Semiconductor process cavity
By designing filter boxes and multi-layer filter systems in the semiconductor process chamber, the problem of waste gas failure to be efficiently extracted and purified is solved, efficient filtration and purification of waste gas is achieved, and the safety and quality of equipment and products are improved.
Patent Information
- Application Number
- CN202421552837.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-03
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2034-07-03
AI Technical Summary
After the operation is completed, the existing semiconductor process chamber lacks a mechanism for efficient extraction and filtration purification of the waste gas generated in the cavity, resulting in the accumulation of waste gas, corroding equipment, affecting product quality and operator health, and seriously polluting the environment.
A semiconductor process chamber is designed, including a filter box, filter rack, filter mesh, fan and conduit. The exhaust gas is sucked in through the fan and filtered through four filter mesh with different functions (coarse-effect filter mesh, HEPA filter mesh, activated carbon filter mesh and acid mist filter mesh) to finally obtain the purified gas.
It realizes efficient filtration and purification of waste gas, reduces the impact of waste gas on the environment and personnel, extends the service life of the equipment, improves product quality and operation safety, and simplifies the disassembly and maintenance process of the filter.
Smart Images

Figure CN222765887U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor process chamber. Background Art
[0002] The semiconductor process chamber is a key device used in the semiconductor manufacturing process. It provides a controlled vacuum environment, allowing specific chemical reactions to be carried out under precisely controlled conditions. Its main functions include controlling the inflow of gaseous chemicals, maintaining a predetermined pressure in a vacuum environment, removing unwanted impurities, and controlling the heating and cooling of silicon wafers. These operations ensure that the manufacturing process of semiconductor devices can be carried out in an efficient, stable and clean environment, thereby ensuring the performance and quality of semiconductor devices.
[0003] After the operation is completed, the existing semiconductor process chamber lacks a mechanism for efficient extraction and filtration and purification of the waste gas generated inside the chamber. This defect may lead to serious consequences. First, failure to extract and purify the waste gas in time will cause a large amount of harmful gases and particles to accumulate in the process chamber. These pollutants will not only corrode the equipment and shorten its service life, but also have adverse effects on the subsequent semiconductor manufacturing process and reduce the performance and quality of the product. Secondly, the long-term accumulation of waste gas may also pose a threat to the health of operators. These waste gases may contain toxic substances. If they are directly discharged into the working environment without treatment, they will increase the risk of occupational diseases for employees and may even cause serious health problems. In addition, improper treatment of waste gas will also pollute the environment. The semiconductor process chamber is one of the important pollution sources in the semiconductor industry. If the waste gas generated by it is not effectively treated, it will aggravate the environmental pollution problem and is not conducive to sustainable development. Therefore, we propose a semiconductor process chamber. Utility Model Content
[0004] The utility model aims to provide a semiconductor process chamber to solve the problem mentioned in the above background technology that there is a lack of filtering and purifying the waste gas inside the semiconductor process chamber.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor process chamber, comprising a process chamber body, a filter box is arranged on one side of the process chamber body, four filter frames are arranged inside the filter box, and filter screens are fixedly installed on the inner walls of the four filter frames, a fan is fixedly installed on one side of the filter box, a bottom cover is arranged at one side of the bottom of the filter box, the bottom of the filter box is fixedly connected with fixed blocks on both sides corresponding to the bottom cover, and a card slot is opened on the opposite sides of the two fixed blocks, a screw rod is arranged at the center of the bottom cover, a card plate is arranged at both sides of the bottom cover, a shaft rod is fixedly connected to the center of the bottom of the bottom cover, the upper end of the shaft rod passes through the inside of the bottom cover, a gear is fixedly connected to the upper end of the shaft rod at the center position of the screw rod surface, the two gears are meshed and connected, a knob is fixedly installed on the lower end of the shaft rod, and a conduit is fixedly connected to the top of one side of the process chamber body, and one end of the conduit is fixedly connected to one side of the filter box.
[0006] Compared with the prior art, the beneficial effects of the utility model are:
[0007] The semiconductor process chamber is designed with a filter box, a filter frame, a filter screen, a fan and a duct. The duct is connected to the filter box. When exhaust gas needs to be discharged from the process chamber, the exhaust gas can be sucked into the filter box by starting the fan. Inside the filter box, the exhaust gas is filtered through four filters with different functions, and large particles of impurities, tiny particles, harmful gases and acidic substances in the exhaust gas are removed in turn to finally obtain purified gas. This multi-level filtering method can ensure the purification effect of the exhaust gas and effectively reduce the impact of the exhaust gas on the environment and personnel. The design of the bottom cover, the fixing block, the card slot, the screw rod, the card plate, the shaft rod, the gear and the knob can be used as required. To replace or clean the filter, the user only needs to rotate the knob to drive the shaft to rotate. The upper end of the shaft engages with the gear on the lead screw through the gear to achieve synchronous rotation. The rotation of the lead screw further causes the two clips threaded with it to move relative to or away from each other on the lead screw. Since the opposite sides of the clips cooperate with the slots, this movement will cause the clips to disengage or get stuck in the slots. When the clips are completely out of the slots, the connection between the bottom cover and the filter box is released, and the user can easily remove the bottom cover and the filter on it. This design not only simplifies the removal process of the filter, but also makes the cleaning and maintenance of the filter more efficient and convenient. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Figure 1 It is a schematic diagram of the structure of the utility model;
[0009] Figure 2 For this utility model Figure 1 A is a partial enlarged schematic diagram;
[0010] Figure 3 For this utility model Figure 1 A partial enlarged schematic diagram of B in the middle;
[0011] Figure 4 It is a structural stereogram of the pallet of the utility model.
[0012] In the figure: 1. process chamber body; 2. filter box; 3. filter frame; 4. filter screen; 5. fan; 6. bottom cover; 7. fixing block; 8. slot; 9. screw rod; 10. clamping plate; 11. threaded groove; 12. slide groove; 13. slider; 14. shaft rod; 15. gear; 16. knob; 17. plug plate; 18. slot; 19. exhaust groove; 20. duct. DETAILED DESCRIPTION
[0013] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0014] See also Figure 1-4 The utility model provides a technical solution: a semiconductor process chamber, including a process chamber body 1, a filter box 2 is arranged on one side of the process chamber body 1, four filter frames 3 are arranged inside the filter box 2, and filter screens 4 are fixedly installed on the inner walls of the four filter frames 3, a fan 5 is fixedly installed on one side of the filter box 2, a bottom cover 6 is arranged at one side of the bottom of the filter box 2, and the bottom of the filter box 2 is fixedly connected with fixed blocks 7 on both sides corresponding to the bottom cover 6, and a card slot 8 is opened on the opposite side of the two fixed blocks 7, a screw rod 9 is arranged at the center of the bottom cover 6, and a card plate 10 is arranged on both sides of the bottom cover 6, a shaft rod 14 is fixedly connected to the center of the bottom of the bottom cover 6, and the upper end of the shaft rod 14 passes through the inside of the bottom cover 6, and a gear 15 is fixedly connected to the upper end of the shaft rod 14 at the center position of the surface of the screw rod 9, and the two gears 15 are meshed and connected, and a knob 16 is fixedly installed on the lower end of the shaft rod 14, and a conduit 20 is fixedly connected to the top of one side of the process chamber body 1, and one end of the conduit 20 is fixedly connected to one side of the filter box 2.
[0015] From left to right, they are respectively a coarse filter, a HEPA filter, an activated carbon filter and an acid mist filter. This order of arrangement of the filters 4 ensures that after the exhaust gas enters the filter box 2, it first passes through the coarse filter to remove large particles of impurities, then passes through the HEPA filter to remove tiny particles, then the activated carbon filter absorbs harmful gases, and finally the acid mist filter removes acidic substances, thereby achieving multi-stage filtration of the exhaust gas and ensuring the purification effect.
[0016] The centers of the tops of the four filter frames 3 are fixedly connected with plug plates 17, and the inner top of the filter box 2 is provided with slots 18 corresponding to the upper ends of the four plug plates 17. The tops of the four plug plates 17 respectively penetrate into the interiors of the four slots 18 and are plugged into the inner walls of the slots 18, ensuring the stable installation of the filter frame 3 in the filter box 2, while facilitating the disassembly and replacement of the filter frame 3, and providing convenience for the maintenance of the filter screen 4.
[0017] A threaded groove 11 is provided in the center of the opposite side of the two clamping plates 10, and the two ends of the screw rod 9 respectively penetrate into the interior of the two threaded grooves 11 and are threadedly connected with the inner wall of the threaded groove 11, and the opposite sides of the two clamping plates 10 penetrate into the outside of the bottom cover 6 and are respectively clamped with the inner walls of the two clamping grooves 8. By rotating the screw rod 9 and utilizing the principle of thread transmission, the relative or opposite movement of the clamping plates 10 is achieved, thereby controlling the locking and unlocking between the bottom cover 6 and the filter box 2, which provides the possibility for quick disassembly and installation of the bottom cover 6 and the filter screen 4.
[0018] A sealing gasket is fixedly installed on the top of the bottom cover 6, and the top of the sealing gasket contacts the bottom of the filter box 2. The lower ends of the four filter frames 3 all penetrate to the outside of the filter box 2 and are fixedly connected to the top of the bottom cover 6. The setting of the sealing gasket ensures the sealing between the bottom cover 6 and the filter box 2 and prevents exhaust gas leakage.
[0019] Slide grooves 12 are provided on both sides of the top and bottom of the bottom cover 6, and sliders 13 are fixedly connected to one side of the top and bottom of the two plug plates 17. The tops and bottoms of the four sliders 13 arranged up and down are slidably connected to the inner walls of the four slide grooves 12 respectively, providing a stable guide for the plug plates 17 and ensuring the smooth movement of the plug plates 17 in the slots 18, further improving the convenience and stability of the installation of the filter frame 3.
[0020] A solenoid valve is fixedly installed at a center position on the surface of the conduit 20, and exhaust grooves 19 are provided at the top and bottom of one side of the filter box 2. The setting of the solenoid valve can control the discharge of exhaust gas as needed, thereby improving the flexibility and controllability of the system. The opening of the exhaust groove 19 ensures that the filtered purified gas can be smoothly discharged from the filter box 2, thereby realizing effective treatment of the exhaust gas.
[0021] When the exhaust gas generated inside the process chamber body 1 needs to be filtered through the filter box 2, under the operation of the fan 5, the exhaust gas first enters the filter box 2 through the conduit 20. At this time, according to the process requirements, the flow of the exhaust gas can be controlled by the solenoid valve. Inside the filter box 2, the exhaust gas passes through the filter screens 4 on the four filter frames 3 in sequence. These filter screens 4 are respectively a coarse filter screen, a HEPA filter screen, an activated carbon filter screen and an acid mist filter screen. The exhaust gas is firstly removed of large particle impurities by the coarse filter screen, and then passes through the HEPA filter screen to remove tiny particles, and then passes through the activated carbon filter screen to absorb harmful gases, and finally passes through the acid mist filter screen to remove acidic substances. When the filter screen 4 needs to be cleaned or replaced, it can be operated by rotating the knob 16. The knob 16 is connected to the shaft 14. The gear 15 at the upper end of the shaft 14 is meshed with the gear 15 on the screw rod 9. When the knob 16 is rotated, the screw rod 9 will rotate synchronously through the meshing action of the gear 15. Since the two ends of the screw rod 9 are threadedly connected with the threaded grooves 11 on the two clamping plates 10, the rotation of the screw rod 9 will drive the clamping plates 10 to move relative to or opposite to each other. When the clamping plates 10 are out of the clamping grooves 8, the locking state between the bottom cover 6 and the filter box 2 is released, and the bottom cover 6 and the filter screen 4 can be taken out of the filter box 2 for cleaning or replacement.
[0022] In summary: the semiconductor process chamber, through the design of the filter box 2, the filter frame 3, the filter screen 4, the fan 5 and the duct 20, the duct 20 is connected to the filter box 2. When the exhaust gas needs to be discharged from the process chamber, the exhaust gas can be sucked into the filter box 2 by starting the fan 5. Inside the filter box 2, the exhaust gas is filtered through four filter screens 4 with different functions, and large particles of impurities, tiny particles, harmful gases and acidic substances in the exhaust gas are removed in turn to finally obtain purified gas. This multi-level filtering method can ensure the purification effect of the exhaust gas and effectively reduce the impact of the exhaust gas on the environment and personnel. The design of the bottom cover 6, the fixing block 7, the slot 8, the screw rod 9, the card plate 10, the shaft rod 14, the gear 15 and the knob 16 is as follows: When replacing or cleaning the filter 4, the user only needs to rotate the knob 16 to drive the shaft 14 to rotate. The upper end of the shaft 14 meshes with the gear 15 on the screw rod 9 through the gear 15 to achieve synchronous rotation. The rotation of the screw rod 9 further causes the two clamping plates 10 threadedly connected thereto to move relative to or away from each other on the screw rod 9. Since the opposite sides of the clamping plates 10 cooperate with the slots 8, this movement will cause the clamping plates 10 to disengage from or engage in the slots 8. When the clamping plates 10 are completely disengaged from the slots 8, the connection between the bottom cover 6 and the filter box 2 is released, and the user can easily remove the bottom cover 6 and the filter 4 thereon together. This design not only simplifies the disassembly process of the filter 4, but also makes the cleaning and maintenance of the filter 4 more efficient and convenient.
[0023] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0024] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A semiconductor process chamber, comprising a process chamber body (1), characterized in that: A filter box (2) is arranged on one side of the process chamber body (1), four filter frames (3) are arranged inside the filter box (2), filter screens (4) are fixedly installed on the inner walls of the four filter frames (3), a fan (5) is fixedly installed on one side of the filter box (2), a bottom cover (6) is arranged at a position close to one side of the bottom of the filter box (2), fixed blocks (7) are fixedly connected to the bottom of the filter box (2) on both sides corresponding to the bottom cover (6), and slots (8) are provided on the opposite sides of the two fixed blocks (7), a screw rod (9) is arranged at the center of the bottom cover (6), and the bottom cover A clamping plate (10) is provided on both sides of the bottom cover (6), a shaft rod (14) is fixedly connected to the center of the bottom of the bottom cover (6), the upper end of the shaft rod (14) passes through the inside of the bottom cover (6), a gear (15) is fixedly connected to the center position of the surface of the screw rod (9) and the upper end of the shaft rod (14), the two gears (15) are meshingly connected, a knob (16) is fixedly installed on the lower end of the shaft rod (14), and a conduit (20) is fixedly connected to the top of one side of the process chamber body (1), and one end of the conduit (20) is fixedly connected to one side of the filter box (2).
2. A semiconductor process chamber according to claim 1, characterized in that: The four filters (4) are respectively a coarse filter, a HEPA filter, an activated carbon filter and an acid mist filter from left to right.
3. A semiconductor process chamber according to claim 1, characterized in that: The centers of the tops of the four filter frames (3) are fixedly connected with plug plates (17), and the inner top of the filter box (2) is provided with slots (18) corresponding to the upper ends of the four plug plates (17), and the tops of the four plug plates (17) respectively penetrate into the interiors of the four slots (18) and are plugged into the inner walls of the slots (18).
4. A semiconductor process chamber according to claim 1, characterized in that: A thread groove (11) is provided at the center of one side opposite to the other of the two clamping plates (10), and the two ends of the screw rod (9) respectively penetrate into the inside of the two thread grooves (11) and are threadedly connected with the inner wall of the thread groove (11), and the opposite sides of the two clamping plates (10) penetrate into the outside of the bottom cover (6) and are respectively clamped with the inner wall of the two clamping grooves (8).
5. A semiconductor process chamber according to claim 1, characterized in that: A sealing gasket is fixedly mounted on the top of the bottom cover (6), the top of the sealing gasket contacts the bottom of the filter box (2), and the lower ends of the four filter frames (3) all penetrate to the outside of the filter box (2) and are fixedly connected to the top of the bottom cover (6).
6. A semiconductor process chamber according to claim 1, characterized in that: Slide grooves (12) are provided on both sides of the top and bottom of the bottom cover (6), and sliders (13) are fixedly connected to one side of the top and bottom of the two plug plates (17). The tops and bottoms of the four sliders (13) arranged up and down are slidably connected to the inner walls of the four slide grooves (12) respectively.
7. A semiconductor process chamber according to claim 1, characterized in that: A solenoid valve is fixedly mounted at a center position on the surface of the conduit (20), and exhaust grooves (19) are provided at the top and bottom of one side of the filter box (2).