Silicon carbide wafer cleaning and drying auxiliary device
By designing a silicon carbide wafer cleaning and drying auxiliary device including a jam fixing seat and a rocking device, the problem of uneven ultrasonic energy propagation during the cleaning process is solved, and the uniformity of cleaning and drying effects is improved.
Patent Information
- Application Number
- CN202421637652.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-11
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2034-07-11
AI Technical Summary
During the cleaning process of silicon carbide wafers, the energy propagation of ultrasonic waves or megasonic waves is uneven, resulting in the cleaning effect varying at different locations, especially the high particle level at the head and tail positions.
A silicon carbide wafer cleaning and drying auxiliary device is designed, including a jam fixing seat and a rocking device. The jam fixing seat is used to fix the jam. The jam fixing seat is arranged on the tray of the swing device. The swing device drives the jam fixing seat and the silicon carbide wafer on the jam through the pallet and the drive assembly, thereby uniformly transmitting ultrasonic waves or nitrogen purges during the cleaning and drying process.
Driven by the swing device, the position of the silicon carbide wafer in the cleaning tank body is continuously changed, improving the uniformity of cleaning; under the action of nitrogen purge in the drying tank body, the cleaning liquid on the surface of the silicon carbide wafer is evenly purged and dried, improving the uniformity of drying.
Smart Images
Figure CN222775303U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor processing, and particularly relates to a silicon carbide wafer cleaning and drying auxiliary device. Background Art
[0002] As the level of integrated technology continues to improve and device size continues to shrink, the requirements for the quality of silicon substrates are further increased. After slicing, chamfering, double-sided grinding, polishing and other processes, the surface of silicon carbide wafers has been seriously contaminated. Particles, organic matter, metals, adsorbed molecules, etc. on the surface of silicon carbide wafers will seriously affect device performance. In order to ensure the quality and performance of silicon carbide wafers, the cleaning process is particularly important.
[0003] The purpose of cleaning is to remove dirt from the surface of the wafer. The contaminants on the surface of the silicon carbide wafer usually exist on the surface of the silicon carbide wafer in the form of atoms, ions, molecules, particles or films in the form of physical adsorption or chemical adsorption. According to statistics, device failures caused by poor cleaning have exceeded half of the total losses in integrated circuit manufacturing. Therefore, cleaning is an essential and critical step in the semiconductor process, and the application of ultrasonic and megasonic technology in the cleaning process is very important.
[0004] In order to meet the production demand, the cleaning of silicon carbide wafers is more often done by using RCA (Radio Corporation of America) tank cleaning. In order to achieve a better removal effect, ultrasonic or megasonic waves are generally added to assist cleaning during the cleaning process. The main method of ultrasonic or megasonic wave participation is to install an ultrasonic or megasonic wave vibration plate at the bottom of the tank, and achieve the cleaning index by adjusting the power of the ultrasonic or megasonic wave.
[0005] In actual use, the plug containing the silicon carbide wafer is fixed inside the slot, and the cleaning position of the silicon carbide wafer is fixed. After cleaning, the cleaning effect of the silicon carbide wafer at different positions is different. The most obvious one is that the particle level at the head and tail positions is higher, indicating that there is unevenness in the energy propagation of ultrasonic or megasonic waves during the cleaning process of the silicon carbide wafer.
[0006] Therefore, how to improve the uniformity of cleaning is a problem that needs to be solved urgently by those skilled in the art. Utility Model Content
[0007] In view of this, an object of the present invention is to provide a silicon carbide wafer cleaning and drying auxiliary device to improve the uniformity of cleaning and drying.
[0008] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0009] A silicon carbide wafer cleaning and drying auxiliary device, comprising:
[0010] A plug fixing seat, wherein the plug fixing seat has a fixing slot for fixing the plug;
[0011] The swing device comprises a tray and a swing driving assembly for driving the tray to swing, and the plug fixing seat is arranged on the tray.
[0012] Optionally, in the above-mentioned silicon carbide wafer cleaning and drying auxiliary device, the swing drive component includes:
[0013] a swing arm, a first end of the swing arm being fixed on the tray;
[0014] The swing shaft and the swing driving system are used to drive the swing arm to swing around the axis of the swing shaft.
[0015] Optionally, in the above-mentioned silicon carbide wafer cleaning and drying auxiliary device, the swing drive system includes:
[0016] A slider mechanism, comprising a sliding track and a sliding block slidably matched with the sliding track, wherein the sliding block is drivingly connected to the swing arm;
[0017] The driving device is connected to the sliding block in driving mode and is used for driving the sliding block to move back and forth along the sliding track to drive the swing arm to swing.
[0018] Optionally, in the above-mentioned silicon carbide wafer cleaning and drying auxiliary device, a controller display screen for setting swing parameters is also included;
[0019] The swing parameter includes at least one of a moving speed of the sliding block, a moving distance of the sliding block, and a swing time of the swing arm.
[0020] Optionally, in the above-mentioned silicon carbide wafer cleaning and drying auxiliary device, the swing shaft is arranged on the inner wall of the process tank body, the swing arm is rotatably connected to the swing shaft, and the process tank body is a cleaning tank body or a drying tank body.
[0021] Optionally, in the above-mentioned silicon carbide wafer cleaning and drying auxiliary device, two toggle blocks are arranged on the sliding block, and the second end of the swing arm extends between the two toggle blocks.
[0022] Optionally, in the above-mentioned silicon carbide wafer cleaning and drying auxiliary device, a toggle sliding sleeve is hinged on the sliding block, and the second end of the swing arm is sleeved in the toggle sliding sleeve and slidably cooperates with the toggle sliding sleeve.
[0023] Optionally, in the above-mentioned silicon carbide wafer cleaning and drying auxiliary device, the swing shaft is arranged outside the process tank body, and the process tank body is a cleaning tank body or a drying tank body;
[0024] The swing drive system also includes:
[0025] A driving swing arm, wherein the driving swing arm is rotatably connected to the swing shaft, and the swing arm is fixed to the driving swing arm;
[0026] A toggle rod has one end connected to the sliding block and the other end toggles the driving swing arm.
[0027] Optionally, in the above-mentioned silicon carbide wafer cleaning and drying auxiliary device, a toggle slide groove is provided on the driving swing arm, and a toggle part that slidably cooperates with the toggle slide groove is provided on the toggle rod.
[0028] Optionally, in the above-mentioned silicon carbide wafer cleaning and drying auxiliary device, baffles are provided on both sides of the plug fixing seat, and the plug is installed between the two baffles; and / or,
[0029] The plug fixing seat is provided with a top knife for supporting the silicon carbide wafer in the plug, and a drainage groove is provided in the middle of the top knife; and / or,
[0030] The parts of the plug fixing seat and the swing device located in the process tank body are made of plastic material or sprayed with plastic coating.
[0031] The utility model provides a silicon carbide wafer cleaning and drying auxiliary device, which fixes the plug through a plug fixing seat, and the plug is used to insert the silicon carbide wafer, so that the silicon carbide wafer to be cleaned or dried can be fixed on the plug fixing seat through the plug. The plug fixing seat is fixed on the tray of the swing device, and the swing device can drive the plug fixing seat and the silicon carbide wafer on the plug fixing seat to swing back and forth. When the silicon carbide wafer is cleaned, under the action of ultrasonic waves or megasonic waves in the cleaning tank body, the dirt on the surface of the silicon carbide wafer is cleaned away. Because the swing device drives the silicon carbide wafer to swing back and forth in the cleaning tank body, individual positions that are difficult to clean will also change with the swing, and the position of the silicon carbide wafer will continue to change, thereby achieving a uniform cleaning effect. When the silicon carbide wafer is dried, under the action of nitrogen purge in the drying tank body, the cleaning liquid on the surface of the silicon carbide wafer is purged and dried. Because the swing device drives the silicon carbide wafer to swing back and forth in the drying tank, individual positions that are difficult to dry will also swing, and the position of the silicon carbide wafer will constantly change, thereby achieving a uniform drying effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.
[0033] Figure 1 A schematic diagram of the structure of the cooperation between the plug fixing seat and the swing device provided in the embodiment of the utility model;
[0034] Figure 2 A module diagram of the silicon carbide wafer cleaning and drying auxiliary device provided by the embodiment of the utility model when in use;
[0035] Figure 3 A module diagram of a silicon carbide wafer cleaning and drying auxiliary device provided by another embodiment of the utility model when in use;
[0036] Figure 4 A schematic diagram of the structure of the silicon carbide wafer cleaning and drying auxiliary device provided by an embodiment of the utility model when it swings to the lowest position;
[0037] Figure 5 A schematic diagram of the structure of the silicon carbide wafer cleaning and drying auxiliary device provided by an embodiment of the utility model when it swings to the highest position;
[0038] Figure 6 This is a comparison diagram of the silicon carbide wafer after cleaning provided by an embodiment of the utility model.
[0039] The meanings of the reference numerals in the figures are as follows:
[0040] 100-swing device; 101-tray; 102-swing shaft; 103-swing arm; 104-slider mechanism; 1041-sliding track; 1042-sliding block; 105-driving device; 106-driving swing arm; 1061-sliding slot; 107-sliding rod;
[0041] 200-card fixing seat; 201-fixed card slot; 202-baffle; 203-top knife; 204-drainage slot;
[0042] 300-stuck;
[0043] 400-process tank. DETAILED DESCRIPTION
[0044] The core of the utility model is to provide a silicon carbide wafer cleaning and drying auxiliary device to improve the uniformity of cleaning and drying.
[0045] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0046] The applicant found that no matter whether it is cleaning or drying, there are some locations of the silicon carbide wafer where the cleaning / drying effect is not ideal. Taking cleaning as an example, after cleaning, the particle level at the head and tail of the silicon carbide wafer is significantly higher than other locations. The applicant found through research that this is because the energy propagation of ultrasound or megasonic waves is uneven. For example, some structures in the cleaning tank body block ultrasound or megasonic waves, affecting the uniformity of propagation, which in turn results in poor cleaning effects in some areas. The drying process also has a similar problem, that is, the internal structure of the drying tank body will block the nitrogen purge airflow, affecting the uniformity of the purge, which in turn results in poor drying effects in some areas.
[0047] Based on this, the present utility model discloses a silicon carbide wafer cleaning and drying auxiliary device, such as Figure 1-Figure 3 As shown, the silicon carbide wafer cleaning and drying auxiliary device disclosed in the embodiment of the utility model includes a plug fixing seat 200 and a swing device 100.
[0048] Among them, the plug fixing seat 200 has a fixed card slot 201 for fixing the plug 300. Usually, the four corners of the bottom of the plug 300 are provided with bottom legs, and the plug fixing seat 200 can be provided with fixed card slots 201 for each bottom leg to be embedded. The plug 300 can use the bottom legs at the bottom of the plug to fit with the fixed card slot 201 to achieve the effect of fixing the plug 300 on the plug fixing seat 200. It should be noted that in order to improve the stability of the plug 300 after being fixed, other fixing structures can be added on the basis of the fixed card slot 201 provided on the plug fixing seat 200, such as clamping structures located on both sides of the plug 300, etc. There are many ways to achieve the fixing of the plug 300, and the utility model does not limit the specific fixing method.
[0049] The swing device 100 includes a tray 101 and a swing drive assembly for driving the tray 101 to swing, and a plug fixing seat 200 is arranged on the tray 101. The fixing method of the plug fixing seat 200 and the tray 101 can be a fixing method such as a fastener fixing, a clamping structure clamping, etc., as long as the plug fixing seat 200 can be limited on the tray 101. While the swing drive assembly drives the tray 101 to swing back and forth, it also drives the plug fixing seat 200, the plug 300 and the silicon carbide wafer embedded in the plug 300 on the tray 101 to swing back and forth. By swinging, the position of the silicon carbide wafer can be changed, so that the position of the silicon carbide wafer in the process tank body 400 (the process tank body 400 in the cleaning process is a cleaning tank body, and the process tank body 400 in the drying process is a drying tank body) is not fixed. The positions of the head and tail of the silicon carbide wafer that are difficult to be processed can be changed by swinging the silicon carbide wafer in the process tank 400, thereby improving the uniformity of cleaning / drying of various positions of the silicon carbide wafer through the change of position.
[0050] The silicon carbide wafer cleaning and drying auxiliary device provided by the utility model fixes the plug 300 through the plug fixing seat 200. The plug 300 is used to insert the silicon carbide wafer, so that the silicon carbide wafer to be cleaned or dried can be fixed on the plug fixing seat 200 through the plug 300. The plug fixing seat 200 is fixed on the tray 101 of the swing device 100, and the swing device 100 can drive the plug fixing seat 200 and the silicon carbide wafer on the plug fixing seat 200 to swing back and forth (such as Figure 4 and Figure 5 shown).
[0051] When cleaning the silicon carbide wafer, the dirt on the surface of the silicon carbide wafer is cleaned under the action of ultrasonic waves or megasonic waves in the cleaning tank. Because the swing device 100 drives the silicon carbide wafer to swing back and forth in the cleaning tank, individual positions that are difficult to clean will also swing, and the position of the silicon carbide wafer will continuously change, thereby achieving a uniform cleaning effect.
[0052] Table 1 Comparison of the number of particles at different positions on the wafer before and after optimization
[0053] Wafer location 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 Mean Before optimization 30 28 17 22 17 12 12 8 19 12 10 16 21 17 15 19 9 15 16 18 14 17 10 66 89 21.16 After optimization 10 20 6 16 6 4 15 8 20 4 5 8 15 8 6 6 5 7 1 8 10 8 14 13 1 9.96
[0054] The silicon carbide wafer is divided into 26 regions, and the number of particles (i.e., dirty particles) in each region after cleaning is counted. Figure 6 As shown, Figure 6 The middle left figure shows a silicon carbide wafer cleaned by a conventional cleaning method, i.e., the position of the silicon carbide wafer in the cleaning tank remains fixed; Figure 6 The middle right figure shows a silicon carbide wafer cleaned by the cleaning method of the present application, that is, the position of the silicon carbide wafer in the cleaning tank body swings back and forth.
[0055] In the above table, the silicon carbide wafers before optimization were cleaned by the traditional cleaning method; the silicon carbide wafers after optimization were cleaned by the cleaning method of the present application. It can be seen that after applying the silicon carbide wafer cleaning and drying auxiliary device disclosed in the embodiment of the utility model, the average number of particles in each area of the cleaned silicon carbide wafer decreased from 21.6 to 9.96, showing a significant decrease, and the number of particles in different areas is relatively uniform.
[0056] When the silicon carbide wafer is dried, the cleaning liquid on the surface of the silicon carbide wafer is purged and dried under the action of nitrogen purge in the drying tank. Because the swing device 100 drives the silicon carbide wafer to swing back and forth in the drying tank, individual positions that are difficult to dry will also swing, and the position of the silicon carbide wafer will continuously change, thereby achieving a uniform drying effect.
[0057] like Figure 2 As shown, in a specific embodiment of the utility model, the swing drive assembly includes a swing arm 103, a swing shaft 102 and a swing drive system. Among them, the first end of the swing arm 103 is fixed on the tray 101, which is used to transmit the swinging action to the tray 101. The swing drive system is used to drive the swing arm 103 to swing around the axis of the swing shaft 102. The swing arm 103 can be directly connected to the swing shaft 102 to swing around the swing shaft 102, and can also be indirectly connected to the swing shaft 102 to swing around the swing shaft 102.
[0058] like Figure 2 , Figure 4 and Figure 5 As shown, in this embodiment, the swing drive system includes a slider mechanism 104 driving device 105. The slider mechanism 104 includes a sliding rail 1041 and a sliding block 1042 that slides with the sliding rail 1041. It should be noted that the slider mechanism 104 should be arranged outside the process tank body 400. For example, when the silicon carbide wafer cleaning and drying auxiliary device is applied to the cleaning process, the slider mechanism 104 is arranged outside the cleaning tank body to avoid the risk of the cleaning liquid in the cleaning tank body corroding the slider mechanism 104.
[0059] The sliding block 1042 is connected to the swing arm 103 in a transmission manner. The connection method between the two can be arbitrary, as long as the two are prevented from getting stuck during the motion transmission process. It is necessary to ensure that the sliding block 1042 can drive the swing arm 103 to swing back and forth around the swing axis 102 during the reciprocating movement along the sliding track 1041. Since the motion trajectories of the swing arm 103 and the sliding block 1042 are one swinging and the other moving, it is necessary to design corresponding degrees of freedom at the connection between the two to ensure the sustainability of motion transmission.
[0060] The driving device 105 is in transmission connection with the sliding block 1042, and is used to drive the sliding block 1042 to move back and forth along the sliding track 1041, so as to drive the swing arm 103 to swing. Since the motion trajectory of the sliding block 1042 is a reciprocating linear motion, the driving device 105 can select a mechanism that can output reciprocating linear motion. The more common ones are a cylinder, a hydraulic cylinder, a linear motor, a screw mechanism driven by a motor, a crank slider mechanism driven by a motor, etc. It can be understood by those skilled in the art that the present embodiment does not limit the form of the driving device 105, as long as it can output reciprocating linear motion.
[0061] In a specific embodiment of the utility model, the silicon carbide wafer cleaning and drying auxiliary device may also include a controller display screen for setting swing parameters. The swing parameters may include: at least one of the moving speed of the sliding block 1042, the moving distance of the sliding block 1042, and the swing time of the swing arm 103. The moving speed of the sliding block 1042, the moving distance of the sliding block 1042, and the swing time of the swing arm 103 are all related to the driving device 105, and the above-mentioned swing parameters all need to control the driving device 105. For example, the moving speed of the sliding block 1042 is related to the speed at which the driving device 105 outputs power. Taking the driving device 105 as a motor as an example, the controller can control the motor to output a corresponding speed when setting the moving speed of the sliding block 1042 based on the relationship between the moving speed of the sliding block 1042 and the motor speed. Similarly, the moving distance of the sliding block 1042 is related to the number of clockwise and counterclockwise rotations of the motor. According to the relationship between the moving distance of the sliding block 1042 and the number of motor rotations, when setting the moving distance of the sliding block 1042, the controller controls the motor to output the corresponding number of counterclockwise and clockwise rotations. The swinging time of the swing arm 103 is the same as the time when the motor outputs power.
[0062] like Figure 2 As shown, the swing shaft 102 is arranged on the inner wall of the process tank body 400, and the swing arm 103 is rotatably connected to the swing shaft 102. The swing arm 103 is directly connected to the swing shaft 102, and the sliding block 1042 can directly drive the swing arm 103 to swing without the help of other components. Specifically, the swing shaft 102 may only include an axis body fixed on the inner wall of the process tank body 400, and a hinge hole is provided on the swing arm 103 for rotational cooperation with the swing shaft 102. Of course, the swing shaft 102 may also be a component structure in which the axis body and the sleeve are rotationally cooperated, that is, one of the axis body and the sleeve is fixed on the inner wall of the process tank body 400, and the other is fixed on the swing arm 103.
[0063] In order to enable the sliding block 1042 to drive the swing arm 103 to swing without getting stuck during the reciprocating movement, in this embodiment, two toggle blocks (not shown in the figure) can be set on the sliding block 1042, and the second end of the swing arm 103 extends between the two toggle blocks. For ease of understanding, the two toggle blocks are named as the first toggle block and the second toggle block, respectively, and the swing arm 103 extends into the first toggle block and the second toggle block, and there is no locking connection relationship between the swing arm 103 and the first toggle block and the second toggle block.
[0064] For ease of understanding, the sliding direction of the sliding block 1042 is named as the front-to-back direction. For example, when the sliding block 1042 slides forward (the sliding direction is only an example), the first toggle block pushes the swing arm 103 to swing clockwise (the swing direction is only an example). During the swinging process of the swing arm 103, there is a tendency to slide relative to the first toggle block to avoid the first toggle block and the swing arm 103 from getting stuck. Similarly, when the sliding block 1042 slides backward, the second toggle block pushes the swing arm 103 to swing counterclockwise. During the swinging process of the swing arm 103, there is a tendency to slide relative to the second toggle block to avoid the second toggle block and the swing arm 103 from getting stuck.
[0065] In addition to the above-mentioned toggle block solution, a toggle sleeve solution (not shown in the figure) can also be adopted, that is, the toggle sleeve is hinged on the sliding block 1042. Since the toggle sleeve is hinged on the sliding block 1042, it can rotate under the influence of external force.
[0066] The second end of the swing arm 103 is sleeved in the toggle sleeve and slides with the toggle sleeve. For example, when the sliding block 1042 slides forward (the sliding direction is only an example), the toggle sleeve pushes the swing arm 103 to swing clockwise (the swinging direction is only an example). During the swinging process of the swing arm 103, there is a tendency to slide relative to the toggle sleeve to avoid the toggle sleeve and the swing arm 103 from getting stuck. At the same time, the toggle sleeve rotates with the swinging of the swing arm 103. Similarly, when the sliding block 1042 slides backward, the toggle sleeve pushes the swing arm 103 to swing counterclockwise. During the swinging process of the swing arm 103, there is a tendency to slide relative to the toggle sleeve to avoid the toggle sleeve and the swing arm 103 from getting stuck. It is sufficient to ensure that when the sliding block 1042 slides to the extreme position, the swing arm 103 will not be separated from the toggle sleeve.
[0067] like Figure 3 As shown, in a specific embodiment of the present invention, the swing shaft 102 can also be arranged outside the process tank 400. The swing drive system disclosed in this embodiment also includes a driving swing arm 106 and a toggle rod 107, that is, in this embodiment, the swing arm 103 is indirectly connected to the swing shaft 102.
[0068] The driving swing arm 106 is rotatably connected to the swing shaft 102, and the swing arm 103 is fixed to the driving swing arm 106. The swing shaft 102 may only include a shaft body fixed to a frame outside the process tank body 400, and a hinge hole is provided on the driving swing arm 106 to rotate with the swing shaft 102. Of course, the swing shaft 102 may also be a component structure in which the shaft body and the shaft sleeve are rotatably matched, that is, one of the shaft body and the shaft sleeve is fixed to a frame outside the process tank body 400, and the other is fixed to the driving swing arm 106.
[0069] One end of the toggle rod 107 is connected to the sliding block 1042, and the other end toggles the driving swing arm 106. Specifically, a toggle slide groove 1061 can be provided on the driving swing arm 106, and a toggle portion that slidably cooperates with the toggle slide groove 1061 can be provided on the toggle rod 107. For example, when the sliding block 1042 slides forward (the sliding direction is only an example), the toggle rod 107 pushes the driving swing arm 106 and the swing arm 103 fixedly connected to the driving swing arm 106 to swing clockwise (the swing direction is only an example), and during the swinging process of the swing arm 103, the toggle portion of the toggle rod 107 slides in the toggle slide groove 1061 to avoid the toggle slide sleeve and the swing arm 103 from getting stuck; similarly, when the sliding block 1042 slides backward, the toggle rod 107 pushes the driving swing arm 106 and the swing arm 103 fixedly connected to the driving swing arm 106 to swing counterclockwise, and during the swinging process of the swing arm 103, the toggle portion of the toggle rod 107 slides in the toggle slide groove 1061 to avoid the toggle slide sleeve and the swing arm 103 from getting stuck. The length of the toggle slide groove 1061 only needs to ensure that when the sliding block 1042 slides to the extreme position, the swing arm 103 will not be separated from the toggle slide sleeve.
[0070] like Figure 1 As shown, in a specific embodiment of the present invention, baffles 202 can be provided on both sides of the plug fixing seat 200, and the plug 300 is installed between the two baffles 202. It should be noted that the two sides of the plug fixing seat 200 refer to the two sides of the plug fixing seat 200 along the swinging direction. That is, baffles 202 are provided on the front and rear sides of the plug fixing seat 200 along the swinging direction, and the baffles 202 have a limiting effect on the plug 300, thereby avoiding the problem of the plug 300 tipping over or falling due to a large swinging frequency during the swinging of the plug fixing seat 200.
[0071] In addition, a top knife 203 for supporting the silicon carbide wafer in the plug 300 is also provided on the plug fixing seat 200. After the plug 300 filled with silicon carbide wafers is installed on the plug fixing seat 200, the part of the silicon carbide wafer extending out of the bottom of the plug 300 can be supported by the top knife 203 to improve the stability of the silicon carbide wafer during the cleaning or drying process.
[0072] A drainage groove 204 is opened in the middle of the top knife 203. During the drying process, when the nitrogen purge gas flow acts on the silicon carbide wafer in the plug 300, the residual cleaning liquid will flow downward along the silicon carbide wafer. When it flows to the plug fixing seat 200, it can be discharged in time through the drainage groove 204 opened in the middle of the top knife 203 to achieve a complete drying effect.
[0073] The parts of the plug fixing seat 200 and the swing device 100 located in the process tank body 400 are made of plastic material or sprayed with plastic coating. Due to the entry of metal material into the cleaning liquid, there is a risk of metal contamination.
[0074] As shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "a kind" and / or "the" do not refer to the singular, but also include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements. The elements defined by the sentence "includes a..." do not exclude the existence of other identical elements in the process, method, commodity or device that includes the elements.
[0075] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.
[0076] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.
[0077] This article uses specific examples to illustrate the principles and implementation methods of the utility model. The above examples are only used to help understand the method and core ideas of the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.
Claims
1. A silicon carbide wafer cleaning and drying auxiliary device, characterized in that: include: A plug fixing seat (200), wherein the plug fixing seat (200) has a fixing slot (201) for fixing the plug (300); A swing device (100) comprises a tray (101) and a swing drive assembly for driving the tray (101) to swing, and the plug fixing seat (200) is arranged on the tray (101).
2. The silicon carbide wafer cleaning and drying auxiliary device according to claim 1, characterized in that: The swing drive assembly comprises: A swing arm (103), wherein a first end of the swing arm (103) is fixed on the tray (101); A swing shaft (102) and a swing drive system, wherein the swing drive system is used to drive the swing arm (103) to swing around the axis of the swing shaft (102).
3. The silicon carbide wafer cleaning and drying auxiliary device according to claim 2, characterized in that: The swing drive system comprises: A slider mechanism (104) comprises a sliding track (1041) and a sliding block (1042) slidably matched with the sliding track (1041), wherein the sliding block (1042) is transmission-connected to the swing arm (103); The driving device (105) is in driving connection with the sliding block (1042) and is used for driving the sliding block (1042) to move back and forth along the sliding track (1041) so as to drive the swing arm (103) to swing.
4. The silicon carbide wafer cleaning and drying auxiliary device according to claim 3, characterized in that: Also included is a controller display for setting swing parameters; The swing parameter includes at least one of: a moving speed of the sliding block (1042), a moving distance of the sliding block (1042), and a swing time of the swing arm (103).
5. The silicon carbide wafer cleaning and drying auxiliary device according to claim 3, characterized in that: The swing shaft (102) is arranged on the inner wall of the process tank body (400), the swing arm (103) is rotatably connected to the swing shaft (102), and the process tank body (400) is a cleaning tank body or a drying tank body.
6. The silicon carbide wafer cleaning and drying auxiliary device according to claim 5, characterized in that: The sliding block (1042) is provided with two toggle blocks, and the second end of the swing arm (103) extends between the two toggle blocks.
7. The silicon carbide wafer cleaning and drying auxiliary device according to claim 5, characterized in that: The sliding block (1042) is hinged with a toggle sliding sleeve, and the second end of the swing arm (103) is sleeved in the toggle sliding sleeve and slidably cooperates with the toggle sliding sleeve.
8. The silicon carbide wafer cleaning and drying auxiliary device according to claim 3, characterized in that: The swing shaft (102) is arranged outside a process tank body (400), and the process tank body (400) is a cleaning tank body or a drying tank body; The swing drive system also includes: A driving swing arm (106), wherein the driving swing arm (106) is rotatably connected to the swing shaft (102), and the swing arm (103) is fixed to the driving swing arm (106); A toggle rod (107) has one end connected to the sliding block (1042) and the other end toggle the driving swing arm (106).
9. The silicon carbide wafer cleaning and drying auxiliary device according to claim 8, characterized in that: The driving swing arm (106) is provided with a toggle slide groove (1061), and the toggle rod (107) is provided with a toggle portion that slidably cooperates with the toggle slide groove (1061).
10. The silicon carbide wafer cleaning and drying auxiliary device according to any one of claims 1 to 9, characterized in that: Baffles (202) are provided on both sides of the plug fixing seat (200), and the plug (300) is installed between the two baffles (202); and / or, The plug fixing seat (200) is provided with a top knife (203) for supporting the silicon carbide wafer in the plug (300), and a drainage groove (204) is provided in the middle of the top knife (203); and / or, The parts of the plug fixing seat (200) and the swing device (100) located in the process tank body (400) are made of plastic material or sprayed with a plastic coating.