Sheet wafer cleaning disc

Abstract

The utility model discloses a slice wafer cleaning disc in the field of wafer wet process production equipment, which comprises a sucker main body and a sealing cover, the middle of the sealing cover is provided with a hole and is fixedly attached to the bottom of the sucker main body, the bottom of the sucker main body is provided with a connecting part which is convexly inserted into the hole of the sealing cover, and the sucker main body is provided with a central air passage which is coaxially arranged with the connecting part. A sealed sucker core cover is assembled at an opening in the top of the central air passage; the face, attached to the sealing cover, of the suction cup body is further provided with an annular air groove coaxial with the center air channel, at least two first air guide channels communicated with the center air channel are formed in the annular air groove, and a plurality of second air guide channels which are annularly distributed and communicated with the annular air groove are formed in the surface of the suction cup body. The surface of the sucker body is further provided with at least two M4 machines annularly distributed on the outer side of the second air guide channel and a flange pin. The safety of the wafer in the cleaning process is improved, the probability of wafer scrapping is reduced, and the wafer cleaning device plays an important role in improving the production efficiency and reducing the cost.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer wet process production equipment, in particular to a thin wafer cleaning disc. Background Art

[0002] Wafers, also known as silicon wafers or silicon chips, are silicon wafers used to make silicon semiconductor circuits and are the basis of semiconductor chips. The raw material is silicon, which is made through a series of complex processing processes. First, high-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rods are formed into silicon wafers, that is, wafers. Wafers have a wide range of applications, including computers, communication equipment, entertainment equipment, electronic games, smartphones, tablets, and various other electronic devices. For example, the central processing unit, memory, graphics chip, etc. of computers all require semiconductor wafers to manufacture; wireless communication equipment and satellite communication systems in the communication field also use a large number of semiconductor wafers; game consoles, graphics cards, etc. in the entertainment field also use semiconductor wafers; processors, memories, and wireless communication modules in electronic devices such as smartphones and tablets also use wafers.

[0003] During the wafer etching and other manufacturing processes, a large amount of abrasives, cutting agents and other chemical impurities will be generated. If these impurities are not cleaned in time, they will have a serious impact on the performance and quality of the wafer, such as reducing the yield of the wafer and causing the quality of the device to deteriorate. During the wafer etching and cleaning process, in order to evenly distribute the etching liquid or cleaning liquid to remove the impurities generated during the etching process and ensure high uniformity and high precision of etching, the wafer needs to rotate at high speed, among which wafer fixing is an important link in this process.

[0004] Ordinary wafers are thicker and can withstand greater forces without being easily broken, so they are often fixed by clamping. Thin wafers are usually less than 200 microns thick and are more likely to break due to stress concentration during handling. If thin wafers are fixed by traditional clamping methods, the edges or fragile parts of the thin wafers may break due to excessive stress due to uneven distribution of clamping force.

[0005] In addition, if the wafer is not effectively fixed, the wafer may shift or even fall off due to the centrifugal force during rotation, which will not only damage the wafer, but may also damage the equipment, causing production interruptions and increased costs. Utility Model Content

[0006] In order to overcome the deficiencies of the prior art solutions, the utility model provides a thin wafer cleaning disk, which can effectively solve the technical problem that the wafer is easily damaged during the cleaning process.

[0007] The technical solution adopted by the utility model to solve its technical problems is:

[0008] A thin wafer cleaning disc, comprising a suction cup body and a sealing cover, wherein the sealing cover has a hole in the middle and is fixedly attached to the bottom of the suction cup body, the bottom of the suction cup body is provided with a connecting portion with a protrusion inserted into the opening of the sealing cover, the suction cup body is provided with a central airway coaxially arranged with the connecting portion, and a sealed suction cup core cover is assembled at the top opening of the central airway;

[0009] The suction cup body is fitted with a sealing cover on one side thereof and is also provided with an annular air groove coaxially arranged with the central air channel, and at least two first air guide channels connected with the central air channel are provided in the annular air groove, and a plurality of second air guide channels distributed in an annular manner and connected with the annular air groove are provided on the surface of the suction cup body, and at least two M4 machine rices and retaining edge pins distributed in an annular manner on the outside of the second air guide channels are also provided on the surface of the suction cup body.

[0010] Furthermore, the suction cup body is also provided with a plurality of secondary air channels surrounding the central air channel, and the tops of the secondary air channels are communicated with the central air channel.

[0011] Furthermore, an inclined surface is provided at the top opening of the central airway, and the suction cup core cover is fixed on the surface of the inclined surface around it.

[0012] Furthermore, a central air hole communicating with the central air channel is provided on the surface of the suction cup core cover.

[0013] Furthermore, an inner sealing ring and an outer sealing ring coaxially arranged with the annular air groove are provided at the joint between the suction cup body and the sealing cover. The inner sealing ring is arranged on the inner side of the annular air groove, and the outer sealing ring is arranged on the outer side of the annular air groove.

[0014] Furthermore, two sealing grooves for placing and fixing the inner sealing ring and the outer sealing ring respectively are provided at the bottom of the suction cup body.

[0015] Furthermore, a coaxially arranged convex portion is provided in the annular air groove, and the convex portion is provided with at least two conducting through holes.

[0016] Furthermore, the end of the M4 machine rice is connected to a cylindrical head screw which is inserted into the inside of the suction cup body and fixed.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] When cleaning the wafer, the utility model creates an airflow at the bottom of the suction cup body and forms a negative pressure on the bottom of the wafer by using the Bernoulli principle, thereby reducing the risk of direct contact between the effective area of ​​the wafer and the surface of the suction cup body, avoiding potential scratch problems. At the same time, the ineffective area around the wafer contacts the edge pins on the surface of the suction cup body, thereby ensuring the stability of the wafer during rotation. This not only improves the safety of the wafer during the cleaning process as a whole, but also reduces the probability of wafer scrapping, which plays an important role in improving production efficiency and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the utility model;

[0020] Figure 2 This is the first exploded schematic diagram of the overall structure of the embodiment of the utility model;

[0021] Figure 3 This is a second exploded schematic diagram of the overall structure of the embodiment of the utility model;

[0022] Figure 4 This is an exploded schematic diagram of the internal structure of the suction cup body of the utility model embodiment;

[0023] Figure 5 It is a schematic top view of the overall structure of an embodiment of the utility model;

[0024] Figure 6 For the utility model embodiment Figure 5 Schematic diagram of the cross-section structure of the middle A surface;

[0025] Figure 7 For the utility model embodiment Figure 5 Schematic diagram of the cross-sectional structure of the middle B surface;

[0026] Numbers in the figure:

[0027] 1-suction cup body, 2-sealing cover, 3-connecting part, 4-central air channel, 5-suction cup core cover, 6-annular air groove, 7-first air guide channel, 8-second air guide channel, 9-M4 machine rice, 10-rib pin, 11-auxiliary air channel, 12-inclined surface, 13-central air hole, 14-inner sealing ring, 15-outer sealing ring, 16-sealing groove, 17-raised part, 18-through hole, 19-cylinder head screw. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] like Figure 1-7 As shown, the utility model provides a thin wafer cleaning tray, which is mainly used for placing and cleaning thin wafers. After the wafer is placed on the surface of the suction cup main body 1, the wafer is cleaned by the Bernoulli principle, which reduces the physical pressure on the wafer, evenly disperses the fixing force, and reduces the risk of damage caused by local stress concentration during the cleaning process. It is mainly composed of a suction cup main body 1 and a sealing cover 2. The specific connection structure between the two is that the sealing cover 2 has a hole in the middle and is fixed to the bottom of the suction cup main body 1, and a connecting part 3 with a protrusion inserted into the opening of the sealing cover 2 is provided at the bottom of the suction cup main body 1. After connection, a plurality of screws that are locked with the suction cup main body 1 are assembled upward from the bottom of the sealing cover 2. When locking, the screws are assembled in the form of inner and outer circles with the annular air groove 6 as a reference. After being connected and fixed, they can rotate synchronously, and the sealing of the annular air groove 6 can also be improved.

[0030] A central air channel 4 coaxially arranged with the connecting portion 3 is provided in the middle of the suction cup body 1, the central air channel 4 is connected up and down, and a suction cup core cover 5 aligned with and sealed to the surface of the suction cup body 1 is assembled at the top opening position. At the same time, an annular air groove 6 coaxially arranged with the central air channel 4 is also provided on the side of the suction cup body 1 that fits the sealing cover 2. At least two first air guide channels 7 connected to the central air channel 4 are provided in the annular air groove 6. A plurality of second air guide channels 8 distributed in an annular manner and connected to the annular air groove 6 are provided on the surface of the suction cup body 1. To realize the Bernoulli principle, it is necessary to introduce gas from one end of the bottom opening of the central air channel 4 to form an airflow. At this time, the airflow is transmitted to the annular air groove 6 through the plurality of first air guide channels 7 in the central air channel 4 for convergence and uniform dispersion. The airflow uniformly dispersed in the annular air groove 6 then passes through the plurality of second air guide channels 8. The air is transported to the surface of the suction cup body 1 through the air channel 8. At the same time, a central air hole 13 connected to the central air channel 4 is also provided on the surface of the suction cup core cover 5. When the wafer is placed at the center of the surface of the suction cup body 1 and covers the position of the suction cup core cover 5, a negative pressure is formed as the air flow blows out from the second air guide channel 8 and the central air hole 13. Under the action of the atmospheric pressure above the wafer itself, the pressure on the upper surface of the wafer is greater than the pressure on the lower surface. The wafer can be firmly placed on the surface of the suction cup body 1, thereby maintaining a high degree of stability during the cleaning process, which not only greatly improves the cleaning efficiency, but also ensures the safety of the operation process. The Bernoulli principle plays a key role in the whole process. It adjusts the air flow velocity and pressure distribution to achieve precise control and efficient cleaning of thin wafers and avoid damage to the thin wafers.

[0031] It should be noted that when gas is delivered to the central air channel 4 to form an airflow, a plurality of auxiliary air channels 11 surrounding the central air channel 4 are also provided on the suction cup body 1, and the top of the auxiliary air channel is connected to the central air channel 4. The user can deliver gas to the auxiliary air channel 11 and the central air channel 4 simultaneously to form a larger airflow, and they can be used together when necessary.

[0032] When the suction cup core cover 5 is placed at the top opening of the central air passage 4, an inclined surface 12 is provided at the top opening of the central air passage 4, and the suction cup core cover 5 is fixed on the surface of the inclined surface 12 and locked by a plurality of screws.

[0033] After the airflow in the central air channel 4 is transported to the annular air groove 6 and gathered, a coaxially arranged protrusion 17 is added in the annular air groove 6. The height of the protrusion 17 in the annular air groove 6 is less than the height of the annular air groove 6, and the protrusion 17 is also distributed with at least two guide holes 18 connected on both sides. The protrusion 17 blocks the airflow during its flow, thereby preventing the airflow transported from the first air guiding channel 7 from being directly discharged to the second air guiding channel 8 directly opposite, making all the second air guiding channels 8 more uniform and accelerating the dispersion through the guide holes 18.

[0034] At the same time, in order to ensure the sealing of the annular air groove 6, an inner sealing ring 14 and an outer sealing ring 15 are added to the side where the suction cup body 1 and the sealing cover 2 are fitted to increase the sealing. The inner sealing ring 14 and the outer sealing ring 15 are coaxially arranged with the annular air groove 6, and the inner sealing ring 14 is arranged on the inner side of the annular air groove 6, while the outer sealing ring 15 is arranged on the outer side of the annular air groove 6, which effectively enhances the sealing of the inner and outer sides of the annular air groove 6. In addition, in order to better fix the positions of the inner sealing ring 14 and the outer sealing ring 15, two sealing grooves 16 for placing and fixing the inner sealing ring 14 and the outer sealing ring 15 are opened at the bottom of the suction cup body 1, and the inner sealing ring 14 and the outer sealing ring 15 are squeezed in the sealing groove 16 to form a sealing effect.

[0035] However, during the cleaning process, the surface of the suction cup body 1 is further provided with at least two M4 machine feet 9 and side guard pins 10 distributed in an annular manner on the outside of the second air guide channel 8. During the rotating cleaning process of the wafer, the side surface of the wafer is blocked by the side guard pins 10, so that the invalid area around the wafer is pressed and fixed on the surface of the M4 machine feet 9, ensuring that the wafer will rotate along with the suction cup body 1 without slipping while the suction cup body 1 is rotating. A cylindrical head screw 19 inserted into and fixed inside the suction cup body 1 is provided at the connection position of the M4 machine feet 9. The M4 machine feet 9 is connected to the top of the cylindrical head screw 19 and ejected. At this time, the cylindrical head screw 19 can be a hexagonal cylindrical head screw.

[0036] Compared with traditional technology, when cleaning the wafer, this technical solution creates an airflow at the bottom of the suction cup body 1 and uses the Bernoulli principle to form a negative pressure on the bottom of the wafer, thereby reducing the risk of direct contact between the effective area of ​​the wafer and the surface of the suction cup body 1, avoiding potential scratch problems. At the same time, the ineffective area around the wafer contacts the retaining pins 10 on the surface of the suction cup body 1, thereby ensuring the stability of the wafer during rotation. Overall, it not only improves the safety of the wafer during the cleaning process, but also reduces the probability of wafer scrapping, which plays an important role in improving production efficiency and reducing costs.

[0037] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention, and any figure mark in the claims should not be regarded as limiting the claims involved.

Claims

1. A thin wafer cleaning tray, consisting of a suction cup body and a sealing cover, characterized in that: The sealing cover has a hole in the middle and is fixed to the bottom of the suction cup body. The bottom of the suction cup body is provided with a connecting portion that is inserted into the hole of the sealing cover. The suction cup body is provided with a central airway coaxially arranged with the connecting portion, and a sealed suction cup core cover is assembled at the top opening of the central airway. The suction cup body is fitted with a sealing cover on one side thereof and is also provided with an annular air groove coaxially arranged with the central air channel, and at least two first air guide channels connected with the central air channel are provided in the annular air groove, and a plurality of second air guide channels distributed in an annular manner and connected with the annular air groove are provided on the surface of the suction cup body, and at least two M4 machine rices and retaining edge pins distributed in an annular manner on the outside of the second air guide channels are also provided on the surface of the suction cup body.

2. A thin wafer cleaning tray according to claim 1, characterized in that: The suction cup body is also provided with a plurality of secondary air channels surrounding the central air channel, and the tops of the secondary air channels are communicated with the central air channel.

3. A thin wafer cleaning tray according to claim 1, characterized in that: An inclined surface is arranged at the top opening of the central airway, and the suction cup core cover is fixedly attached to the surface of the inclined surface on all sides.

4. A thin wafer cleaning disk according to claim 1 or 3, characterized in that: The surface of the suction cup core cover is provided with a central air hole communicated with the central air channel.

5. The thin wafer cleaning tray according to claim 1, characterized in that: An inner sealing ring and an outer sealing ring coaxially arranged with the annular air groove are also provided at the joint portion between the suction cup body and the sealing cover. The inner sealing ring is arranged on the inner side of the annular air groove, and the outer sealing ring is arranged on the outer side of the annular air groove.

6. A thin wafer cleaning tray according to claim 5, characterized in that: The bottom of the suction cup body is provided with two sealing grooves for respectively placing and fixing the inner sealing ring and the outer sealing ring.

7. A thin wafer cleaning tray according to claim 1 or 5, characterized in that: A coaxially arranged convex portion is also provided in the annular air groove, and the convex portion is provided with at least two conducting through holes.

8. The thin wafer cleaning tray according to claim 1, characterized in that: The end of the M4 machine rice is connected with a cylindrical head screw which is inserted into the interior of the suction cup body and fixed.

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