Power amplifier with heat dissipation function

Abstract

The utility model relates to the technical field of electromagnetic compatibility testing, in particular to a power amplifier with a heat dissipation function, which is used for electromagnetic compatibility testing and comprises a power amplification assembly, a first shell, a refrigeration assembly, a second shell and a third shell. The first shell wraps the power amplification assembly and is made of a metal material, the refrigeration assembly is provided with a cold end attached to the outer surface of the first shell, the second shell wraps the first shell and is made of a non-metal material, and the refrigeration assembly is arranged on the second shell; the third shell wraps the second shell, the inner wall of the third shell is attached to the hot end of the refrigeration assembly, and the third shell is made of metal. The power amplifier disclosed by the utility model can be subjected to closed electromagnetic shielding through the multi-layer shell, and has a controllable and better heat dissipation effect at the same time.

Description

Technical Field

[0001] The utility model relates to the field of electromagnetic compatibility testing, in particular to a power amplifier with a heat dissipation function. Background Art

[0002] As the electromagnetic environment becomes increasingly complex, people's health and quality of life are greatly affected by the electromagnetic compatibility performance of various electronic products. Under the global trend of "low radiation, high environmental protection", how to reduce the electromagnetic interference of various electronic products has become a focus of many people, and thus electromagnetic compatibility testing has come into being. Electromagnetic compatibility testing refers to the test of evaluating the electromagnetic compatibility of systems and equipment under laboratory or field environmental conditions using electromagnetic interference detection equipment and electromagnetic interference generation equipment.

[0003] Among the many devices required for electromagnetic compatibility testing, the power amplifier is one of the most critical devices. In the electromagnetic compatibility test, the electromagnetic interference generated by the power amplifier itself and the electromagnetic interference generated outside the power amplifier have a great impact on the power amplifier and the electromagnetic compatibility test, so the power amplifier needs to be sealed with electromagnetic shielding. However, the power amplifier generates a lot of heat when working, and sealing electromagnetic shielding will not dissipate heat sufficiently and affect its performance. Summary of the invention

[0004] In order to solve the above problems in the background technology, the utility model provides a power amplifier with heat dissipation function.

[0005] The solution adopted by the utility model to solve its technical problems is:

[0006] A power amplifier with heat dissipation function is a power amplifier for electromagnetic compatibility testing, comprising: a power amplifier component, a first shell, a refrigeration component, a second shell and a third shell, wherein the power amplifier component is used for power amplification of a signal source in the electromagnetic compatibility test, the first shell forms a chamber to cover the power amplifier component and the first shell is made of metal, the refrigeration component has a cold end attached to the outer surface of the first shell, the second shell forms a chamber to cover the first shell and the second shell is made of non-metallic material, the refrigeration component is arranged in the second shell, the third shell forms a chamber to cover the second shell and the inner wall is attached to the hot end of the refrigeration component, and the third shell is made of metal. In this case, the first shell and the third shell can electromagnetically shield the power amplifier component, the refrigeration component can dissipate the heat generated when the power amplifier component is working, and the third shell can further electromagnetically shield the refrigeration component, thereby being able to perform a closed electromagnetic shielding on itself through the multi-layer shell while having a controllable and better heat dissipation effect.

[0007] According to the power amplifier involved in the utility model, optionally, the cold end is attached to the outer surface of the first shell through a heat-conducting adhesive or a non-metallic heat-conducting sheet. In this case, the refrigeration component can better absorb the heat of the first shell without affecting each other.

[0008] According to the power amplifier involved in the utility model, optionally, the inner wall of the third housing is attached to the hot end by heat-conducting glue or non-metallic heat-conducting sheet. In this case, the refrigeration component can better conduct heat to the third housing for heat dissipation without affecting each other.

[0009] According to the power amplifier involved in the utility model, optionally, the refrigeration component conducts the heat energy of the cold end to the hot end by using the Peltier effect. In this case, the heat dissipation of the power amplifier can be controlled, thereby improving the heat dissipation effect.

[0010] According to the power amplifier involved in the utility model, optionally, the first shell, the second shell and the third shell have preset through holes, and the wires of the power amplification component are connected to external devices through the preset through holes. In this case, the power amplifier can be easily used.

[0011] According to the power amplifier involved in the utility model, optionally, the outer surface of the third housing is at least partially concave or convex. In this case, when heat is transferred to the third housing, the concave or convex outer surface of the third housing can increase the contact area with the air, thereby better dissipating heat.

[0012] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the structure of a power amplifier with heat dissipation function involved in an example of the present utility model;

[0014] Figure 2 This is a schematic diagram of the connection and distribution between the first housing, the second housing, the third housing and the refrigeration assembly in the power amplifier involved in the example of the utility model;

[0015] Figure 3 This is a schematic diagram of the appearance of the third shell in the power amplifier involved in the example of the present utility model.

[0016] In the figure: 1…power amplifier; 11…first housing; 12…second housing; 13…third housing; 14…power amplifier assembly; 15…refrigeration assembly; 151…cold end; 152…hot end; 16…thermal conductive adhesive; 17…non-metallic thermal conductive sheet. DETAILED DESCRIPTION

[0017] In order to make the content of the utility model more clearly understood, the utility model is further described below based on specific embodiments in combination with the accompanying drawings.

[0018] It should be noted that the terms "center", "upper", "lower", "front", "back", "left", "right", "inner", "outer" and the like used herein to indicate directions or positional relationships are based on directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. Unless otherwise specified, "plurality" means two or more.

[0019] Unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood by specific circumstances.

[0020] like Figure 1 As shown, the utility model describes a power amplifier 1 with a heat dissipation function, which is a power amplifier 1 used for electromagnetic compatibility testing. For the convenience of description below, the power amplifier 1 with a heat dissipation function is referred to as "power amplifier 1" for short.

[0021] like Figure 1 As shown, in some examples, the power amplifier 1 may include: a power amplification component 14 , a first shell 11 , a cooling component 15 , a second shell 12 , and a third shell 13 .

[0022] In some examples, the power amplifier component 14 can be used for power amplification of a signal source in an electromagnetic compatibility test. The first shell 11 is formed with a chamber to cover the power amplifier component 14 and the first shell 11 is made of metal. The refrigeration component 15 has a cold end 151 attached to the outer surface of the first shell 11. The second shell 12 is formed with a chamber to cover the first shell 11 and the second shell 12 is made of non-metallic material. The refrigeration component 15 is arranged in the second shell 12. The third shell 13 is formed with a chamber to cover the second shell 12 and the inner wall is attached to the hot end 152 of the refrigeration component 15, and the third shell 13 is made of metal. In this case, the first shell 11 and the third shell 13 can electromagnetically shield the power amplifier component 14, the refrigeration component 15 can dissipate the heat generated by the power amplifier component 14 when it is working, and the third shell 13 can further electromagnetically shield the refrigeration component 15, thereby being able to perform a closed electromagnetic shielding on itself through the multi-layer shell while having a controllable and better heat dissipation effect.

[0023] like Figure 2 As shown, in some examples, optionally, the cold end 151 can be attached to the outer surface of the first shell 11 through a thermally conductive adhesive 16 or a non-metallic thermally conductive sheet 17. In this case, the refrigeration assembly 15 can better absorb the heat of the first shell 11 without affecting each other.

[0024] like Figure 2 As shown, in some examples, optionally, the inner wall of the third housing 13 and the hot end 152 can be attached by thermal adhesive 16 or non-metallic thermal conductive sheet 17. In this case, the refrigeration component 15 can better conduct heat to the third housing 13 for heat dissipation without affecting each other.

[0025] In some examples, optionally, the cooling component 15 can utilize the Peltier effect to conduct the heat energy of the cold end 151 to the hot end 152. In this case, the heat dissipation of the power amplifier 1 can be controlled, thereby improving the heat dissipation effect.

[0026] In some examples, the cooling component 15 may be a semiconductor cooling chip.

[0027] In some examples, optionally, the first housing 11, the second housing 12, and the third housing 13 may have preset through holes, and the wires of the power amplifier component 14 are connected to external devices through the preset through holes. In this case, it is convenient to use the power amplifier 1. In other examples, the preset through holes can also be used to set buttons, knobs, or switches of the power amplifier component 14. In this case, it is convenient to adjust the working state of the power amplifier 1 through buttons, knobs, or switches.

[0028] like Figure 3As shown, in some examples, optionally, the outer surface of the third shell 13 is at least partially concave or convex. In this case, when heat is transferred to the third shell 13, the contact area with the air can be increased through the concave or convex outer surface of the third shell 13, thereby better heat dissipation.

[0029] The embodiments described above are only preferred implementation modes of the present utility model and cannot be used to limit the protection scope of the present utility model. Any non-substantial changes and modifications made by technicians in this field on the basis of the utility model shall fall within the protection scope of the present utility model.

Claims

1. A power amplifier with heat dissipation function, which is a power amplifier used for electromagnetic compatibility testing, characterized in that: include: A power amplifying component, a first shell, a refrigeration component, a second shell and a third shell, wherein the power amplifying component is used for power amplification of a signal source in the electromagnetic compatibility test, the first shell forms a chamber to cover the power amplifying component and the first shell is made of metal, the refrigeration component has a cold end attached to the outer surface of the first shell, the second shell forms a chamber to cover the first shell and the second shell is made of non-metallic material, the refrigeration component is arranged in the second shell, the third shell forms a chamber to cover the second shell and the inner wall is attached to the hot end of the refrigeration component, and the third shell is made of metal.

2. The power amplifier with heat dissipation function according to claim 1, characterized in that: The cold end is attached to the outer surface of the first shell through heat-conducting glue or non-metallic heat-conducting sheet.

3. The power amplifier with heat dissipation function according to claim 1, characterized in that: The inner wall of the third shell is bonded to the hot end via heat-conducting glue or a non-metallic heat-conducting sheet.

4. The power amplifier with heat dissipation function according to claim 1, characterized in that: The refrigeration component conducts the heat energy of the cold end to the hot end by using the Peltier effect.

5. The power amplifier with heat dissipation function according to claim 1, characterized in that: The first shell, the second shell and the third shell have preset through holes, and the wires of the power amplifying component are connected to external devices through the preset through holes.

6. The power amplifier with heat dissipation function according to claim 1, characterized in that: The outer surface of the third shell is at least partially concave or convex.

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