Heat dissipation assembly, vehicle-mounted device and vehicle

Abstract

The utility model discloses a heat dissipation assembly, vehicle-mounted device and vehicle, wherein the heat dissipation assembly comprises a shell and a heat dissipation piece, the shell comprises a metal part and a plastic part, the metal part corresponds to a chip, the outer wall of the metal part is provided with a mounting groove, the plastic part corresponds to a built-in antenna, and the mounting groove is provided with a mounting hole. The chip and the built-in antenna are arranged on a circuit board in the shell, the heat dissipation piece is arranged in the mounting groove, the heat dissipation piece comprises an air-cooled heat dissipation piece, the air-cooled heat dissipation piece comprises a fan and heat dissipation fins, the fan and the heat dissipation fins are arranged adjacently, the air-cooled heat dissipation piece further comprises a fan cover plate, and the fan cover plate is arranged on the shell. The fan cover plate is provided with a fan through groove and a fin through groove. The heat dissipation assembly is high in heat dissipation efficiency, heat dissipation performance and antenna performance are both considered, water and dust are prevented from entering the heat dissipation assembly, and meanwhile the heat dissipation assembly is small in size, light in weight and low in noise.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle-mounted devices, and in particular to a heat dissipation component, a vehicle-mounted device and a vehicle. Background Art

[0002] The circuit board is generally provided with a chip module, which will generate heat during operation and needs to be cooled. The existing heat dissipation structure for the chip module generally adopts a full metal shell or a fan built into the shell. Regarding the use of a full metal shell to meet the heat dissipation requirements, there are the following defects: pure passive heat dissipation, poor heat dissipation capacity; it is difficult to solve the heat dissipation problem of high-heat components; the full metal shell will increase the weight of the host and affect the performance of the built-in antenna. Regarding the built-in fan, there are the following defects: the built-in fan will cause dust to accumulate inside the host; the built-in fan will cause water to enter the host; the built-in fan will increase the total height of the host; the built-in fan has a large air inlet and outlet resistance, which reduces the service life of the fan and makes the fan noise louder. Utility Model Content

[0003] In order to solve at least one of the problems mentioned in the above background technology, the utility model provides a heat dissipation component, a vehicle-mounted device and a vehicle, wherein the heat dissipation component has high heat dissipation efficiency, avoids water ingress and dust accumulation inside, and is small in size, light in weight and low in noise.

[0004] The specific technical solutions provided by the utility model are as follows:

[0005] In a first aspect, a heat dissipation assembly is provided, comprising:

[0006] A housing, the housing comprising a metal part and a plastic part, the metal part corresponds to the chip and an outer wall of the metal part is provided with a mounting groove, the plastic part corresponds to the built-in antenna, wherein the chip and the built-in antenna are arranged on a circuit board in the housing;

[0007] A heat sink is disposed in the mounting groove.

[0008] By means of the above technical scheme, the utility model sets a metal part and a plastic part in the shell, so that the heat generated by the chip during operation can be dissipated through the metal part, and a heat sink is set in the mounting groove of the outer wall of the metal part. This can not only improve the heat dissipation efficiency of the chip, but also reduce water ingress and dust accumulation inside the shell. At the same time, the external heat sink has low noise and will not affect the overall height of the shell. The entire shell has a small volume and light weight. At the same time, the plastic part will not affect the performance of the built-in antenna when the built-in antenna is working, thus taking into account both heat dissipation and antenna performance.

[0009] As a preferred embodiment of the above scheme, the heat sink includes an air-cooled heat sink, and the air-cooled heat sink includes a fan and heat sink fins, and the fan and the heat sink fins are arranged adjacent to each other. According to the above scheme, the external air-cooled heat sink can not only improve the heat dissipation efficiency of the chip, but also reduce water ingress and dust accumulation inside the shell, with low noise, small inlet and outlet wind resistance, and a long service life of the air-cooled heat sink. The fan works in conjunction with the metal part to dissipate heat from the chip, and the heat sink fins can increase the heat dissipation area and improve the heat dissipation capacity.

[0010] As a preferred embodiment of the above scheme, the air-cooled heat sink also includes a fan cover plate, the fan cover plate is provided with a fan slot and a fin slot, the fan slot corresponds to the fan, the fin slot corresponds to the heat dissipation fin, and the fan cover plate is fixed to the mounting slot. According to the above scheme, the fan cover plate protects the fan and the heat dissipation fin, the fan slot and the fin slot are arranged so that the air in and out of the fan is smooth when the fan is working, and the fan and the heat dissipation fin form an air duct, and the heat generated by the chip is taken away by the operation of the fan.

[0011] As a preferred embodiment of the above scheme, a through hole is provided on the inner wall of the mounting groove, and the through hole is connected to the circuit board. According to the above scheme, a fan harness is provided on the fan, and the fan harness passes through the through hole and is inserted into the connector on the circuit board, which facilitates the connection of the fan harness.

[0012] As a preferred embodiment of the above scheme, a groove is provided on the inner wall of the installation groove around the through hole, a first sealing member is provided in the groove, and the fan is pressed against the through hole and the first sealing member. According to the above scheme, the provision of the first sealing member can prevent the accumulated water in the installation groove from penetrating into the housing through the through hole, thereby improving the waterproof ability of the housing.

[0013] As a preferred embodiment of the above solution, a first boss is provided on the inner wall of the metal part, a first heat conducting member is provided on the first boss, and the first heat conducting member is close to the chip. According to the above solution, the heat generated by the chip is transferred to the metal part through the first heat conducting member, and then the heat is dissipated through the metal part, thereby improving the heat dissipation efficiency of the chip.

[0014] As a preferred embodiment of the above scheme, the shell is composed of half of the metal part and half of the plastic part, and the metal part and the plastic part are divided along the length direction of the shell. According to the above scheme, the shell is composed of half of the metal part and half of the plastic part, and the metal part and the plastic part are divided along the length direction of the shell, which is convenient for manufacturing the shell. When manufacturing the shell, the metal part is first die-casted, and then the metal part is placed in the mold of the plastic part after molding, and injection molding is performed. The metal part and the plastic part are insert-molded, and staggered combination is adopted at the combination position to increase the combination force.

[0015] In a second aspect, a vehicle-mounted device is provided, comprising the above-mentioned heat dissipation component and a circuit board, a chip, a built-in antenna and an upper cover, wherein the heat dissipation component comprises a shell and a heat sink, the chip and the built-in antenna are arranged on the circuit board, the circuit board, the chip and the built-in antenna are arranged in a cavity formed by the shell and the upper cover, and the upper cover is fixed to the shell.

[0016] As a preferred embodiment of the above solution, a second boss is provided on the inner wall of the upper cover, a second heat conducting member is provided on the second boss, and the second heat conducting member is closely attached to the circuit board corresponding to the chip. According to the above solution, the heat generated by the chip is transferred to the upper cover through the second heat conducting member, and then the heat is dissipated through the upper cover, which further improves the heat dissipation efficiency of the chip.

[0017] As a preferred embodiment of the above solution, a second sealing member is provided between the housing and the upper cover, and the second sealing member is provided around the circuit board. According to the above solution, the provision of the second sealing member improves the waterproof capability of the cavity formed by the housing and the upper cover.

[0018] A third aspect provides a vehicle comprising the above-mentioned vehicle-mounted device.

[0019] The vehicle-mounted device of the utility model is mounted on a vehicle, and the circuit board and the chip are responsible for processing signals, thereby realizing signal interactive control of the vehicle. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 This is a schematic diagram of a housing and an air-cooled heat sink in a first embodiment of the utility model;

[0022] Figure 2 This is a schematic diagram of the structure between the housing and the circuit board in the first embodiment of the utility model;

[0023] Figure 3 This is a schematic diagram of the inner wall structure of the housing of the first embodiment of the utility model;

[0024] Figure 4 This is a schematic diagram of the overall structure of the second embodiment of the present utility model;

[0025] Figure 5 This is a schematic diagram of the explosion structure of the second embodiment of the utility model;

[0026] Figure 6 This is a schematic diagram of the structure of the upper cover of the second embodiment of the utility model. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Embodiment 1

[0029] like Figures 1 to 3 As shown, the utility model provides a heat dissipation assembly, including a shell 1 and a heat sink, the shell 1 includes a metal part 11 and a plastic part 12, the metal part 11 corresponds to the chip 3, an installation groove 111 is provided on the outer wall of the metal part 11, the heat sink 5 is arranged in the installation groove 111, and the plastic part 12 corresponds to the built-in antenna 4. In this embodiment, the shell 1 is composed of half a metal part 11 and half a plastic part 12. The metal part 11 and the plastic part 12 are divided along the length direction of the shell 1. When making the shell 1, the metal part 11 is die-cast first, and then the metal part 11 is placed in the mold of the plastic part 12 after being formed, and injection molding is performed. The metal part 11 and the plastic part 12 are insert-molded, and staggered combination is adopted at the combined position to increase the bonding force. A part of the plastic part 12 corresponds to the built-in antenna 4, and a battery compartment 121 is provided on the outer wall of the other part. A battery (not shown) is arranged in the battery compartment 121, and a battery cover 6 is covered on the battery. The battery cover 6 is made of plastic material and can realize buffer protection for the battery. The plastic part 12 of the shell 1 will not affect the performance of the built-in antenna 4, and can realize buffer protection for the built-in antenna 4 and the battery. At the same time, the plastic part 12 is light in weight, which can reduce the weight of the entire shell 1.

[0030] The heat sink includes an air-cooled heat sink 5. The external air-cooled heat sink 5 can not only improve the heat dissipation efficiency of the chip 3, but also reduce water ingress and dust accumulation inside the housing 1. It has low noise, low inlet and outlet wind resistance, and a long service life of the air-cooled heat sink 5. The air-cooled heat sink 5 includes a fan 51 and a heat dissipation fin 52. The fan 51 and the heat dissipation fin 52 are arranged adjacent to each other. The fan 51 works in conjunction with the metal part 11 to dissipate heat from the chip 3. The heat dissipation fin 52 can increase the heat dissipation area and improve the heat dissipation capacity. In this embodiment, the fan 51 is fixed to the inner wall of the mounting groove 111 by screws, and a relatively long heat dissipation fin 52 is formed on the inner wall of the mounting groove 111. The air-cooled heat sink 5 also includes a fan cover 53, on which a fan slot 531 and a fin slot 532 are provided, the fan slot 531 corresponds to the fan 51, the fin slot 532 corresponds to the heat dissipation fin 52, and the fan cover 53 is fixed on the mounting slot 111. In this embodiment, the fan cover 53 is made of metal, and the high thermal conductivity of the metal material is conducive to heat dissipation. The fan cover 53 is fixed on the mounting slot 111 by screws, and the fan cover 53 covers the fan 51 and the heat dissipation fin 52. The fan cover 53 protects the fan 51 and the heat dissipation fin 52. The fan slot 531 and the fin slot 532 are provided so that the air in and out of the fan 51 is smooth when the fan 51 is working, and the fan 51 is combined with the heat dissipation fin 52 to form an air duct, and the heat generated by the chip 3 is taken away by the operation of the fan 51. A through hole 112 is provided on the inner wall of the mounting slot 111, and the through hole 112 is connected to the circuit board 2. The fan 51 is provided with a fan harness (not shown), which passes through the through hole 112 and is inserted into the connector on the circuit board 2, so that it is convenient to connect the fan harness on the production line. A groove 113 is provided on the inner wall of the mounting groove 111 around the through hole 112, and a first seal 71 is provided in the groove 113. The fan 51 is pressed against the through hole 112 and the first seal 71, and the bottom of the fan 51 is flat. The bottom of the fan 51 is pressed tightly against the first seal 71 to achieve waterproofing. The setting of the first seal 71 can prevent the accumulated water in the mounting groove 111 from penetrating into the housing 1 from the through hole 112, thereby improving the waterproof ability of the housing 1. The first seal 71 in this embodiment is a sealant, and the cross-sections of the through hole 112, the groove 113 and the fan 51 are all circular, and the cross-sectional circular diameters of the through hole 112, the groove 113 and the fan 51 increase successively.

[0031] The inner wall of the metal part 11 is provided with a first boss 114, and the first boss 114 is provided with a first heat conducting member 81, and the first heat conducting member 81 is close to the chip 3. The heat generated by the chip 3 is transferred to the metal part 11 through the first heat conducting member 81, and then the heat is transferred to the air with the air cooling heat sink 5, so that the heat dissipation efficiency of the chip 3 is improved. In this embodiment, the first heat conducting member 81 is a heat conductive glue.

[0032] The utility model sets a metal part 11 and a plastic part 12 in the shell 1, so that the chip 3 can dissipate heat through the metal part 11 when it is working, and the plastic part 12 will not affect the performance of the built-in antenna 4 when the built-in antenna 4 is working. An air-cooling heat sink 5 is set in the installation groove 111 of the outer wall of the metal part 11, which can not only improve the heat dissipation efficiency of the chip 3, but also reduce water ingress and dust accumulation in the shell 1. At the same time, the external air-cooling heat sink 5 has low noise and small inlet and outlet wind resistance. The service life of the air-cooling heat sink 5 is long, the total height of the shell 1 is not increased, and the entire shell 1 is small in size and light in weight.

[0033] Embodiment 2

[0034] like Figures 4 to 6 As shown, the utility model provides a vehicle-mounted device, which can be a vehicle-mounted control host or other vehicle-mounted equipment. Other vehicle-mounted equipment includes information navigation equipment, safety monitoring equipment, entertainment interconnection equipment, charging equipment, etc. The information navigation equipment includes a vehicle-mounted navigator, a driving recorder, a GPS navigator, etc. The safety monitoring equipment includes a reversing radar, a reversing image, a driving recorder, etc. The entertainment interconnection equipment includes a vehicle-mounted audio, a vehicle-mounted entertainment screen, a vehicle-mounted TV, etc. The charging equipment includes a vehicle-mounted charger, a vehicle-mounted power supply, etc. The vehicle-mounted device includes the above-mentioned heat dissipation component and a circuit board 2, a chip 3, a built-in antenna 4 and an upper cover 9, wherein the heat dissipation component includes a shell 1 and a heat sink, the chip 3 and the built-in antenna 4 are arranged on the circuit board 2, the circuit board 2, the chip 3 and the built-in antenna 4 are arranged in a cavity formed by the shell 1 and the upper cover 9, and the upper cover 9 is fixed on the shell 1.

[0035] In the electronic and electrical system of a vehicle, a circuit board 2 (PCB, PCBA) is usually required to implement some functions of vehicle signal interaction and processing. A chip 3 is provided on the circuit board 2. The chip 3 generates heat during operation and needs to be cooled. The heat dissipation component in this embodiment can effectively dissipate the heat of the chip 3 without affecting the performance of the built-in antenna 4.

[0036] A second boss 91 is provided on the inner wall of the upper cover 9, and a second heat-conducting member 82 is provided on the second boss 91. The second heat-conducting member 82 is close to the circuit board 2 corresponding to the chip 3. The chip 3 in this embodiment is a chip module, and the chip modules are distributed at different positions on the circuit board 2. The second heat-conducting member 82 is distributed corresponding to the chip module. The heat generated by the chip 3 is transferred to the upper cover 9 through the second heat-conducting member 82, and then the heat is dissipated through the upper cover 9, which further improves the heat dissipation efficiency of the chip 3. The second heat-conducting member 82 in this embodiment is a heat-conducting glue. A second sealing member 72 is provided between the shell 1 and the upper cover 9, and the second sealing member 72 is arranged around the circuit board 2. The setting of the second sealing member 72 improves the waterproof ability of the cavity composed of the shell 1 and the upper cover 9. The second sealing member 72 in this embodiment is a sealant.

[0037] When assembling the vehicle-mounted device of the utility model, firstly, sealant is applied to the groove 111 of the shell 1 and the position of the inner wall of the shell 1 corresponding to the upper cover 9, then the fan 51 is installed at the corresponding position of the installation groove 111, the fan wiring harness is arranged to pass the fan wiring harness through the through hole 112, the fan screw is locked, and then the fan cover 53 is installed, and the fan cover screw is locked. Then, thermal conductive glue is applied to the first boss 114 of the shell 1 and the second boss 91 of the upper cover 9, and the circuit board 2 is installed into the shell 1, and the chip 3 is close to the thermal conductive glue of the first boss 114. The fan wiring harness is inserted into the connector on the circuit board 2, and finally the upper cover 9 is installed on the shell 1, and the back of the circuit board 2 corresponding to the chip module is close to the thermal conductive glue of the second boss 91, and then the battery cover screw is locked to complete the assembly of the entire vehicle-mounted device.

[0038] Embodiment 3

[0039] The utility model provides a vehicle, comprising the above-mentioned vehicle-mounted device.

[0040] The vehicle-mounted device of the utility model is mounted on a vehicle, and the circuit board and the chip are responsible for processing signals, thereby realizing signal interactive control of the vehicle.

[0041] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present invention.

[0042] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A heat dissipation component, characterized in that: include: A housing, the housing comprising a metal part and a plastic part, the metal part corresponds to the chip and an outer wall of the metal part is provided with a mounting groove, the plastic part corresponds to the built-in antenna, wherein the chip and the built-in antenna are arranged on a circuit board in the housing; A heat sink is disposed in the mounting groove.

2. The heat dissipation assembly according to claim 1, characterized in that: The heat sink comprises an air-cooled heat sink, and the air-cooled heat sink comprises a fan and heat dissipation fins, wherein the fan and the heat dissipation fins are arranged adjacent to each other.

3. The heat dissipation assembly according to claim 2, characterized in that: The air-cooled heat sink also includes a fan cover plate, on which a fan slot and a fin slot are provided, the fan slot corresponds to the fan, the fin slot corresponds to the heat dissipation fin, and the fan cover plate is fixed on the mounting slot.

4. The heat dissipation assembly according to claim 2, characterized in that: A through hole is provided on the inner wall of the mounting groove, and the through hole is communicated with the circuit board.

5. The heat dissipation assembly according to claim 4, characterized in that: A groove is arranged on the inner wall of the mounting groove around the through hole, a first sealing member is arranged in the groove, and the fan is pressed against the through hole and the first sealing member.

6. The heat dissipation assembly according to claim 1, characterized in that: A first boss is disposed on the inner wall of the metal part, a first heat conducting member is disposed on the first boss, and the first heat conducting member is closely attached to the chip.

7. The heat dissipation assembly according to claim 1, characterized in that: The shell is composed of half of the metal part and half of the plastic part, and the metal part and the plastic part are divided along the length direction of the shell.

8. A vehicle-mounted device, characterized in that: It comprises a heat dissipation component as described in any one of claims 1 to 7, as well as a circuit board, a chip, a built-in antenna and an upper cover, wherein the heat dissipation component comprises a shell and a heat sink, the chip and the built-in antenna are arranged on the circuit board, the circuit board, the chip and the built-in antenna are arranged in a cavity formed by the shell and the upper cover, and the upper cover is fixed to the shell.

9. The vehicle-mounted device according to claim 8, characterized in that: A second boss is disposed on the inner wall of the upper cover, a second heat-conducting member is disposed on the second boss, and the second heat-conducting member is closely attached to the circuit board corresponding to the chip.

10. A vehicle, characterized in that: Comprising the vehicle-mounted device as described in any one of claims 8-9.

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