Tandem diode module sintering mold

Abstract

The utility model discloses a series type diode module sintering die which comprises a base, the base is arranged in a concave shape, placing grooves are formed in the two opposite side walls of the base, a lower die block and an upper die block are arranged between the two placing grooves in a sliding mode, and the upper die block is located on the side, away from the bottom wall of the base, of the lower die block. A plurality of through grooves are formed in the side, close to the lower module, of the upper module, the bottom walls of the through grooves are arranged in a penetrating mode, the through grooves are distributed at equal intervals in the length direction, a plurality of containing grooves are formed in the side, close to the upper module, of the lower module, the containing grooves are distributed at equal intervals in the length direction, and two through holes are formed in each containing groove; a corresponding copper connecting piece is placed in each containing groove, a lower lead of a diode penetrates through a hole in the copper connecting piece and penetrates out of a through hole of the containing groove, an upper lead of the diode is sequentially sleeved with the copper connecting piece and then penetrates out of the through groove, the upper module fixes the upper lead and the copper connecting piece, and welding flux is placed at the welding position for welding. And the diode module becomes tidy and beautiful.

Description

Technical Field

[0001] The utility model relates to the field of diode welding, in particular to a series-connected diode module sintering die. Background Art

[0002] With the development of power systems and electronic applications, the demand for high-voltage products has gradually become prominent. Due to structural limitations, a single diode cannot achieve excessively high withstand voltage. Therefore, in order to meet market demand and realize the high withstand voltage characteristics of diode products, multiple diodes are usually connected in series to form a diode module to achieve the purpose of high withstand voltage.

[0003] We sintered multiple glass-encapsulated axial diodes through solder and connecting sheets, and cut off the leads after they were connected in series. The existing method is to use high-temperature solder paste and connecting sheets to connect the diodes in series, and then place them flat in a high-temperature furnace for sintering; because there is no mold to fix the product and parts, the diodes are not neat after sintering, and the connecting sheets are not on the same plane. This results in some connecting sheets protruding too much from the plastic shell after plastic sealing, and some connecting sheets contacting each other, causing a short circuit. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a sintering mold for a series diode module.

[0005] The utility model is realized through the following technical solutions.

[0006] The utility model provides a series diode module sintering mold, comprising a base, the base is concavely arranged, two opposite side walls of the base are provided with placement grooves, a lower module and an upper module are slidably arranged between the two placement grooves, and the upper module is located on the side of the lower module away from the bottom wall of the base;

[0007] A plurality of through slots are provided on one side of the upper module close to the lower module, and the bottom wall of the through slots is arranged to penetrate, and the plurality of through slots are evenly spaced along the length direction thereof; a plurality of accommodating slots are provided on one side of the lower module close to the upper module, and the plurality of accommodating slots are evenly spaced along the length direction thereof, and two through holes are provided in the accommodating slots.

[0008] Preferably, bosses are fixedly connected to both ends of the lower module close to opposite sides of the base, and one end of the boss away from the lower module faces the upper module.

[0009] Preferably, an upper pressure block is slidably arranged between the two sides of the placement groove, and the upper pressure block is arranged on the side of the upper module away from the bottom wall of the base. The upper pressure block has two first through holes at both ends along its length direction, and the upper module has second through holes at both ends along its length direction. The first through holes and the second through holes correspond to each other one by one, and the lower module is provided with a connection structure that facilitates the connection of the long lead to the connecting diode.

[0010] Preferably, the connecting structure includes a limiting groove formed on the protrusion, and two opposite side walls of the two limiting grooves are arranged through, and a positioning groove is formed on the bottom wall of the limiting groove. When the upper module conflicts with the protrusion, the two limiting grooves are connected to the two through grooves at the ends of the upper module.

[0011] Preferably, the lower module is provided with a containing frame, and the width and length of the containing frame are greater than the length of the lower lead of the diode.

[0012] Preferably, a plurality of placement grooves are provided on two opposite sides of the base, and the plurality of placement grooves are distributed at equal intervals.

[0013] Preferably, the base, the upper module and the lower module are all made of stainless steel.

[0014] Preferably, the base, the upper module and the lower module are all plated with a layer of nickel.

[0015] The beneficial effects of the utility model are as follows: firstly, a corresponding copper connecting piece is placed in each receiving groove, each copper connecting piece has two holes, so that the hole in the copper connecting piece corresponds to the through hole in the receiving groove, and then the lower leads of multiple diodes are respectively passed through the holes in the copper connecting piece and passed through the through hole of the receiving groove, and solder is placed at the copper connecting piece and the lower lead, so that the lower module arranges the diodes and the copper connecting piece neatly; the copper connecting piece is sequentially put on the upper lead of the diode, and one copper connecting piece is penetrated with two upper leads, and then the upper module is slidably abutted on the lower module, so that the upper lead with the copper connecting piece passes through the through groove, so that the upper module stabilizes the upper lead and the copper connecting piece, and then solder is placed at the upper lead and the copper connecting piece;

[0016] The entire structure is placed in a sintering device for sintering and welding. During the sintering and welding process, multiple diodes are on the same horizontal plane, and the copper connecting pieces are also placed horizontally, so that the multiple diodes are neat and beautiful after sintering and welding, which solves the problem of skewness of the copper connecting pieces after sintering or even short circuit of the diode module, thereby greatly improving the efficiency of diode sintering and welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the utility model;

[0018] Figure 2 It is a structural schematic diagram of some parts of the utility model;

[0019] Explanation of the reference numerals: 1-base; 2-placing groove; 3-upper module; 4-lower module; 5-through groove; 6-accommodating groove; 7-through hole; 8-bump; 9-upper pressing block; 10-first through hole; 11-second through hole; 12-limiting groove; 13-positioning groove; 14-accommodating frame. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0022] like Figure 1 As shown, it includes a base 1, which is concavely set. The base 1 is set to be made of stainless steel and is plated with a layer of nickel to prevent the base 1 from being corroded and rusted, thereby increasing the service life of the overall structure. Multiple placement grooves 2 are opened on opposite sides of the base 1 and the multiple placement grooves 2 are evenly distributed. The placement grooves 2 on the opposite side walls of the base 1 correspond to each other one by one, which is convenient for sintering and welding of multiple groups of diodes at the same time, and helps to improve the sintering and welding efficiency of the diode module.

[0023] like Figure 1 and Figure 2 As shown, a lower module 4 and an upper module 3 are slidably arranged between two relative placement grooves 2. The upper module 3 and the lower module 4 are also made of stainless steel and are plated with a layer of nickel. The upper module 3 is located on the side of the lower module 4 away from the bottom wall of the base 1. Both ends of the upper module 3 and the lower module 4 are respectively integrally connected with sliding blocks. The two sliding blocks on the upper module 3 and the lower module 4 are respectively slidably connected in the two relative placement grooves 2, and can also facilitate the upper module 3 and the lower module 4 to slide in and out of the base 1, so as to facilitate the taking and placing of the upper module 3 and the lower module 4.

[0024] like Figure 2As shown, the lower module 4 is fixedly connected with protrusions 8 on both ends of the opposite sides close to the base 1, and the end of the protrusion 8 away from the lower module 4 faces the upper module 3. When the upper module 3 is in contact with the protrusion 8, there is a certain degree of gap between the upper module 3 and the lower module 4, so that the diode will not be squeezed by the upper module 3 when it is placed between the upper module 3 and the lower module 4; at the same time, the lower module 4 is provided with a accommodating frame 14, and the width and length of the accommodating frame 14 are greater than the length of the diode lead, so as to facilitate the neat arrangement of the lower lead of the diode.

[0025] like Figure 2 As shown, at the same time, a plurality of through slots 5 are provided on the side of the upper module 3 close to the lower module 4, and the bottom wall of the through slots 5 is set through, and the plurality of through slots 5 are evenly spaced along the length direction thereof, and a plurality of accommodating slots 6 are provided on the side of the lower module 4 close to the upper module 3, and the plurality of accommodating slots 6 are evenly spaced along the length direction thereof. Upper pressing blocks 9 are slidably provided on both sides of the placement groove 2, and the upper pressing blocks 9 are provided on the side of the upper module 3 away from the bottom wall of the base 1, and the two ends of the upper pressing blocks 9 are respectively connected with sliders so that the upper pressing blocks 9 are slidably connected to the base 1, and the two ends of the upper pressing blocks 9 along the length direction thereof are provided with two first through holes 10, and the two ends of the upper module 3 along the length direction thereof are provided with second through holes 11, and the two first through holes 10 correspond to the two second through holes 11 one by one, and the lower module 4 is provided with a connection structure that facilitates the connection of the long lead wire with the connecting diode.

[0026] like Figure 2 As shown, the connection structure includes a limiting groove 12 provided on the protrusion 8, the two opposite side walls of the two limiting grooves 12 are through-set, and the bottom wall of the limiting groove 12 is provided with a positioning groove 13. When the upper module 3 conflicts with the protrusion 8, the two limiting grooves 12 are connected to the two through grooves 5 at both ends of the upper module 3;

[0027] When the upper lead of a diode placed at both ends of the lower module 4 is respectively penetrated with a copper connecting piece, and two holes are set on the copper connecting piece, when the protrusion 8 is connected to the upper module 3, the two copper connecting pieces are respectively placed between the limiting groove 12 and the through groove 5 at the end of the upper module 3, the upper pressing block 9 is slidably placed on the base 1, and then the two long leads are respectively passed through the first through holes 10 at both ends of the upper pressing block 9, and at the same time, respectively passed through the second through holes 11 on the upper module 3, so that the two long leads are respectively placed in the limiting grooves 12 of the two protrusions 8, and the two long leads pass through the copper connecting pieces placed in the limiting grooves 12 and are placed in the positioning grooves 13;

[0028] Solder is placed on the long lead, the copper connecting piece and the upper leads of the two diodes at the end of the upper module 3. The long lead is stabilized in position by the upper pressing block 9, so that the two long leads are sintered and welded with the upper leads of the diode through the copper connecting piece, so as to achieve rapid welding of the two ends of the diode module with the long lead, so as to make the overall structure of the sintering welding of the long lead and the diode module more beautiful.

[0029] The working principle of this embodiment is as follows: first, a corresponding copper connecting piece is placed in each receiving groove 6, each copper connecting piece has two holes, so that the hole in the copper connecting piece corresponds to the through hole 7 in the receiving groove 6, and then the lower leads of multiple diodes are respectively passed through the holes in the copper connecting piece and passed through the through hole 7 of the receiving groove 6, so that the lower leads are placed in the receiving frame 14, and solder is placed at the copper connecting piece and the lower lead, so that the lower module 4 arranges the diodes and the copper connecting piece neatly; except for the upper leads of the two diodes at the ends of the lower module 4, the copper connecting pieces are sequentially covered on the upper leads of the remaining diodes, and one copper connecting piece is penetrated with two upper leads, and then the upper module 3 is slid against the lower module 4, so that the upper lead covered with the copper connecting piece passes through the through groove 5, so that the upper module 3 stabilizes the upper lead and the copper connecting piece, and solder is placed on the upper lead and the copper connecting piece at the same time;

[0030] At the same time, the upper leads of the diodes at both ends of the lower module 4 are separately sleeved with copper connecting pieces. When the bump is connected to the upper module 3, the two copper connecting pieces are respectively placed between the limiting groove 12 and the through groove 5 at the end of the upper module 3. Then, the two long leads are respectively passed through the first through hole 10 and the second through hole 11, and then respectively passed through the holes of the two copper connecting pieces and placed in the positioning groove 13. Then, solder is placed in the long leads, the upper leads of the two diodes, and the two copper connecting pieces; so that the long leads, the upper leads and the corresponding copper connecting pieces are neatly arranged and placed between the upper module 3 and the lower module 4;

[0031] The entire structure is placed in a sintering device for sintering and welding. During the sintering and welding process, multiple diodes are on the same horizontal plane, and the copper connecting pieces on the upper leads and the lower leads are also placed horizontally, so that the multiple diodes are neat and beautiful after sintering and welding. At the same time, the sintering and welding of the diode module and the long lead can also become neat and beautiful, which solves the problem of skewness of the copper connecting piece after sintering and even short circuit of the diode module, thereby greatly improving the efficiency of diode sintering and welding.

[0032] The above are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A sintering mold for a series diode module, characterized in that: The invention comprises a base (1), wherein the base (1) is concavely arranged, and placement grooves (2) are provided on two opposite side walls of the base (1), and a lower module (4) and an upper module (3) are slidably arranged between the two placement grooves (2), and the upper module (3) is located on a side of the lower module (4) away from the bottom wall of the base (1); A plurality of through slots (5) are provided on a side of the upper module (3) close to the lower module (4), and the bottom wall of the through slots (5) is arranged to penetrate, and the plurality of through slots (5) are evenly spaced along the length direction thereof; a plurality of accommodating slots (6) are provided on a side of the lower module (4) close to the upper module (3), and the plurality of accommodating slots (6) are evenly spaced along the length direction thereof; and two through holes (7) are provided in the accommodating slots (6).

2. A sintering mold for a series diode module as claimed in claim 1, characterized in that: Bosses are fixedly connected to the two ends of the lower module (4) on opposite sides close to the base (1), and one end of the boss away from the lower module (4) faces the upper module (3).

3. A sintering mold for a series diode module as claimed in claim 2, characterized in that: An upper pressing block (9) is slidably arranged between the two sides of the placement groove (2), and the upper pressing block (9) is arranged on the side of the upper module (3) away from the bottom wall of the base (1). The upper pressing block (9) is provided with two first through holes (10) at both ends along its length direction, and the upper module (3) is provided with second through holes (11) at both ends along its length direction, and the first through holes (10) and the second through holes (11) correspond to each other one by one. The lower module (4) is provided with a connection structure that facilitates the connection of a long lead wire with a connecting diode.

4. A sintering mold for a series diode module as claimed in claim 3, characterized in that: The connection structure comprises a limiting groove (12) formed on the protrusion (8), two opposite side walls of the two limiting grooves (12) being arranged through, and a positioning groove (13) being formed on the bottom wall of the limiting groove (12). When the upper module (3) contacts the protrusion (8), the two limiting grooves (12) are connected to the two through grooves (5) at the ends of the upper module (3).

5. A sintering mold for a series diode module as claimed in claim 1, characterized in that: The lower module (4) is provided with a containing frame (14), and the width and length of the containing frame (14) are greater than the length of the lower lead of the diode.

6. A sintering mold for a series diode module as claimed in claim 1, characterized in that: The base (1) is provided with a plurality of placement grooves (2) on opposite sides, and the plurality of placement grooves (2) are distributed at equal intervals.

7. A sintering mold for a series diode module as claimed in claim 1, characterized in that: The base (1), the upper module (3) and the lower module (4) are all made of stainless steel.

8. The sintering mold for a series diode module according to claim 1, characterized in that: The base (1), the upper module (3) and the lower module (4) are all plated with a layer of nickel.

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