Circuit board assembly convenient for heat dissipation

Abstract

The utility model belongs to the technical field of circuit boards, and particularly relates to a circuit board assembly convenient for heat dissipation, which comprises a base body, an air inlet cover is arranged on the base body, a plurality of air inlets are formed in the side wall of the air inlet cover, a supporting notch is formed in the top of the air inlet cover, and a circuit board body is inserted into the supporting notch; the upper cover is arranged on the top of the base body in a covering mode, heat dissipation holes are formed in the upper cover, a heat dissipation fan is installed at the heat dissipation holes, and a plurality of through holes are formed in the circuit board body; the air inlet is formed in the side wall of the air inlet cover, air suction can be completed, air flow can be formed in cooperation with the heat dissipation holes in the top to actively dissipate heat of the circuit board body, the air flow flows through the through holes in the circuit board from the bottom of the circuit board body, and heat of devices on the circuit board body can be dissipated more effectively.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit boards, and in particular relates to a circuit board component which is convenient for heat dissipation. Background Art

[0002] The heat dissipation of the circuit board is usually achieved by installing a heat dissipation device on the circuit board or by dissipating the heat through the circuit board itself. The most widely used PCB materials are copper-clad / epoxy glass cloth substrates or phenolic resin glass cloth substrates, and a small amount of paper-based copper-clad materials are also used;

[0003] Although these substrates have excellent electrical and processing properties, they have poor heat dissipation. Existing circuit boards are usually mounted on a base, and heat dissipation fins are attached to components with high heat generation. However, a few components have high heat generation, and the attached heat dissipation fins cannot dissipate heat well.

[0004] Therefore, it is necessary to provide a circuit board assembly that is provided with active heat dissipation and is convenient for heat dissipation. Utility Model Content

[0005] The utility model aims to provide a circuit board component which is provided with active heat dissipation and is convenient for heat dissipation.

[0006] In order to solve the above technical problems, the utility model provides a circuit board assembly that is easy to dissipate heat, including: a base body, an air inlet cover is arranged on the base body, a plurality of air inlets are opened on the side wall of the air inlet cover, a support notch is opened on the top of the air inlet cover, and a circuit board body is inserted into the support notch; an upper cover, the upper cover is arranged on the top of the base body, a heat dissipation hole is opened on the upper cover, a heat dissipation fan is installed at the heat dissipation hole, and a plurality of through holes are opened on the circuit board body.

[0007] Preferably, the top surface of the base body is arranged in a shell-shaped manner, and the side walls of the base body are respectively provided with a pair of air inlet notches, and the air inlet cover is clamped in the air inlet notches.

[0008] Preferably, the air inlet gap extends out of both ends of the air inlet cover, and the air inlet is opened at the extended end of the air inlet cover.

[0009] Preferably, the other two side walls of the base body are provided with a plurality of connection notches, and connectors are arranged in the connection notches.

[0010] Preferably, the top and bottom of the connection notch are respectively provided with positioning grooves of different widths, and the top and bottom of the connector are respectively provided with positioning blocks adapted to the positioning grooves.

[0011] Preferably, a support platform is provided in the support notch, and the circuit board body is clamped on the top of the support platform.

[0012] Preferably, the heat dissipation hole is a circular through hole, and the heat dissipation fan is coaxially arranged with the heat dissipation hole.

[0013] Preferably, the upper cover of the cooling fan is provided with a protective cover, the protective cover is connected to the top of the upper cover, and a plurality of strip-shaped cooling grooves are formed on the top surface of the protective cover.

[0014] Preferably, the heat dissipation slots are arranged at an angle.

[0015] Preferably, a cover block is integrally provided at the bottom of the upper cover, and the cover block is clamped in the air inlet notch.

[0016] The beneficial effects of the utility model are:

[0017] 1. The air inlet cover can be installed through the base body, and a supporting notch is opened on the top of the air inlet cover to install the circuit board body;

[0018] 2. An air inlet is opened on the side wall of the air inlet cover to complete the air intake. Together with the heat dissipation holes on the top, an airflow can be formed to actively dissipate heat for the circuit board body. The airflow flows from the bottom of the circuit board body through the through holes on the circuit board, which can dissipate heat for the components on the circuit board body in a better way.

[0019] 3. By setting an upper cover on the top of the base body and opening heat dissipation holes on the upper cover, the air can be extracted in conjunction with a heat dissipation fan to form a heat dissipation airflow, and the structure is simple and reliable.

[0020] Other features and advantages of the present invention will be set forth in the following description, and in part will become apparent from the description, or may be understood by implementing the present invention.

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1It is a three-dimensional diagram of a preferred embodiment of the circuit board assembly of the utility model;

[0024] Figure 2 It is an exploded view of a preferred embodiment of the base body of the utility model;

[0025] Figure 3 It is an exploded view of a preferred embodiment of the air inlet cover and the circuit board body of the utility model;

[0026] Figure 4 It is an exploded view of a preferred embodiment of the upper cover of the utility model.

[0027] In the figure:

[0028] 000, circuit board body; 001, through hole;

[0029] 100, base body; 101, air inlet notch; 102, connection notch; 103, connector; 104, positioning groove; 105, positioning block;

[0030] 200, air inlet cover; 201, air inlet; 202, support gap; 203, support platform;

[0031] 300, upper cover; 301, heat dissipation hole; 302, heat dissipation fan; 303, protective cover; 304, heat dissipation slot; 305, cover setting block. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Example

[0033] like Figure 1-4As shown, a circuit board assembly that is easy to dissipate heat in this embodiment includes: a base body 100, an air inlet cover 200 is arranged on the base body 100, a plurality of air inlets 201 are opened on the side wall of the air inlet cover 200, a support notch 202 is opened on the top of the air inlet cover 200, and a circuit board body 000 is inserted into the support notch 202; an upper cover 300, the upper cover 300 is arranged on the top of the base body 100, a heat dissipation hole is opened on the upper cover 300, a heat dissipation fan 302 is installed at the heat dissipation hole, and a plurality of through holes 001 are opened on the circuit board body 000; in short, the air inlet cover 200 can be installed through the base body 100, and the support notch 202 is opened on the top of the air inlet cover 200, so as to complete the circuit The board body 000 is installed; further, an air inlet 201 is opened on the side wall of the air inlet cover 200 to complete the air intake, and together with the heat dissipation holes 301 on the top, an airflow can be formed to actively dissipate the heat of the circuit board body 000, and the airflow flows from the bottom of the circuit board body 000 through the through holes 001 on the circuit board, which can dissipate the heat of the components on the circuit board body 000 with better effect; further, by arranging an upper cover 300 on the top of the base body 100, and opening heat dissipation holes on the upper cover 300, together with the heat dissipation fan 302, air can be extracted to form a heat dissipation airflow, and the structure is simple and reliable; wherein, bolts are inserted at the bottom of the base body 100 to complete the connection of the air inlet cover 200, and the upper cover 300 is connected to the base body 100 by bolts.

[0034] The top surface of the base body 100 is arranged in a shell-drawing manner, and the side walls of the base body 100 are respectively provided with a pair of air inlet notches 101, and the air inlet cover 200 is clamped in the air inlet notches 101; in short, a chamber running through the top is provided on the base body 100, and the air inlet cover 200 can be installed inside the base body 100, so as to effectively protect the circuit board body 000 on the air inlet cover 200.

[0035] The air inlet gap 101 extends from both ends of the air inlet cover 200, and the air inlet port 201 is opened at the extended end of the air inlet cover 200; in short, the air inlet gap 101 is opened at the extended end of the air inlet cover 200, which can inhale air from the farther ends of the two ends of the base body 100 to improve the heat dissipation effect.

[0036] The other two side walls of the base body 100 are provided with a plurality of connection notches 102, and connectors 103 are arranged in the connection notches; in short, the connectors 103 are electrically connected to the output end of the circuit board body 000, so as to realize the connection between the circuit board body 000 and external devices.

[0037] The top and bottom of the connecting notch 102 are respectively provided with positioning grooves 104 of different widths, and the top and bottom of the connecting head 103 are respectively provided with positioning blocks 105 adapted to the positioning grooves 104; in short, the positioning grooves 104 of different widths can avoid the wrong direction when installing the connecting head 103.

[0038] A support platform 203 is provided in the support notch 202, and the circuit board body 000 is clamped on the top of the support platform 203; in short, the circuit board body 000 can be embedded in the support notch 202 through the support platform 203, and holes for inserting bolts (not shown in the figure) are provided on the circuit board body 000, and it is connected to the bottom of the support platform 203 through bolts.

[0039] The heat dissipation hole 301 is a circular through hole, and the heat dissipation fan 302 is coaxially arranged with the heat dissipation hole 301; in short, the diameter of the circular through hole is equal to the diameter of the blade of the heat dissipation fan 302, which can improve the exhaust efficiency of the heat dissipation fan 302 while ensuring the strength of the upper cover 300, thereby improving the heat dissipation effect.

[0040] The upper cover of the cooling fan 302 is provided with a protective cover 303, and the protective cover 303 is connected to the top of the upper cover 300, and a plurality of strip-shaped heat dissipation grooves 304 are opened on the top surface of the protective cover 303; the home appearance, through the setting of the strip-shaped grooves, can effectively prevent debris from falling and damaging the cooling fan 302.

[0041] The heat dissipation slots 304 are arranged at an angle; in short, the heat dissipation slots 304 are arranged at an angle so that the hot air flow can be directed to one side. When multiple groups of circuit board assemblies are arranged in an array, the hot air flow can be prevented from intersecting and generating turbulence, which will be re-absorbed into the circuit board assemblies.

[0042] The bottom of the upper cover 300 is integrally provided with a cover block 305, and the cover block 305 is clamped in the air inlet gap 101; in short, the area between the air inlet cover 200 and the upper cover 300 can be sealed by the cover block 305, so as to effectively protect the circuit board body 000.

[0043] All devices (parts without specific structure) selected in this application are universal standard parts or parts known to those skilled in the art, and their structures and principles can be known by those skilled in the art through technical manuals or conventional experimental methods. In addition, the software programs involved in this application are all prior art, and this application does not involve any improvement to the software programs.

[0044] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0046] Based on the above ideal embodiments of the utility model, the relevant staff can make various changes and modifications without deviating from the technical concept of the utility model through the above description. The technical scope of the utility model is not limited to the content of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A circuit board assembly that facilitates heat dissipation, characterized in that: include: A base body, wherein an air inlet cover is arranged on the base body, a plurality of air inlets are opened on the side wall of the air inlet cover, a support notch is opened on the top of the air inlet cover, and a circuit board body is inserted into the support notch; An upper cover, the upper cover is arranged on the top of the base body, the upper cover is provided with a heat dissipation hole, a heat dissipation fan is installed at the heat dissipation hole, and The circuit board body is provided with a plurality of through holes.

2. The circuit board assembly for facilitating heat dissipation as claimed in claim 1, characterized in that: The top surface of the base body is arranged in a shell-drawing manner, and the side walls of the base body are respectively provided with a pair of air inlet notches, and the air inlet cover is clamped in the air inlet notches.

3. The circuit board assembly for facilitating heat dissipation as claimed in claim 2, characterized in that: The two ends of the air inlet cover extend out of the air inlet notch, and the air inlet is opened at the extended end of the air inlet cover.

4. The circuit board assembly for facilitating heat dissipation as claimed in claim 3, characterized in that: The other two side walls of the base body are provided with a plurality of connection notches, and connection heads are arranged in the connection notches.

5. The circuit board assembly for facilitating heat dissipation as claimed in claim 4, characterized in that: The top and bottom of the connection notch are respectively provided with positioning grooves with different widths, and the top and bottom of the connector are respectively provided with positioning blocks adapted to the positioning grooves.

6. The circuit board assembly for facilitating heat dissipation as claimed in claim 5, characterized in that: A support platform is arranged in the support notch, and the circuit board body is clamped on the top of the support platform.

7. The circuit board assembly for facilitating heat dissipation as claimed in claim 6, characterized in that: The heat dissipation hole is a circular through hole, and the heat dissipation fan is coaxially arranged with the heat dissipation hole.

8. The circuit board assembly for facilitating heat dissipation as claimed in claim 7, characterized in that: The upper cover of the heat dissipation fan is provided with a protective cover, the protective cover is connected to the top of the upper cover, and a plurality of strip-shaped heat dissipation grooves are opened on the top surface of the protective cover.

9. The circuit board assembly for facilitating heat dissipation as claimed in claim 8, characterized in that: The heat dissipation slots are arranged obliquely.

10. The circuit board assembly for facilitating heat dissipation according to claim 9, characterized in that: A cover block is integrally arranged at the bottom of the upper cover, and the cover block is clamped in the air inlet notch.

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