Dust-free paper with thermal insulation layer on surface

Abstract

The utility model provides dust-free paper with a heat preservation layer on the surface, which comprises a dust-free paper layer, the heat preservation layer and an aluminized film layer, the heat preservation layer is arranged on the lower surface of the dust-free paper layer, a fiber layer is arranged between the aluminized film layer and the heat preservation layer, and a heat blocking layer is embedded in the fiber layer. According to the dust-free paper, the heat preservation layer and the heat blocking layer are arranged, the heat preservation layer conducts heat preservation on an object to a certain degree, the heat blocking layer can block heat exchange between the object and the outside to a certain degree, the fiber layer can adsorb water vapor in the dust-free paper, and therefore the dust-free paper is good in heat preservation effect. The dust-free paper layer is kept in a dry state, mold on the surface of the dust-free paper due to the fact that the dust-free paper is in a wet state for a long time is avoided, meanwhile, a channel can be provided for discharging moisture in the dust-free paper through the arrangement of the moisture guiding holes, and therefore the situation that the overall structure of the dust-free paper is damaged due to excessive moisture accumulation on the fiber layer is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of nonwoven fabrics, in particular to dust-free paper with a heat-insulating layer on the surface. Background Art

[0002] Due to its unique physical properties, such as high elasticity, softness, strong water absorption and good water retention, dust-free paper is widely used in the fields of sanitary care products, special medical products, industrial wiping products, etc. However, traditional dust-free paper has poor thermal insulation performance and cannot meet the demand for thermal insulation performance in specific environments. Therefore, the development of a thermal insulation dust-free paper has practical application value and market prospects.

[0003] In the public document with publication number CN212073189U, a sterilized dust-free paper is disclosed, wherein a water absorption cavity is arranged inside the dust-free paper wrapping layer, water absorption cotton is arranged inside the water absorption cavity, a water absorption port 1 is arranged above the dust-free paper wrapping layer, a waterproof and breathable membrane is arranged around the outer wall of the dust-free paper wrapping layer, a water absorption port 2 corresponding to the water absorption port 1 is arranged above the waterproof and breathable membrane, an adhesion layer 1 is arranged above the waterproof and breathable membrane, an adhesion layer 2 is arranged below the waterproof and breathable membrane, silver ion antibacterial fiber is arranged above the adhesion layer 1, dust-free paper is arranged above the silver ion antibacterial fiber, a wear-resistant layer is arranged below the adhesion layer 2, and wear-resistant bumps are arranged below the wear-resistant layer.

[0004] The beneficial effects of the above technology are that by arranging silver ion antibacterial fibers, the silver ion antibacterial fibers are arranged into cross-connected parallelograms so that they have good ductility, and absorbent cotton and antistatic particles are arranged so that they have good water absorption and prevent static electricity, but the performance in terms of thermal insulation is still somewhat lacking.

[0005] However, the current thermal insulation dust-free paper is mainly composed of a multi-layer structure for insulation. When facing some special application scenarios, due to the material factors of the dust-free paper, the dust-free paper will absorb some water vapor in the air. The water vapor accumulates and contacts with the insulation layer and other internal structures through the holes of the fiber mesh, making the internal environment of the dust-free paper in a moist state. Under this condition, long-term use of the dust-free paper may cause the surface of the dust-free paper to mold, resulting in hygiene problems with the dust-free paper. Utility Model Content

[0006] In view of the technical defects existing in the background technology, the utility model proposes a dust-free paper with a heat-insulating layer on the surface, which solves the above technical problems and meets the actual needs. The specific technical solution is as follows:

[0007] A dust-free paper with a thermal insulation layer on its surface comprises a dust-free paper layer, a thermal insulation layer and an aluminized film layer, wherein the thermal insulation layer is arranged on the lower surface of the dust-free paper layer, a fiber layer is arranged between the aluminized film layer and the thermal insulation layer, a thermal barrier layer is embedded in the fiber layer, and the aluminized film layer and the thermal barrier layer are provided with moisture-conducting holes penetrating along the thickness direction.

[0008] Furthermore, the thermal insulation layer is a non-woven fabric with a thickness of 0.1-0.2 mm, and the thermal insulation layer is selected from any one of PP non-woven fabric, meltblown non-woven fabric, and spunlace non-woven fabric.

[0009] Furthermore, the fiber layer between the dust-free paper layer and the thermal insulation layer is in a grid structure, the fiber layer, the dust-free paper layer and the thermal insulation layer are bonded by an adhesive, the fiber layer is woven with a plurality of hygroscopic fibers, and the hygroscopic fibers are selected from any one of bamboo carbon fiber, vinylon fiber and cotton fiber.

[0010] Furthermore, the mesh structure of the fiber layer is filled with heat-insulating material to form a heat-blocking insulation layer, and the heat-insulating material is selected from any one of hollow glass beads, basalt, white jade, sepiolite, and perlite.

[0011] Furthermore, the moisture conducting holes are evenly distributed on the surface of the aluminum-plated film layer, and the diameter of the moisture conducting holes is 0.01-0.02 mm.

[0012] Furthermore, one end of the moisture conducting hole is arranged on the lower surface of the aluminum-plated film layer, and the other end of the moisture conducting hole is connected to the thermal insulation layer.

[0013] Furthermore, the heat-blocking layer is bonded to the thermal insulation layer and the aluminum-plated film layer by an adhesive.

[0014] Beneficial effects of the utility model:

[0015] By setting up the thermal insulation layer and the heat barrier layer, the thermal insulation layer can insulate the object to a certain extent, and the heat barrier layer can block the heat exchange between the object and the outside world to a certain extent, which can better prevent heat loss and maintain temperature stability. The thermal insulation layer can better improve the use efficiency of dust-free paper, enhance the thermal insulation performance of dust-free paper, and further enhance the practicality of dust-free paper. Moreover, the fiber layer can absorb the water vapor inside the dust-free paper to keep the dust-free paper layer dry at all times, avoiding the formation of mold on the surface of the dust-free paper due to being in a wet state for a long time, which can effectively improve product quality and extend the service life of the product. At the same time, the setting of the moisture-conducting holes can provide a channel for the evaporation of moisture inside the dust-free paper, thereby avoiding excessive accumulation of moisture in the fiber layer and destroying the overall structure of the dust-free paper. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a partial structural schematic diagram of the utility model.

[0017] Figure 2 This is a schematic diagram of the structure of the fiber layer and the heat barrier layer of the utility model.

[0018] In the figure: dust-free paper layer 1, thermal insulation layer 2, thermal barrier layer 3, aluminized film layer 4, moisture-conducting holes 5, and fiber layer 6. DETAILED DESCRIPTION

[0019] The implementation methods of the present invention are described below in conjunction with the accompanying drawings and relevant embodiments. It should be pointed out that the following relevant embodiments are only preferred embodiments for better illustrating the present invention itself, and the implementation methods of the present invention are not limited to the following embodiments, and the present invention involves relevant necessary components in this technical field, which should be regarded as the known technology in this technical field and can be known and mastered by the technical personnel in this technical field.

[0020] like Figure 1 and Figure 2 As shown, the utility model proposes a dust-free paper with a thermal insulation layer on the surface, comprising a dust-free paper layer 1, a thermal insulation layer 2 and an aluminum-plated film layer 4, the thermal insulation layer 2 is arranged on the lower surface of the dust-free paper layer 1, a fiber layer 6 is provided between the aluminum-plated film layer 4 and the thermal insulation layer 2, a thermal barrier layer 3 is embedded in the fiber layer 6, and the aluminum-plated film layer 4 and the thermal barrier layer 3 are provided with moisture-conducting holes 5 penetrating along the thickness direction.

[0021] The dust-free paper of the utility model has good thermal insulation and heat preservation performance in structure. The dust-free paper layer 1 is used as the base layer, and the heat preservation layer 2 is arranged underneath to provide a stable heat preservation effect. The heat preservation layer 2 is made of non-woven fabric, and the heat preservation function itself has a heat preservation function, which further enhances the overall heat preservation performance of the dust-free paper. At the same time, the heat-blocking layer 3 embedded in the fiber layer 6 is formed by filling the grid structure of the fiber layer 6 with heat-insulating material, constructing an effective thermal barrier, effectively blocking the transfer of heat, and effectively improving the heat insulation performance of the dust-free paper. The grid structure of the fiber layer 6 and its hygroscopic fibers not only enhance the stability of the dust-free paper structure, but also improve the moisture absorption and air permeability of the product. The moisture-conducting holes 5 are evenly distributed on the aluminum-plated film layer 4 and penetrate into the heat-blocking layer 3, thereby effectively promoting the rapid discharge of moisture and avoiding the problem of affecting the heat preservation effect and comfort due to moisture accumulation.

[0022] As a preferred embodiment of the present invention, the thermal insulation layer 2 is a non-woven fabric with a thickness of 0.1-0.2 mm, and the thermal insulation layer 2 is selected from any one of PP non-woven fabric, meltblown non-woven fabric, and spunlace non-woven fabric.

[0023] The thermal insulation layer 2 has good thermal insulation performance, and also has certain flexibility and durability, which can effectively reduce heat loss. The material of the thermal insulation layer 2 is preferably spunlace non-woven fabric with a thickness of 0.2 mm. The spunlace non-woven fabric can effectively reduce heat loss and improve the overall thermal insulation effect of the dust-free paper due to the tight entanglement and mesh structure between the internal fibers. At the same time, the bonding force between the internal fibers of the spunlace non-woven fabric is strong, thereby improving the strength and stability of the spunlace non-woven fabric, so that the spunlace non-woven fabric can better resist the influence of external stress when used as the thermal insulation layer 2, and maintain the stability of the shape and performance of the dust-free paper. In addition, the spunlace non-woven fabric has good hygroscopicity and can quickly absorb and transfer moisture to the fiber layer 6 to keep the surface of the dust-free paper dry.

[0024] As a preferred embodiment of the utility model, the fiber layer 6 between the dust-free paper layer 1 and the thermal insulation layer 2 has a grid structure, and the fiber layer 6 is bonded to the dust-free paper layer 1 and the thermal insulation layer 2 by an adhesive. The fiber layer 6 is woven with a plurality of hygroscopic fibers, and the hygroscopic fibers are selected from any one of bamboo carbon fibers, vinylon fibers and cotton fibers.

[0025] The fiber layer 6 is bonded to the dust-free paper layer 1 and the thermal insulation layer 2 by hot melt adhesive. The fiber layer 6 is woven with a plurality of hygroscopic fibers. The hygroscopic fibers are preferably bamboo charcoal fibers. The surface of the bamboo charcoal fibers has a honeycomb microporous structure, which makes the bamboo charcoal fibers have strong moisture absorption capacity and can quickly attract moisture inside the dust-free paper into the fiber layer 6, thereby keeping the dust-free paper layer 1 dry. At the same time, the bamboo carbon fiber also has excellent antibacterial function, which can effectively inhibit bacterial growth, thereby avoiding the possibility of dust-free paper becoming mildewed in a humid state to a certain extent.

[0026] During weaving, the selected bamboo charcoal fibers are pre-treated by washing, drying and cutting to ensure the cleanliness of the bamboo charcoal fibers and a length suitable for weaving. A carding machine is used to card the treated bamboo charcoal fibers so that the bamboo charcoal fibers are arranged neatly and decomposed into single strands along a certain direction. The carded bamboo charcoal fibers are woven through a weaving machine, interwoven and fixed according to a preset grid structure to form a square grid structure. After weaving, the grid structure is reinforced, which can be reinforced by chemical bonding, thermal bonding and other methods to enhance the strength and stability of the grid structure.

[0027] As a preferred embodiment of the utility model, the mesh structure of the fiber layer 6 is filled with heat insulating material to form a heat-blocking insulation layer 3, and the heat insulating material is selected from any one of hollow glass beads, basalt, white jade, sepiolite, and perlite.

[0028] The thermal insulation material is preferably hollow glass beads with a particle size of 50-100 microns. The hollow glass beads contain air inside, which makes them have a lower thermal conductivity, so that the thermal barrier layer 3 can effectively block the transfer of heat, thereby forming a thermal insulation barrier in the dust-free paper. At the same time, the hollow structure of the hollow glass beads makes them extremely low in density and relatively large in volume, which helps to reduce the weight of the entire dust-free paper.

[0029] When constructing the interlocking structure of the fiber layer 6 and the thermal barrier layer 3, the fiber layer 6 woven with bamboo carbon fiber is first bonded to the surface of the aluminum-plated film layer 4 by hot-melt adhesive, and then the hollow glass beads are evenly sprinkled on the surface of the fiber layer 6 to fill the grid structure of the constructed fiber layer 6, thereby forming the thermal barrier layer 3. During the bonding process, since the hot-melt adhesive is in a hardened state and still has a certain degree of viscosity, the fiber layer 6 can be turned over at this time so that the side with the hollow glass beads faces downward, and then the excess hollow glass beads are shaken off by shaking or vibrating, thereby completing the construction of the fiber layer 6 and the thermal barrier layer 3.

[0030] As a preferred embodiment of the utility model, the moisture conducting holes 5 are evenly distributed on the surface of the aluminum-plated film layer 4, and the diameter of the moisture conducting holes 5 is 0.01-0.02 mm. One end of the moisture conducting holes 5 is arranged on the lower surface of the aluminum-plated film layer 4, and the other end of the moisture conducting holes 5 is connected to the thermal insulation layer 3.

[0031] The diameter of the moisture-conducting holes 5 is preferably 0.02 mm. The moisture-conducting holes 5 allow air circulation and enhance air permeability while maintaining a certain thermal insulation performance of the dust-free paper. When the dust-free paper encounters moisture during use, the moisture-conducting holes 5 can serve as a channel for moisture discharge, quickly guiding the moisture in the fiber layer 6 to the thermal barrier layer 3 and diffusing it outward, thereby keeping the surface of the dust-free paper dry and avoiding moisture accumulation inside the dust-free paper. Although the main function of the moisture-conducting holes 5 is not to directly regulate the temperature, they can affect the path and efficiency of heat conduction to a certain extent. The inside of the moisture-conducting holes 5 is air, and air has a low thermal conductivity and poor heat transfer capacity. By reasonably designing the distribution and size of the moisture-conducting holes 5, the thermal conduction resistance of the dust-free paper can be increased to a certain extent, thereby effectively increasing the overall thermal insulation effect of the dust-free paper.

[0032] As a preferred embodiment of the present invention, the thermal barrier layer 3 is bonded to the thermal insulation layer 2 and the aluminum-plated film layer 4 by an adhesive; the hierarchical structures of the dust-free paper are bonded by hot-melt adhesive. When making the dust-free paper, the fiber layer 6 woven with bamboo carbon fiber is first bonded to the upper surface of the aluminum-plated film layer 4, and then hollow glass beads are filled in the grid of the fiber layer 6 to form a thermal barrier layer 3. After the hot-melt adhesive is cured, a punching device is used to punch holes upward from the lower surface of the aluminum-plated film layer 4, and moisture-conducting holes 5 are punched in the thermal barrier layer 3 and the aluminum-plated film layer 4. Then, hot-melt adhesive is used to bond the thermal insulation layer 2 and the dust-free paper layer 1 on the upper surfaces of the thermal barrier layer 3 and the fiber layer 6 in turn, thereby obtaining the dust-free paper of the present invention.

[0033] The aluminized film layer 4 in the dust-free paper structure has good barrier properties. The aluminized film layer 4 is coated with an extremely thin layer of metal aluminum on its surface, which can enhance the barrier properties of the dust-free paper and effectively block the penetration of gas, water vapor and part of the light into the dust-free paper. Therefore, when the dust-free paper is used to wrap objects, the objects inside the dust-free paper are protected from the influence of the external environment. At the same time, the aluminized film layer 4 is tightly combined with the fiber layer 6 and the thermal barrier layer 3, and is bonded by an adhesive, thereby enhancing the overall structural stability of the dust-free paper, so that the dust-free paper can resist external pressure and impact during use and maintain its integrity and functionality.

[0034] During use, the dust-free paper can be directly adhered to or wrapped around objects. The dust-free paper layer 1, the thermal insulation layer 2 and the aluminum-coated film layer 4 in the dust-free paper structure are all highly flexible and have a good bonding effect. They can easily and conveniently cover objects and keep the objects warm, so that the temperature of the objects is constant within a certain range and the temperature change of the objects is reduced. The fiber layer 6 can effectively absorb and transfer moisture to keep the surface of the thermal insulation dust-free paper dry, thereby reducing the problem of mold on the thermal insulation dust-free paper due to excessive water vapor and increasing the service life of the thermal insulation dust-free paper.

[0035] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A dust-free paper having a heat-insulating layer on the surface, characterized in that: The invention comprises a dust-free paper layer (1), a heat-insulating layer (2) and an aluminized film layer (4), wherein the heat-insulating layer (2) is arranged on the lower surface of the dust-free paper layer (1), a fiber layer (6) is arranged between the aluminized film layer (4) and the heat-insulating layer (2), a heat-blocking layer (3) is embedded in the fiber layer (6), and the aluminized film layer (4) and the heat-blocking layer (3) are provided with moisture-conducting holes (5) penetrating along the thickness direction.

2. The dust-free paper having a heat-insulating layer on the surface according to claim 1, characterized in that: The thermal insulation layer (2) is a non-woven fabric with a thickness of 0.1-0.2 mm. The thermal insulation layer (2) is selected from any one of PP non-woven fabric, meltblown non-woven fabric, and spunlace non-woven fabric.

3. The dust-free paper having a heat-insulating layer on the surface according to claim 1, characterized in that: The fiber layer (6) between the dust-free paper layer (1) and the thermal insulation layer (2) presents a grid-like structure, the fiber layer (6) is bonded to the dust-free paper layer (1) and the thermal insulation layer (2) by an adhesive, the fiber layer (6) is woven from a plurality of hygroscopic fibers, and the hygroscopic fibers are selected from any one of bamboo carbon fibers, vinylon fibers and cotton fibers.

4. The dust-free paper having a heat-insulating layer on the surface according to claim 1, characterized in that: The mesh structure of the fiber layer (6) is filled with a heat insulating material to form a heat-blocking insulation layer (3), wherein the heat insulating material is selected from any one of hollow glass beads, basalt, white jade, sepiolite, and perlite.

5. The dust-free paper having a heat-insulating layer on the surface according to claim 1, characterized in that: The moisture conducting holes (5) are evenly distributed on the surface of the aluminum-plated film layer (4), and the diameter of the moisture conducting holes (5) is 0.01-0.02 mm.

6. The dust-free paper having a heat-insulating layer on the surface according to claim 5, characterized in that: One end of the moisture conducting hole (5) is arranged on the lower surface of the aluminum-plated film layer (4), and the other end of the moisture conducting hole (5) is connected to the heat-blocking layer (3).

7. The dust-free paper having a heat-insulating layer on the surface according to claim 1, characterized in that: The heat-blocking layer (3) is bonded to the thermal insulation layer (2) and the aluminum-plated film layer (4) by an adhesive.

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