I-shaped intensive bus duct with high heat dissipation performance
By setting a heat conduction dissipation mechanism and graphite sheet inside the dense bus duct, the problems of low heat dissipation performance and unsolid connection fixation are solved, and the rapid cooling of the copper bar and the overall service life are improved.
Patent Information
- Application Number
- CN202420557141.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-21
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-03-21
AI Technical Summary
The existing intensive bus duct has low heat dissipation performance during use, resulting in high temperature of copper discharge, shortened service life, and unstable connections, making it difficult to operate.
Multiple heat conduction distributive mechanisms can be detached inside the dense busbar trough, and graphite sheets are arranged in the middle of two adjacent copper rows, so as to quickly absorb and export the heat generated by the copper rows with the heat conduction distributive mechanism.
It achieves rapid cooling of copper ducts, improves overall service life, and enhances the firmness and heat dissipation efficiency of the busbar duct.
Smart Images

Figure CN222763565U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of bus duct application, in particular to an I-type high-heat dissipation performance intensive bus duct. Background Art
[0002] In order to meet the needs of high-current low-voltage transmission lines in industrial and civil engineering construction, power distribution design adopts bus duct trunk system. In recent years, with the continuous increase in the capacity of transmission and distribution lines, bus duct trunk system has been widely used in engineering, and the structural design of bus duct products has also been gradually updated from air insulation type to dense insulation type, from steel plate shell to aluminum alloy shell. Bus duct is a closed metal device composed of copper and aluminum busbar columns. It is used to distribute large power to various components of the distributed system. It has increasingly replaced wires and cables in indoor low-voltage power transmission trunk engineering projects.
[0003] When manufacturing and processing the existing intensive bus duct, generally multiple parts are assembled on the outer aluminum alloy shell, so that the whole structure needs a large number of bolts to connect and fix during use, which makes the operation difficult and unstable. At the same time, the intensive bus duct will generate a lot of high temperature during long-term use. The traditional heat dissipation method only conducts heat through the extruded plates on both sides, which cannot dissipate the internal high temperature in a timely and effective manner, resulting in reduced heat dissipation performance, thereby reducing the service life of the entire bus duct. Therefore, the utility model proposes an I-type high heat dissipation performance intensive bus duct. Utility Model Content
[0004] The technical problem to be solved by the utility model is to provide an I-type high-heat dissipation performance intensive bus duct, by detachably arranging a plurality of heat-conducting dissipating mechanisms inside the intensive bus duct, so that the heat generated by the copper bar inside the bus duct can be quickly conducted and dissipated, so that the copper bar can be quickly cooled during use, and the overall service life is improved. At the same time, a graphite sheet is arranged between two adjacent copper bars, and the heat-conducting dissipating mechanisms are further cooperated to quickly absorb and conduct the heat generated by the copper bar, thereby achieving a high-performance heat dissipation effect.
[0005] In order to solve the above technical problems, a technical solution adopted by the utility model is: to provide an I-type high-heat dissipation performance intensive bus duct, including an I-type bus duct body, a plurality of installation grooves are evenly opened on both sides of the I-type bus duct body, and the interiors of the plurality of installation grooves are all snap-connected with heat dissipation mechanisms, and the two side walls of the I-type bus duct body are symmetrically and tightly provided with copper bars, and graphite heat sinks are tightly provided between two groups of the copper bars.
[0006] The utility model is further configured as follows: the heat dissipation mechanism includes two heat-conducting frames engaged in the mounting groove, both side walls of the two heat-conducting frames are fixedly connected with heat-conducting sheets, U-shaped grooves are provided on the side walls of the two heat-conducting frames that are far away from each other and close to the end faces, two sliding rods are slidably connected through the opposite end faces of the two heat-conducting frames and located at the U-shaped grooves, springs are sleeved on the outer walls of the two sliding rods near the end faces, the end faces of the two groups of springs are respectively tightly fitted with the inner walls of the two U-shaped grooves, and the end faces of the two heat-conducting frames that are far away from each other are fixedly connected with heat dissipation blocks.
[0007] Through the above technical solution, two heat-conducting frames are used to slide on the slide rod to squeeze the springs on both sides, so that the entire heat-conducting frame can be placed in the installation groove, and then the heat-conducting frame is loosened, and the elasticity of the internal spring is used to make the two heat-conducting frames slide relative to each other through the U-shaped groove, so that the heat dissipation block on the end surface is engaged in the first slot, and then the installation is completed, and the copper bars on both sides can quickly transfer the generated heat to the heat-conducting frame through the heat-conducting sheet, and then quickly dissipate it through multiple heat dissipation blocks, thereby improving the heat dissipation efficiency of the heat generated inside the copper bar.
[0008] The utility model is further configured as follows: the two heat-conducting frames have the same structure and are slidably arranged to cover each other through the U-shaped groove.
[0009] The above technical solution facilitates mutual sliding of the heat-conducting frames during installation, thereby facilitating adjustment of the heat-conducting dissipation mechanism to be installed, and further allowing the heat-conducting dissipation mechanism to be quickly and accurately installed inside the installation slot.
[0010] The utility model is further configured as follows: first card slots are provided at the tops and bottoms of the plurality of mounting slots, and the plurality of groups of first card slots penetrate the I-type bus trough body; the plurality of groups of heat dissipation blocks are respectively connected to the plurality of corresponding first card slots in a card-engaging manner, and penetrate the top and bottom of the I-type bus trough body through the plurality of groups of first card slots.
[0011] The above technical solution facilitates the positioning and engagement of the entire heat dissipation mechanism during installation, and the first card slot and the heat dissipation block are used for positioning, thereby facilitating rapid installation and subsequent disassembly of the heat dissipation mechanism.
[0012] The utility model is further configured as follows: two copper bars close to the I-type bus trough body are arranged in close contact with the side walls of the plurality of heat dissipation mechanisms.
[0013] Through the above technical solution, the heat generated by the copper busbar installed inside the entire bus duct can be quickly absorbed and transferred, preventing the heat generated by the internal copper busbar from being difficult to quickly remove, thereby improving the service life of the entire bus duct.
[0014] The utility model is further configured as follows: the tops and bottoms of the two graphite heat sinks are fixedly connected with a plurality of heat dissipation extension blocks, the tops and bottoms of the I-type busbar trough body and near the middle are provided with a plurality of second card slots, and are respectively connected with the plurality of heat dissipation extension blocks through the plurality of second card slots.
[0015] Through the above technical solution, the heat generated between the two copper bars can be quickly absorbed and transferred by utilizing the thermal conductivity of the graphite material itself, thereby quickly conducting the absorbed heat out, thereby improving the heat dissipation efficiency between the two copper bars.
[0016] The utility model is further configured as follows: the top and bottom of the I-type bus trough body and near the end surface are bolted with positioning mounting blocks, and the two groups of positioning mounting blocks at the top and bottom are bolted to the two extruded side panels, and the side walls away from the two extruded side panels are fixedly connected with a plurality of heat dissipation fins, and the cross-sections of the two groups of heat dissipation fins are arranged in an isosceles trapezoidal shape, and the end surfaces of the I-type bus trough body are respectively bolted with side connecting frames through positioning mounting block bolts.
[0017] Through the above technical scheme, the two sets of positioning and mounting blocks on the I-type bus trough body can be used to quickly bolt and fix the side connecting frame of the end face, and it is convenient to disassemble and replace it later. The multiple heat dissipating fins on the extruded side panel can absorb and dissipate the heat emitted by the internally bonded copper busbar, and the cross-section of the heat dissipating fin is arranged in an isosceles trapezoidal shape, which can gradually increase the space between adjacent heat dissipating fins, thereby facilitating the rapid dissipation of heat and improving the heat dissipation efficiency.
[0018] The beneficial effects of the utility model are as follows:
[0019] 1. The utility model proposes a high heat dissipation performance intensive bus duct with multiple heat dissipation mechanisms detachably arranged inside the intensive bus duct, so as to quickly conduct and dissipate the heat generated by the copper bar inside the bus duct, so that the copper bar can be quickly cooled during use, thereby improving the overall service life;
[0020] 2. The utility model proposes a high-performance intensive bus duct with high heat dissipation performance. A graphite sheet is arranged between two adjacent copper bars, and a heat conduction and dissipation mechanism is further used to quickly absorb and dissipate the heat generated by the copper bars, thereby achieving a high-performance heat dissipation effect;
[0021] 3. The utility model proposes a high heat dissipation performance intensive bus duct, which increases the firmness of the bus duct during installation and use by setting the bus duct shell as a whole. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1This is a schematic diagram of the overall structure of an industrial type high heat dissipation performance intensive bus duct of the utility model;
[0023] Figure 2 This is a structural diagram of an I-type bus trough body in an I-type high heat dissipation performance intensive bus trough of the utility model;
[0024] Figure 3 This is an exploded view of an industrial type high heat dissipation performance intensive bus duct of the utility model;
[0025] Figure 4 It is a partial cross-sectional view of an I-type high heat dissipation performance intensive bus duct of the utility model;
[0026] Figure 5 The utility model is a structural diagram of a heat dissipation mechanism in an industrial type high heat dissipation performance intensive bus duct.
[0027] In the figure: 1. I-type bus trough; 11. mounting slot; 12. first slot; 13. second slot; 2. heat dissipation mechanism; 21. heat conduction frame; 22. heat conduction sheet; 23. U-shaped slot; 24. slide bar; 25. spring; 26. heat sink; 3. copper busbar; 4. graphite heat sink; 41. heat sink extension block; 5. extruded side plate; 51. heat sink fin; 6. positioning mounting block; 7. side connecting frame. DETAILED DESCRIPTION
[0028] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.
[0029] like Figure 1-Figure 4 As shown, an I-type high heat dissipation performance intensive bus duct includes an I-type bus duct body 1, multiple installation grooves 11 are evenly penetrated on both sides of the I-type bus duct body 1, the tops and bottoms of the multiple installation grooves 11 are each provided with a first card slot 12, and multiple groups of first card slots 12 penetrate the I-type bus duct body 1, multiple groups of heat dissipation blocks 26 are respectively connected to the multiple groups of corresponding first card slots 12 in a card-engaged manner, and penetrate the top and bottom of the I-type bus duct body 1 through the multiple groups of first card slots 12, respectively, to facilitate the positioning and card engagement of the entire heat dissipation mechanism 2 when it is installed.
[0030] like Figure 3 and Figure 5As shown, the interiors of the plurality of mounting grooves 11 are all engaged with heat dissipation mechanisms 2, and the heat dissipation mechanisms 2 include two heat-conducting frames 21 engaged with the interiors of the mounting grooves 11. The two heat-conducting frames 21 have the same structure and are arranged to cover and slide with each other through the U-shaped grooves 23, which is convenient for mutual sliding when the heat-conducting frames 21 are installed, thereby facilitating the adjustment of the heat-conducting dissipation mechanisms 2 to be installed, and then quickly and accurately installing the heat-conducting dissipation mechanisms 2 in the interiors of the mounting grooves 11. The two side walls of the two heat-conducting frames 21 are fixedly connected with heat-conducting sheets 22, and the two heat-conducting frames 21 are provided with U-shaped grooves 23 at the side walls far away from each other and near the end faces. The opposite end faces of the two heat-conducting frames 21 are slidably connected with two sliding rods 24 at the U-shaped grooves 23, and the outer walls of the two sliding rods 24 are sleeved with springs 25 near the end faces, and the end faces of the two groups of springs 25 are respectively connected to the two U-shaped grooves 23. The inner wall of the heat conducting frame 21 is tightly fitted, and the two heat conducting frames 21 are used to slide on the slide bar 24, so as to squeeze the springs 25 on both sides, so that the entire heat conducting frame 21 can be placed in the interior of the installation groove 11, and then the heat conducting frame 21 is released, and the elasticity of the internal spring 25 is used to make the two heat conducting frames 21 slide relative to each other through the U-shaped groove 23, so that the heat dissipation block 26 on the end face is engaged with the interior of the first card slot 12, and then the installation is completed, and the copper bus 3 on both sides can quickly transfer the generated heat to the heat conducting frame 21 through the heat conducting sheet 22, and then quickly dissipate it through multiple heat dissipation blocks 26, thereby improving the dissipation efficiency of the heat generated inside the copper bus 3, and the end faces of the two heat conducting frames 21 that are far away from each other are fixedly connected with the heat dissipation block 26, and the first card slot 12 is used to be engaged and positioned with the heat dissipation block 26, so as to facilitate the rapid installation and later disassembly of the heat dissipation mechanism 2.
[0031] like Figure 4 As shown, copper bars 3 are symmetrically and tightly arranged on both side walls of the I-type bus trough body 1, and the two copper bars 3 close to the I-type bus trough body 1 are tightly arranged with the side walls of multiple heat dissipation mechanisms 2, so as to facilitate the rapid absorption and transfer of heat generated by the copper bars 3 installed inside the entire bus trough, prevent the heat generated by the internal copper bars 3 from being difficult to be quickly removed, and improve the service life of the entire bus trough.
[0032] like Figure 2-Figure 4 As shown, graphite heat sinks 4 are tightly fitted between the two groups of copper bars 3, and multiple heat dissipation extension blocks 41 are fixedly connected to the tops and bottoms of the two graphite heat sinks 4. Multiple second card slots 13 are opened on the top and bottom and near the middle of the I-type busbar trough body 1, and are respectively connected to the multiple heat dissipation extension blocks 41 in a card-engaged manner through the multiple second card slots 13. By utilizing the thermal conductivity of the graphite material itself, the heat generated between the two copper bars 3 can be quickly absorbed and transferred, so that the absorbed heat can be quickly exported, which can improve the heat dissipation efficiency between the two copper bars 3.
[0033] like Figure 2-Figure 4 As shown, the top and bottom of the I-type bus trough body 1 and near the end surface are bolted with positioning and mounting blocks 6, and the two groups of positioning and mounting blocks 6 at the top and bottom are bolted to the two extruded side panels 5, and the side walls away from each other of the two extruded side panels 5 are fixedly connected with a plurality of heat dissipating fins 51, and the cross-sections of the two groups of heat dissipating fins 51 are arranged in an isosceles trapezoidal shape, and the end surfaces of the I-type bus trough body 1 are bolted with side connecting frames 7 through the positioning and mounting blocks 6 respectively. The two groups of positioning and mounting blocks 6 on the I-type bus trough body 1 can be used to quickly bolt and fix the side connecting frames 7 on the end surfaces, and it is convenient to disassemble and replace them later. The multiple heat dissipating fins 51 on the extruded side panels 5 can absorb and dissipate the heat dissipated by the copper busbar 3 fitted inside, and the cross-section of the heat dissipating fins 51 is arranged in an isosceles trapezoidal shape, which can gradually increase the space between adjacent heat dissipating fins 51, thereby facilitating the rapid dissipation of heat and improving the heat dissipation efficiency.
[0034] When the utility model is used, firstly, multiple heat-conducting and heat-dissipating mechanisms 2 are installed inside the installation groove 11, and two heat-conducting frames 21 are used to slide on the slide bar 24, so as to squeeze the springs 25 on both sides, so that the entire heat-conducting frame 21 can be put into the interior of the installation groove 11, and then the heat-conducting frame 21 is loosened, and the elasticity of the internal spring 25 is used to make the two heat-conducting frames 21 slide relative to each other through the U-shaped groove 23, so that the heat-dissipating block 26 on the end face is engaged with the interior of the first card groove 12, so as to complete the installation, and then the internal copper bar 3 is tightly fixed. The side walls of the heat-conducting and heat-dissipating mechanism 2 are tightly pressed and fit closely with the heat-conducting sheet 22 to improve the heat dissipation efficiency of the high temperature generated inside. At the same time, graphite heat sinks 4 are placed between the two groups of copper bars 3, so that they are fixed with the second card slots 13 through the heat dissipation extension block 41, thereby quickly absorbing and transferring the heat generated between the copper bars 3, further improving the heat dissipation efficiency. Finally, the extruded side plates 5 on both sides are installed and fixed, and the internal heat dissipation structure is used to further absorb and dissipate the heat of the copper bars 3, which can improve the overall heat dissipation performance of the bus duct.
[0035] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.
Claims
1. An I-type high heat dissipation performance intensive bus duct, comprising an I-type bus duct body (1), characterized in that: A plurality of installation grooves (11) are evenly penetrated on both sides of the I-type bus trough body (1), and a heat dissipation mechanism (2) is snap-connected inside each of the plurality of installation grooves (11). Copper bars (3) are symmetrically and tightly fitted on both side walls of the I-type bus trough body (1), and graphite heat sinks (4) are tightly fitted between two groups of the copper bars (3) facing each other.
2. The high heat dissipation performance intensive bus duct according to claim 1 is characterized in that: The heat dissipation mechanism (2) comprises two heat-conducting frames (21) engaged in the installation groove (11), both side walls of the two heat-conducting frames (21) are fixedly connected with heat-conducting sheets (22), the two side walls of the two heat-conducting frames (21) are separated from each other and are close to the end faces thereof, U-shaped grooves (23) are provided on the side walls of the two heat-conducting frames (21) that are separated from each other and are close to the end faces thereof, two sliding rods (24) are slidably connected through the opposite end faces of the two heat-conducting frames (21) and are located at the U-shaped grooves (23), the outer walls of the two sliding rods (24) are sleeved with springs (25) near the end faces, the end faces of the two groups of springs (25) are respectively arranged to be tightly fitted with the inner walls of the two U-shaped grooves (23), and the end faces of the two heat-conducting frames (21) that are separated from each other are fixedly connected with heat-dissipating blocks (26).
3. The high heat dissipation performance intensive bus duct according to claim 2 is characterized in that: The two heat-conducting frames (21) have the same structure and are arranged to cover and slide with each other via a U-shaped groove (23).
4. The high heat dissipation performance intensive bus duct according to claim 2 is characterized in that: The tops and bottoms of the plurality of mounting slots (11) are each provided with a first card slot (12), and the plurality of groups of first card slots (12) penetrate the I-type bus trough body (1), and the plurality of groups of heat dissipation blocks (26) are respectively engaged with the plurality of corresponding groups of first card slots (12), and penetrate the top and bottom of the I-type bus trough body (1) through the plurality of groups of first card slots (12).
5. The I-type high heat dissipation performance intensive bus duct according to claim 1 is characterized in that: The two copper bars (3) close to the I-type bus trough body (1) are arranged to be tightly fitted with the side walls of the plurality of heat dissipation mechanisms (2).
6. The I-type high heat dissipation performance intensive bus duct according to claim 1 is characterized in that: The tops and bottoms of the two graphite heat sinks (4) are fixedly connected to a plurality of heat dissipation extension blocks (41); the tops and bottoms of the I-type busbar trough body (1) and near the middle thereof are provided with a plurality of second slots (13), which are respectively connected in a snap-fit manner to the plurality of heat dissipation extension blocks (41) via the plurality of second slots (13).
7. The I-type high heat dissipation performance intensive bus duct according to claim 1 is characterized in that: The top and bottom of the I-type bus trough body (1) and positions close to the end faces are both bolted with positioning mounting blocks (6), and the two groups of positioning mounting blocks (6) at the top and bottom are both bolted with the two extruded side panels (5), and the side walls of the two extruded side panels (5) that are far away from each other are both fixedly connected with a plurality of heat dissipation fins (51), and the cross-sections of the two groups of heat dissipation fins (51) are arranged in an isosceles trapezoidal shape, and the end faces of the I-type bus trough body (1) are respectively bolted with side connecting frames (7) via the positioning mounting blocks (6).