment mechanism (33), wherein the adjustment mechanism (33) is arranged on the first correction block (31) and / or the second correction block (32), and the adjustment mechanism (33) is used to adjust the minimum distance between the first correction block (31) and the second correction block (32).

4. A chip position correction device according to claim 3, characterized in that: The adjusting mechanism (33) comprises a first adjusting screw (331) and a first locking nut (332); the first adjusting screw (331) is screwed into the first correction block (31); the first locking nut (332) is screwed onto the first adjusting screw (331); and the first locking nut (332) is used for locking the first adjusting screw (331).

5. A chip position correction device according to claim 4, characterized in that: The adjustment mechanism (33) also includes a second adjustment screw (333) and a second locking nut (334), wherein the second adjustment screw (333) is screwed into the second correction block (32), and the second locking nut (334) is screwed onto the second adjustment screw (333), and the second locking nut (334) is used to lock the second adjustment screw (333).

6. The chip position correction device according to claim 2, characterized in that: The first chip placement half groove (311) and the second chip correction half groove (321) are both provided with a hollow position (312), and the hollow position (312) is used to accommodate the wafer on the chip.

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