Thermoelectric separation circuit board

Abstract

The utility model belongs to the field of circuit boards, and particularly relates to a thermoelectric separation circuit board, which comprises a copper substrate, high-conductivity adhesive insulating layers are fixedly connected to the upper side surface and the lower side surface of the copper substrate respectively, copper foils are fixedly connected to the two ends of the side edges, far away from the copper substrate, of the high-conductivity adhesive insulating layers respectively, and wire road surfaces are arranged on the surfaces of the copper foils. A center groove is formed in the middle of the high-conductivity adhesive insulating layer, a plurality of sets of positioning blocks are symmetrically and fixedly connected to the inner wall of the center groove, positioning protrusions are fixedly connected to the centers of the upper side and the lower side of the copper substrate, and the positioning protrusions are located in the center of the center groove. The heat dissipation efficiency of the copper substrate body and the positioning protrusions is improved, and therefore the situation that operation of the lamp beads is interfered after the copper substrate operates for a long time is avoided. And in addition, by arranging a protective sleeve, the two ends of the copper substrate can be protected, and the copper substrate is not prone to being damaged when collided.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a thermoelectric separation circuit board. Background Art

[0002] Copper substrate is the most expensive metal substrate. Its thermal conductivity is many times better than that of aluminum substrate and iron substrate. It is suitable for high-frequency circuits, areas with large high and low temperature changes, heat dissipation of precision communication equipment, and architectural decoration industries. In the circuit board processing of automobile lights, fake double-sided boss thermoelectric separation copper substrate is needed.

[0003] However, the current thermoelectric separation copper substrate has a poor heat dissipation effect, resulting in the copper substrate temperature at the lamp bead being higher than the surrounding copper substrate temperature after a long period of operation, which causes certain interference to the subsequent operation of the lamp bead and even has an irreversible impact on the service life of the lamp bead. In addition, the existing thermoelectric separation copper substrate has a poor protective effect, resulting in the copper substrate being easily damaged if a collision occurs at the end during installation or transportation, which causes certain interference to the subsequent installation of the staff. Therefore, a thermoelectric separation circuit board is proposed to address the above problems. Utility Model Content

[0004] In order to make up for the shortcomings of the prior art, the current thermoelectric separation copper substrate has a poor heat dissipation effect and a poor protection effect, the utility model proposes a thermoelectric separation circuit board.

[0005] The technical solution adopted by the utility model to solve its technical problems is: a thermoelectric separation circuit board described in the utility model comprises a copper substrate, high-conductivity adhesive insulating layers are respectively fixedly connected to the upper and lower surfaces of the copper substrate, copper foils are respectively fixedly connected to the two ends of the sides of the high-conductivity adhesive insulating layer away from the copper substrate, a circuit surface is arranged on the surface of the copper foil, a central groove is provided in the middle of the high-conductivity adhesive insulating layer, a plurality of groups of positioning blocks are symmetrically fixedly connected to the inner wall of the central groove, positioning protrusions are fixedly connected to the central positions of the upper and lower sides of the copper substrate, the positioning protrusions are located at the central position of the central groove, a plurality of groups of positioning blocks are attached to the outer side walls of the positioning protrusions, an electrode is fixedly connected to the side of the copper foil close to the positioning protrusion, the copper foil, the high-conductivity adhesive insulating layer and the copper substrate constitute a fixed structure, so that the copper foil is not easy to fall off during use, and it is convenient to install lamp beads and connect positive and negative electrodes, and there is a gap between the positioning protrusion and the central groove, which is convenient for heat dissipation.

[0006] Preferably, an open through groove is provided in the middle of the left and right ends of the copper substrate to facilitate heat dissipation of the copper substrate.

[0007] Preferably, a plurality of groups of ridges are arranged on the inner wall of the through slot, and the cross-section of the ridges is trapezoidal, so as to increase the air contact area on the inner wall of the through slot and improve the heat dissipation effect.

[0008] Preferably, a plurality of groups of heat dissipation protrusions are fixedly connected at equal intervals on the side walls at the left and right ends of the copper substrate, thereby further improving the heat dissipation effect.

[0009] Preferably, protective sleeves are respectively installed on the left and right ends of the copper substrate, and an insert block is fixedly connected to the inner side of the protective sleeve, and the insert block is adapted to the through slot. The protective sleeve protects the ends of the copper substrate to avoid damage by collision.

[0010] Preferably, the copper substrate is provided with heat dissipation holes, which are arranged at the inner side of the central groove. There are four groups of heat dissipation holes which are symmetrically arranged around the positioning protrusion, so as to further improve the heat dissipation effect of the copper substrate.

[0011] Preferably, the protective sleeve is made of rubber material to play a role of buffering and protection to protect the copper substrate.

[0012] The utility model is beneficial in that:

[0013] 1. The utility model improves the heat dissipation effect of the copper base plate by arranging structures such as a central groove, heat dissipation holes, through grooves, heat dissipation bumps, and convex ridges, and accelerates the heat dissipation efficiency of the copper base plate body and the positioning protrusions, thereby avoiding the situation in which the operation of the lamp beads is disturbed after the copper base plate has been running for a long time.

[0014] 2. The utility model can protect both ends of the copper substrate by providing a protective cover, so that the copper substrate is not easily damaged when it is hit. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1 It is a schematic diagram of the overall structure of the first embodiment;

[0017] Figure 2 It is a schematic diagram of the local structure of the first embodiment;

[0018] Figure 3 is a side view of the copper substrate of Example 1;

[0019] Figure 4It is a schematic structural diagram of the protective cover of the first embodiment;

[0020] Figure 5 It is a structural schematic diagram of the connection position between the clamping column and the clamping slot of the second embodiment;

[0021] Figure 6 It is a partial cross-sectional view of the second embodiment;

[0022] Figure 7 For Example 2 Figure 6 A schematic diagram of the enlarged structure in the middle.

[0023] In the figure: 1. Copper substrate; 2. High-conductivity adhesive insulation layer; 3. Through groove; 4. Protective cover; 5. Positioning protrusion; 6. Center groove; 7. Positioning block; 8. Heat dissipation hole; 9. Copper foil; 10. Circuit surface; 11. Insert block; 12. Raised ridge; 13. Heat dissipation protrusion; 14. Card slot; 15. Movable slot; 16. Card column; 17. Installation slot; 18. Spring; 19. Telescopic rod; 20. Electrode. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Embodiment 1

[0026] See also Figure 1-4 As shown, a thermal-electric separation circuit board comprises a copper substrate 1, wherein the upper and lower surfaces of the copper substrate 1 are respectively fixedly connected with a high-conductivity adhesive insulating layer 2, and the two ends of the side of the high-conductivity adhesive insulating layer 2 away from the copper substrate 1 are respectively fixedly connected with a copper foil 9, and the surface of the copper foil 9 is provided with a circuit surface 10, and a central groove 6 is provided in the middle of the high-conductivity adhesive insulating layer 2, and a plurality of groups of positioning blocks 7 are symmetrically fixedly connected on the inner wall of the central groove 6, and a positioning protrusion 5 is fixedly connected at the center position of the upper and lower sides of the copper substrate 1, and the positioning protrusion 5 is located at the center position of the central groove 6, and a plurality of groups of the positioning blocks 7 are attached to the central groove 6. On the outer side wall of the positioning protrusion 5, the copper foil 9 is fixedly connected to the electrode 20 on one side close to the positioning protrusion 5; when working, the copper foil 9, the high-conductivity adhesive insulating layer 2 and the copper substrate 1 form a fixed structure, so that the copper foil 9 is not easy to fall off during use, and the outer surface of the copper foil 9 is provided with a circuit surface 10, and at the same time, the side of the copper foil 9 is fixedly installed with an electrode 20, which is convenient for connecting the positive and negative electrodes through a conductive connector. The lamp bead is fixedly installed on the top of the positioning protrusion 5 through a heat dissipation pad, so that the temperature generated by the lamp bead when working can be quickly dissipated, and the heat dissipation effect of the positioning protrusion 5 is increased by setting the central groove 6.

[0027] An open through slot 3 is provided in the middle of the left and right ends of the copper substrate 1; during operation, the contact area between the copper substrate 1 and the air is increased by providing the through slot 3, thereby improving the heat dissipation effect.

[0028] A plurality of groups of ridges 12 are arranged on the inner wall of the through slot 3, and the cross section of the ridges 12 is trapezoidal. During operation, the contact area between the inner wall of the through slot 3 and the air is increased by arranging the trapezoidal ridges 12, thereby improving the heat dissipation effect.

[0029] A plurality of heat dissipation protrusions 13 are fixedly connected to the side walls at both ends of the copper substrate 1 at equal intervals. When working, the heat dissipation effect of the copper substrate 1 is improved by providing the plurality of heat dissipation protrusions 13 .

[0030] The left and right ends of the copper substrate 1 are respectively installed with protective sleeves 4, and the inner side of the protective sleeve 4 is fixedly connected with an insert block 11, and the insert block 11 is adapted to the through slot 3; when working, the protective sleeve 4 is arranged on the end of the copper substrate 1 to play a protective role, so that the copper substrate 1 is not easily damaged when it is hit.

[0031] The copper substrate 1 is provided with heat dissipation holes 8, which are arranged at the inner side of the central groove 6. There are four groups of heat dissipation holes 8, which are symmetrically arranged around the positioning protrusion 5. During operation, air convection is formed by setting the heat dissipation holes 8 that pass through from top to bottom, which facilitates the heat dissipation of the copper substrate 1.

[0032] The protective sleeve 4 is made of rubber material, and is convenient for protecting the copper substrate 1 during operation.

[0033] Embodiment 2

[0034] See also Figure 5-7 As shown, compared with Example 1, as another implementation of the utility model, a card slot 14 is provided on the inner wall of the through slot 3, and a movable slot 15 is provided on the side wall of the plug block 11 at a position corresponding to the card slot 14, and a card column 16 is movably installed in the movable slot 15, and the card column 16 is adapted to the card slot 14, and installation slots 17 are symmetrically provided at both ends of the bottom of the movable slot 15, and a telescopic rod 19 is installed in the middle of the installation slot 17, and a spring 18 is sleeved on the outer side of the telescopic rod 19, and the upper and lower ends of the spring 18 are respectively fixedly connected with the card column 16 and the bottom of the installation slot 17; during operation, when the protective cover 4 is installed, the plug block 11 is aligned with the through slot 3, and the plug block 11 is pushed to move into the through slot 3, and the card column 16 is squeezed and retracted into the movable slot 15, and when the card column 16 moves to a position aligned with the card slot 14, the card column 16 is pushed to be connected to the card slot 14 by the rebound action of the spring 18, so that the protective cover 4 is not easy to fall off.

[0035] Working principle: copper foil 9, high-conductivity adhesive insulating layer 2 and copper substrate 1 form a fixed structure, so that copper foil 9 is not easy to fall off during use, and the outer surface of copper foil 9 is provided with circuit surface 10, and the side of copper foil 9 is fixedly installed with electrode 20, which is convenient for connecting positive and negative electrodes through conductive connectors. The lamp bead is fixedly installed on the top of the positioning protrusion 5 through the heat dissipation pad, so that the temperature generated when the lamp bead is working can be quickly dissipated, and the heat dissipation effect of the positioning protrusion 5 is increased by setting the center groove 6; the heat dissipation effect of the copper substrate 1 is further improved by setting structures such as through grooves 3, convex ridges 12 and heat dissipation holes 8; in addition, a protective cover 4 is provided to be sleeved on the end of the copper substrate 1 to play a protective role, so that the copper substrate 1 is not easily damaged when it is hit.

[0036] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0037] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. A thermal and electrical separation circuit board, characterized in that: The invention comprises a copper substrate (1), wherein the upper and lower surfaces of the copper substrate (1) are respectively fixedly connected with a high-conductivity adhesive insulating layer (2), the two ends of the side of the high-conductivity adhesive insulating layer (2) away from the copper substrate (1) are respectively fixedly connected with copper foil (9), the surface of the copper foil (9) is provided with a circuit surface (10), a central groove (6) is provided in the middle of the high-conductivity adhesive insulating layer (2), a plurality of groups of positioning blocks (7) are symmetrically fixedly connected on the inner wall of the central groove (6), a positioning protrusion (5) is fixedly connected at the central position of the upper and lower sides of the copper substrate (1), the positioning protrusion (5) is located at the central position of the central groove (6), a plurality of groups of positioning blocks (7) are attached to the outer wall of the positioning protrusion (5), and an electrode (20) is fixedly connected to the side of the copper foil (9) close to the positioning protrusion (5).

2. A thermal-electric separation circuit board according to claim 1, characterized in that: An open through slot (3) is provided in the middle of the left and right ends of the copper base plate (1).

3. A thermal-electric separation circuit board according to claim 2, characterized in that: A plurality of groups of ridges (12) are arranged on the inner wall of the through groove (3), and the cross section of the ridges (12) is trapezoidal.

4. The thermoelectric separation circuit board according to claim 1, characterized in that: A plurality of groups of heat dissipation protrusions (13) are fixedly connected at equal intervals to the side walls at the left and right ends of the copper base plate (1).

5. The thermoelectric separation circuit board according to claim 1, characterized in that: Protective sleeves (4) are respectively installed at the left and right ends of the copper base plate (1), and an insert block (11) is fixedly connected to the inner side of the protective sleeve (4), and the insert block (11) is adapted to the through slot (3).

6. The thermoelectric separation circuit board according to claim 1, characterized in that: The copper substrate (1) is provided with heat dissipation holes (8), the heat dissipation holes (8) are arranged at the inner side of the central groove (6), and the heat dissipation holes (8) are provided in four groups and are symmetrically arranged around the positioning protrusion (5).

7. The thermoelectric separation circuit board according to claim 5, characterized in that: The protective sleeve (4) is made of rubber material.

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