Semiconductor precision cleaning device capable of adjusting cleaning force

Abstract

The utility model relates to the technical field of semiconductor cleaning, in particular to a semiconductor precision cleaning device capable of adjusting cleaning strength, which comprises a cleaning equipment body, an ultrasonic cleaning pool and a flushing pool which are distributed side by side are mounted at the top of the cleaning equipment body, and a support frame is mounted at the top of the ultrasonic cleaning pool. A telescopic assembly is installed at the bottom of the supporting frame, a moving assembly for moving the telescopic assembly left and right is installed at the top of the telescopic assembly, and the telescopic assembly sequentially places the semiconductor precision parts into an ultrasonic cleaning pool and a flushing pool for thorough cleaning through stretching and moving. According to the embodiment of the invention, the telescopic rod of the electric telescopic rod drives the stretching rod to stretch out and draw back up and down in the fixed rod, and the driving motor drives the screw rod to rotate, so that the moving block drives the stretching rod to move left and right; the box body for containing the semiconductor is sequentially placed in the ultrasonic cleaning pool and the flushing pool to be thoroughly cleaned.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor cleaning, and more specifically to a semiconductor precision cleaning device capable of adjusting the cleaning force. Background Art

[0002] In the semiconductor production process, the surface of the wafer will inevitably be contaminated with various pollutants, such as tiny particles, organic matter, metal ions, etc. If these pollutants are not completely removed, they will seriously affect the performance, reliability and yield of semiconductor devices.

[0003] When cleaning semiconductors, ultrasonic cleaning is generally used. The semiconductor precision parts are placed in a cleaning tank, and the cavitation effect of ultrasonic waves in the cleaning tank water is used to remove pollutants adhered to the surface of the semiconductor precision parts. However, the water source in the cleaning tank is replaced regularly. After cleaning the semiconductor pollutants many times, the pollutants will float in the water source. When the semiconductor precision parts are cleaned and taken out, the pollutants will adhere to their surface again, resulting in incomplete cleaning. Therefore, a semiconductor precision cleaning device with adjustable cleaning force that can efficiently clean semiconductor precision parts is needed.

[0004] In view of this, the utility model provides a semiconductor precision cleaning device with adjustable cleaning force. Utility Model Content

[0005] The purpose of the utility model is to solve the above-mentioned shortcomings and provide a semiconductor precision cleaning device with adjustable cleaning force that can efficiently clean semiconductor precision parts.

[0006] The telescopic components and the moving components are used to carry out mobile cleaning of the semiconductor parts to be cleaned, while the rinsing tank and the ultrasonic cleaning tank can thoroughly clean the semiconductor parts.

[0007] Therefore, the utility model provides a semiconductor precision cleaning device with adjustable cleaning force, including a cleaning equipment body, wherein an ultrasonic cleaning pool and a rinsing pool distributed side by side are installed on the top of the cleaning equipment body, a support frame is installed on the top of the ultrasonic cleaning pool, a telescopic component is installed on the bottom of the support frame, and a moving component for moving the telescopic component left and right is installed on the top of the telescopic component. The telescopic component places the semiconductor precision parts in the ultrasonic cleaning pool and the rinsing pool in turn for thorough cleaning through telescoping and moving.

[0008] As a further improvement of the present technical solution, water spray pipes are installed on both sides of the inner wall of the rinsing pool, and a plurality of water spray outlets are opened on the outer surface of the water spray pipes. The water spray pipes can adjust the pressure of the delivered water source so that the water spray outlets can adjust the water spraying intensity to rinse semiconductor precision parts.

[0009] As a further improvement of the present technical solution, the moving component includes a driving motor installed inside the support frame and a screw rod rotatably installed at the bottom of the support frame, a gear is installed on the outer surface of one end of the screw rod, a rotating tooth is installed on the output shaft of the driving motor to mesh with the gear, driving the screw rod to rotate, a moving block is threadedly connected to the outer surface of the screw rod, the top of the moving block is against the bottom of the support frame, and the outer surface of the screw rod drives the telescopic component installed at the bottom to move left and right.

[0010] As a further improvement of the present technical solution, the telescopic assembly includes a connecting plate fixedly installed at the bottom of the moving block, a fixed rod fixedly installed at the bottom of the connecting plate, a stretching rod slidably installed inside the fixed rod, the fixed rod and the stretching rod are symmetrically distributed at the bottom of the connecting plate, a fixed plate one and a fixed plate two are fixedly installed between the two fixed rods and the stretching rod, an electric telescopic rod is installed between the fixed plate one and the fixed plate two, the electric telescopic rod telescopes downward, driving the stretching rod to telescope at the top of the cleaning equipment body.

[0011] As a further improvement of the technical solution, a hook is installed at the bottom of the stretching rod, and the hook can hang the box body for placing semiconductor precision parts.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] In the semiconductor precision cleaning device with adjustable cleaning force, when cleaning the semiconductor, the electric telescopic rod is telescoped downward to drive the stretching rod to move downward, the moving block moves on the screw driven by the driving motor, and the stretching rod is moved to the left, so that the hook hangs the box body containing semiconductor parts placed on the top of the cleaning device body, and the electric telescopic rod is started again, the stretching rod is retracted upward to pull up the box body, and the driving motor is started again to move the moving block on the outer surface of the screw rod, and drive the box body to move to the top of the ultrasonic cleaning tank, and the electric telescopic rod is telescoped downward to make the stretching rod place the box body in the ultrasonic cleaning tank for ultrasonic cleaning, and after the cleaning is completed, the above operation is repeated again, and the box body is placed in the washing tank, and the water flow pressure of the water spray pipe is controlled to control the water spray port to spray water to wash the pollutants adhered to the semiconductor parts in the box body in the ultrasonic cleaning tank, and the electric telescopic rod is started to pull the stretching rod to drive the box body to rise upward, and the moving block drives the stretching rod to move to the right, and the cleaned box body containing semiconductor parts is placed on the top of the cleaning device body, and the staff processes the cleaned semiconductor parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention is described in more detail below by way of example with reference to the accompanying drawings, in which:

[0015] Figure 1It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the mobile component of the utility model;

[0017] Figure 3 It is a schematic diagram of the telescopic component structure of the utility model.

[0018] The meaning of each number in the figure is:

[0019] 1. Cleaning equipment body; 11. Ultrasonic cleaning tank; 101. Water spray pipe; 12. Flushing tank;

[0020] 2. Support frame;

[0021] 3. Telescopic assembly; 301. Connecting plate; 302. Fixing rod; 303. Stretching rod; 304. Electric telescopic rod;

[0022] 4. Moving assembly; 401. Driving motor; 402. Screw rod; 403. Gear; 404. Moving block;

[0023] 5. Hook. DETAILED DESCRIPTION

[0024] When cleaning semiconductors, ultrasonic cleaning is generally used. The semiconductor precision parts are placed in a cleaning tank, and the cavitation effect of ultrasonic waves in the cleaning tank water is used to remove pollutants adhered to the surface of the semiconductor precision parts. However, the water source in the cleaning tank is replaced regularly. After cleaning the semiconductor pollutants many times, the pollutants will float in the water source. When the semiconductor precision parts are cleaned and taken out, the pollutants will adhere to their surface again, resulting in incomplete cleaning. Therefore, a semiconductor precision cleaning device with adjustable cleaning force that can efficiently clean semiconductor precision parts is needed.

[0025] like Figure 1-3 As shown, the device comprises a cleaning device body 1, on the top of which an ultrasonic cleaning tank 11 and a rinsing tank 12 are arranged side by side, on the top of which a support frame 2 is installed, on the bottom of which a telescopic component 3 is installed, on the top of which a moving component 4 for moving the telescopic component 3 left and right is installed, and by telescoping and moving, the telescopic component 3 sequentially places semiconductor precision parts into the ultrasonic cleaning tank 11 and the rinsing tank 12 for thorough cleaning;

[0026] First, the specific structure of the moving component 4 is disclosed. The moving component 4 includes a driving motor 401 installed inside the support frame 2 and a screw rod 402 rotatably installed at the bottom of the support frame 2. A gear 403 is installed on the outer surface of one end of the screw rod 402. The output shaft of the driving motor 401 is equipped with a rotating tooth that meshes with the gear 403, driving the screw rod 402 to rotate. The outer surface of the screw rod 402 is threadedly connected with a moving block 404. The top of the moving block 404 is against the bottom of the support frame 2, and the outer surface of the screw rod 402 drives the telescopic component 3 installed at the bottom to move left and right.

[0027] The improvement of this embodiment lies in that: by installing a support frame 2 on the top of the cleaning equipment body 1, the drive motor 401 is installed on the top of the support frame 2, and the drive motor 401 is horizontally installed on the top of the screw rod. The rotating teeth installed on the output shaft can engage with the gear 403 installed horizontally on the screw rod 402 at the bottom of the support frame 2, so that the drive motor 401 is powered on and started, driving the moving block 404 on the outer surface of the screw rod 402 to move left and right at the bottom of the support frame 2, so that the telescopic component 3 installed at the bottom of the moving block 404 moves left and right together.

[0028] Due to the problem of how to move the semiconductor parts for cleaning by the telescopic assembly 3 in the prior art, Figure 3 A second embodiment of the present utility model is shown.

[0029] The specific structure of the telescopic assembly 3 is disclosed again. The telescopic assembly 3 includes a connecting plate 301 fixedly installed at the bottom of the moving block 404, a fixed rod 302 fixedly installed at the bottom of the connecting plate 301, a stretching rod 303 slidably installed inside the fixed rod 302, the fixed rod 302 and the stretching rod 303 are symmetrically distributed at the bottom of the connecting plate 301, a fixed plate 1 and a fixed plate 2 are fixedly installed between the two fixed rods 302 and the stretching rod 303, an electric telescopic rod 304 is installed between the fixed plates 1 and 2, and the electric telescopic rod 304 is telescoped downward, driving the stretching rod 303 to telescope at the top of the cleaning device body 1. A hook 5 is installed at the bottom of the stretching rod 303, and the hook 5 can hang the box body for placing semiconductor precision parts.

[0030] Water spray pipes 101 are installed on both sides of the inner wall of the washing pool 12. The outer surface of the water spray pipe 101 is provided with multiple water spray outlets. The water spray pipe 101 can adjust the pressure of the water source so that the water spray outlet can adjust the water spraying force to wash the semiconductor precision parts.

[0031] The improvement of this embodiment lies in that: the stretching rod 303 is driven to extend and retract up and down inside the fixed rod 302 through the telescopic rod of the electric telescopic rod 304, and the screw rod 402 driven by the driving motor 401 rotates, so that the moving block 404 drives the stretching rod 303 to move left and right, and through the cooperation of the moving component 4 and the telescopic component 3, the box body containing the semiconductor is placed in the ultrasonic cleaning tank 11 and the rinsing tank 12 in turn for thorough cleaning.

[0032] The ultrasonic cleaning pool 11 is a prior art. The ultrasonic cleaning pool 11 can adjust the frequency of the ultrasonic wave to clean different semiconductor parts. The rinse pool 12 can also adjust the strength of the water jet from the water spray pipe 101 to achieve the effect of adjusting and controlling the cleaning strength.

[0033] In summary, the working principle of this solution is as follows:

[0034] When cleaning the semiconductor, the electric telescopic rod 304 is telescoped downward to drive the stretching rod 303 to move downward, the moving block 404 moves on the screw rod 402 driven by the driving motor 401, and the stretching rod 303 is moved to the left, so that the hook 5 hangs the box body containing semiconductor parts placed on the top of the cleaning device body 1, and the electric telescopic rod 304 is started again, and the stretching rod 303 is retracted upward to pull up the box body, and the driving motor 401 is started again to move the moving block 404 on the outer surface of the screw rod 402, driving the box body to move to the top of the ultrasonic cleaning tank 11, and the electric telescopic rod 304 is telescoped downward to make the stretching rod 30 3 Place the box body in the ultrasonic cleaning tank 11 and perform ultrasonic cleaning. After the cleaning is completed, repeat the above operation again and place the box body in the rinsing tank 12. By controlling and adjusting the water flow pressure of the water spray pipe 101, control the water spray port to spray water to rinse the pollutants adhered to the semiconductor parts in the box body in the ultrasonic cleaning tank 11. Start the electric telescopic rod 304 to pull the stretching rod 303 to drive the box body to rise upward, and the moving block 404 drives the stretching rod 303 to move to the right. The cleaned box body containing the semiconductor parts is placed on the top of the cleaning equipment body 1, and the staff will process the cleaned semiconductor parts.

[0035] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A semiconductor precision cleaning device with adjustable cleaning force, comprising a cleaning device body (1), wherein an ultrasonic cleaning tank (11) and a rinsing tank (12) arranged side by side are installed on the top of the cleaning device body (1), characterized in that: A support frame (2) is installed on the top of the ultrasonic cleaning tank (11), a telescopic component (3) is installed on the bottom of the support frame (2), and a moving component (4) for moving the telescopic component (3) left and right is installed on the top of the telescopic component (3). The telescopic component (3) is used to place semiconductor precision parts in the ultrasonic cleaning tank (11) and the rinsing tank (12) in sequence for thorough cleaning through telescoping and moving.

2. The semiconductor precision cleaning device with adjustable cleaning force as claimed in claim 1, characterized in that: Water spray pipes (101) are installed on both sides of the inner wall of the flushing pool (12), and a plurality of water spray outlets are provided on the outer surface of the water spray pipe (101). The water spray pipe (101) can adjust the pressure of the water source so that the water spray outlets can adjust the water spraying force to flush the semiconductor precision parts.

3. The semiconductor precision cleaning device with adjustable cleaning force as claimed in claim 1, characterized in that: The moving assembly (4) comprises a driving motor (401) installed inside the support frame (2) and a screw rod (402) rotatably installed at the bottom of the support frame (2); a gear (403) is installed on the outer surface of one end of the screw rod (402); a rotating tooth is installed on the output shaft of the driving motor (401) and meshes with the gear (403), thereby driving the screw rod (402) to rotate; a moving block (404) is threadedly connected to the outer surface of the screw rod (402); the top of the moving block (404) is against the bottom of the support frame (2), and the outer surface of the screw rod (402) drives the telescopic assembly (3) installed at the bottom to move left and right.

4. The semiconductor precision cleaning device with adjustable cleaning force as claimed in claim 3, characterized in that: The telescopic assembly (3) comprises a connecting plate (301) fixedly mounted at the bottom of the moving block (404); a fixing rod (302) is fixedly mounted at the bottom of the connecting plate (301); a stretching rod (303) is slidably mounted inside the fixing rod (302); the fixing rod (302) and the stretching rod (303) are symmetrically distributed at the bottom of the connecting plate (301); a fixing plate 1 and a fixing plate 2 are fixedly mounted between the two fixing rods (302) and the stretching rod (303); an electric telescopic rod (304) is mounted between the fixing plate 1 and the fixing plate 2; the electric telescopic rod (304) telescopes downward, driving the stretching rod (303) to telescope at the top of the cleaning device body (1).

5. The semiconductor precision cleaning device with adjustable cleaning force as claimed in claim 4, characterized in that: A hook (5) is installed at the bottom of the stretching rod (303), and the hook (5) can hang a box body containing semiconductor precision parts.

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