Edge polishing silicon wafer adsorption device

Abstract

The utility model relates to the technical field of silicon wafer adsorption equipment, in particular to an edge-polished silicon wafer adsorption device, which comprises a base, a sliding cylinder for supporting is assembled on the surface of the top end of the base, a ring sleeve for connection is screwed on the surface of the periphery of the sliding cylinder, and a sucker for adsorbing a silicon wafer is integrally constructed on the surface of the top end of the ring sleeve; when a piston on the inner side of a sliding cylinder is moved, a servo motor can operate and drive a worm on the inner side of a shell cover to rotate under the operation of a speed reducer, and the worm rotates to be meshed with a worm gear and drives the worm gear to rotate; the lifting displacement of the screw rod is convenient for pulling a piston on the inner side of a sliding barrel to move and generating negative pressure on the inner side of the sliding barrel, so that a silicon wafer placed on the surface of a suction cup can be tightly sucked and limited, the subsequent polishing work is convenient, the whole process is electrically operated, and the working efficiency is improved. More labor is saved, and convenience is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer adsorption equipment, in particular to an edge polished silicon wafer adsorption device. Background Art

[0002] Silicon wafers are often used in aviation, aerospace, industry, medicine, agriculture, home appliances and other fields. Chips made of silicon wafers are well-known "magic calculators" with amazing computing power. Silicon wafers need to be polished on their edges during processing to maintain the smoothness and flatness of the silicon wafers. Patent No. CN201920890979.2 discloses an edge-polished silicon wafer adsorption device, which presses the silicon wafer on the suction cup and pulls the connecting rod downward through the limit plate to move the sealing plug downward in the cylinder, and rotates the shaft to connect the card plate to the limit plate, so that negative pressure is formed inside the suction cup, and the silicon wafer is adsorbed on the device to maintain the fixed performance of the silicon wafer. However, when using the adsorption equipment to adsorb and limit the silicon wafer, the staff needs to manually pull the limit plate to make the suction cup suck and limit the silicon wafer, which is not convenient to operate. To this end, we propose an edge-polished silicon wafer adsorption device. Utility Model Content

[0003] In view of the problems in the prior art, the utility model provides an edge polishing silicon wafer adsorption device.

[0004] The technical solution adopted by the utility model to solve the technical problem is an edge polished silicon wafer adsorption device, comprising a base, a slide cylinder for support is mounted on the top surface of the base, and a ring sleeve for connection is screwed on the outer peripheral surface of the slide cylinder, a suction cup for silicon wafer adsorption is integrally constructed on the top surface of the ring sleeve, and a piston for adsorbing silicon wafer is slidably mounted on the inner side of the slide cylinder;

[0005] The bottom surface of the piston is equipped with a screw for adjustment, the bottom surface of the base is equipped with a disc seat for sealing through bolts, and the bottom surface of the disc seat is rotatably equipped with a worm gear threadedly connected to the screw, the bottom surface of the base is equipped with a shell cover for worm gear protection through bolts, and a worm meshing with the worm gear is rotatably installed inside the shell cover, the outer wall surface of the shell cover is equipped with a reducer transmission-connected to the worm through bolts, and a servo motor is equipped at the power input end of the reducer.

[0006] By adopting the above technical solution, before polishing the edge of the silicon wafer, it is convenient to place the silicon wafer on the surface of the suction cup on the top surface of the non-slip cylinder on the top of the base, and the suction cup is screwed together with the sliding cylinder by the ring sleeve, which is convenient for disassembly and replacement of the suction cup, and convenient for replacing different suction cups according to silicon wafers of different specifications, and then the piston inside the sliding cylinder is lowered to generate negative pressure inside the sliding cylinder, and then the silicon wafer can be adsorbed through the suction hole on the top of the sliding cylinder and the suction cup, so that it is convenient to suck and limit it, and it is convenient to polish the edge of the silicon wafer stably later;

[0007] When the piston on the inner side of the slide cylinder is moved, the servo motor can be operated and the worm on the inner side of the shell cover can be driven to rotate under the operation of the reducer. The worm rotates and meshes with the worm wheel and drives the worm wheel to rotate. Since the lead screw cannot rotate, the thread on the inner periphery of the worm wheel and the lead screw are screwed together to make it perform lifting and displacement movements. The lifting and displacement of the lead screw facilitates the movement of the piston on the inner side of the slide cylinder and the generation of negative pressure on the inner side of the slide cylinder, thereby sucking and limiting the silicon wafer placed on the surface of the suction cup, facilitating the subsequent polishing work. The whole process is electric-operated, which is more labor-saving and convenient.

[0008] Specifically, the outer peripheral surface of the screw rod is provided with arc grooves for connection, and there are multiple groups of arc grooves. The inner side of the disc seat is equipped with sliding sleeves that fit and connect with the arc grooves.

[0009] By adopting the above technical solution, the protrusion on the inner circumference of the sleeve and the arc groove on the surface of the screw rod are fitted and connected with each other, so that the screw rod cannot rotate, and the screw rod and the thread on the inner circumference of the worm wheel are screwed together to facilitate lifting and lowering movements.

[0010] Specifically, a rubber pad for protection is bonded to the top surface of the suction cup.

[0011] By adopting the above technical solution, the rubber pad has certain insulation and elasticity, so that the silicon wafer can be stably placed on the surface of the suction cup and is convenient for subsequent polishing.

[0012] Specifically, a spring located on the outer periphery of the screw rod is installed inside the slide cylinder.

[0013] By adopting the above technical solution, the spring can easily provide buffering when the piston inside the slide cylinder descends.

[0014] Specifically, the outer peripheral surface of the ring sleeve is provided with concave holes for rotation, and there are multiple groups of concave holes.

[0015] By adopting the above technical solution, the concave hole makes it easier for the ring sleeve to rotate.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] 1. The technical solution of the present application, through the design of the slide cylinder, the ring sleeve, the suction cup and the piston, makes it convenient to place the silicon wafer on the surface of the suction cup on the top surface of the non-slide cylinder on the top of the base before polishing the edge of the silicon wafer. The suction cup is threadedly connected to the slide cylinder by the ring sleeve, which is convenient for disassembly, assembly and replacement of the suction cup, and convenient for replacing different suction cups according to silicon wafers of different specifications. Subsequently, the piston on the inner side of the slide cylinder is lowered to generate negative pressure on the inner side of the slide cylinder, and then the silicon wafer can be adsorbed through the suction holes on the top of the slide cylinder and the suction cup, so that it is convenient to suck and limit it, and facilitate the subsequent stable polishing of the edge of the silicon wafer.

[0018] 2. The technical solution of the present application, through the design of a lead screw, a disc seat, a worm gear, a worm, a shell cover, a reducer and a servo motor, can enable the servo motor to operate and drive the worm on the inside of the shell cover to rotate under the operation of the reducer when the piston on the inner side of the slide cylinder is moved. The worm rotates and meshes with the worm gear and drives the worm gear to rotate. Since the lead screw cannot rotate, the thread on the inner circumference of the worm gear and the lead screw are screwed together to make it perform a lifting and displacement movement. The lifting and displacement of the lead screw facilitates the movement of the piston on the inner side of the slide cylinder and the generation of negative pressure on the inner side of the slide cylinder, so that the silicon wafer placed on the surface of the suction cup can be sucked and limited, which is convenient for subsequent polishing work. The entire process is electric-operated, which is more labor-saving and convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0020] Figure 1 It is an axonometric drawing of the utility model;

[0021] Figure 2 It is a schematic cross-sectional view of the inner structure of the slide cylinder of the utility model;

[0022] Figure 3 It is an exploded view of the connection structure between the screw rod and the disc seat of the utility model;

[0023] In the figure: 1. base; 2. slide; 3. ring sleeve; 4. suction cup; 5. piston; 6. screw; 7. disc seat; 8. worm gear; 9. shell cover; 10. worm; 11. reducer; 12. servo motor; 13. arc groove; 14. slide sleeve; 15. spring; 16. rubber pad; 17. concave hole. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0025] See also Figure 1-3The embodiment of the utility model provides a technical solution: an edge polished silicon wafer adsorption device, comprising a base 1, a slide cylinder 2 for support is mounted on the top surface of the base 1, and a ring sleeve 3 for connection is screwed and installed on the outer peripheral surface of the slide cylinder 2, a suction cup 4 for silicon wafer adsorption is integrally constructed on the top surface of the ring sleeve 3, and a piston 5 for adsorbing silicon wafers is slidably installed on the inner side of the slide cylinder 2; a screw rod 6 for adjustment is mounted on the bottom surface of the piston 5, a disk seat 7 for blocking is mounted on the bottom surface of the base 1 through bolts, and a worm wheel 8 screwed and connected to the screw rod 6 is rotatably mounted on the bottom surface of the disk seat 7, a shell cover 9 for protecting the worm wheel 8 is mounted on the bottom surface of the base 1 through bolts, and a worm 10 meshing with the worm wheel 8 is rotatably mounted on the inner side of the shell cover 9, a reducer 11 transmission-connected to the worm 10 is mounted on the outer wall surface of the shell cover 9 through bolts, and a servo motor 12 is mounted on the power input end of the reducer 11.

[0026] When in use, before polishing the edge of the silicon wafer, it is convenient to place the silicon wafer on the surface of the suction cup 4 on the top surface of the non-sliding cylinder 2 on the top of the base 1, and the suction cup 4 is screwed together with the sliding cylinder 2 by the ring sleeve 3, so that the suction cup 4 can be disassembled and replaced, and different suction cups 4 can be replaced according to silicon wafers of different specifications. Then, the piston 5 inside the sliding cylinder 2 is lowered to generate negative pressure inside the sliding cylinder 2, and then the silicon wafer can be adsorbed through the suction holes on the top of the sliding cylinder 2 and the suction cup 4, so that it is convenient to suck and limit it, so that the edge of the silicon wafer can be polished stably later;

[0027] When the piston 5 on the inner side of the slide 2 is moved, the servo motor 12 can be operated and the worm 10 on the inner side of the shell cover 9 can be driven to rotate under the operation of the reducer 11. The worm 10 rotates and meshes with the worm wheel 8 and drives the worm wheel 8 to rotate. Since the lead screw 6 cannot rotate, the thread on the inner circumference of the worm wheel 8 is screwed with the lead screw 6 to make it perform lifting and displacement movements. The lifting and displacement of the lead screw 6 facilitates the pulling of the piston 5 on the inner side of the slide 2 to move and the generation of negative pressure on the inner side of the slide 2, so that the silicon wafer placed on the surface of the suction cup 4 can be sucked and limited, which is convenient for subsequent polishing work. The whole process is electric operation, which is more labor-saving and convenient.

[0028] like Figure 3 As shown, the outer surface of the screw rod 6 is provided with arc grooves 13 for connection, and there are multiple groups of arc grooves 13 , and the inner side of the disc seat 7 is equipped with a sliding sleeve 14 that fits and connects with the arc grooves 13 .

[0029] When in use, the protrusion on the inner circumference of the sliding sleeve 14 and the arc groove 13 on the surface of the screw rod 6 fit together, so that the screw rod 6 cannot rotate, and the screw rod 6 and the threads on the inner circumference of the worm wheel 8 are screwed together to facilitate lifting and lowering movements.

[0030] like Figure 1 and Figure 2 As shown, a protective rubber pad 16 is bonded to the top surface of the suction cup 4 .

[0031] When in use, the rubber pad 16 has certain insulation and elasticity, so that the silicon wafer can be stably placed on the surface of the suction cup 4 and is convenient for subsequent polishing.

[0032] like Figure 2 As shown, a spring 15 located on the outer periphery of the screw rod 6 is installed inside the slide cylinder 2 .

[0033] When in use, the spring 15 is convenient for providing buffering when the piston 5 inside the slide cylinder 2 descends.

[0034] like Figure 2 As shown, the outer circumferential surface of the ring sleeve 3 is provided with concave holes 17 for rotation, and there are multiple groups of concave holes 17.

[0035] When in use, the recessed hole 17 makes it easier for the ring sleeve 3 to rotate.

[0036] The working principle and use process of the utility model are as follows: when in use, first install the corresponding structural components in the appropriate position, and before polishing the edge of the silicon wafer, it is convenient to place the silicon wafer on the surface of the suction cup 4 on the top surface of the non-sliding cylinder 2 on the top of the base 1, and the suction cup 4 is screwed together with the sliding cylinder 2 by the ring sleeve 3, so that the suction cup 4 can be disassembled and replaced, and different suction cups 4 can be replaced according to silicon wafers of different specifications. Then, the piston 5 inside the sliding cylinder 2 is lowered to generate negative pressure inside the sliding cylinder 2, and then the silicon wafer can be adsorbed through the suction holes on the top of the sliding cylinder 2 and the suction cup 4, so that it is convenient to suck and limit it, so that the edge of the silicon wafer can be polished stably later, and at the same time, when the piston 5 inside the sliding cylinder 2 is moved, The servo motor 12 can be operated and drive the worm 10 inside the shell cover 9 to rotate under the operation of the reducer 11. The worm 10 rotates and meshes with the worm wheel 8 to drive the worm wheel 8 to rotate. Since the screw rod 6 cannot rotate, the thread on the inner circumference of the worm wheel 8 is screwed with the screw rod 6 to make it move up and down. The lifting and displacement of the screw rod 6 facilitates the pulling of the piston 5 inside the slide cylinder 2 to move and the generation of negative pressure inside the slide cylinder 2. A hole is reserved at the bottom of the shell cover 9 for the screw rod 6 to pass through when it is lifted and displaced, so that the screw rod 6 can be lifted and moved stably, and then the silicon wafer placed on the surface of the suction cup 4 can be sucked and limited, which is convenient for subsequent polishing work. The whole process is electric operation, which is more labor-saving and convenient.

[0037] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions in the specification are only to illustrate the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the protection required by the utility model. The scope of protection required by the utility model is defined by the attached claims and their equivalents.

Claims

1. An edge polished silicon wafer adsorption device, characterized in that: The invention comprises a base (1), the top surface of the base (1) is equipped with a slide cylinder (2) for support, the outer peripheral surface of the slide cylinder (2) is threadedly mounted with a ring sleeve (3) for connection, the top surface of the ring sleeve (3) is integrally constructed with a suction cup (4) for adsorbing silicon wafers, and a piston (5) for adsorbing silicon wafers is slidably mounted inside the slide cylinder (2); The bottom surface of the piston (5) is equipped with a screw (6) for adjustment, the bottom surface of the base (1) is equipped with a disc seat (7) for sealing by bolts, and a worm gear (8) threadedly connected to the screw (6) is rotatably mounted on the bottom surface of the disc seat (7), the bottom surface of the base (1) is equipped with a shell cover (9) for protecting the worm gear (8) by bolts, and a worm (10) meshingly connected to the worm gear (8) is rotatably mounted inside the shell cover (9), and a reducer (11) transmission-connected to the worm gear (10) is equipped with a reducer (11) on the outer wall surface of the shell cover (9) by bolts, and a servo motor (12) is mounted on the power input end of the reducer (11).

2. The edge polished silicon wafer adsorption device according to claim 1, characterized in that: The outer peripheral surface of the screw rod (6) is provided with an arc groove (13) for connection, and there are multiple groups of arc grooves (13). The inner side of the disc seat (7) is equipped with a sliding sleeve (14) that is matched and connected with the arc groove (13).

3. The edge polished silicon wafer adsorption device according to claim 1, characterized in that: A rubber pad (16) for protection is bonded to the top surface of the suction cup (4).

4. The edge polished silicon wafer adsorption device according to claim 1, characterized in that: The inner side of the slide cylinder (2) is equipped with a spring (15) located on the outer periphery of the screw rod (6).

5. The edge polished silicon wafer adsorption device according to claim 1, characterized in that: The outer peripheral surface of the ring sleeve (3) is provided with concave holes (17) for rotation, and there are multiple groups of concave holes (17).

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