Non-contact digital infrared temperature sensor

Abstract

The utility model discloses a non-contact digital infrared temperature sensor. The infrared thermopile temperature sensor at least comprises a TO base, an infrared thermopile temperature sensing chip and a signal conditioning chip which are packaged on the TO base, and a TO tube cap which realizes packaging with the TO base, and the infrared thermopile temperature sensing chip and the signal conditioning chip are positioned in an accommodating space formed by the TO tube cap and the TO base. Temperature changes are detected through the infrared thermopile temperature sensing chip, detected signals are processed and converted through the signal conditioning chip, and finally accurate digital temperature signals are output. The non-contact digital infrared temperature sensor adopts the cone-like TO tube cap design, so that the sensor is smaller in size, and meanwhile, high performance and reliability are kept. In addition, the built-in signal conditioning chip can realize the conditioning calibration of the temperature of the target object, and the anti-electromagnetic interference capability and reliability are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature measurement, and more specifically to a non-contact digital infrared temperature sensor. Background Art

[0002] With the rapid development of science and technology, especially in the fields of industrial automation, smart home, medical health, etc., higher requirements are put forward for the accuracy and convenience of temperature monitoring. The traditional contact temperature measurement method has gradually failed to meet the needs of modern applications due to its limitations such as possible damage to the surface of the object being measured, the risk of cross contamination, and structural design defects. Therefore, non-contact infrared temperature sensor technology came into being and has been widely used, becoming an important innovation in the field of modern temperature measurement.

[0003] In recent years, infrared temperature measurement technology has become a dominant technology in the field of temperature detection due to its non-invasive, fast response and long-distance measurement advantages. In particular, with the advancement of semiconductor technology, optical design, and signal processing algorithms, the performance of non-contact infrared temperature sensors has been significantly improved. In order to achieve miniaturization of sensor structure and anti-electromagnetic interference, digital infrared temperature sensors packaged in TO39 or TO46 are gradually commercialized. Traditional TO46 or TO39 structure packaged non-contact digital infrared temperature sensors usually adopt a cylindrical shell structure, which may affect its adaptability to different groups of people in some cases. For example, when measuring the body temperature of children or infants, because their ears are relatively small, the use of traditional cylindrical shell structures may result in inaccurate measurement results and inconvenience caused to users by size deviations, limiting its scope of application.

[0004] Therefore, how to provide a miniaturized non-contact digital infrared temperature sensor structure has become an urgent problem to be solved. Utility Model Content

[0005] The utility model provides a non-contact digital infrared temperature sensor. It is used to solve the problem that the infrared temperature sensor in the prior art may use a traditional cylindrical tube shell structure, which may lead to inaccurate measurement results and dimensional deviation. The preferred technical solution among the many technical solutions provided by the utility model can produce many technical effects as described below.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] The utility model provides a non-contact digital infrared temperature sensor, which at least comprises:

[0008] TO base;

[0009] An infrared thermopile temperature sensor chip and a signal conditioning chip packaged on the TO base;

[0010] A TO tube cap is packaged with the TO base; the TO tube cap and the TO base form a receiving space; the infrared thermopile temperature sensor chip and the signal conditioning chip are located in the receiving space.

[0011] Optionally, the TO tube cap is a conical tube shell structure; the cross-section of the TO tube cap is trapezoidal; and the cross-section of the TO base is rectangular.

[0012] Optionally, the cross-sections of the TO base and the TO tube cap are in a stepped structure; the lower base length of the trapezoidal cross-section corresponding to the TO tube cap is smaller than the cross-section length corresponding to the TO base.

[0013] Optional, non-contact digital infrared temperature sensor also includes:

[0014] Infrared filter;

[0015] The infrared filter is arranged on the top of the TO tube cap as an optical window, and is used for filtering and receiving infrared light.

[0016] Optionally, the signal conditioning chip is connected to the infrared thermopile temperature sensor chip, and the signal conditioning chip is used to enable the infrared thermopile temperature sensor chip to condition and calibrate the temperature of the target object.

[0017] Optionally, the TO cap is welded to the TO base to achieve airtight packaging.

[0018] Optional, non-contact digital infrared temperature sensor also includes:

[0019] Multiple pins;

[0020] The plurality of pins are arranged on the lower surface of the TO base, and are used to connect various structures and external devices in the non-contact digital infrared temperature sensor to output a processed digital temperature signal.

[0021] Optionally, the infrared thermopile temperature sensor chip is used to receive infrared light through the infrared filter, detect temperature changes of the target object, and transmit the detected temperature change signal to the signal conditioning chip.

[0022] Optionally, the signal conditioning chip is used to process and convert the received temperature change signal, generate the digital temperature signal, and output it through the multiple pins.

[0023] Compared with the prior art, in the technical solution provided by the utility model, the non-contact digital infrared temperature sensor at least includes a TO base, an infrared thermopile temperature sensor chip and a signal conditioning chip packaged on the TO base, and a TO cap packaged with the TO base; the infrared thermopile temperature sensor chip and the signal conditioning chip are located in the accommodation space formed by the TO cap and the TO base. The temperature change is detected by the infrared thermopile temperature sensor chip, and the detected signal is processed and converted by the signal conditioning chip, and finally an accurate digital temperature signal is output. The non-contact digital infrared temperature sensor adopts a conical TO cap design, which makes the sensor smaller while maintaining high performance and reliability. In addition, the built-in signal conditioning chip can realize the conditioning and calibration of the temperature of the target object, improve the anti-electromagnetic interference ability and reliability, and the built-in signal conditioning chip can also reduce the overall size of the non-contact digital infrared temperature sensor. The non-contact digital infrared temperature sensor provided by the utility model is suitable for use in occasions where high-precision temperature measurement is required. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 A cross-sectional view of the non-contact digital infrared temperature sensor provided by the utility model;

[0026] Figure 2 This is a structural schematic diagram of the non-contact digital infrared temperature sensor provided by the utility model.

[0027] Reference numerals:

[0028] 1-TO base; 2-infrared thermopile temperature sensor chip; 3-signal conditioning chip; 4-TO cap; 5-infrared filter; 6-pin. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the utility model.

[0030] The non-contact digital infrared temperature sensor provided by the utility model is mainly used in the field of temperature measurement, such as human body temperature measurement, especially for infants and young children. When measuring the body temperature of children or infants, due to their relatively small ears, the use of a traditional cylindrical shell structure may lead to inaccurate measurement results and inconvenience caused by size deviation to the user, limiting its application range. Therefore, a miniaturized non-contact digital infrared temperature sensor structure is proposed to effectively expand its application field.

[0031] The following is an explanation of the embodiments with reference to the accompanying drawings. In addition, the embodiments shown below do not limit the contents of the utility model described in the claims. In addition, the entire contents of the structures represented by the following embodiments are not limited to the solutions required as the utility model described in the claims.

[0032] Figure 1 A cross-sectional view of the non-contact digital infrared temperature sensor provided by the utility model; Figure 2 This is a schematic diagram of the structure of the non-contact digital infrared temperature sensor provided by the utility model. Figure 1 and Figure 2 As shown, the non-contact digital infrared temperature sensor provided by the utility model may at least include:

[0033] TO base 1;

[0034] An infrared thermopile temperature sensor chip 2 and a signal conditioning chip 3 packaged on the TO base 1;

[0035] A TO tube cap 4 is packaged with the TO base 1; the TO tube cap 4 and the TO base 1 form a receiving space; the infrared thermopile temperature sensor chip 2 and the signal conditioning chip 3 are located in the receiving space.

[0036] Among them, the TO (Transistor Outline) base of the infrared sensor is a packaging and mounting standard specially designed for semiconductor devices, especially for optoelectronic devices such as infrared sensors. The TO base 1 is usually made of ceramic or metal materials, and is designed to accommodate and protect the infrared sensor chip while providing electrical connection to the external circuit. In the application of infrared sensors, the TO base 1 defines the physical size, pin arrangement and packaging method of the sensor. Since the infrared sensor may generate heat when working, the design of the TO base 1 usually takes into account the thermal conductivity, which helps to dissipate the heat generated by the sensor chip and ensure its stable operation. The TO base 1 ensures that the sensor is firmly mounted on the final product or circuit board, reducing the impact of vibration or external force on the sensor performance. In addition, an electrical path is provided from the sensor chip to the external circuit board, usually achieved through pins or solder balls, to ensure the stability and reliability of signal transmission.

[0037] The infrared thermopile temperature sensing chip 2 may be located at the bottom of the non-contact digital infrared temperature sensor, that is, disposed on the TO base 1, for directly contacting the target object and detecting the temperature change of the target object.

[0038] The signal conditioning circuit, the bottom of the non-contact digital infrared temperature sensor, is arranged on the TO base 1 and is connected to the infrared thermopile temperature sensor chip 2 to process and convert the temperature change signal detected by the infrared thermopile temperature sensor chip 2.

[0039] The TO cap 4 is welded to the TO base 1 to form an airtight package, which is located between the infrared filter 5 and the signal conditioning circuit to protect the internal components from environmental influences. When the TO cap 4 is covered on the TO base 1, the TO cap 4 can cover the infrared thermopile temperature sensor chip 2 and the signal conditioning chip 3.

[0040] Figure 1 and Figure 2 In addition to the above structure, it also includes an infrared filter 5 and a plurality of pins 6;

[0041] The infrared filter 5 is an optical element, which is mainly used to control the passage of a specific wavelength band in the spectrum, while blocking or weakening the light of other wavelength bands. Specifically, the infrared filter 5 has the main function of allowing the light in the visible light region to pass through, while effectively blocking or weakening the light in the infrared light region.

[0042] The infrared filter 5 is arranged on the top of the TO tube cap 4 as an optical window to filter and receive infrared light. The infrared filter 5 receives infrared light signals, the infrared thermopile temperature sensor chip 2 detects the temperature change of the target object, the signal conditioning circuit processes and converts the detected signal, and outputs an accurate digital temperature signal through pin 6.

[0043] The plurality of pins 6 are disposed on the lower surface of the TO base 1 and are used to connect various structures in the non-contact digital infrared temperature sensor and external devices to output processed digital temperature signals.

[0044] The utility model provides Figure 1 and Figure 2The structure of the non-contact digital infrared temperature sensor at least includes a TO base 1, an infrared thermopile temperature sensor chip 2 and a signal conditioning chip 3 packaged on the TO base 1, and a TO cap 4 packaged with the TO base 1; the infrared thermopile temperature sensor chip 2 and the signal conditioning chip 3 are located in the accommodation space formed by the TO cap 4 and the TO base 1. The temperature change is detected by the infrared thermopile temperature sensor chip 2, and the detected signal is processed and converted by the signal conditioning chip 3, and finally an accurate digital temperature signal is output. The non-contact digital infrared temperature sensor adopts a conical TO cap design, which makes the sensor smaller while maintaining high performance and reliability. In addition, the built-in signal conditioning chip 3 can realize the conditioning and calibration of the temperature of the target object, improve the anti-electromagnetic interference ability and reliability, and the built-in signal conditioning chip 3 can also reduce the overall size of the non-contact digital infrared temperature sensor. The non-contact digital infrared temperature sensor provided by the utility model is suitable for use in occasions where high-precision temperature measurement is required.

[0045] Next, for Figure 1 and Figure 2 The specific implementation scheme corresponding to the provided structure is described in detail:

[0046] Optionally, the TO cap 4 is a conical shell structure; the cross section of the TO cap 4 is a trapezoid; the cross section of the TO base 1 is a rectangle. The cross sections of the TO base 1 and the TO cap 4 are stepped structures; the lower base length of the cross section trapezoid corresponding to the TO cap 4 is less than the cross section length corresponding to the TO base 1.

[0047] like Figure 1 , the cross section of the TO tube cap 4 is a trapezoid. At this time, the structure of the non-contact digital infrared temperature sensor is as follows Figure 1 and 2 As shown, specifically, in practical applications, the size of the TO cap 4 can be adjusted for different needs, as long as the length of the lower base of the cross-sectional trapezoid corresponding to the TO cap 4 is smaller than the length of the cross-sectional area corresponding to the TO base 1. For example, the upper base size of the cross-sectional area of ​​the TO cap 4 can be further reduced to meet the needs of people with relatively small ears.

[0048] Optionally, the signal conditioning chip 3 is connected to the infrared thermopile temperature sensor chip 2 , and the signal conditioning chip 3 is used to implement the conditioning and calibration of the infrared thermopile temperature sensor chip 2 on the temperature of the target object.

[0049] Optionally, the TO cap 4 is welded to the TO base 1 to achieve airtight packaging.

[0050] Optionally, the non-contact digital infrared temperature sensor may also include:

[0051] Multiple pins 6;

[0052] The plurality of pins 6 are arranged on the lower surface of the TO base 1, and are used to connect the various structures and external devices in the non-contact digital infrared temperature sensor to output the processed digital temperature signal. The various components are connected through the plurality of pins 6 to form a complete sensor system. The number of pins 6 can be set according to the actual application requirements.

[0053] Optionally, the infrared thermopile temperature sensor chip 2 is used to receive infrared light through the infrared filter 5, detect the temperature change of the target object, and transmit the detected temperature change signal to the signal conditioning chip 3. The signal conditioning circuit can realize the conditioning and calibration of the temperature of the target object, further improving the performance and application range of the sensor.

[0054] Optionally, the signal conditioning chip 3 is used to process and convert the received temperature change signal, generate the digital temperature signal, and output it through the multiple pins 6.

[0055] The utility model proposes a miniaturized non-contact digital infrared temperature sensor structure with a TO-shaped structure package, specifically, a non-contact digital infrared temperature sensor with a conical TO shell structure, which is smaller than the TO46 shell. The conical TO cap with an infrared filter 5 optical window is welded to the TO base 1 to achieve airtight packaging, and the built-in signal conditioning circuit realizes the conditioning and calibration of the target object temperature by the thermopile sensor chip, so that the sensor outputs an accurate digital temperature signal, thereby achieving anti-electromagnetic interference and improving reliability.

[0056] The utility model proposes a miniaturized non-contact digital infrared temperature sensor with a conical TO shell structure. The beneficial effects of the structure may include:

[0057] 1) The traditional cylindrical shell is changed to a conical design, the size is further reduced, and the TO base is also further reduced than the TO46 base, thereby reducing the overall volume of the sensor, thus better adapting to the needs of different groups of people.

[0058] 2) At the same time, the TO material system can still be used, and the existing mature TO welding process can still be used for packaging. The TO material system can still use the current mature TO packaging process, and the process is mature.

[0059] 3) Compared with the prior art, the technical solution provided by the utility model uses a TO tube shell to encapsulate the temperature sensor chip and the conditioning circuit chip inside, and the conditioning and calibration of the analog temperature signal are realized inside, and the digital temperature signal is directly output. Through the cooperation of the infrared filter 5 and the infrared thermopile temperature sensor chip 2, the temperature of the target object is accurately measured.

[0060] 4) The signal conditioning circuit improves the sensor's anti-electromagnetic interference capability and reliability, and ensures the stability and accuracy of the output signal.

[0061] 5) The hermetic packaging achieved by the conical TO cap protects the internal components from environmental influences and increases the service life of the sensor.

[0062] 6) The signal conditioning circuit can realize the calibration of the temperature of the target object, further improving the performance and application range of the sensor; reducing the volume of the sensor structure, expanding the application range, achieving a wider measurement application range and a more user-friendly experience, which is especially suitable for temperature monitoring of different groups such as adults and children.

[0063] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0064] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Although the utility model is described in conjunction with specific features and embodiments thereof, it is obvious that various modifications and combinations can be made to it without departing from the spirit and scope of the utility model. Accordingly, this specification and the drawings are only exemplary illustrations of the utility model defined by the attached claims, and are deemed to have covered any and all modifications, changes, combinations or equivalents within the scope of the utility model. Obviously, those skilled in the art can make various changes and modifications to the utility model without departing from the spirit and scope of the utility model. In this way, if these modifications and variations of the utility model fall within the scope of the claims of the utility model and their equivalent technologies, the utility model is also intended to include these changes and variations. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be covered within the protection scope of the utility model. Therefore, the protection scope of the utility model shall be based on the protection scope of the claims.

Claims

1. A non-contact digital infrared temperature sensor, characterized in that: At least: TO base; An infrared thermopile temperature sensor chip and a signal conditioning chip packaged on the TO base; A TO tube cap that is packaged with the TO base; the TO tube cap and the TO base form a containing space; the infrared thermopile temperature sensor chip and the signal conditioning chip are located in the containing space; the TO tube cap is a conical tube shell structure; the cross section of the TO tube cap is a trapezoid; the cross section of the TO base is a rectangle.

2. The non-contact digital infrared temperature sensor according to claim 1, characterized in that: The cross sections of the TO base and the TO cap are in a stepped structure; the lower base length of the trapezoidal cross section corresponding to the TO cap is smaller than the cross section length corresponding to the TO base.

3. The non-contact digital infrared temperature sensor according to claim 1, characterized in that: The non-contact digital infrared temperature sensor also includes: Infrared filter; The infrared filter is arranged on the top of the TO tube cap as an optical window, and is used for filtering and receiving infrared light.

4. The non-contact digital infrared temperature sensor according to claim 3, characterized in that: The signal conditioning chip is connected to the infrared thermopile temperature sensor chip, and the signal conditioning chip is used to enable the infrared thermopile temperature sensor chip to condition and calibrate the temperature of the target object.

5. The non-contact digital infrared temperature sensor according to claim 1, characterized in that: The TO cap is welded to the TO base to achieve airtight packaging.

6. The non-contact digital infrared temperature sensor according to claim 4, characterized in that: The non-contact digital infrared temperature sensor also includes: Multiple pins; The plurality of pins are arranged on the lower surface of the TO base, and are used to connect various structures and external devices in the non-contact digital infrared temperature sensor to output a processed digital temperature signal.

7. The non-contact digital infrared temperature sensor according to claim 6, characterized in that: The infrared thermopile temperature sensor chip is used to receive infrared light through the infrared filter, detect the temperature change of the target object, and transmit the detected temperature change signal to the signal conditioning chip.

8. The non-contact digital infrared temperature sensor according to claim 7, characterized in that: The signal conditioning chip is used to process and convert the received temperature change signal, generate the digital temperature signal, and output it through the multiple pins.

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